MPC875CVR133 vs MPC870CVR133 Vergleich
Detaillierter Direktvergleich von MPC875CVR133 von NXP Semiconductors und MPC870CVR133 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC875CVR133 | MPC870CVR133 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $43,75 | $18,40 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Category | Microprocessors (MPU) | — |
| Processor Series | MPC8xx / PowerQUICC | — |
| Core | MPC8xx (Power Architecture Technology) | MPC8xx |
| Datenbusbreite | 32-bit | 32-bit |
| Maximale Taktfrequenz | 133 MHz | 133 MHz |
| Performance | 176 MIPS | — |
| Number of Cores | 1 | 1 |
| Core Supply Voltage | 1.8 V | — |
| I/O Supply Voltage | 3.3 V | — |
| Betriebstemperatur | -40C to +100C | — |
| Gehäuse | 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) | 256-BGA (PBGA, 23x23 mm) |
| Montageart | Surface Mount | Surface Mount |
| On-chip Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/USB/FEC/ATM) | — |
| RoHS-Status | [DATA_NEEDED: rohs status] | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Series | — | PowerQUICC MPC8xx |
| Core Architecture | — | Power Architecture (32-bit RISC) |
| Instruction Throughput | — | 176 MIPS |
| Betriebsversorgungsspannung | — | 3.3 V |
| Betriebstemperaturbereich | — | -40 °C to +100 °C (junction) |
| Temperature Grade | — | Commercial |
| Peripherals | — | CPM (FCC/SCC/SMC), DMA, Ethernet, UART, SPI, I²C |
| System Bus Frequency | — | 26 MHz (60x bus, internal core multiplier) |