STL35N75LF3 vs NOPB Perbandingan
Perbandingan bersamaan detil STL35N75LF3 dari STMicroelectronics dan NOPB dari Texas Instruments. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
STMicroelectronics
STL35N75LF3 - 35V N-Channel Power MOSFET | STMicroelectronics
STL35N75LF3 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | STL35N75LF3 | NOPB |
|---|---|---|
| Merek | STMicroelectronics | Texas Instruments |
| Kategori | MOSFETs | Logic ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Polarity | N-Channel | — |
| Drain-Source Voltage (VDS) | 35 V | — |
| Continuous Drain Current (ID) | 35 A | — |
| On-Resistance (RDS(on)) | [DATA_NEEDED: RDS(on) value] | — |
| Gate-Source Voltage (VGS) | [DATA_NEEDED: VGS max] | — |
| Gate Charge (Qg) | [DATA_NEEDED: Qg value] | — |
| Power Dissipation (PD) | [DATA_NEEDED: PD value] | — |
| Rentang Suhu Kerja | -55°C to +150°C | — |
| Paket | PowerFLAT 5x6 | — |
| Tipe Mounting | Surface Mount | Surface Mount (packaging dependent on base MPN) |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| ESD Protection | Integrated | — |
| Technology | Strip-layout | — |
| Tahanan Panas, Hubung-lingkungan | [DATA_NEEDED: RthJA value] | — |
| Suffix Type | — | Part-number ordering suffix (not a standalone IC) |
| Meaning | — | No Lead / No Pb (lead-free packaging) |
| Origin | — | National Semiconductor ordering system (inherited by TI) |
| Lead Finish | — | Matte tin (Sn) or Sn-Ag-Cu (lead-free) |
| RoHS Compliance | — | Yes - compliant with EU Directive 2011/65/EU |
| REACH Compliance | — | Compliant (per TI declaration) |
| Peak Reflow Temperature | — | 260 C (JEDEC J-STD-020 lead-free profile) |
| MSL Classification | — | Per JEDEC J-STD-033 (device-dependent, typically MSL 2 or 3) |
| Suhu Kerja | — | Inherits base MPN specification |
| Equivalent Legacy Suffixes | — | /PBFREE, /LEADFREE, /LF (vendor-specific) |
| Functional Equivalence | — | Identical die and electrical specs to non-NOPB variant |
| Backwards Compatibility | — | Compatible with Sn-Pb and lead-free assembly lines when reflow profiled correctly |
| Document Reference | — | TI Packaging Terminology Guide (ti.com/design-development/packaging) |
| Country of Origin | — | Multiple (per base MPN country of assembly) |