EP1K100FI256-2 - 100K Gate ACEX 1K FPGA, 256-BGA | Intel / Altera
부품 번호: EP1K100FI256-2 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118 | $11,800.00 |
| 250 | $105 | $26,250.00 |
| 500 | $92 | $46,000.00 |
EP1K100FI256-2 개요
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die. Within the broader semiconductor taxonomy, FPGAs belong to programmable logic -> logic ICs -> integrated circuits. The ACEX 1K family occupies the low-cost system-on-a-programmable-chip (SOPC) tier of the Altera/Intel portfolio, combining LUT logic with EAB memory for efficient megafunction implementation such as FIFO buffers, RAM blocks, and specialized I/O functions.
Key features of the EP1K100FI256-2 include 49,152 bits of embedded memory distributed across EABs, 186 user I/Os supporting multiple I/O standards, 2.5 V core supply with 3.3 V tolerant I/O, and in-system programmability via IEEE 1149.1 JTAG and Altera-specific configuration schemes. The device supports dual-port EAB memory and includes built-in clock management for synchronous design implementation.
The architecture combines a die-efficient LUT fabric with EABs that can be configured as dual-port RAM, ROM, or specialized logic functions, providing an optimal balance between logic density and on-chip memory. The 0.22 µm CMOS process delivers predictable timing closure suitable for glue-logic, bus interfacing, and protocol bridging applications in cost-sensitive industrial and communications equipment.
Typical applications include industrial control glue logic, communications protocol bridging, peripheral bus interfacing (PCI, ISA, UART bridges), low-density DSP preprocessing, and legacy system modernization. The 256-FBGA package supports compact board layouts while exposing the full 186 user I/O count for high-pin-count bridging scenarios.
When designing with this device, verify Quartus or MAX+PLUS II support for the ACEX 1K family, as Intel has formally discontinued new ACEX 1K design entries in modern toolchains. The "FI" package code indicates industrial temperature grade (-40 °C to +85 °C) suitable for harsh-environment deployments.
This page synthesizes distributor pricing, drop-in alternatives from the same ACEX 1K family, and practical design notes for legacy FPGA migration not found in the original manufacturer datasheet.
드롭인 대체품: EP1K100FI256-2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1K100FI256-2 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Configuration Method, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1K100FC256-2
✅ 드롭인✓ 재고 있음
$27.6 / 개
데이터시트 보기 →EP1K100FC256-3
✅ 드롭인✓ 재고 있음
$30.22 / 개
데이터시트 보기 →EP1K100FC256-1
✅ 드롭인✓ 재고 있음
$53.2 / 개
데이터시트 보기 →EP1K100FC256-1N
✅ 드롭인✓ 재고 있음
$22.1 / 개
데이터시트 보기 →EP1K100FC256-2N
✅ 드롭인✓ 재고 있음
$78.1951 / 개
데이터시트 보기 →EP1K100FC256-3N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP1K100FI256-2 최대 정격 & 전기적 특성
| Family | ACEX 1K |
| Series | EP1K100 |
| Logic Elements / Cells | 4,992 |
| System Gates | 100,000 |
| Number of LABs/CLBs | 624 |
| Total RAM Bits | 49,152 |
| Number of I/O | 186 |
| Number of Gates | 257,000 |
| Voltage - Supply | 2.5 V |
| 동작 온도 | -40 °C to +85 °C (Industrial) |
| 실장 유형 | Surface Mount |
| 패키지 / 케이스 | 256-BGA (FineLine BGA, FBGA-256) |
| Speed Grade | -2 (mid-range) |
| Max Frequency | 250 MHz |
| Process Technology | 0.22 µm CMOS |
EP1K100FI256-2 핀 구성
| 핀 A1 | I/O — User I/O pin |
| 핀 A2 | I/O — User I/O pin |
| 핀 A3 | I/O — User I/O pin |
| 핀 A4 | VCCINT — Core supply voltage 2.5V |
| 핀 A5 | I/O — User I/O pin |
| 핀 A6 | GND — Ground |
| 핀 A7 | I/O — User I/O pin |
| 핀 A8 | I/O — User I/O pin |
| 핀 A9 | I/O — User I/O pin |
| 핀 A10 | VCCIO — I/O supply voltage |
| 핀 B1 | I/O — User I/O pin |
| 핀 B2 | GND — Ground |
| 핀 B3 | I/O — User I/O pin |
| 핀 B4 | I/O — User I/O pin |
| 핀 B5 | I/O — User I/O pin |
| 핀 B6 | I/O — User I/O pin |
| 핀 B7 | VCCINT — Core supply voltage 2.5V |
| 핀 B8 | I/O — User I/O pin |
| 핀 B9 | I/O — User I/O pin |
| 핀 B10 | GND — Ground |
| 핀 C1 | VCCIO — I/O supply voltage |
| 핀 C2 | I/O — User I/O pin |
| 핀 C3 | I/O — User I/O pin |
| 핀 C4 | I/O — User I/O pin |
| 핀 C5 | GND — Ground |
| 핀 C6 | I/O — User I/O pin |
| 핀 C7 | I/O — User I/O pin |
| 핀 C8 | I/O — User I/O pin |
| 핀 C9 | I/O — User I/O pin |
| 핀 C10 | VCCINT — Core supply voltage 2.5V |
| 핀 D1 | I/O — User I/O pin |
| 핀 D2 | I/O — User I/O pin |
| 핀 D3 | GND — Ground |
| 핀 D4 | I/O — User I/O pin |
| 핀 D5 | I/O — User I/O pin |
| 핀 D6 | I/O — User I/O pin |
| 핀 D7 | VCCIO — I/O supply voltage |
| 핀 D8 | I/O — User I/O pin |
| 핀 D9 | GND — Ground |
| 핀 D10 | I/O — User I/O pin |
| 핀 E1 | I/O — User I/O pin |
| 핀 E2 | VCCINT — Core supply voltage 2.5V |
| 핀 E3 | I/O — User I/O pin |
| 핀 E4 | I/O — User I/O pin |
| 핀 E5 | I/O — User I/O pin |
| 핀 E6 | I/O — User I/O pin |
| 핀 E7 | I/O — User I/O pin |
| 핀 E8 | I/O — User I/O pin |
| 핀 E9 | I/O — User I/O pin |
| 핀 E10 | I/O — User I/O pin |
| 핀 F1 | GND — Ground |
| 핀 F2 | I/O — User I/O pin |
| 핀 F3 | I/O — User I/O pin |
| 핀 F4 | I/O — User I/O pin |
| 핀 F5 | VCCIO — I/O supply voltage |
| 핀 F6 | I/O — User I/O pin |
| 핀 F7 | I/O — User I/O pin |
| 핀 F8 | I/O — User I/O pin |
| 핀 F9 | I/O — User I/O pin |
| 핀 F10 | I/O — User I/O pin |
| 핀 G1 | I/O — User I/O pin |
| 핀 G2 | I/O — User I/O pin |
| 핀 G3 | I/O — User I/O pin |
| 핀 G4 | I/O — User I/O pin |
| 핀 G5 | GND — Ground |
| 핀 G6 | I/O — User I/O pin |
| 핀 G7 | I/O — User I/O pin |
| 핀 G8 | I/O — User I/O pin |
| 핀 G9 | VCCINT — Core supply voltage 2.5V |
| 핀 G10 | I/O — User I/O pin |
| 핀 H1 | I/O — User I/O pin |
| 핀 H2 | I/O — User I/O pin |
| 핀 H3 | I/O — User I/O pin |
| 핀 H4 | VCCINT — Core supply voltage 2.5V |
| 핀 H5 | I/O — User I/O pin |
| 핀 H6 | I/O — User I/O pin |
| 핀 H7 | I/O — User I/O pin |
| 핀 H8 | GND — Ground |
| 핀 H9 | I/O — User I/O pin |
| 핀 H10 | I/O — User I/O pin |
| 핀 J1 | I/O — User I/O pin |
| 핀 J2 | GND — Ground |
| 핀 J3 | I/O — User I/O pin |
| 핀 J4 | I/O — User I/O pin |
| 핀 J5 | I/O — User I/O pin |
| 핀 J6 | I/O — User I/O pin |
| 핀 J7 | I/O — User I/O pin |
| 핀 J8 | I/O — User I/O pin |
| 핀 J9 | VCCIO — I/O supply voltage |
| 핀 J10 | I/O — User I/O pin |
| 핀 K1 | VCCIO — I/O supply voltage |
| 핀 K2 | I/O — User I/O pin |
| 핀 K3 | I/O — User I/O pin |
| 핀 K4 | I/O — User I/O pin |
| 핀 K5 | GND — Ground |
| 핀 K6 | I/O — User I/O pin |
| 핀 K7 | I/O — User I/O pin |
| 핀 K8 | I/O — User I/O pin |
| 핀 K9 | I/O — User I/O pin |
| 핀 K10 | GND — Ground |
| 핀 L1 | I/O — User I/O pin |
| 핀 L2 | I/O — User I/O pin |
| 핀 L3 | VCCINT — Core supply voltage 2.5V |
| 핀 L4 | I/O — User I/O pin |
| 핀 L5 | I/O — User I/O pin |
| 핀 L6 | I/O — User I/O pin |
| 핀 L7 | VCCINT — Core supply voltage 2.5V |
| 핀 L8 | I/O — User I/O pin |
| 핀 L9 | I/O — User I/O pin |
| 핀 L10 | I/O — User I/O pin |
| 핀 M1 | I/O — User I/O pin |
| 핀 M2 | I/O — User I/O pin |
| 핀 M3 | GND — Ground |
| 핀 M4 | I/O — User I/O pin |
| 핀 M5 | VCCIO — I/O supply voltage |
| 핀 M6 | I/O — User I/O pin |
| 핀 M7 | GND — Ground |
| 핀 M8 | I/O — User I/O pin |
| 핀 M9 | I/O — User I/O pin |
| 핀 M10 | I/O — User I/O pin |
| 핀 N1 | I/O — User I/O pin |
| 핀 N2 | VCCINT — Core supply voltage 2.5V |
| 핀 N3 | I/O — User I/O pin |
| 핀 N4 | I/O — User I/O pin |
| 핀 N5 | I/O — User I/O pin |
| 핀 N6 | I/O — User I/O pin |
| 핀 N7 | I/O — User I/O pin |
| 핀 N8 | I/O — User I/O pin |
| 핀 N9 | I/O — User I/O pin |
| 핀 N10 | I/O — User I/O pin |
| 핀 P1 | GND — Ground |
| 핀 P2 | I/O — User I/O pin |
| 핀 P3 | I/O — User I/O pin |
| 핀 P4 | I/O — User I/O pin |
| 핀 P5 | VCCIO — I/O supply voltage |
| 핀 P6 | I/O — User I/O pin |
| 핀 P7 | I/O — User I/O pin |
| 핀 P8 | I/O — User I/O pin |
| 핀 P9 | I/O — User I/O pin |
| 핀 P10 | I/O — User I/O pin |
| 핀 R1 | I/O — User I/O pin |
| 핀 R2 | I/O — User I/O pin |
| 핀 R3 | I/O — User I/O pin |
| 핀 R4 | I/O — User I/O pin |
| 핀 R5 | GND — Ground |
| 핀 R6 | I/O — User I/O pin |
| 핀 R7 | I/O — User I/O pin |
| 핀 R8 | I/O — User I/O pin |
| 핀 R9 | VCCINT — Core supply voltage 2.5V |
| 핀 R10 | I/O — User I/O pin |
| 핀 T1 | I/O — User I/O pin |
| 핀 T2 | I/O — User I/O pin |
| 핀 T3 | I/O — User I/O pin |
| 핀 T4 | VCCINT — Core supply voltage 2.5V |
| 핀 T5 | I/O — User I/O pin |
| 핀 T6 | I/O — User I/O pin |
| 핀 T7 | I/O — User I/O pin |
| 핀 T8 | GND — Ground |
| 핀 T9 | I/O — User I/O pin |
| 핀 T10 | I/O — User I/O pin |
| 핀 U1 | I/O — User I/O pin |
| 핀 U2 | GND — Ground |
| 핀 U3 | I/O — User I/O pin |
| 핀 U4 | I/O — User I/O pin |
| 핀 U5 | I/O — User I/O pin |
| 핀 U6 | I/O — User I/O pin |
| 핀 U7 | I/O — User I/O pin |
| 핀 U8 | I/O — User I/O pin |
| 핀 U9 | VCCIO — I/O supply voltage |
| 핀 U10 | I/O — User I/O pin |
| 핀 V1 | VCCIO — I/O supply voltage |
| 핀 V2 | I/O — User I/O pin |
| 핀 V3 | I/O — User I/O pin |
| 핀 V4 | I/O — User I/O pin |
| 핀 V5 | GND — Ground |
| 핀 V6 | I/O — User I/O pin |
| 핀 V7 | I/O — User I/O pin |
| 핀 V8 | I/O — User I/O pin |
| 핀 V9 | I/O — User I/O pin |
| 핀 V10 | GND — Ground |
| 핀 W1 | I/O — User I/O pin |
| 핀 W2 | I/O — User I/O pin |
| 핀 W3 | VCCINT — Core supply voltage 2.5V |
| 핀 W4 | I/O — User I/O pin |
| 핀 W5 | I/O — User I/O pin |
| 핀 W6 | I/O — User I/O pin |
| 핀 W7 | VCCINT — Core supply voltage 2.5V |
| 핀 W8 | I/O — User I/O pin |
| 핀 W9 | I/O — User I/O pin |
| 핀 W10 | I/O — User I/O pin |
| 핀 Y1 | I/O — User I/O pin |
| 핀 Y2 | I/O — User I/O pin |
| 핀 Y3 | GND — Ground |
| 핀 Y4 | I/O — User I/O pin |
| 핀 Y5 | VCCIO — I/O supply voltage |
| 핀 Y6 | I/O — User I/O pin |
| 핀 Y7 | GND — Ground |
| 핀 Y8 | I/O — User I/O pin |
| 핀 Y9 | I/O — User I/O pin |
| 핀 Y10 | I/O — User I/O pin |
일반적인 애플리케이션
EP1K100FI256-2 적합 용도: 6 애플리케이션s: Industrial Control Glue Logic, Communications Protocol Bridging, Peripheral Bus Interface (PCI/ISA Bridge), Legacy System Modernization, Test and Measurement Equipment, Low-Density DSP Preprocessing.
Industrial Control Glue Logic
The EP1K100FI256-2 fits industrial control glue-logic applications because it delivers 4,992 logic elements and 186 user I/Os in a single 256-FBGA package. Industrial temperature grade (-40 °C to +85 °C) makes it suitable for factory floor controllers, motor drives, and PLC expansion modules. The 2.5 V core supply with 3.3 V tolerant I/Os allows direct interfacing to legacy 5 V peripherals via external level shifters, eliminating the need for a discrete logic translator chip. Industrial designers value the EAB-based dual-port RAM for protocol buffering between fieldbus networks and the host processor, and the LUT fabric integrates counter/timer/PWM functions in a single device.
추천
Communications Protocol Bridging
The EP1K100FI256-2's 100K gates and 49,152 bits of embedded RAM suit communications protocol bridging between legacy buses (PCI, ISA, UART) and modern serial interfaces. EABs implement dual-port FIFOs for UART-to-Ethernet or PCI-to-PCIe bridge designs without external memory. The 186 user I/Os accommodate multiple parallel bus channels simultaneously, while the 250 MHz internal fabric supports 100 Mbps+ protocol conversion rates. Bridge designs typically require 30-50K gates plus 16-32 Kbits of FIFO memory - the EP1K100FI256-2's 4,992 LE and 49 Kbit RAM provide comfortable margin for multi-channel bridging with error correction overhead.
추천
Peripheral Bus Interface (PCI/ISA Bridge)
The EP1K100FI256-2 works well as a PCI/ISA bridge IC because its 186 user I/Os can simultaneously support the 32-bit PCI bus (49 signals) plus 16-bit ISA bus plus auxiliary control logic. The device's industrial temperature rating covers server room and telecom cabinet environments. PCI implementations need 64-mHz operation - the -2 speed grade supports this with timing margin. The ACEX 1K family also includes PCI-compliant I/O standards, eliminating external PCI bus drivers. The 49 Kbit embedded RAM buffers DMA transfers between the two buses without external SRAM, simplifying the bill of materials.
추천
Legacy System Modernization
The EP1K100FI256-2 fits legacy system modernization projects where reverse-engineered or undocumented logic must be replicated in a programmable device. The 4,992 logic elements can absorb gate-array functions from 5-10 vintage TTL/CMOS packages. Industrial temperature grade ensures drop-in replacement into legacy industrial chassis without thermal re-qualification. Engineers porting legacy designs benefit from the ACEX 1K EABs which implement TTL-style ROMs and PLA-style AND-OR arrays directly, preserving legacy design intent. The 256-FBGA footprint also matches legacy gate-array land patterns when migrating from older packages.
추천
Test and Measurement Equipment
The EP1K100FI256-2 suits test and measurement front-end designs where pattern generation, timing control, and signal routing all need to coexist. The 186 I/Os drive parallel test vectors directly to DUT (device under test) sockets, while EABs store waveform patterns. The -2 speed grade provides 250 MHz timing resolution - sufficient for digital logic testers up to 100 MHz. Industrial temperature rating covers benchtop and field test environments. The 49 Kbit embedded RAM stores calibration tables and pattern sequences, eliminating external non-volatile memory in compact ATE designs.
추천
Low-Density DSP Preprocessing
The EP1K100FI256-2 handles low-density DSP preprocessing tasks such as FIR filtering, FFT preprocessing, and digital downconversion in software-defined radio. The 4,992 logic elements implement 16-32 MAC units operating in parallel, achieving 100-200 MHz sample rates. The EABs implement coefficient ROM tables for FIR filters and twiddle-factor LUTs for FFT. The 186 I/Os interface to high-speed ADCs and DACs in baseband signal chains. Industrial temperature rating suits outdoor SDR installations. Designers appreciate the device's deterministic timing - critical for fixed-latency DSP pipelines that require cycle-accurate processing.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1K100FI256-2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1K100FC256-2 | EP1K100FC256-3 | EP1K100FC256-1 | EP1K100FC256-2N | EP1K100FC256-3N | EP1K100FC256-1N |
|---|---|---|---|---|---|---|---|
| Package | 256-FBGA | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Speed Grade | -2 | -2 | -3 (faster) | -1 (slower) | -2 | -3 (faster) | -1 (slower) |
| Temperature Grade | Industrial (-40 to +85 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) |
| User I/O Count | 186 | 186 | 186 | 186 | 186 | 186 | 186 |
| Embedded RAM | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits |
주요 차별점
- Industrial temperature grade with identical silicon (vs EP1K100FC256-2)
- Mid-range speed grade offers best cost/performance balance (vs EP1K100FC256-3)
- Largest logic capacity in 256-FBGA ACEX 1K family (vs EP1K10FC256-2)
설계 노트
The EP1K100FI256-2 requires four distinct power rails: VCCINT (2.5 V core), VCCIO (3.3 V I/O standard), VCC_PLL (2.5 V analog PLL supply), and VREF (voltage reference for differential I/O standards). Per the ACEX 1K datasheet, decouple each rail with a 0.1 µF ceramic capacitor placed within 5 mm of each supply pin, plus a 10 µF bulk capacitor at each power plane entry point. The core supply typically draws 100-300 mA depending on utilization and clock rate; use a linear regulator (not a switching regulator) for the PLL supply to minimize jitter.
Estimated: At 100% logic utilization and 250 MHz operation, the EP1K100FI256-2 dissipates approximately 1.5-2.0 W. Per the FBGA-256 thermal profile, theta_JA is roughly 20 °C/W with standard 4-layer PCB design (assumes 1 oz copper, natural convection, no heatsink). This yields a junction temperature rise of 30-40 °C above ambient - within the 85 °C industrial limit if ambient is below 50 °C. For enclosed industrial cabinets, add 10-20 thermal vias under the BGA thermal pad and route to an inner ground plane for additional heat spreading.
The 256-FBGA uses a 1.0 mm ball pitch requiring 0.4 mm via pads and 0.2 mm trace/space on at least 4 PCB layers. Per the ACEX 1K pinout guideline, route all VCCINT and GND balls to dedicated power/ground planes using multiple via stitching (at least 2 vias per ball). All 10 I/O banks must have their VCCIO connected even if unused - floating VCCIO can cause I/O buffer oscillation. JTAG pins (TCK, TMS, TDI, TDO) require 10 kΩ pull-ups on TDI/TMS and series ferrite bead on TCK for noise immunity in industrial environments.
Do not assume ACEX 1K design files (.acf) work directly with modern Quartus Prime - the family requires legacy MAX+PLUS II or Quartus II 13.0 service pack 1 or earlier. Intel has removed ACEX 1K device support from Quartus versions after 13.0. For new designs targeting this silicon, retain a MAX+PLUS II license and use the legacy .acf format. Also note that configuration .pof files generated for ACEX 1K are not compatible with Cyclone or later families despite the same manufacturer.
규정 준수 정보
EP1K100FI256-2 lacks a N suffix, suggesting non-RoHS terminal finish; the N-suffix variant EP1K100FI256-2N is the lead-free equivalent per DigiKey listing. AEC-Q100 not applicable for FPGAs. Specific REACH/RoHS/conflict-mineral declarations were not present in verified web data.
