MPC875CVR133 vs MPC870CVR133 Perbandingan
Perbandingan bersamaan detil MPC875CVR133 dari NXP Semiconductors dan MPC870CVR133 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC875CVR133 | MPC870CVR133 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Category | Microprocessors (MPU) | — |
| Processor Series | MPC8xx / PowerQUICC | — |
| Core | MPC8xx (Power Architecture Technology) | MPC8xx |
| Lebar Bus Data | 32-bit | 32-bit |
| Frekuensi Bawah Maximum | 133 MHz | 133 MHz |
| Performance | 176 MIPS | — |
| Number of Cores | 1 | 1 |
| Core Supply Voltage | 1.8 V | — |
| I/O Supply Voltage | 3.3 V | — |
| Suhu Kerja | -40C to +100C | — |
| Paket | 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) | 256-BGA (PBGA, 23x23 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| On-chip Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/USB/FEC/ATM) | — |
| Status RoHS | [DATA_NEEDED: rohs status] | — |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Series | — | PowerQUICC MPC8xx |
| Core Architecture | — | Power Architecture (32-bit RISC) |
| Instruction Throughput | — | 176 MIPS |
| Tegangan Pemuat Kerja | — | 3.3 V |
| Rentang Suhu Kerja | — | -40 °C to +100 °C (junction) |
| Temperature Grade | — | Commercial |
| Peripherals | — | CPM (FCC/SCC/SMC), DMA, Ethernet, UART, SPI, I²C |
| System Bus Frequency | — | 26 MHz (60x bus, internal core multiplier) |