SC667112CLC vs MC9S08QD4CSC Perbandingan
Perbandingan bersamaan detil SC667112CLC dari NXP Semiconductors dan MC9S08QD4CSC dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | SC667112CLC | MC9S08QD4CSC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Akhir Hidup |
| Core Architecture | S08 (8-bit CISC) | — |
| Core Family | Freescale/NXP S08 family | — |
| Maximum CPU Frequency | 20 MHz | — |
| Program Memory (Flash) | 16 KB | — |
| Instruction Set Compatibility | Freescale HC08 (upward compatible) | — |
| Bus Architecture | Von Neumann | — |
| Maximum Operating Frequency | 20 MHz | — |
| Operating Voltage Range | [DATA_NEEDED: Vdd range] | — |
| Rentang Suhu Kerja | [DATA_NEEDED: industrial/commercial grade] | — |
| Package Type | LQFP | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Jumlah Pin | [DATA_NEEDED: pin count from LQFP package] | — |
| On-chip Debug | Background Debug Mode (BDM) | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance] | — |
| Manufacturing Status | Rochester Electronics continues supply as authorized aftermarket source | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Frekuensi Bawah Maximum | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| Tegangan Pemuat | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Paket | — | 8-SOIC |
| Packaging | — | Tube |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | — | End of Life (per NXP product page) |