MPC875VR133 vs MPC870ZT133 Perbandingan
Perbandingan bersamaan detil MPC875VR133 dari NXP Semiconductors dan MPC870ZT133 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC875VR133 | MPC870ZT133 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP USA Inc. (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | — |
| Core Architecture | Power Architecture (32-bit RISC) | Power Architecture (G2_LE) |
| Core Count | 1 | — |
| Core Frequency | 133 MHz | 133 MHz |
| Performance | 176 MIPS | — |
| Lebar Bus Data | 32 bit | — |
| Process Technology | 0.18 µm CMOS | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Suhu Kerja | 0 °C to +95 °C | 0C to +95C (commercial) |
| Package Type | 256-PBGA (HBGA), 23x23 mm | — |
| Terminal Pitch | 1.27 mm | — |
| On-chip Communications | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII | — |
| Memory Controller | SDRAM, Flash, SRAM, ROM support | — |
| PCI Bridge | Integrated (PCI 2.1) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Non-Compliant (legacy part) |
| Product Family | — | PowerQUICC MPC8xx |
| Processor Type | — | MPC8xx PowerQUICC, 32-Bit |
| Number of Cores | — | 1 |
| External Data Bus Width | — | 32-bit |
| Tegangan Pemuat | — | 3.3 V I/O, 1.8 V core |
| Paket / Case | — | 256-PBGA (23 x 23 mm) |
| Terminal Form | — | BALL |
| Number of Terminals | — | 256 |
| Package Code | — | HBGA |
| Lead Free Status | — | Contains Lead |
| Packaging | — | Tray |