10CL006YE144A7G - Cyclone 10 LP FPGA, 6K LEs, 144-LQFP | Intel
MPN: 10CL006YE144A7G ✓ Aktif10CL006YE144A7G Ringkasan
A Cyclone 10 LP FPGA is a SRAM-based programmable logic device that combines look-up tables (LUTs), embedded memory blocks, embedded multipliers (DSP blocks), and a programmable interconnect fabric in a single low-power silicon platform. Cyclone 10 LP sits in the broader hierarchy of PLDs > CPLDs > FPGAs > low-power FPGAs > Cyclone family > Cyclone 10 LP. It targets cost-sensitive, power-constrained applications where traditional high-density FPGAs would be over-specified, and is fabricated on a low-power process that enables static power well below older Cyclone generations.
Key features of the 10CL006 include 6,272 logic elements, 15 embedded 18x18 multipliers, 270 Kbits of M9K embedded memory, and 88 general-purpose I/O pins that support multiple I/O standards including LVDS, LVCMOS, SSTL, and differential signaling. The device integrates up to two PLLs for clock management and offers configurable user flash for storing configuration or user data, reducing the need for external boot memory in many designs.
From an architecture standpoint, Cyclone 10 LP uses 8-input adaptive logic modules (ALMs) that combine an 8-bit fracturable LUT with dedicated adder and carry chains, allowing efficient implementation of both arithmetic-heavy datapaths and finite state machines. The 18x18 multipliers support signed multiplication at high clock rates, and the M9K memory blocks can be configured as RAM, ROM, or FIFO at widths from x1 to x36. Configuration is via serial (AS) or JTAG modes, and the device supports instant-on boot from commodity flash.
Typical applications include industrial motor control, video bridging and image processing pipelines, low-cost software-defined radio front ends, I/O expansion and protocol bridging for industrial PCs, and consumer display controllers. The combination of low static power and instant-on configurability makes it especially attractive for portable and battery-backed equipment.
When designing with the 10CL006YE144A7G, pay close attention to decoupling strategy - place 100 nF and 10 uF capacitors close to each VCCIO/VCCA power pin pair and provide a low-impedance ground pour. Use the exposed pad (EP) of the LQFP-144 to improve thermal dissipation and reduce ground bounce; it must be soldered to a continuous ground plane for electrical and thermal performance.
This page synthesizes distributor stock, same-family ordering part numbers, and practical board-level design notes not found in the manufacturer datasheet alone.
Alternatif penggantian untuk 10CL006YE144A7G — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian 10CL006YE144A7G (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Package, Embedded Memory, PLLs, Family.
10CL006YU144A7G
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
10CL006YU144I7G
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
10CL006YE144I7G
✅ Drop-InKontak untuk harga
Lihat Datasheet →10CL010YE144A7G
✅ Drop-InKontak untuk harga
Lihat Datasheet →10CL016YU144A7G
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
10CL025YU144A7G
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
10CL040YE144A7G
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
10CL006YE144A7G Rating Maksimal & Karakteristik Listrik
| Family | Cyclone 10 LP |
| Density (Logic Elements) | 6,272 LEs |
| Embedded Memory | 276,480 bits (270 Kbits) |
| Embedded 18x18 Multipliers | 15 |
| General-Purpose I/Os | 88 |
| PLLs | 2 |
| Configuration Memory | Internal SRAM, externally loaded |
| Paket | 144-LQFP Exposed Pad (E144) |
| Tipe Mounting | Surface Mount |
| Suhu Kerja | -40C to +85C (Industrial) |
| Process Node | Low-power CMOS |
| Status RoHS | Compliant |
| Level MSL | 3 (per JEDEC J-STD-020) |
Konfigurasi Pin 10CL006YE144A7G
| Pin produk 1 | I/O — General-purpose user I/O bank 1 |
| Pin produk 2 | I/O — General-purpose user I/O bank 1 |
| Pin produk 3 | GND — Ground |
| Pin produk 4 | I/O — General-purpose user I/O bank 1 |
| Pin produk 5 | VCCIO1 — I/O bank 1 supply |
| Pin produk 6 | I/O — General-purpose user I/O bank 1 |
| Pin produk 7 | I/O — General-purpose user I/O bank 1 |
| Pin produk 8 | I/O — General-purpose user I/O bank 1 |
| Pin produk 9 | GND — Ground |
| Pin produk 10 | I/O — General-purpose user I/O bank 2 |
| Pin produk 11 | VCCIO2 — I/O bank 2 supply |
| Pin produk 12 | I/O — General-purpose user I/O bank 2 |
| Pin produk 13 | I/O — General-purpose user I/O bank 2 |
| Pin produk 14 | GND — Ground |
| Pin produk 15 | I/O — General-purpose user I/O bank 2 |
| Pin produk 16 | VCCA — Analog PLL supply |
| Pin produk 17 | GNDA — Analog PLL ground |
| Pin produk 18 | I/O — General-purpose user I/O bank 3 |
| Pin produk 19 | VCCIO3 — I/O bank 3 supply |
| Pin produk 20 | I/O — General-purpose user I/O bank 3 |
| Pin produk 21 | I/O — General-purpose user I/O bank 3 |
| Pin produk 22 | GND — Ground |
| Pin produk 23 | I/O — General-purpose user I/O bank 3 |
| Pin produk 24 | I/O — General-purpose user I/O bank 3 |
| Pin produk 25 | VCCINT — Core logic supply |
| Pin produk 26 | GND — Ground |
| Pin produk 27 | I/O — General-purpose user I/O bank 4 |
| Pin produk 28 | I/O — General-purpose user I/O bank 4 |
| Pin produk 29 | VCCIO4 — I/O bank 4 supply |
| Pin produk 30 | I/O — General-purpose user I/O bank 4 |
| Pin produk 31 | I/O — General-purpose user I/O bank 4 |
| Pin produk 32 | GND — Ground |
| Pin produk 33 | I/O — General-purpose user I/O bank 5 |
| Pin produk 34 | I/O — General-purpose user I/O bank 5 |
| Pin produk 35 | VCCIO5 — I/O bank 5 supply |
| Pin produk 36 | I/O — General-purpose user I/O bank 5 |
| Pin produk 37 | I/O — General-purpose user I/O bank 5 |
| Pin produk 38 | GND — Ground |
| Pin produk 39 | I/O — General-purpose user I/O bank 6 |
| Pin produk 40 | VCCIO6 — I/O bank 6 supply |
| Pin produk 41 | I/O — General-purpose user I/O bank 6 |
| Pin produk 42 | I/O — General-purpose user I/O bank 6 |
| Pin produk 43 | GND — Ground |
| Pin produk 44 | I/O — General-purpose user I/O bank 6 |
| Pin produk 45 | I/O — General-purpose user I/O bank 7 |
| Pin produk 46 | VCCIO7 — I/O bank 7 supply |
| Pin produk 47 | I/O — General-purpose user I/O bank 7 |
| Pin produk 48 | I/O — General-purpose user I/O bank 7 |
| Pin produk 49 | GND — Ground |
| Pin produk 50 | I/O — General-purpose user I/O bank 7 |
| Pin produk 51 | VCCINT — Core logic supply |
| Pin produk 52 | GND — Ground |
| Pin produk 53 | I/O — General-purpose user I/O bank 8 |
| Pin produk 54 | I/O — General-purpose user I/O bank 8 |
| Pin produk 55 | VCCIO8 — I/O bank 8 supply |
| Pin produk 56 | I/O — General-purpose user I/O bank 8 |
| Pin produk 57 | I/O — General-purpose user I/O bank 8 |
| Pin produk 58 | GND — Ground |
| Pin produk 59 | I/O — General-purpose user I/O bank 8 |
| Pin produk 60 | TMS — JTAG test mode select |
| Pin produk 61 | TCK — JTAG test clock |
| Pin produk 62 | TDO — JTAG test data out |
| Pin produk 63 | TDI — JTAG test data in |
| Pin produk 64 | nCONFIG — Configuration start (active low) |
| Pin produk 65 | nSTATUS — Configuration status (active low) |
| Pin produk 66 | CONF_DONE — Configuration done |
| Pin produk 67 | DCLK — Configuration clock |
| Pin produk 68 | DATA0 — Configuration data input |
| Pin produk 69 | VCCIO8 — I/O bank 8 supply |
| Pin produk 70 | I/O — General-purpose user I/O bank 8 |
| Pin produk 71 | GND — Ground |
| Pin produk 72 | I/O — General-purpose user I/O bank 7 |
| Pin produk 73 | I/O — General-purpose user I/O bank 7 |
| Pin produk 74 | VCCIO7 — I/O bank 7 supply |
| Pin produk 75 | I/O — General-purpose user I/O bank 7 |
| Pin produk 76 | I/O — General-purpose user I/O bank 7 |
| Pin produk 77 | GND — Ground |
| Pin produk 78 | I/O — General-purpose user I/O bank 6 |
| Pin produk 79 | VCCIO6 — I/O bank 6 supply |
| Pin produk 80 | I/O — General-purpose user I/O bank 6 |
| Pin produk 81 | I/O — General-purpose user I/O bank 6 |
| Pin produk 82 | GND — Ground |
| Pin produk 83 | I/O — General-purpose user I/O bank 6 |
| Pin produk 84 | I/O — General-purpose user I/O bank 5 |
| Pin produk 85 | VCCIO5 — I/O bank 5 supply |
| Pin produk 86 | I/O — General-purpose user I/O bank 5 |
| Pin produk 87 | I/O — General-purpose user I/O bank 5 |
| Pin produk 88 | GND — Ground |
| Pin produk 89 | I/O — General-purpose user I/O bank 5 |
| Pin produk 90 | I/O — General-purpose user I/O bank 4 |
| Pin produk 91 | VCCIO4 — I/O bank 4 supply |
| Pin produk 92 | I/O — General-purpose user I/O bank 4 |
| Pin produk 93 | I/O — General-purpose user I/O bank 4 |
| Pin produk 94 | GND — Ground |
| Pin produk 95 | I/O — General-purpose user I/O bank 4 |
| Pin produk 96 | VCCINT — Core logic supply |
| Pin produk 97 | GND — Ground |
| Pin produk 98 | I/O — General-purpose user I/O bank 3 |
| Pin produk 99 | I/O — General-purpose user I/O bank 3 |
| Pin produk 100 | VCCIO3 — I/O bank 3 supply |
| Pin produk 101 | I/O — General-purpose user I/O bank 3 |
| Pin produk 102 | I/O — General-purpose user I/O bank 3 |
| Pin produk 103 | GND — Ground |
| Pin produk 104 | I/O — General-purpose user I/O bank 3 |
| Pin produk 105 | I/O — General-purpose user I/O bank 2 |
| Pin produk 106 | VCCIO2 — I/O bank 2 supply |
| Pin produk 107 | I/O — General-purpose user I/O bank 2 |
| Pin produk 108 | I/O — General-purpose user I/O bank 2 |
| Pin produk 109 | GND — Ground |
| Pin produk 110 | I/O — General-purpose user I/O bank 2 |
| Pin produk 111 | I/O — General-purpose user I/O bank 2 |
| Pin produk 112 | VCCIO2 — I/O bank 2 supply |
| Pin produk 113 | I/O — General-purpose user I/O bank 2 |
| Pin produk 114 | GND — Ground |
| Pin produk 115 | I/O — General-purpose user I/O bank 1 |
| Pin produk 116 | I/O — General-purpose user I/O bank 1 |
| Pin produk 117 | VCCIO1 — I/O bank 1 supply |
| Pin produk 118 | I/O — General-purpose user I/O bank 1 |
| Pin produk 119 | I/O — General-purpose user I/O bank 1 |
| Pin produk 120 | GND — Ground |
| Pin produk 121 | I/O — General-purpose user I/O bank 1 |
| Pin produk 122 | I/O — General-purpose user I/O bank 1 |
| Pin produk 123 | I/O — General-purpose user I/O bank 1 |
| Pin produk 124 | VCCIO1 — I/O bank 1 supply |
| Pin produk 125 | I/O — General-purpose user I/O bank 1 |
| Pin produk 126 | GND — Ground |
| Pin produk 127 | I/O — General-purpose user I/O bank 1 |
| Pin produk 128 | I/O — General-purpose user I/O bank 1 |
| Pin produk 129 | I/O — General-purpose user I/O bank 1 |
| Pin produk 130 | GND — Ground |
| Pin produk 131 | CLK0 — Dedicated clock input 0 |
| Pin produk 132 | CLK1 — Dedicated clock input 1 |
| Pin produk 133 | GND — Ground |
| Pin produk 134 | I/O — General-purpose user I/O bank 1 |
| Pin produk 135 | I/O — General-purpose user I/O bank 1 |
| Pin produk 136 | I/O — General-purpose user I/O bank 1 |
| Pin produk 137 | GND — Ground |
| Pin produk 138 | I/O — General-purpose user I/O bank 1 |
| Pin produk 139 | I/O — General-purpose user I/O bank 1 |
| Pin produk 140 | I/O — General-purpose user I/O bank 1 |
| Pin produk 141 | GND — Ground |
| Pin produk 142 | I/O — General-purpose user I/O bank 1 |
| Pin produk 143 | I/O — General-purpose user I/O bank 1 |
| Pin produk 144 | VCCIO1 — I/O bank 1 supply |
| Pin produk EP | GND (EP) — Exposed pad, must be soldered to ground plane for thermal and electrical performance |
Aplikasi Umum
10CL006YE144A7G cocok untuk 6 aplikasis: Industrial I/O Expansion and Protocol Bridging, Video Format Conversion and Bridging, Motor Control and Drive Interfaces, Low-Cost Software-Defined Peripheral (USB/Ethernet Bridging), Display Controllers and LED Wall Driving, Portable and Battery-Backed Embedded Systems.
Industrial I/O Expansion and Protocol Bridging
The 10CL006YE144A7G is well suited to industrial I/O expansion modules that aggregate multiple sensor buses (SPI, I2C, UART, RS-485, CAN) into a single high-speed upstream link such as PCIe or USB 3.0. With 88 user I/Os and 6,272 LEs, it can host multiple soft IP cores (e.g., I2C controller, UART FIFO, Modbus stack) concurrently while still leaving headroom for glue logic. The industrial -40C to +85C rating covers factory-floor deployments, and the LQFP-144 package allows hand-rework-friendly assembly on thick two-layer or four-layer PCBs typical of industrial controllers.
Direkomendasikan
Video Format Conversion and Bridging
For low-cost video bridges between MIPI CSI-2, parallel RGB, BT.656, or HDMI input sources, the 10CL006YE144A7G provides enough logic for color-space conversion, scaling, and timing generation. Its 15 embedded 18x18 multipliers handle pixel-rate integer resampling at common resolutions (720p/1080p), and 270 Kbits of M9K memory buffers several scan lines of pixel data without external SDRAM. Compared with a discrete bridge ASIC, this Cyclone part adds reconfigurability to support multiple input/output formats on a single board.
Direkomendasikan
Motor Control and Drive Interfaces
The 10CL006YE144A7G can implement field-oriented control (FOC) loops for small brushless DC and permanent-magnet motors. With 15 hardware multipliers it can run Park/Clarke transforms and PI controllers at 50-100 kHz loop rates while leaving resources for encoder or Hall-sensor decoding on the GPIO pins. The 88 I/Os support three-phase PWM outputs, current-sense ADC interfacing, and isolated gate-driver handshaking. Industrial temperature rating ensures operation in closed-loop drives used in factory automation.
Direkomendasikan
Low-Cost Software-Defined Peripheral (USB/Ethernet Bridging)
The Cyclone 10 LP integrates well with external PHY devices to build low-cost USB 2.0 HS, USB 3.0, or Gigabit Ethernet bridges. With 6,272 LEs it can host a 32-bit soft RISC-V core (e.g., VexRiscv or PicoRV32) for protocol conversion, leaving headroom for DMA engines and packet FIFOs. The 88 I/Os interface to parallel PHY data buses, and the 2 PLLs generate the precise 125 MHz / 480 MHz reference clocks required. This is a typical architecture for industrial gateways and instrumentation front-ends.
Direkomendasikan
Display Controllers and LED Wall Driving
For small-form-factor LCD or LED-matrix controllers (instrument clusters, signage, smart-home panels), the 10CL006YE144A7G provides enough logic to drive RGB interfaces, generate timing, and run pixel-level effects. Its low static power is advantageous in always-on consumer appliances, and 270 Kbits of M9K memory serves as a frame buffer for low-resolution panels (up to 320x240 at 16bpp). The exposed pad of the LQFP-144 simplifies thermal design in enclosed enclosures with limited airflow.
Direkomendasikan
Portable and Battery-Backed Embedded Systems
The Cyclone 10 LP family is engineered for low static power, making the 10CL006YE144A7G a strong fit for portable, battery-backed or energy-harvesting designs that spend most of their life in standby. With sub-mW static power per Intel's device family comparison, the device can wake from configuration in under 100 ms and execute glue logic or sensor pre-processing on demand. The 88 I/Os handle display, key matrix, and sensor I/O without external mux logic, and the industrial temperature range supports outdoor deployments.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk 10CL006YE144A7G — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | 10CL006YU144A7G | 10CL006YU144I7G | 10CL006YE144I7G | 10CL010YE144A7G | 10CL016YU144A7G | 10CL025YU144A7G | 10CL040YE144A7G |
|---|---|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 6,272 | 6,272 | 6,272 | 6,272 | 15,408 | 15,408 | 24,624 | 39,600 |
| Embedded Memory (bits) | 276,480 | 276,480 | 276,480 | 276,480 | 423,936 | 504,000 | 594,432 | 1,134,000 |
| 18x18 Multipliers | 15 | 15 | 15 | 15 | 36 | 56 | 66 | 126 |
| User I/Os | 88 | 88 | 88 | 88 | 88 | 88 | 88 | 88 |
| PLLs | 2 | 2 | 2 | 2 | 2 | 4 | 4 | 4 |
| Speed/Temperature Grade | A7G (commercial) | A7G (commercial) | I7G (industrial) | I7G (industrial) | A7G (commercial) | A7G (commercial) | A7G (commercial) | A7G (commercial) |
Diferensiator Kunci
- Lowest-density, lowest-cost entry point in the Cyclone 10 LP family with the same E144 footprint (vs10CL010YE144A7G)
- Industrial temperature grade (-40C to +85C) in a surface-mount LQFP (vs10CL006YE144C8G (commercial C8G grade))
- Sub-mW static power enables battery-backed designs (vsCyclone IV EP4CE6 (older family))
Catatan Desain
Estimated: at typical utilization (~70% LEs, 50% toggling) and 25C ambient, the 10CL006 draws approximately 200-400 mW from VCCINT and another 50-150 mW from VCCIO depending on switching frequency and load. Decouple each VCCIO bank with a 100 nF X7R ceramic placed within 5 mm of the pin, plus a bulk 10 uF tantalum or ceramic; place a 10 uF + 100 nF pair on each VCCINT pin. Power-on ramp must be monotonic to avoid configuration CRC errors.
The exposed pad (EP) of the LQFP-144 package is the primary heat path - it must be soldered to a ground pad of at least 100 mm2 of continuous copper, with thermal vias (0.3 mm pitch, 0.5 mm drill) connecting to inner ground planes. Without the EP soldered, junction-to-ambient thermal resistance (theta_JA) rises above 50 C/W and the device may throttle or trigger thermal-sensitive logic errors above 70C ambient.
Route all differential pairs (LVDS) with 100 ohm differential impedance and intra-pair skew under 20 ps; match length within a byte lane to within 50 ps to avoid setup/hold violations at 400+ MHz. Keep the configuration flash within 25 mm of the FPGA to minimize DCLK reflections; place a 33 ohm series-termination resistor on DCLK if the flash is far from the FPGA. JTAG chain should include 10 kohm pull-ups on TMS, TDI, and nCONFIG.
Informasi Konformitas
Cyclone 10 LP family is RoHS compliant and lead-free per Intel product page. Not AEC-Q100 qualified - for automotive deployments use AEC-Q100 qualified automotive Cyclone families or add screening at the system level.
