STL35N75LF3 vs NOPB Karşılaştırma
Ayrıntılı yan yana karşılaştırma STL35N75LF3 tarafından STMicroelectronics ve NOPB tarafından Texas InstrumentsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
STMicroelectronics
STL35N75LF3 - 35V N-Channel Power MOSFET | STMicroelectronics
STL35N75LF3 ✓ AktifÖzellik Karşılaştırması
| Parametre | STL35N75LF3 | NOPB |
|---|---|---|
| Marka | STMicroelectronics | Texas Instruments |
| Kategori | MOSFETs | Logic ICs |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Polarity | N-Channel | — |
| Drain-Source Voltage (VDS) | 35 V | — |
| Continuous Drain Current (ID) | 35 A | — |
| On-Resistance (RDS(on)) | [DATA_NEEDED: RDS(on) value] | — |
| Gate-Source Voltage (VGS) | [DATA_NEEDED: VGS max] | — |
| Gate Charge (Qg) | [DATA_NEEDED: Qg value] | — |
| Power Dissipation (PD) | [DATA_NEEDED: PD value] | — |
| İşletim Sıcaklığı Aralığı | -55°C to +150°C | — |
| Paket | PowerFLAT 5x6 | — |
| Montaj Türü | Surface Mount | Surface Mount (packaging dependent on base MPN) |
| RoHS Durumu | Compliant | — |
| Lead-Free | Yes | — |
| ESD Protection | Integrated | — |
| Technology | Strip-layout | — |
| Jantten Ortama Termal Direnç | [DATA_NEEDED: RthJA value] | — |
| Suffix Type | — | Part-number ordering suffix (not a standalone IC) |
| Meaning | — | No Lead / No Pb (lead-free packaging) |
| Origin | — | National Semiconductor ordering system (inherited by TI) |
| Lead Finish | — | Matte tin (Sn) or Sn-Ag-Cu (lead-free) |
| RoHS Compliance | — | Yes - compliant with EU Directive 2011/65/EU |
| REACH Compliance | — | Compliant (per TI declaration) |
| Peak Reflow Temperature | — | 260 C (JEDEC J-STD-020 lead-free profile) |
| MSL Classification | — | Per JEDEC J-STD-033 (device-dependent, typically MSL 2 or 3) |
| İşletim Sıcaklığı | — | Inherits base MPN specification |
| Equivalent Legacy Suffixes | — | /PBFREE, /LEADFREE, /LF (vendor-specific) |
| Functional Equivalence | — | Identical die and electrical specs to non-NOPB variant |
| Backwards Compatibility | — | Compatible with Sn-Pb and lead-free assembly lines when reflow profiled correctly |
| Document Reference | — | TI Packaging Terminology Guide (ti.com/design-development/packaging) |
| Country of Origin | — | Multiple (per base MPN country of assembly) |