S9S08SL8F1CTJ vs MC9S08SL16CTJ Perbandingan
Perbandingan bersamaan detil S9S08SL8F1CTJ dari NXP Semiconductors dan MC9S08SL16CTJ dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | S9S08SL8F1CTJ | MC9S08SL16CTJ |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Core Processor | S08 8-bit | S08 (HCS08) |
| Core Size | 8-bit | 8-Bit |
| Frekuensi Bawah Maximum | 40 MHz | — |
| Flash Memory | 8 KB (8K x 8) | — |
| EEPROM | Integrated EEPROM (size [DATA_NEEDED: EEPROM size]) | — |
| RAM Size | [DATA_NEEDED: RAM size] | [DATA_NEEDED: RAM size] |
| ADC Resolution | 10-bit | — |
| LIN Interface | Embedded slave LIN interface controller (SLIC) | — |
| Paket | 20-TSSOP (0.173 in, 4.40 mm width) | 20-TSSOP |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | -40 C to +85 C | [DATA_NEEDED: operating temperature range] |
| Tegangan Pemuat | [DATA_NEEDED: supply voltage range] | 3.3 V / 5 V |
| Tingkat Sensitivitas Kekeringan (MSL) | 3 | — |
| Peak Reflow Temperature | 260 C | — |
| Maximum Time at Peak Reflow Temperature | 40 s | — |
| Terminal Finish | Tin (JESD-609 Code e3) | — |
| Process Technology | 0.25 um | — |
| Status RoHS | Compliant | — |
| Maximum Clock Speed | — | 40 MHz |
| Program Memory Size | — | 16KB (16K x 8) |
| Program Memory Type | — | FLASH |
| EEPROM Size | — | 256 x 8 |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 16 |
| Interrupt/Reset Sources | — | Up to 32 |
| Packaging | — | Tube |
| Special Module | — | Embedded Slave LIN Interface Controller (SLIC) |
| Instruction Set | — | HC08 compatible with added BGND instruction |
| Part Status | — | Obsolete |