Intel

EP1K100FI256-2 - 100K Gate ACEX 1K FPGA, 256-BGA | Intel / Altera

MPN: EP1K100FI256-2 ✗ Akhir Hidup

2.5 V Vdss 256-BGA (FineLine BGA, FBGA-256) Package -2 (mid-range) Speed

Ajukan Diskon

MOQ: 1 |

Lihat Datasheet (PDF) Lihat Alternatif

Kuantitas

EP1K100FI256-2 Ringkasan

The Intel (formerly Altera) EP1K100FI256-2 is an ACEX 1K family Field Programmable Gate Array (FPGA) delivering 100,000 system gates with 4,992 logic elements in a 256-ball FineLine BGA package. Per the manufacturer datasheet, the device integrates a look-up table (LUT)-based logic fabric with embedded array blocks (EABs) and is fabricated on a 2.5 V CMOS process supporting maximum operating frequencies up to 250 MHz. The "-2" speed grade designates a mid-range performance bin between the -1 (slower) and -3 (faster) ACEX 1K variants.

A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die. Within the broader semiconductor taxonomy, FPGAs belong to programmable logic -> logic ICs -> integrated circuits. The ACEX 1K family occupies the low-cost system-on-a-programmable-chip (SOPC) tier of the Altera/Intel portfolio, combining LUT logic with EAB memory for efficient megafunction implementation such as FIFO buffers, RAM blocks, and specialized I/O functions.

Key features of the EP1K100FI256-2 include 49,152 bits of embedded memory distributed across EABs, 186 user I/Os supporting multiple I/O standards, 2.5 V core supply with 3.3 V tolerant I/O, and in-system programmability via IEEE 1149.1 JTAG and Altera-specific configuration schemes. The device supports dual-port EAB memory and includes built-in clock management for synchronous design implementation.

The architecture combines a die-efficient LUT fabric with EABs that can be configured as dual-port RAM, ROM, or specialized logic functions, providing an optimal balance between logic density and on-chip memory. The 0.22 µm CMOS process delivers predictable timing closure suitable for glue-logic, bus interfacing, and protocol bridging applications in cost-sensitive industrial and communications equipment.

Typical applications include industrial control glue logic, communications protocol bridging, peripheral bus interfacing (PCI, ISA, UART bridges), low-density DSP preprocessing, and legacy system modernization. The 256-FBGA package supports compact board layouts while exposing the full 186 user I/O count for high-pin-count bridging scenarios.

When designing with this device, verify Quartus or MAX+PLUS II support for the ACEX 1K family, as Intel has formally discontinued new ACEX 1K design entries in modern toolchains. The "FI" package code indicates industrial temperature grade (-40 °C to +85 °C) suitable for harsh-environment deployments.

This page synthesizes distributor pricing, drop-in alternatives from the same ACEX 1K family, and practical design notes for legacy FPGA migration not found in the original manufacturer datasheet.

Alternatif penggantian untuk EP1K100FI256-2 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EP1K100FI256-2 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Speed Grade, Configuration Method, Core Voltage.

EP1K100FC256-1

Altera

Package: 256-BGA (FineLine)

Speed Grade: -1

Core Voltage: 2.5 V