STL35N75LF3 vs NOPB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci STL35N75LF3 disebabkan oleh STMicroelectronics dan NOPB disebabkan oleh Texas Instruments. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
STMicroelectronics
STL35N75LF3 - 35V N-Channel Power MOSFET | STMicroelectronics
STL35N75LF3 ✓ AktifPengandingan Spesifikasi
| Parametr | STL35N75LF3 | NOPB |
|---|---|---|
| Merek | STMicroelectronics | Texas Instruments |
| Kategori | MOSFETs | Logic ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Polarity | N-Channel | — |
| Drain-Source Voltage (VDS) | 35 V | — |
| Continuous Drain Current (ID) | 35 A | — |
| On-Resistance (RDS(on)) | [DATA_NEEDED: RDS(on) value] | — |
| Gate-Source Voltage (VGS) | [DATA_NEEDED: VGS max] | — |
| Gate Charge (Qg) | [DATA_NEEDED: Qg value] | — |
| Power Dissipation (PD) | [DATA_NEEDED: PD value] | — |
| Gambaran Suhu Operasi | -55°C to +150°C | — |
| Kemasan | PowerFLAT 5x6 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (packaging dependent on base MPN) |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| ESD Protection | Integrated | — |
| Technology | Strip-layout | — |
| Tegangan Panas, Hubungan ke Lingkungan | [DATA_NEEDED: RthJA value] | — |
| Suffix Type | — | Part-number ordering suffix (not a standalone IC) |
| Meaning | — | No Lead / No Pb (lead-free packaging) |
| Origin | — | National Semiconductor ordering system (inherited by TI) |
| Lead Finish | — | Matte tin (Sn) or Sn-Ag-Cu (lead-free) |
| RoHS Compliance | — | Yes - compliant with EU Directive 2011/65/EU |
| REACH Compliance | — | Compliant (per TI declaration) |
| Peak Reflow Temperature | — | 260 C (JEDEC J-STD-020 lead-free profile) |
| MSL Classification | — | Per JEDEC J-STD-033 (device-dependent, typically MSL 2 or 3) |
| Suhu Operasi | — | Inherits base MPN specification |
| Equivalent Legacy Suffixes | — | /PBFREE, /LEADFREE, /LF (vendor-specific) |
| Functional Equivalence | — | Identical die and electrical specs to non-NOPB variant |
| Backwards Compatibility | — | Compatible with Sn-Pb and lead-free assembly lines when reflow profiled correctly |
| Document Reference | — | TI Packaging Terminology Guide (ti.com/design-development/packaging) |
| Country of Origin | — | Multiple (per base MPN country of assembly) |