S9S08QD4J2MSCR vs S9S08QD4J1VSC 比較
詳細並排比較 S9S08QD4J2MSCR 由 NXP Semiconductors 與 S9S08QD4J1VSC 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | S9S08QD4J2MSCR | S9S08QD4J1VSC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | NRND |
| Core | HCS08 | — |
| Instruction Set Architecture | CISC (68 HC08 with added BGND) | — |
| Core Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | 16 MHz |
| Program Memory Type | Flash | — |
| Program Memory Size | 4 KB (4K x 8) | — |
| 供應電壓 | 2.7 V to 5.5 V | — |
| 工作溫度 | -40 C to +125 C | -40C to +105C |
| 封裝 | 8-SOIC (0.154 inch, 3.90 mm width) | 8-pin SOIC (SOIC-8) |
| 安裝類型 | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (TR) | — |
| I/O Pins | 4 | — |
| ADC | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI | 8-channel 10-bit |
| Timers | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) | TPM (16-bit) + MTIM (8-bit) |
| Debug | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints | — |
| RoHS 狀態 | Compliant | Compliant |
| Core Architecture | — | HCS08 (S08 family) |
| CPU Bit Width | — | 8-bit |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Debug Interface | — | Background debug (single wire) + on-chip breakpoints |
| AEC-Q100 | — | Qualified (automotive) |
| Instruction Set | — | HC08 + BGND |
| MSL 等級 | — | MSL3 (per SOIC-8 standard) |