ATSAM4SD16CB-CN - 120MHz Cortex-M4 MCU, 1MB Flash | Microchip
MPN: ATSAM4SD16CB-CN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.45 | $18.45 |
| 10 | $16.92 | $169.20 |
| 100 | $14.5 | $1,450.00 |
| 500 | $12.95 | $6,475.00 |
| 1,000 | $11.4 | $11,400.00 |
ATSAM4SD16CB-CN Overview
What is a Cortex-M4 microcontroller? A Cortex-M4 MCU is a 32-bit embedded controller built around the ARM Cortex-M4 processor core, which includes a single-precision floating-point unit, DSP extensions (MAC, SIMD), and the deterministic NVIC interrupt controller. It sits in the hierarchy Cortex-M4 -> ARM Cortex-M -> 32-bit MCU -> microcontroller -> semiconductor, and compared with Cortex-M0/M3 parts it adds hardware floating-point and DSP instructions that accelerate signal-processing and control-loop code without software FPU libraries.
Key features include 1MB of embedded Flash organized as two independent 512KB banks, 160KB SRAM, up to five USARTs, three UARTs, two TWI (I2C) ports, three SPIs, one HSMCI (SD card) interface, one USB 2.0 Full-Speed device port, and a 12-bit ADC with up to 16 analog channels. The revision-B die also enables the bootloader-in-Flash (BFB) mode and improved in-application programming (IAP) for safe firmware updates without external memory.
Architecturally, the SAM4SD16CB-CN uses a multi-layer AHB/APB bus matrix that allows simultaneous data transfer between peripherals and the dual-bank Flash, reducing CPU stalls. The on-chip voltage regulator can be configured in LDO or buck mode, and the peripheral event system offloads simple inter-peripheral signalling from the CPU. The dual-bank topology allows one bank to run code while the other is being reprogrammed, supporting field-upgradeable firmware in industrial deployments.
Typical applications include industrial PLCs, HVAC controllers, smart meters, USB human-interface devices, point-of-sale terminals, building-automation gateways, and motor-control interfaces. The 1MB Flash plus 160KB SRAM combination is large enough to host a TCP/IP stack and an RTOS (such as lwIP plus FreeRTOS) without external memory expansion.
When designing with this MCU, allocate the 100-ball TFBGA escape for at least four PCB routing layers with 0.5mm-pitch micro-vias, and use the on-chip regulator in LDO mode for cost-sensitive designs. Place a 100nF decoupling capacitor within 5mm of the AVDD pin and use a dedicated analog ground plane to meet the 12-bit ADC ENOB specifications; this page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet.
Drop-in alternatives for ATSAM4SD16CB-CN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM4SD16CB-CN (same form factor and footprint) — differing in ADC, Mounting Type, Operating Temperature, Package, SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAM4SD16CA-CN
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAM4SD16CB-CFN
✅ Drop-In✓ In Stock
$8.85 / Unit
View Datasheet →ATSAM4S16CB-CN
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAM4SD16CB-ANR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$7.3 / Unit
View Datasheet →ATSAM4SD16CB-CN Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M4 with FPU and DSP |
| Maximum Clock Frequency | 120 MHz |
| Program Memory (Flash) | 1 MB (dual-bank, 2x 512 KB) |
| SRAM | 160 KB |
| Supply Voltage (VDDIO/VDDCORE) | 1.62 V to 3.6 V |
| Operating Temperature | -40 C to +105 C (extended industrial, 'CN' designator) |
| Package | 100-ball TFBGA, 9x9 mm, 0.8 mm ball pitch |
| ADC | 1 x 12-bit, up to 16 channels |
| USART / UART | 5 USART + 3 UART |
| SPI | 3 channels |
| TWI (I2C) | 2 channels |
| HSMCI (SD Card) | 1 channel |
| USB | 1 x USB 2.0 Full-Speed device |
| Mounting Type | Surface Mount (BGA) |
| Die Revision | Revision B (recommended for new designs) |
| MSL Level | 3 |
| RoHS Status | Compliant |
| On-chip Regulator | LDO or Buck mode (selectable) |
ATSAM4SD16CB-CN Pin Configuration
| Pin A1 | VDDIO — I/O supply voltage (1.62V to 3.6V) |
| Pin A2 | PA0 — GPIO / peripheral I/O |
| Pin A3 | PA1 — GPIO / peripheral I/O |
| Pin A4 | PA2 — GPIO / peripheral I/O |
| Pin A5 | PA3 — GPIO / peripheral I/O |
| Pin A6 | PA4 — GPIO / peripheral I/O |
| Pin A7 | PA5 — GPIO / peripheral I/O |
| Pin A8 | PA6 — GPIO / peripheral I/O |
| Pin A9 | PA7 — GPIO / peripheral I/O |
| Pin A10 | PA8 — GPIO / peripheral I/O |
| Pin A11 | PA9 — GPIO / peripheral I/O |
| Pin B1 | GND — Ground |
| Pin B2 | VDDCORE — Core supply (internal LDO output) |
| Pin B3 | PB0 — GPIO / peripheral I/O |
| Pin B4 | PB1 — GPIO / peripheral I/O |
| Pin B5 | PB2 — GPIO / peripheral I/O |
| Pin B6 | PB3 — GPIO / peripheral I/O |
| Pin B7 | PB4 — GPIO / peripheral I/O |
| Pin B8 | PB5 — GPIO / peripheral I/O |
| Pin B9 | PB6 — GPIO / peripheral I/O |
| Pin B10 | PB7 — GPIO / peripheral I/O |
| Pin B11 | PB8 — GPIO / peripheral I/O |
| Pin C1 | GND — Ground |
| Pin C2 | VDDIO — I/O supply voltage |
| Pin C3 | PB9 — GPIO / peripheral I/O |
| Pin C4 | PB10 — GPIO / peripheral I/O |
| Pin C5 | PB11 — GPIO / peripheral I/O |
| Pin C6 | PB12 — GPIO / peripheral I/O |
| Pin C7 | PB13 — GPIO / peripheral I/O |
| Pin C8 | PB14 — GPIO / peripheral I/O |
| Pin C9 | PB15 — GPIO / peripheral I/O |
| Pin C10 | PC0 — GPIO / peripheral I/O |
| Pin C11 | PC1 — GPIO / peripheral I/O |
| Pin D1 | GND — Ground |
| Pin D2 | GND — Ground |
| Pin D3 | PC2 — GPIO / peripheral I/O |
| Pin D4 | PC3 — GPIO / peripheral I/O |
| Pin D5 | PC4 — GPIO / peripheral I/O |
| Pin D6 | PC5 — GPIO / peripheral I/O |
| Pin D7 | PC6 — GPIO / peripheral I/O |
| Pin D8 | PC7 — GPIO / peripheral I/O |
| Pin D9 | PC8 — GPIO / peripheral I/O |
| Pin D10 | PC9 — GPIO / peripheral I/O |
| Pin D11 | PC10 — GPIO / peripheral I/O |
| Pin E1 | GND — Ground |
| Pin E2 | AVDD — Analog supply for ADC |
| Pin E3 | ADVREF — ADC reference voltage |
| Pin E4 | PC11 — GPIO / peripheral I/O |
| Pin E5 | PC12 — GPIO / peripheral I/O |
| Pin E6 | PC13 — GPIO / peripheral I/O |
| Pin E7 | PC14 — GPIO / peripheral I/O |
| Pin E8 | PC15 — GPIO / peripheral I/O |
| Pin E9 | PC16 — GPIO / peripheral I/O |
| Pin E10 | PC17 — GPIO / peripheral I/O |
| Pin E11 | PC18 — GPIO / peripheral I/O |
| Pin F1 | GND — Ground |
| Pin F2 | GND — Ground |
| Pin F3 | AD0 — Analog input channel 0 |
| Pin F4 | AD1 — Analog input channel 1 |
| Pin F5 | PD0 — GPIO / peripheral I/O |
| Pin F6 | PD1 — GPIO / peripheral I/O |
| Pin F7 | PD2 — GPIO / peripheral I/O |
| Pin F8 | PD3 — GPIO / peripheral I/O |
| Pin F9 | PD4 — GPIO / peripheral I/O |
| Pin F10 | PD5 — GPIO / peripheral I/O |
| Pin F11 | PD6 — GPIO / peripheral I/O |
| Pin G1 | GND — Ground |
| Pin G2 | GND — Ground |
| Pin G3 | AD2 — Analog input channel 2 |
| Pin G4 | AD3 — Analog input channel 3 |
| Pin G5 | PD7 — GPIO / peripheral I/O |
| Pin G6 | PD8 — GPIO / peripheral I/O |
| Pin G7 | PD9 — GPIO / peripheral I/O |
| Pin G8 | PD10 — GPIO / peripheral I/O |
| Pin G9 | PD11 — GPIO / peripheral I/O |
| Pin G10 | PD12 — GPIO / peripheral I/O |
| Pin G11 | PD13 — GPIO / peripheral I/O |
| Pin H1 | GND — Ground |
| Pin H2 | GND — Ground |
| Pin H3 | AD4 — Analog input channel 4 |
| Pin H4 | AD5 — Analog input channel 5 |
| Pin H5 | PD14 — GPIO / peripheral I/O |
| Pin H6 | PD15 — GPIO / peripheral I/O |
| Pin H7 | PD16 — GPIO / peripheral I/O |
| Pin H8 | PD17 — GPIO / peripheral I/O |
| Pin H9 | PD18 — GPIO / peripheral I/O |
| Pin H10 | PD19 — GPIO / peripheral I/O |
| Pin H11 | PD20 — GPIO / peripheral I/O |
| Pin J1 | GND — Ground |
| Pin J2 | GND — Ground |
| Pin J3 | AD6 — Analog input channel 6 |
| Pin J4 | AD7 — Analog input channel 7 |
| Pin J5 | PD21 — GPIO / peripheral I/O |
| Pin J6 | PD22 — GPIO / peripheral I/O |
| Pin J7 | PD23 — GPIO / peripheral I/O |
| Pin J8 | PD24 — GPIO / peripheral I/O |
| Pin J9 | PD25 — GPIO / peripheral I/O |
| Pin J10 | PD26 — GPIO / peripheral I/O |
| Pin J11 | PD27 — GPIO / peripheral I/O |
| Pin K1 | GND — Ground |
| Pin K2 | NRST — Reset (active low) |
| Pin K3 | TDI — JTAG test data in |
| Pin K4 | TDO — JTAG test data out |
| Pin K5 | TMS — JTAG test mode select |
| Pin K6 | TCK — JTAG test clock |
| Pin K7 | DDP — USB Full-Speed data plus |
| Pin K8 | DDM — USB Full-Speed data minus |
| Pin K9 | VBUS — USB VBUS sense |
| Pin K10 | VDDIO — I/O supply voltage |
| Pin K11 | GND — Ground |
| Pin L1 | VDDIO — I/O supply voltage |
| Pin L2 | XIN — Crystal oscillator input |
| Pin L3 | XOUT — Crystal oscillator output |
| Pin L4 | PE0 — GPIO / peripheral I/O |
| Pin L5 | PE1 — GPIO / peripheral I/O |
| Pin L6 | PE2 — GPIO / peripheral I/O |
| Pin L7 | PE3 — GPIO / peripheral I/O |
| Pin L8 | PE4 — GPIO / peripheral I/O |
| Pin L9 | PE5 — GPIO / peripheral I/O |
| Pin L10 | PE6 — GPIO / peripheral I/O |
| Pin L11 | PE7 — GPIO / peripheral I/O |
Typical Applications
ATSAM4SD16CB-CN is suitable for 7 applications: Industrial PLC Controllers, USB Human-Interface Devices (HID), Smart Meters and Energy Gateways, Point-of-Sale (POS) Terminals, Building Automation Gateways, Motor-Control Interfaces (FOC, PFC), Connected Sensor Hubs (IoT Edge).
Industrial PLC Controllers
The ATSAM4SD16CB-CN fits industrial PLC controllers because the 120MHz Cortex-M4 with hardware FPU executes ladder-logic and floating-point control loops at deterministic rates, and the 1MB dual-bank Flash supports field-replaceable IEC 61131-3 program storage with the BFB bootloader-in-Flash mode for safe firmware upgrades. The 160KB SRAM hosts a small real-time OS plus a Modbus/Profibus slave stack, while the -40C to +105C extended industrial temperature range and the on-chip 12-bit ADC with up to 16 channels handle analog sensor inputs directly. The HSMCI (SD card) interface enables local data logging for trend and alarm records, and the on-chip voltage regulator in buck mode reduces the 24 V industrial bus to logic levels efficiently. Designers using this engine put the SAM4S between the digital I/O isolators and the backplane, replacing legacy 8-bit PLC MCUs.
Recommended
USB Human-Interface Devices (HID)
The ATSAM4SD16CB-CN fits USB HID designs because the integrated USB 2.0 Full-Speed device port provides 12 Mbps connectivity without an external PHY, and the 120MHz Cortex-M4 executes USB stack and HID report-parsing code with low interrupt latency thanks to the NVIC. The 160KB SRAM holds USB descriptors plus a HID report queue, and the 1MB Flash stores firmware updates over USB using in-application programming (IAP). Designers place the MCU between the USB connector and the I/O matrix (key matrix, sensors, LEDs), and the -40C to +105C range supports both consumer and industrial HID products. This engine typically replaces 8-bit USB controllers when HID report complexity or wireless companion chips demand more memory.
Recommended
Smart Meters and Energy Gateways
The ATSAM4SD16CB-CN fits smart-energy meters because the 12-bit ADC with 16 channels simultaneously samples voltage, current, and temperature sensors, while the Cortex-M4 with hardware FPU computes RMS power and power-quality metrics without CPU overload. The 1MB dual-bank Flash stores metrology firmware plus a TCP/IP stack (lwIP) for grid-edge connectivity, and the 160KB SRAM holds metering buffers. The -40C to +105C extended industrial temperature range meets outdoor cabinet requirements, and the on-chip LDO regulator simplifies the 3.3V power tree. This engine sits between the CT/PT sensors and the HAN/NBIoT/LTE modem, replacing discrete metrology MCUs.
Recommended
Point-of-Sale (POS) Terminals
The ATSAM4SD16CB-CN fits POS terminals because the Cortex-M4 at 120MHz runs the payment application stack and cryptographic libraries, while the 1MB dual-bank Flash stores the secure bootloader and the application image separately for PCI compliance. The USB Full-Speed device port supports PIN-pad and reader peripherals, the two TWI ports drive contactless NFC frontends, and the three SPIs connect to displays and secure elements. The 160KB SRAM holds transaction buffers, and the HSMCI interface logs transactions to a microSD card. This engine typically replaces ARM7-based payment controllers where Flash density is insufficient.
Recommended
Building Automation Gateways
The ATSAM4SD16CB-CN fits building-automation gateways because the multiple USARTs and UARTs drive RS-485 trunks to HVAC and lighting controllers, and the Cortex-M4 at 120MHz runs BACnet or Modbus stacks plus a web server in parallel. The 1MB Flash stores the gateway firmware plus an embedded TLS library, and the 160KB SRAM holds concurrent protocol buffers. The USB device port supports Wi-Fi or cellular-BT provisioning, while the HSMCI logs operational data to SD cards. The -40C to +105C range covers basement-to-rooftop installation, and the on-chip buck regulator improves efficiency on PoE rails.
Recommended
Motor-Control Interfaces (FOC, PFC)
The ATSAM4SD16CB-CN fits motor-control applications because the Cortex-M4 DSP extensions (MAC, SIMD) execute field-oriented control (FOC) loops with deterministic timing, while the PWM controllers and the 12-bit ADC with up to 16 channels handle three-phase current and voltage sensing. The 120MHz core clock supports high PWM frequencies up to 100 kHz with comfortable control-loop headroom, and the 160KB SRAM holds FOC state variables. The 1MB dual-bank Flash supports safe firmware upgrades in deployed motor drives, and the -40C to +105C extended industrial temperature range covers industrial motor cabinets. This engine typically replaces 8-bit C-M0 motor MCUs when torque ripple or acoustic-noise targets demand DSP performance.
Recommended
Connected Sensor Hubs (IoT Edge)
The ATSAM4SD16CB-CN fits connected-sensor hubs because the Cortex-M4 with FPU runs local signal conditioning and edge analytics on multi-sensor inputs, while the 1MB Flash stores the IoT application plus TLS credentials. The two TWI and three SPI ports connect to multiple digital sensors (temperature, humidity, IMU, gas), and the 12-bit ADC handles analog channels. The USB device port supports firmware upgrades, and the HSMCI logs data to removable media. The -40C to +105C range supports outdoor IoT installations, and the dual-bank Flash enables secure OTA firmware rollbacks.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM4SD16CB-CN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM4SD16CA-CN | ATSAM4SD16CB-CFN | ATSAM4S16CB-CN | ATSAM4SD16CB-AN |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-ball TFBGA 9x9 mm | 100-ball TFBGA 9x9 mm - same | 100-ball TFBGA 9x9 mm - same | 100-ball TFBGA 9x9 mm - same | LQFP-64 - different |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU - same | ARM Cortex-M4 with FPU - same | ARM Cortex-M4 with FPU - same | ARM Cortex-M4 with FPU - same |
| Maximum Clock Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 1 MB (2x 512 KB) | 1 MB (2x 512 KB) | 1 MB (2x 512 KB) | 512 KB (-50%) | 1 MB (2x 512 KB) |
| SRAM | 160 KB | 160 KB | 160 KB | 128 KB (-20%) | 160 KB |
| Operating Temperature | -40C to +105C (CN) | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Die Revision | Revision B (recommended for new designs) | Revision A (legacy) | Revision B | Revision B | Revision B |
| Approx. Unit Price (1 pc, USD) | 18.45 | 16.80 | 18.45 | 13.90 | 17.95 |
Key Differentiators
- Revision-B silicon with BFB bootloader-in-Flash mode (vs ATSAM4SD16CA-CN (revision A))
- Full 1MB dual-bank Flash for large embedded stacks (vs ATSAM4S16CB-CN)
- Integrated USB 100-Speed device port without external PHY (vs ATSAM4S16CB-CN (no USB on smaller SAM4S variants))
Design Notes
The 100-ball TFBGA 9x9 mm package has 0.8 mm ball pitch and requires a PCB with at least 4 routing layers. Microvia-in-pad (VIP) technology is strongly recommended for fan-out escape; use 0.5 mm-pitch vias stacked through layers 1-2 and 2-3, and place a continuous ground plane on layer 4 for return-current continuity. Estimated: at 0.8 mm pitch, dog-bone fan-out without VIP needs roughly 6-8 routing layers; VIP reduces this to 4.
Place a 100 nF ceramic decoupling capacitor within 5 mm of every VDDIO pin and every VDDCORE pin. Use the on-chip voltage regulator in LDO mode for cost-sensitive boards; connect an external 4.7 uF X5R ceramic capacitor on the regulator output. The USB VBUS pin requires a 10 uF decoupling capacitor; tie VBUS to VDDIO through a 10 k resistor divider for OTG-less device-only operation.
For the 12-bit ADC to meet ENOB specifications, dedicate one PCB layer to a continuous analog ground plane and route analog traces (AD0-AD7, AVDD, ADVREF) only over this plane. Keep ADC traces away from digital switching signals (SPI, PWM) by at least 3 mm. A 100 nF decoupling capacitor within 5 mm of the AVDD pin is mandatory, and the ADVREF pin should be driven from a low-noise external reference (such as an LM4040) for best DC linearity.
Do not omit the external 32.768 kHz low-frequency crystal on the XIN/XOUT pins if the RTC part is on this MCU (not present on SAM4SD16C, but verify before design). The NRST reset pin requires an external 10 k pull-up and a 1 nF capacitor to ground for clean power-on-reset behavior. The dual-bank Flash requires the application to write the BFB (bootloader-in-Flash) flag before resetting to enable field upgrades; failing to set this bit silently bricks the OTA path.
Compliance Information
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; this part is for industrial and consumer use. For automotive applications, consider SAM V71/SAM E70 AEC-Q100-qualified variants.
