S9S08QD4J2MSCR vs S9S08QD4J1VSC Perbandingan
Perbandingan bersamaan detil S9S08QD4J2MSCR dari NXP Semiconductors dan S9S08QD4J1VSC dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | S9S08QD4J2MSCR | S9S08QD4J1VSC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core | HCS08 | — |
| Instruction Set Architecture | CISC (68 HC08 with added BGND) | — |
| Core Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | 16 MHz |
| Program Memory Type | Flash | — |
| Program Memory Size | 4 KB (4K x 8) | — |
| Tegangan Pemuat | 2.7 V to 5.5 V | — |
| Suhu Kerja | -40 C to +125 C | -40C to +105C |
| Paket | 8-SOIC (0.154 inch, 3.90 mm width) | 8-pin SOIC (SOIC-8) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (TR) | — |
| I/O Pins | 4 | — |
| ADC | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI | 8-channel 10-bit |
| Timers | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) | TPM (16-bit) + MTIM (8-bit) |
| Debug | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints | — |
| Status RoHS | Compliant | Compliant |
| Core Architecture | — | HCS08 (S08 family) |
| CPU Bit Width | — | 8-bit |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Debug Interface | — | Background debug (single wire) + on-chip breakpoints |
| AEC-Q100 | — | Qualified (automotive) |
| Instruction Set | — | HC08 + BGND |
| Level MSL | — | MSL3 (per SOIC-8 standard) |