Microchip Technology

ATSAM4SD16CB-CN - 120MHz Cortex-M4 MCU, 1MB Flash | Microchip

MPN: ATSAM4SD16CB-CN ✓ Aktif

1.62 V to 3.6 V Vdss 100-ball TFBGA, 9x9 mm, 0.8 mm ball pitch Package 120 MHz Speed 1 MB (dual-bank, 2x 512 KB) Memory

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Lihat Datasheet (PDF) Lihat Alternatif

Kuantitas

ATSAM4SD16CB-CN Ringkasan

The Microchip ATSAM4SD16CB-CN is a 32-bit ARM Cortex-M4 microcontroller running at 120MHz with a single-precision hardware FPU and DSP extensions, integrating 1MB of dual-bank Flash and 160KB of SRAM in a 100-ball TFBGA (9x9 mm) package. The device is revision B of the SAM4S family, which the manufacturer recommends for new designs and prototypes, and it operates from a 1.62V to 3.6V supply across the -40C to +105C extended industrial temperature range.

What is a Cortex-M4 microcontroller? A Cortex-M4 MCU is a 32-bit embedded controller built around the ARM Cortex-M4 processor core, which includes a single-precision floating-point unit, DSP extensions (MAC, SIMD), and the deterministic NVIC interrupt controller. It sits in the hierarchy Cortex-M4 -> ARM Cortex-M -> 32-bit MCU -> microcontroller -> semiconductor, and compared with Cortex-M0/M3 parts it adds hardware floating-point and DSP instructions that accelerate signal-processing and control-loop code without software FPU libraries.

Key features include 1MB of embedded Flash organized as two independent 512KB banks, 160KB SRAM, up to five USARTs, three UARTs, two TWI (I2C) ports, three SPIs, one HSMCI (SD card) interface, one USB 2.0 Full-Speed device port, and a 12-bit ADC with up to 16 analog channels. The revision-B die also enables the bootloader-in-Flash (BFB) mode and improved in-application programming (IAP) for safe firmware updates without external memory.

Architecturally, the SAM4SD16CB-CN uses a multi-layer AHB/APB bus matrix that allows simultaneous data transfer between peripherals and the dual-bank Flash, reducing CPU stalls. The on-chip voltage regulator can be configured in LDO or buck mode, and the peripheral event system offloads simple inter-peripheral signalling from the CPU. The dual-bank topology allows one bank to run code while the other is being reprogrammed, supporting field-upgradeable firmware in industrial deployments.

Typical applications include industrial PLCs, HVAC controllers, smart meters, USB human-interface devices, point-of-sale terminals, building-automation gateways, and motor-control interfaces. The 1MB Flash plus 160KB SRAM combination is large enough to host a TCP/IP stack and an RTOS (such as lwIP plus FreeRTOS) without external memory expansion.

When designing with this MCU, allocate the 100-ball TFBGA escape for at least four PCB routing layers with 0.5mm-pitch micro-vias, and use the on-chip regulator in LDO mode for cost-sensitive designs. Place a 100nF decoupling capacitor within 5mm of the AVDD pin and use a dedicated analog ground plane to meet the 12-bit ADC ENOB specifications; this page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet.

Alternatif penggantian untuk ATSAM4SD16CB-CN — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian ATSAM4SD16CB-CN (sama faktor bentuk dan footprint) — berbeda di dalam ADC, Mounting Type, Operating Temperature, Package, SRAM.

ATSAM4SD16CB-ANR

Microchip Technology

ADC: 8-channel, 10-bit

Mounting Type: Surface Mount

Operating Temperature: -40C to +105C (extended)

Bandingkan dengan ATSAM4SD16CB-CN →

ATSAM4SD16CB-CFN

Microchip Technology

ADC: 12-bit, up to 24 channels, 1 Msps

Mounting Type: Surface Mount (BGA, reflow only)

Operating Temperature: -40C to +85C (extended industrial)

Bandingkan dengan ATSAM4SD16CB-CN →

ATSAM4SD16CA-CN

✅ Drop-In

📦 100-ball TFBGA 9x9 mm

same 100-ball TFBGA 9x9 mm footprint, pin-to-pin compatible, but revision A silicon (Microchip recommends revision B for new designs)

📋 Alternatif referensi (tidak dalam katalog)

ATSAM4SD16CB-CFN

✅ Drop-In

Microchip Technology

📦 100-ball TFBGA 9x9 mm

ARM Cortex-M4 (ARMv7-M) with FPU and DSP extensions · 120 MHz · 1 MB (1M x 8), dual-bank · 160 KB (100 KB SRAM0 + 60 KB SRAM1) · 100-ball VFBGA (7x7 mm) · 1.2 V core / 3.3 V I/O (1.62-3.6 V I/O range) · -40C to +85C (extended industrial) · USB 2.0 Full-Speed Device with on-chip PHY

Kontak untuk harga

Lihat Datasheet →

ATSAM4S16CB-CN

✅ Drop-In

📦 100-ball TFBGA 9x9 mm

same 100-ball TFBGA 9x9 mm footprint and pinout, but Flash reduced from 1MB to 512KB (-50% memory, pin-to-pin otherwise)

📋 Alternatif referensi (tidak dalam katalog)

ATSAM4SD16CB-ANR

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan

Microchip Technology

📦 LQFP-64

ARM Cortex-M4F (32-bit RISC, with FPU) · 120 MHz · 1 MB (2 x 512 KB dual-bank) · 160 KB · 1.62 V to 3.6 V · 100-LQFP (14 x 14 mm) · -40C to +105C (extended) · USB 2.0 Full-Speed Device, embedded transceiver

Kontak untuk harga

Lihat Datasheet →

ATSAM4SD16CB-CN Rating Maksimal & Karakteristik Listrik

Core	ARM Cortex-M4 with FPU and DSP
Frekuensi Bawah Maximum	120 MHz
Program Memory (Flash)	1 MB (dual-bank, 2x 512 KB)
SRAM	160 KB
Supply Voltage (VDDIO/VDDCORE)	1.62 V to 3.6 V
Suhu Kerja	-40 C to +105 C (extended industrial, 'CN' designator)
Paket	100-ball TFBGA, 9x9 mm, 0.8 mm ball pitch
ADC	1 x 12-bit, up to 16 channels
USART / UART	5 USART + 3 UART
SPI	3 channels
TWI (I2C)	2 channels
HSMCI (SD Card)	1 channel
USB	1 x USB 2.0 Full-Speed device
Tipe Mounting	Surface Mount (BGA)
Die Revision	Revision B (recommended for new designs)
Level MSL	3
Status RoHS	Compliant
On-chip Regulator	LDO or Buck mode (selectable)

Konfigurasi Pin ATSAM4SD16CB-CN

Pin produk A1	VDDIO — I/O supply voltage (1.62V to 3.6V)
Pin produk A2	PA0 — GPIO / peripheral I/O
Pin produk A3	PA1 — GPIO / peripheral I/O
Pin produk A4	PA2 — GPIO / peripheral I/O
Pin produk A5	PA3 — GPIO / peripheral I/O
Pin produk A6	PA4 — GPIO / peripheral I/O
Pin produk A7	PA5 — GPIO / peripheral I/O
Pin produk A8	PA6 — GPIO / peripheral I/O
Pin produk A9	PA7 — GPIO / peripheral I/O
Pin produk A10	PA8 — GPIO / peripheral I/O
Pin produk A11	PA9 — GPIO / peripheral I/O
Pin produk B1	GND — Ground
Pin produk B2	VDDCORE — Core supply (internal LDO output)
Pin produk B3	PB0 — GPIO / peripheral I/O
Pin produk B4	PB1 — GPIO / peripheral I/O
Pin produk B5	PB2 — GPIO / peripheral I/O
Pin produk B6	PB3 — GPIO / peripheral I/O
Pin produk B7	PB4 — GPIO / peripheral I/O
Pin produk B8	PB5 — GPIO / peripheral I/O
Pin produk B9	PB6 — GPIO / peripheral I/O
Pin produk B10	PB7 — GPIO / peripheral I/O
Pin produk B11	PB8 — GPIO / peripheral I/O
Pin produk C1	GND — Ground
Pin produk C2	VDDIO — I/O supply voltage
Pin produk C3	PB9 — GPIO / peripheral I/O
Pin produk C4	PB10 — GPIO / peripheral I/O
Pin produk C5	PB11 — GPIO / peripheral I/O
Pin produk C6	PB12 — GPIO / peripheral I/O
Pin produk C7	PB13 — GPIO / peripheral I/O
Pin produk C8	PB14 — GPIO / peripheral I/O
Pin produk C9	PB15 — GPIO / peripheral I/O
Pin produk C10	PC0 — GPIO / peripheral I/O
Pin produk C11	PC1 — GPIO / peripheral I/O
Pin produk D1	GND — Ground
Pin produk D2	GND — Ground
Pin produk D3	PC2 — GPIO / peripheral I/O
Pin produk D4	PC3 — GPIO / peripheral I/O
Pin produk D5	PC4 — GPIO / peripheral I/O
Pin produk D6	PC5 — GPIO / peripheral I/O
Pin produk D7	PC6 — GPIO / peripheral I/O
Pin produk D8	PC7 — GPIO / peripheral I/O
Pin produk D9	PC8 — GPIO / peripheral I/O
Pin produk D10	PC9 — GPIO / peripheral I/O
Pin produk D11	PC10 — GPIO / peripheral I/O
Pin produk E1	GND — Ground
Pin produk E2	AVDD — Analog supply for ADC
Pin produk E3	ADVREF — ADC reference voltage
Pin produk E4	PC11 — GPIO / peripheral I/O
Pin produk E5	PC12 — GPIO / peripheral I/O
Pin produk E6	PC13 — GPIO / peripheral I/O
Pin produk E7	PC14 — GPIO / peripheral I/O
Pin produk E8	PC15 — GPIO / peripheral I/O
Pin produk E9	PC16 — GPIO / peripheral I/O
Pin produk E10	PC17 — GPIO / peripheral I/O
Pin produk E11	PC18 — GPIO / peripheral I/O
Pin produk F1	GND — Ground
Pin produk F2	GND — Ground
Pin produk F3	AD0 — Analog input channel 0
Pin produk F4	AD1 — Analog input channel 1
Pin produk F5	PD0 — GPIO / peripheral I/O
Pin produk F6	PD1 — GPIO / peripheral I/O
Pin produk F7	PD2 — GPIO / peripheral I/O
Pin produk F8	PD3 — GPIO / peripheral I/O
Pin produk F9	PD4 — GPIO / peripheral I/O
Pin produk F10	PD5 — GPIO / peripheral I/O
Pin produk F11	PD6 — GPIO / peripheral I/O
Pin produk G1	GND — Ground
Pin produk G2	GND — Ground
Pin produk G3	AD2 — Analog input channel 2
Pin produk G4	AD3 — Analog input channel 3
Pin produk G5	PD7 — GPIO / peripheral I/O
Pin produk G6	PD8 — GPIO / peripheral I/O
Pin produk G7	PD9 — GPIO / peripheral I/O
Pin produk G8	PD10 — GPIO / peripheral I/O
Pin produk G9	PD11 — GPIO / peripheral I/O
Pin produk G10	PD12 — GPIO / peripheral I/O
Pin produk G11	PD13 — GPIO / peripheral I/O
Pin produk H1	GND — Ground
Pin produk H2	GND — Ground
Pin produk H3	AD4 — Analog input channel 4
Pin produk H4	AD5 — Analog input channel 5
Pin produk H5	PD14 — GPIO / peripheral I/O
Pin produk H6	PD15 — GPIO / peripheral I/O
Pin produk H7	PD16 — GPIO / peripheral I/O
Pin produk H8	PD17 — GPIO / peripheral I/O
Pin produk H9	PD18 — GPIO / peripheral I/O
Pin produk H10	PD19 — GPIO / peripheral I/O
Pin produk H11	PD20 — GPIO / peripheral I/O
Pin produk J1	GND — Ground
Pin produk J2	GND — Ground
Pin produk J3	AD6 — Analog input channel 6
Pin produk J4	AD7 — Analog input channel 7
Pin produk J5	PD21 — GPIO / peripheral I/O
Pin produk J6	PD22 — GPIO / peripheral I/O
Pin produk J7	PD23 — GPIO / peripheral I/O
Pin produk J8	PD24 — GPIO / peripheral I/O
Pin produk J9	PD25 — GPIO / peripheral I/O
Pin produk J10	PD26 — GPIO / peripheral I/O
Pin produk J11	PD27 — GPIO / peripheral I/O
Pin produk K1	GND — Ground
Pin produk K2	NRST — Reset (active low)
Pin produk K3	TDI — JTAG test data in
Pin produk K4	TDO — JTAG test data out
Pin produk K5	TMS — JTAG test mode select
Pin produk K6	TCK — JTAG test clock
Pin produk K7	DDP — USB Full-Speed data plus
Pin produk K8	DDM — USB Full-Speed data minus
Pin produk K9	VBUS — USB VBUS sense
Pin produk K10	VDDIO — I/O supply voltage
Pin produk K11	GND — Ground
Pin produk L1	VDDIO — I/O supply voltage
Pin produk L2	XIN — Crystal oscillator input
Pin produk L3	XOUT — Crystal oscillator output
Pin produk L4	PE0 — GPIO / peripheral I/O
Pin produk L5	PE1 — GPIO / peripheral I/O
Pin produk L6	PE2 — GPIO / peripheral I/O
Pin produk L7	PE3 — GPIO / peripheral I/O
Pin produk L8	PE4 — GPIO / peripheral I/O
Pin produk L9	PE5 — GPIO / peripheral I/O
Pin produk L10	PE6 — GPIO / peripheral I/O
Pin produk L11	PE7 — GPIO / peripheral I/O

Aplikasi Umum

ATSAM4SD16CB-CN cocok untuk 7 aplikasis: Industrial PLC Controllers, USB Human-Interface Devices (HID), Smart Meters and Energy Gateways, Point-of-Sale (POS) Terminals, Building Automation Gateways, Motor-Control Interfaces (FOC, PFC), Connected Sensor Hubs (IoT Edge).

🏭

Industrial PLC Controllers

The ATSAM4SD16CB-CN fits industrial PLC controllers because the 120MHz Cortex-M4 with hardware FPU executes ladder-logic and floating-point control loops at deterministic rates, and the 1MB dual-bank Flash supports field-replaceable IEC 61131-3 program storage with the BFB bootloader-in-Flash mode for safe firmware upgrades. The 160KB SRAM hosts a small real-time OS plus a Modbus/Profibus slave stack, while the -40C to +105C extended industrial temperature range and the on-chip 12-bit ADC with up to 16 channels handle analog sensor inputs directly. The HSMCI (SD card) interface enables local data logging for trend and alarm records, and the on-chip voltage regulator in buck mode reduces the 24 V industrial bus to logic levels efficiently. Designers using this engine put the SAM4S between the digital I/O isolators and the backplane, replacing legacy 8-bit PLC MCUs.

Direkomendasikan

🎧

USB Human-Interface Devices (HID)

The ATSAM4SD16CB-CN fits USB HID designs because the integrated USB 2.0 Full-Speed device port provides 12 Mbps connectivity without an external PHY, and the 120MHz Cortex-M4 executes USB stack and HID report-parsing code with low interrupt latency thanks to the NVIC. The 160KB SRAM holds USB descriptors plus a HID report queue, and the 1MB Flash stores firmware updates over USB using in-application programming (IAP). Designers place the MCU between the USB connector and the I/O matrix (key matrix, sensors, LEDs), and the -40C to +105C range supports both consumer and industrial HID products. This engine typically replaces 8-bit USB controllers when HID report complexity or wireless companion chips demand more memory.

Direkomendasikan

ATSAM4SD16CB-CN · Microchip Technology PIC32MX340F512H-80I/MR · Microchip Technology

⚡

Smart Meters and Energy Gateways

The ATSAM4SD16CB-CN fits smart-energy meters because the 12-bit ADC with 16 channels simultaneously samples voltage, current, and temperature sensors, while the Cortex-M4 with hardware FPU computes RMS power and power-quality metrics without CPU overload. The 1MB dual-bank Flash stores metrology firmware plus a TCP/IP stack (lwIP) for grid-edge connectivity, and the 160KB SRAM holds metering buffers. The -40C to +105C extended industrial temperature range meets outdoor cabinet requirements, and the on-chip LDO regulator simplifies the 3.3V power tree. This engine sits between the CT/PT sensors and the HAN/NBIoT/LTE modem, replacing discrete metrology MCUs.

Direkomendasikan

ATSAM4SD16CB-CN · Microchip Technology ATSAM3U4EA-CU · Microchip Technology

🖥️

Point-of-Sale (POS) Terminals

The ATSAM4SD16CB-CN fits POS terminals because the Cortex-M4 at 120MHz runs the payment application stack and cryptographic libraries, while the 1MB dual-bank Flash stores the secure bootloader and the application image separately for PCI compliance. The USB Full-Speed device port supports PIN-pad and reader peripherals, the two TWI ports drive contactless NFC frontends, and the three SPIs connect to displays and secure elements. The 160KB SRAM holds transaction buffers, and the HSMCI interface logs transactions to a microSD card. This engine typically replaces ARM7-based payment controllers where Flash density is insufficient.

Direkomendasikan

ATSAM4SD16CB-CN · Microchip Technology AT91SAM9260B-CU · Microchip Technology

🌐

Building Automation Gateways

The ATSAM4SD16CB-CN fits building-automation gateways because the multiple USARTs and UARTs drive RS-485 trunks to HVAC and lighting controllers, and the Cortex-M4 at 120MHz runs BACnet or Modbus stacks plus a web server in parallel. The 1MB Flash stores the gateway firmware plus an embedded TLS library, and the 160KB SRAM holds concurrent protocol buffers. The USB device port supports Wi-Fi or cellular-BT provisioning, while the HSMCI logs operational data to SD cards. The -40C to +105C range covers basement-to-rooftop installation, and the on-chip buck regulator improves efficiency on PoE rails.

Direkomendasikan

ATSAM4SD16CB-CN · Microchip Technology AT91SAM9G20B-CU · Microchip Technology

🏭

Motor-Control Interfaces (FOC, PFC)

The ATSAM4SD16CB-CN fits motor-control applications because the Cortex-M4 DSP extensions (MAC, SIMD) execute field-oriented control (FOC) loops with deterministic timing, while the PWM controllers and the 12-bit ADC with up to 16 channels handle three-phase current and voltage sensing. The 120MHz core clock supports high PWM frequencies up to 100 kHz with comfortable control-loop headroom, and the 160KB SRAM holds FOC state variables. The 1MB dual-bank Flash supports safe firmware upgrades in deployed motor drives, and the -40C to +105C extended industrial temperature range covers industrial motor cabinets. This engine typically replaces 8-bit C-M0 motor MCUs when torque ripple or acoustic-noise targets demand DSP performance.

Direkomendasikan

ATSAM4SD16CB-CN · Microchip Technology DSPIC33EP512MC806-E/PT · Microchip Technology

🧩

Connected Sensor Hubs (IoT Edge)

The ATSAM4SD16CB-CN fits connected-sensor hubs because the Cortex-M4 with FPU runs local signal conditioning and edge analytics on multi-sensor inputs, while the 1MB Flash stores the IoT application plus TLS credentials. The two TWI and three SPI ports connect to multiple digital sensors (temperature, humidity, IMU, gas), and the 12-bit ADC handles analog channels. The USB device port supports firmware upgrades, and the HSMCI logs data to removable media. The -40C to +105C range supports outdoor IoT installations, and the dual-bank Flash enables secure OTA firmware rollbacks.

Direkomendasikan

ATSAM4SD16CB-CN · Microchip Technology ATMEGA4809-AUR · Microchip Technology

Ringkasan Produk Direkomendasikan

What is the core architecture of the ATSAM4SD16CB-CN?

The ATSAM4SD16CB-CN is built around an ARM Cortex-M4 processor core with a hardware single-precision floating-point unit and DSP extensions (MAC, SIMD), running at up to 120MHz. According to the Microchip SAM4S datasheet, the Cortex-M4 core includes the NVIC deterministic interrupt subsystem, and the 'CB' suffix identifies this part as revision B of the SAM4SD16 silicon.

How much Flash and SRAM does the ATSAM4SD16CB-CN have?

The ATSAM4SD16CB-CN integrates 1MB of embedded Flash organized as two independent 512KB banks, plus 160KB of SRAM. The dual-bank Flash enables in-application programming (IAP) and the BFB (bootloader-in-Flash) mode, allowing safe firmware upgrades without external memory.

What package does the ATSAM4SD16CB-CN ship in?

The ATSAM4SD16CB-CN ships in a 100-ball TFBGA measuring 9x9 mm with 0.8 mm ball pitch, surface mount. This compact BGA package is suitable for space-limited designs but requires at least four PCB routing layers and 0.5mm-pitch micro-vias for fan-out escape.

What is the operating voltage and temperature range of the ATSAM4SD16CB-CN?

The ATSAM4SD16CB-CN operates from a 1.62V to 3.6V supply and is specified over the -40C to +105C extended industrial temperature range. The 'CN' suffix in the order code identifies this extended-temperature variant.

What peripherals are available on the ATSAM4SD16CB-CN?

The ATSAM4SD16CB-CN provides up to five USARTs, three UARTs, two TWI (I2C) ports, three SPIs, one HSMCI (SD card) interface, one USB 2.0 Full-Speed device port, and a 12-bit ADC with up to 16 channels. According to the Microchip datasheet, it also includes timers, PWM controllers, and an analog comparator.

Where can I buy the ATSAM4SD16CB-CN online?

The ATSAM4SD16CB-CN is available from authorized distributors including DigiKey, Mouser, MicrochipDirect, Octopart-listed resellers, and XAIPART. Lead time and stock vary by distributor; pricing as of 2026-10-07 starts around $18.45 in single-piece quantity and scales down to $11.40 at 1000-piece quantities.

What is the price of the ATSAM4SD16CB-CN?

The ATSAM4SD16CB-CN price as of 2026-10-07 starts at approximately $18.45 for 1-piece quantity, $16.92 at 10 pieces, $14.50 at 100 pieces, $12.95 at 500 pieces, and $11.40 at 1000 pieces. Volume pricing varies by distributor; contact authorized Microchip distributors for current quotes.

What is the lead time for the ATSAM4SD16CB-CN?

Lead time for the ATSAM4SD16CB-CN is typically 8 to 12 weeks when ordered through MicrochipDirect, and stock-dependent (often immediate) at franchised distributors such as DigiKey or Mouser. As of 2026-10-07, distributors report mixed stock availability, so planning a 12-week safety stock is recommended for production runs.

Is the ATSAM4SD16CB-CN in stock at distributors?

Stock for the ATSAM4SD16CB-CN fluctuates across distributors as of 2026-10-07; some sites show live inventory while others display 'quote only'. For confirmed stock and immediate shipment, check DigiKey or Mouser; for production quantities, order through MicrochipDirect with a 12-week lead-time buffer.

What is the best drop-in replacement for the ATSAM4SD16CB-CN?

The best drop-in replacement for the ATSAM4SD16CB-CN within the SAM4S family is the ATSAM4SD16CB-AN (LQFP-64 variant, but not BGA drop-in) or ATSAM4S16CB-CN (smaller Flash). For a true same-package drop-in, the ATSAM4SD16CA-CN (revision A, 100-ball TFBGA) is pin-compatible and functionally identical except for the die revision.

Can the ATSAM4SD16CA-CN replace the ATSAM4SD16CB-CN?

The ATSAM4SD16CA-CN (revision A) shares the same 100-ball TFBGA 9x9 mm footprint as the CTSAM4SD16CB-CN and is pin-compatible. However, Microchip explicitly recommends revision B for new designs due to feature and longevity improvements; revision A should only be used to fix existing revision-A designs.

Where can I download the ATSAM4SD16CB-CN datasheet PDF?

The official ATSAM4SD16CB-CN datasheet PDF is hosted by Microchip at https://ww1.microchip.com/downloads/aemDocuments/documents/MPU32/ProductDocuments/DataSheets/ATSAM4SD16C-Data-Sheet-DS60002220.pdf. It includes electrical characteristics, pinout, package dimensions, and revision-B errata.

Where can I find the ATSAM4SD16CB-CN pinout?

The ATSAM4SD16CB-CN pinout for the 100-ball TFBGA 9x9 mm package is documented in Section 2 (Package and Pinout) of the Microchip datasheet. BGA balls are arranged in a 12x12 grid with the corner balls depopulated, and A1 is marked with a dot on the package top.

What is the difference between revision A and revision B of the ATSAM4SD16C?

Revision B of the ATSAM4SD16C family (the ATSAM4SD16CB-CN is revision B) adds the BFB bootloader-in-Flash mode, improved IAP support, and silicon-level fixes documented in the errata. According to Microchip, revision B is recommended for all new designs and prototypes; revision A is for maintaining existing revision-A designs only.

What are the key specifications of the ATSAM4SD16CB-CN that engineers should know?

The ATSAM4SD16CB-CN key specifications are: ARM Cortex-M4 core with FPU at 120MHz, 1MB dual-bank Flash, 160KB SRAM, 1.62V to 3.6V supply, -40C to +105C extended industrial temperature range, 100-ball TFBGA 9x9 mm package, 12-bit ADC with up to 16 channels, USB 2.0 Full-Speed device, three SPIs, two TWI, and revision-B silicon with BFB/IAP capability. These parameters make it suitable for industrial PLCs, smart meters, USB HIDs, and connected gateways.

What is the best STM32 equivalent for the ATSAM4SD16CB-CN?

The best STM32 equivalent in the same Cortex-M4 class with comparable memory is the STM32F407VGT6 or STM32F407ZGT6 (168MHz, 1MB Flash, 192KB SRAM, LQFP-100 or LQFP-144). However, these are NOT drop-in replacements because they use a different pinout and package; a PCB redesign is required. Engineers should use them only for new projects.

Is the ATSAM4SD16CB-CN suitable for industrial PLC applications?

Yes, the ATSAM4SD16CB-CN is suitable for industrial PLC applications because of the 120MHz Cortex-M4 with hardware FPU, 1MB dual-bank Flash for field-upgradeable firmware, 160KB SRAM for ladder-logic and protocol stacks, and the -40C to +105C extended industrial temperature range. The HSMCI port enables local data logging to SD cards.

Data referensi engineering untuk ATSAM4SD16CB-CN — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the ATSAM4SD16CB-CN when you need a Cortex-M4 MCU with hardware FPU, 1MB dual-bank Flash for field-upgradeable firmware, USB 2.0 Full-Speed device connectivity, and an extended industrial temperature range in a compact 100-ball TFBGA. For new designs, Microchip explicitly recommends revision B (this part) over revision A (ATSAM4SD16CA-CN). If you can sacrifice Flash density, the ATSAM4S16CB-CN (512KB) is a lower-cost same-package alternative. If you do not need BGA and prefer LQFP for hand-prototyping, the ATSAM4SD16CB-AN (LQFP-64) shares the revision-B die but requires PCB rework. For cross-brand Cortex-M4 alternatives with comparable Flash/SRAM, consider the STM32F407 or NXP Kinetis K64 - these require PCB redesign because packages differ.

Pembandingan dengan Alternatif

Parameter Umum	Produk Ini	ATSAM4SD16CA-CN	ATSAM4SD16CB-CFN	ATSAM4S16CB-CN	ATSAM4SD16CB-AN
Brand	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology
Package	100-ball TFBGA 9x9 mm	100-ball TFBGA 9x9 mm - same	100-ball TFBGA 9x9 mm - same	100-ball TFBGA 9x9 mm - same	LQFP-64 - different
Core	ARM Cortex-M4 with FPU	ARM Cortex-M4 with FPU - same	ARM Cortex-M4 with FPU - same	ARM Cortex-M4 with FPU - same	ARM Cortex-M4 with FPU - same
Maximum Clock Frequency	120 MHz	120 MHz	120 MHz	120 MHz	120 MHz
Flash Memory	1 MB (2x 512 KB)	1 MB (2x 512 KB)	1 MB (2x 512 KB)	512 KB (-50%)	1 MB (2x 512 KB)
SRAM	160 KB	160 KB	160 KB	128 KB (-20%)	160 KB
Operating Temperature	-40C to +105C (CN)	-40C to +105C	-40C to +105C	-40C to +105C	-40C to +105C
Die Revision	Revision B (recommended for new designs)	Revision A (legacy)	Revision B	Revision B	Revision B
Approx. Unit Price (1 pc, USD)	18.45	16.80	18.45	13.90	17.95

Diferensiator Kunci

Revision-B silicon with BFB bootloader-in-Flash mode (vsATSAM4SD16CA-CN (revision A))
Full 1MB dual-bank Flash for large embedded stacks (vsATSAM4S16CB-CN)
Integrated USB 100-Speed device port without external PHY (vsATSAM4S16CB-CN (no USB on smaller SAM4S variants))

Catatan Desain

The 100-ball TFBGA 9x9 mm package has 0.8 mm ball pitch and requires a PCB with at least 4 routing layers. Microvia-in-pad (VIP) technology is strongly recommended for fan-out escape; use 0.5 mm-pitch vias stacked through layers 1-2 and 2-3, and place a continuous ground plane on layer 4 for return-current continuity. Estimated: at 0.8 mm pitch, dog-bone fan-out without VIP needs roughly 6-8 routing layers; VIP reduces this to 4.

Place a 100 nF ceramic decoupling capacitor within 5 mm of every VDDIO pin and every VDDCORE pin. Use the on-chip voltage regulator in LDO mode for cost-sensitive boards; connect an external 4.7 uF X5R ceramic capacitor on the regulator output. The USB VBUS pin requires a 10 uF decoupling capacitor; tie VBUS to VDDIO through a 10 k resistor divider for OTG-less device-only operation.

For the 12-bit ADC to meet ENOB specifications, dedicate one PCB layer to a continuous analog ground plane and route analog traces (AD0-AD7, AVDD, ADVREF) only over this plane. Keep ADC traces away from digital switching signals (SPI, PWM) by at least 3 mm. A 100 nF decoupling capacitor within 5 mm of the AVDD pin is mandatory, and the ADVREF pin should be driven from a low-noise external reference (such as an LM4040) for best DC linearity.

Do not omit the external 32.768 kHz low-frequency crystal on the XIN/XOUT pins if the RTC part is on this MCU (not present on SAM4SD16C, but verify before design). The NRST reset pin requires an external 10 k pull-up and a 1 nF capacitor to ground for clean power-on-reset behavior. The dual-bank Flash requires the application to write the BFB (bootloader-in-Flash) flag before resetting to enable field upgrades; failing to set this bit silently bricks the OTA path.

Informasi Konformitas

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Bebas Logam Lengket

Yes

Bebas Halogena

Yes

Mineral Konflik

Compliant

RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; this part is for industrial and consumer use. For automotive applications, consider SAM V71/SAM E70 AEC-Q100-qualified variants.

Data disahkan pada: 2026-10-07 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Sumber: Manufacturer Product Page, Manufacturer Datasheet, Distributor, Distributor, Octopart

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