S9S08SL8F1CTJ vs MC9S08SL16CTJ Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci S9S08SL8F1CTJ disebabkan oleh NXP Semiconductors dan MC9S08SL16CTJ disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | S9S08SL8F1CTJ | MC9S08SL16CTJ |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Core Processor | S08 8-bit | S08 (HCS08) |
| Core Size | 8-bit | 8-Bit |
| Frekuensi Klock Maksimum | 40 MHz | — |
| Flash Memory | 8 KB (8K x 8) | — |
| EEPROM | Integrated EEPROM (size [DATA_NEEDED: EEPROM size]) | — |
| RAM Size | [DATA_NEEDED: RAM size] | [DATA_NEEDED: RAM size] |
| ADC Resolution | 10-bit | — |
| LIN Interface | Embedded slave LIN interface controller (SLIC) | — |
| Kemasan | 20-TSSOP (0.173 in, 4.40 mm width) | 20-TSSOP |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | -40 C to +85 C | [DATA_NEEDED: operating temperature range] |
| Tegangan Pemberi Arus | [DATA_NEEDED: supply voltage range] | 3.3 V / 5 V |
| Tingkat sensitiviti Air Nama (MSL) | 3 | — |
| Peak Reflow Temperature | 260 C | — |
| Maximum Time at Peak Reflow Temperature | 40 s | — |
| Terminal Finish | Tin (JESD-609 Code e3) | — |
| Process Technology | 0.25 um | — |
| Status RoHS | Compliant | — |
| Maximum Clock Speed | — | 40 MHz |
| Program Memory Size | — | 16KB (16K x 8) |
| Program Memory Type | — | FLASH |
| EEPROM Size | — | 256 x 8 |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 16 |
| Interrupt/Reset Sources | — | Up to 32 |
| Packaging | — | Tube |
| Special Module | — | Embedded Slave LIN Interface Controller (SLIC) |
| Instruction Set | — | HC08 compatible with added BGND instruction |
| Part Status | — | Obsolete |