MPC875VR133 vs MPC870ZT133 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC875VR133 sa pamamagitan ng NXP Semiconductors at MPC870ZT133 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | MPC875VR133 | MPC870ZT133 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP USA Inc. (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | — |
| Core Architecture | Power Architecture (32-bit RISC) | Power Architecture (G2_LE) |
| Core Count | 1 | — |
| Core Frequency | 133 MHz | 133 MHz |
| Performance | 176 MIPS | — |
| Width ng Data Bus | 32 bit | — |
| Process Technology | 0.18 µm CMOS | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Temperature na Operasyon | 0 °C to +95 °C | 0C to +95C (commercial) |
| Package Type | 256-PBGA (HBGA), 23x23 mm | — |
| Terminal Pitch | 1.27 mm | — |
| On-chip Communications | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII | — |
| Memory Controller | SDRAM, Flash, SRAM, ROM support | — |
| PCI Bridge | Integrated (PCI 2.1) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Non-Compliant (legacy part) |
| Product Family | — | PowerQUICC MPC8xx |
| Processor Type | — | MPC8xx PowerQUICC, 32-Bit |
| Number of Cores | — | 1 |
| External Data Bus Width | — | 32-bit |
| Volte ng Pagbibigay | — | 3.3 V I/O, 1.8 V core |
| Packhaging / Kaso | — | 256-PBGA (23 x 23 mm) |
| Terminal Form | — | BALL |
| Number of Terminals | — | 256 |
| Package Code | — | HBGA |
| Lead Free Status | — | Contains Lead |
| Packaging | — | Tray |