S9S08QD4J2MSCR vs S9S08QD4J1VSC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci S9S08QD4J2MSCR disebabkan oleh NXP Semiconductors dan S9S08QD4J1VSC disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | S9S08QD4J2MSCR | S9S08QD4J1VSC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core | HCS08 | — |
| Instruction Set Architecture | CISC (68 HC08 with added BGND) | — |
| Core Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | 16 MHz |
| Program Memory Type | Flash | — |
| Program Memory Size | 4 KB (4K x 8) | — |
| Tegangan Pemberi Arus | 2.7 V to 5.5 V | — |
| Suhu Operasi | -40 C to +125 C | -40C to +105C |
| Kemasan | 8-SOIC (0.154 inch, 3.90 mm width) | 8-pin SOIC (SOIC-8) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (TR) | — |
| I/O Pins | 4 | — |
| ADC | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI | 8-channel 10-bit |
| Timers | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) | TPM (16-bit) + MTIM (8-bit) |
| Debug | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints | — |
| Status RoHS | Compliant | Compliant |
| Core Architecture | — | HCS08 (S08 family) |
| CPU Bit Width | — | 8-bit |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Debug Interface | — | Background debug (single wire) + on-chip breakpoints |
| AEC-Q100 | — | Qualified (automotive) |
| Instruction Set | — | HC08 + BGND |
| Aras MSL | — | MSL3 (per SOIC-8 standard) |