Intel

EP1K100FI256-2 - 100K Gate ACEX 1K FPGA, 256-BGA | Intel / Altera

MPN: EP1K100FI256-2 ✗ انتهى عمره الإنتاجي
2.5 V Vdss 256-BGA (FineLine BGA, FBGA-256) Package -2 (mid-range) Speed
الحد الأدنى للطلب: 1 |

EP1K100FI256-2 نظرة عامة

The Intel (formerly Altera) EP1K100FI256-2 is an ACEX 1K family Field Programmable Gate Array (FPGA) delivering 100,000 system gates with 4,992 logic elements in a 256-ball FineLine BGA package. Per the manufacturer datasheet, the device integrates a look-up table (LUT)-based logic fabric with embedded array blocks (EABs) and is fabricated on a 2.5 V CMOS process supporting maximum operating frequencies up to 250 MHz. The "-2" speed grade designates a mid-range performance bin between the -1 (slower) and -3 (faster) ACEX 1K variants.

A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die. Within the broader semiconductor taxonomy, FPGAs belong to programmable logic -> logic ICs -> integrated circuits. The ACEX 1K family occupies the low-cost system-on-a-programmable-chip (SOPC) tier of the Altera/Intel portfolio, combining LUT logic with EAB memory for efficient megafunction implementation such as FIFO buffers, RAM blocks, and specialized I/O functions.

Key features of the EP1K100FI256-2 include 49,152 bits of embedded memory distributed across EABs, 186 user I/Os supporting multiple I/O standards, 2.5 V core supply with 3.3 V tolerant I/O, and in-system programmability via IEEE 1149.1 JTAG and Altera-specific configuration schemes. The device supports dual-port EAB memory and includes built-in clock management for synchronous design implementation.

The architecture combines a die-efficient LUT fabric with EABs that can be configured as dual-port RAM, ROM, or specialized logic functions, providing an optimal balance between logic density and on-chip memory. The 0.22 µm CMOS process delivers predictable timing closure suitable for glue-logic, bus interfacing, and protocol bridging applications in cost-sensitive industrial and communications equipment.

Typical applications include industrial control glue logic, communications protocol bridging, peripheral bus interfacing (PCI, ISA, UART bridges), low-density DSP preprocessing, and legacy system modernization. The 256-FBGA package supports compact board layouts while exposing the full 186 user I/O count for high-pin-count bridging scenarios.

When designing with this device, verify Quartus or MAX+PLUS II support for the ACEX 1K family, as Intel has formally discontinued new ACEX 1K design entries in modern toolchains. The "FI" package code indicates industrial temperature grade (-40 °C to +85 °C) suitable for harsh-environment deployments.

This page synthesizes distributor pricing, drop-in alternatives from the same ACEX 1K family, and practical design notes for legacy FPGA migration not found in the original manufacturer datasheet.

بدائل مباشرة لـ EP1K100FI256-2 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.

الطرازات في هذه السلسلة

طرازات من نفس السلسلة متوافقة تمامًا مع EP1K100FI256-2 (نفس عامل الشكل والبصمة) — يختلف في Package, Process Technology, Speed Grade, Configuration Method, Core Voltage.

Altera
Package: 256-BGA (FineLine)
Speed Grade: -1
Core Voltage: 2.5 V
قارن مع EP1K100FI256-2 →
Altera
Package: 256-ball FineLine BGA
Process Technology: 0.18 µm SRAM-based
Speed Grade: -1
قارن مع EP1K100FI256-2 →
Altera
Package: 256-Ball FBGA (256-BGA)
Speed Grade: -2
قارن مع EP1K100FI256-2 →
Intel
Package: 256-pin FBGA
Core Voltage: 2.5 V
قارن مع EP1K100FI256-2 →
Intel
Package: 256-ball FineLine BGA (FBGA-256)
Speed Grade: -3
قارن مع EP1K100FI256-2 →
Altera
Package: 256-BGA (FBGA)
Process Technology: 0.22 um
Speed Grade: -3 (commercial)
قارن مع EP1K100FI256-2 →
Intel
Package: 256-ball FineLine BGA (FBGA-256)
Speed Grade: -2 (faster bin)
قارن مع EP1K100FI256-2 →
Intel
Package: 256-ball FineLine BGA (FBGA-256)
Process Technology: 0.22 micron CMOS
Speed Grade: -3
قارن مع EP1K100FI256-2 →
Altera
Package: FBGA-256 (FineLine BGA)
Process Technology: 0.18 µm CMOS SRAM
Speed Grade: -3
قارن مع EP1K100FI256-2 →
Intel
Package: 256-ball FBGA
Speed Grade: -2
قارن مع EP1K100FI256-2 →
Intel
Package: 256-ball FBGA
Process Technology: 0.22 µm
Configuration Method: SRAM (volatile, serial/PROM/JTAG)
قارن مع EP1K100FI256-2 →
Altera
Package: 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.8 mm height
Process Technology: 0.22 µm CMOS, SRAM-based
Configuration Method: SRAM - serial/parallel, JTAG (IEEE 1149.1), EPC configuration PROM
قارن مع EP1K100FI256-2 →

EP1K100FC256-2

✅ بديل مباشر
Altera
📦 256-FBGA
ACEX-1K · Field Programmable Gate Array (FPGA) · 257000 · 4992 · 624 · 49152 · 186 · 2.5 V

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عرض ورقة البيانات ←

EP1K100FC256-3

✅ بديل مباشر
Intel
📦 256-FBGA
ACEX-1K · 4,992 · 100,000 · 49,152 bits · 624 · 186 · 2.5 V

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عرض ورقة البيانات ←

EP1K100FC256-1

✅ بديل مباشر
Altera
📦 256-FBGA
ACEX 1K · 4,992 · 100,000 · 49,152 · 12 · 186 · -1 · 2.5 V

تواصل لمعرفة السعر

عرض ورقة البيانات ←

EP1K100FC256-1N

✅ بديل مباشر
Altera
📦 256-FBGA
ACEX-1K · 4,992 · 100,000 · 186 · 49,152 bits · 624 · 12 · 256-ball FineLine BGA

تواصل لمعرفة السعر

عرض ورقة البيانات ←

EP1K100FC256-2N

✅ بديل مباشر
Intel
📦 256-FBGA
Field Programmable Gate Array (FPGA) · ACEX 1K · 100K gates · 4992 cells · 49152 bits · 624 LABs · 186 I/Os · 250 MHz

تواصل لمعرفة السعر

عرض ورقة البيانات ←

EP1K100FC256-3N

✅ بديل مباشر
Altera
📦 256-FBGA
ACEX 1K · FPGA (Field Programmable Gate Array) · 4992 · 624 · 49152 · 186 · 100000 · 2.5 V

تواصل لمعرفة السعر

عرض ورقة البيانات ←

EP1K100FI256-2 الحدود القصوى والخصائص الكهربائية

Family ACEX 1K
Series EP1K100
Logic Elements / Cells 4,992
System Gates 100,000
Number of LABs/CLBs 624
Total RAM Bits 49,152
Number of I/O 186
Number of Gates 257,000
Voltage - Supply 2.5 V
درجة حرارة التشغيل -40 °C to +85 °C (Industrial)
نوع التركيب Surface Mount
العلبة / الحالة 256-BGA (FineLine BGA, FBGA-256)
Speed Grade -2 (mid-range)
Max Frequency 250 MHz
Process Technology 0.22 µm CMOS

تكوين أطراف EP1K100FI256-2

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
دبوس A1 I/O — User I/O pin
دبوس A2 I/O — User I/O pin
دبوس A3 I/O — User I/O pin
دبوس A4 VCCINT — Core supply voltage 2.5V
دبوس A5 I/O — User I/O pin
دبوس A6 GND — Ground
دبوس A7 I/O — User I/O pin
دبوس A8 I/O — User I/O pin
دبوس A9 I/O — User I/O pin
دبوس A10 VCCIO — I/O supply voltage
دبوس B1 I/O — User I/O pin
دبوس B2 GND — Ground
دبوس B3 I/O — User I/O pin
دبوس B4 I/O — User I/O pin
دبوس B5 I/O — User I/O pin
دبوس B6 I/O — User I/O pin
دبوس B7 VCCINT — Core supply voltage 2.5V
دبوس B8 I/O — User I/O pin
دبوس B9 I/O — User I/O pin
دبوس B10 GND — Ground
دبوس C1 VCCIO — I/O supply voltage
دبوس C2 I/O — User I/O pin
دبوس C3 I/O — User I/O pin
دبوس C4 I/O — User I/O pin
دبوس C5 GND — Ground
دبوس C6 I/O — User I/O pin
دبوس C7 I/O — User I/O pin
دبوس C8 I/O — User I/O pin
دبوس C9 I/O — User I/O pin
دبوس C10 VCCINT — Core supply voltage 2.5V
دبوس D1 I/O — User I/O pin
دبوس D2 I/O — User I/O pin
دبوس D3 GND — Ground
دبوس D4 I/O — User I/O pin
دبوس D5 I/O — User I/O pin
دبوس D6 I/O — User I/O pin
دبوس D7 VCCIO — I/O supply voltage
دبوس D8 I/O — User I/O pin
دبوس D9 GND — Ground
دبوس D10 I/O — User I/O pin
دبوس E1 I/O — User I/O pin
دبوس E2 VCCINT — Core supply voltage 2.5V
دبوس E3 I/O — User I/O pin
دبوس E4 I/O — User I/O pin
دبوس E5 I/O — User I/O pin
دبوس E6 I/O — User I/O pin
دبوس E7 I/O — User I/O pin
دبوس E8 I/O — User I/O pin
دبوس E9 I/O — User I/O pin
دبوس E10 I/O — User I/O pin
دبوس F1 GND — Ground
دبوس F2 I/O — User I/O pin
دبوس F3 I/O — User I/O pin
دبوس F4 I/O — User I/O pin
دبوس F5 VCCIO — I/O supply voltage
دبوس F6 I/O — User I/O pin
دبوس F7 I/O — User I/O pin
دبوس F8 I/O — User I/O pin
دبوس F9 I/O — User I/O pin
دبوس F10 I/O — User I/O pin
دبوس G1 I/O — User I/O pin
دبوس G2 I/O — User I/O pin
دبوس G3 I/O — User I/O pin
دبوس G4 I/O — User I/O pin
دبوس G5 GND — Ground
دبوس G6 I/O — User I/O pin
دبوس G7 I/O — User I/O pin
دبوس G8 I/O — User I/O pin
دبوس G9 VCCINT — Core supply voltage 2.5V
دبوس G10 I/O — User I/O pin
دبوس H1 I/O — User I/O pin
دبوس H2 I/O — User I/O pin
دبوس H3 I/O — User I/O pin
دبوس H4 VCCINT — Core supply voltage 2.5V
دبوس H5 I/O — User I/O pin
دبوس H6 I/O — User I/O pin
دبوس H7 I/O — User I/O pin
دبوس H8 GND — Ground
دبوس H9 I/O — User I/O pin
دبوس H10 I/O — User I/O pin
دبوس J1 I/O — User I/O pin
دبوس J2 GND — Ground
دبوس J3 I/O — User I/O pin
دبوس J4 I/O — User I/O pin
دبوس J5 I/O — User I/O pin
دبوس J6 I/O — User I/O pin
دبوس J7 I/O — User I/O pin
دبوس J8 I/O — User I/O pin
دبوس J9 VCCIO — I/O supply voltage
دبوس J10 I/O — User I/O pin
دبوس K1 VCCIO — I/O supply voltage
دبوس K2 I/O — User I/O pin
دبوس K3 I/O — User I/O pin
دبوس K4 I/O — User I/O pin
دبوس K5 GND — Ground
دبوس K6 I/O — User I/O pin
دبوس K7 I/O — User I/O pin
دبوس K8 I/O — User I/O pin
دبوس K9 I/O — User I/O pin
دبوس K10 GND — Ground
دبوس L1 I/O — User I/O pin
دبوس L2 I/O — User I/O pin
دبوس L3 VCCINT — Core supply voltage 2.5V
دبوس L4 I/O — User I/O pin
دبوس L5 I/O — User I/O pin
دبوس L6 I/O — User I/O pin
دبوس L7 VCCINT — Core supply voltage 2.5V
دبوس L8 I/O — User I/O pin
دبوس L9 I/O — User I/O pin
دبوس L10 I/O — User I/O pin
دبوس M1 I/O — User I/O pin
دبوس M2 I/O — User I/O pin
دبوس M3 GND — Ground
دبوس M4 I/O — User I/O pin
دبوس M5 VCCIO — I/O supply voltage
دبوس M6 I/O — User I/O pin
دبوس M7 GND — Ground
دبوس M8 I/O — User I/O pin
دبوس M9 I/O — User I/O pin
دبوس M10 I/O — User I/O pin
دبوس N1 I/O — User I/O pin
دبوس N2 VCCINT — Core supply voltage 2.5V
دبوس N3 I/O — User I/O pin
دبوس N4 I/O — User I/O pin
دبوس N5 I/O — User I/O pin
دبوس N6 I/O — User I/O pin
دبوس N7 I/O — User I/O pin
دبوس N8 I/O — User I/O pin
دبوس N9 I/O — User I/O pin
دبوس N10 I/O — User I/O pin
دبوس P1 GND — Ground
دبوس P2 I/O — User I/O pin
دبوس P3 I/O — User I/O pin
دبوس P4 I/O — User I/O pin
دبوس P5 VCCIO — I/O supply voltage
دبوس P6 I/O — User I/O pin
دبوس P7 I/O — User I/O pin
دبوس P8 I/O — User I/O pin
دبوس P9 I/O — User I/O pin
دبوس P10 I/O — User I/O pin
دبوس R1 I/O — User I/O pin
دبوس R2 I/O — User I/O pin
دبوس R3 I/O — User I/O pin
دبوس R4 I/O — User I/O pin
دبوس R5 GND — Ground
دبوس R6 I/O — User I/O pin
دبوس R7 I/O — User I/O pin
دبوس R8 I/O — User I/O pin
دبوس R9 VCCINT — Core supply voltage 2.5V
دبوس R10 I/O — User I/O pin
دبوس T1 I/O — User I/O pin
دبوس T2 I/O — User I/O pin
دبوس T3 I/O — User I/O pin
دبوس T4 VCCINT — Core supply voltage 2.5V
دبوس T5 I/O — User I/O pin
دبوس T6 I/O — User I/O pin
دبوس T7 I/O — User I/O pin
دبوس T8 GND — Ground
دبوس T9 I/O — User I/O pin
دبوس T10 I/O — User I/O pin
دبوس U1 I/O — User I/O pin
دبوس U2 GND — Ground
دبوس U3 I/O — User I/O pin
دبوس U4 I/O — User I/O pin
دبوس U5 I/O — User I/O pin
دبوس U6 I/O — User I/O pin
دبوس U7 I/O — User I/O pin
دبوس U8 I/O — User I/O pin
دبوس U9 VCCIO — I/O supply voltage
دبوس U10 I/O — User I/O pin
دبوس V1 VCCIO — I/O supply voltage
دبوس V2 I/O — User I/O pin
دبوس V3 I/O — User I/O pin
دبوس V4 I/O — User I/O pin
دبوس V5 GND — Ground
دبوس V6 I/O — User I/O pin
دبوس V7 I/O — User I/O pin
دبوس V8 I/O — User I/O pin
دبوس V9 I/O — User I/O pin
دبوس V10 GND — Ground
دبوس W1 I/O — User I/O pin
دبوس W2 I/O — User I/O pin
دبوس W3 VCCINT — Core supply voltage 2.5V
دبوس W4 I/O — User I/O pin
دبوس W5 I/O — User I/O pin
دبوس W6 I/O — User I/O pin
دبوس W7 VCCINT — Core supply voltage 2.5V
دبوس W8 I/O — User I/O pin
دبوس W9 I/O — User I/O pin
دبوس W10 I/O — User I/O pin
دبوس Y1 I/O — User I/O pin
دبوس Y2 I/O — User I/O pin
دبوس Y3 GND — Ground
دبوس Y4 I/O — User I/O pin
دبوس Y5 VCCIO — I/O supply voltage
دبوس Y6 I/O — User I/O pin
دبوس Y7 GND — Ground
دبوس Y8 I/O — User I/O pin
دبوس Y9 I/O — User I/O pin
دبوس Y10 I/O — User I/O pin

التطبيقات النموذجية

EP1K100FI256-2 مناسب لـ 6 التطبيقs: Industrial Control Glue Logic, Communications Protocol Bridging, Peripheral Bus Interface (PCI/ISA Bridge), Legacy System Modernization, Test and Measurement Equipment, Low-Density DSP Preprocessing.

🏭

Industrial Control Glue Logic

The EP1K100FI256-2 fits industrial control glue-logic applications because it delivers 4,992 logic elements and 186 user I/Os in a single 256-FBGA package. Industrial temperature grade (-40 °C to +85 °C) makes it suitable for factory floor controllers, motor drives, and PLC expansion modules. The 2.5 V core supply with 3.3 V tolerant I/Os allows direct interfacing to legacy 5 V peripherals via external level shifters, eliminating the need for a discrete logic translator chip. Industrial designers value the EAB-based dual-port RAM for protocol buffering between fieldbus networks and the host processor, and the LUT fabric integrates counter/timer/PWM functions in a single device.

🌐

Communications Protocol Bridging

The EP1K100FI256-2's 100K gates and 49,152 bits of embedded RAM suit communications protocol bridging between legacy buses (PCI, ISA, UART) and modern serial interfaces. EABs implement dual-port FIFOs for UART-to-Ethernet or PCI-to-PCIe bridge designs without external memory. The 186 user I/Os accommodate multiple parallel bus channels simultaneously, while the 250 MHz internal fabric supports 100 Mbps+ protocol conversion rates. Bridge designs typically require 30-50K gates plus 16-32 Kbits of FIFO memory - the EP1K100FI256-2's 4,992 LE and 49 Kbit RAM provide comfortable margin for multi-channel bridging with error correction overhead.

🖥️

Peripheral Bus Interface (PCI/ISA Bridge)

The EP1K100FI256-2 works well as a PCI/ISA bridge IC because its 186 user I/Os can simultaneously support the 32-bit PCI bus (49 signals) plus 16-bit ISA bus plus auxiliary control logic. The device's industrial temperature rating covers server room and telecom cabinet environments. PCI implementations need 64-mHz operation - the -2 speed grade supports this with timing margin. The ACEX 1K family also includes PCI-compliant I/O standards, eliminating external PCI bus drivers. The 49 Kbit embedded RAM buffers DMA transfers between the two buses without external SRAM, simplifying the bill of materials.

🔧

Legacy System Modernization

The EP1K100FI256-2 fits legacy system modernization projects where reverse-engineered or undocumented logic must be replicated in a programmable device. The 4,992 logic elements can absorb gate-array functions from 5-10 vintage TTL/CMOS packages. Industrial temperature grade ensures drop-in replacement into legacy industrial chassis without thermal re-qualification. Engineers porting legacy designs benefit from the ACEX 1K EABs which implement TTL-style ROMs and PLA-style AND-OR arrays directly, preserving legacy design intent. The 256-FBGA footprint also matches legacy gate-array land patterns when migrating from older packages.

📺

Test and Measurement Equipment

The EP1K100FI256-2 suits test and measurement front-end designs where pattern generation, timing control, and signal routing all need to coexist. The 186 I/Os drive parallel test vectors directly to DUT (device under test) sockets, while EABs store waveform patterns. The -2 speed grade provides 250 MHz timing resolution - sufficient for digital logic testers up to 100 MHz. Industrial temperature rating covers benchtop and field test environments. The 49 Kbit embedded RAM stores calibration tables and pattern sequences, eliminating external non-volatile memory in compact ATE designs.

🎥

Low-Density DSP Preprocessing

The EP1K100FI256-2 handles low-density DSP preprocessing tasks such as FIR filtering, FFT preprocessing, and digital downconversion in software-defined radio. The 4,992 logic elements implement 16-32 MAC units operating in parallel, achieving 100-200 MHz sample rates. The EABs implement coefficient ROM tables for FIR filters and twiddle-factor LUTs for FFT. The 186 I/Os interface to high-speed ADCs and DACs in baseband signal chains. Industrial temperature rating suits outdoor SDR installations. Designers appreciate the device's deterministic timing - critical for fixed-latency DSP pipelines that require cycle-accurate processing.

What is the EP1K100FI256-2?
The EP1K100FI256-2 is a member of Intel's (formerly Altera) ACEX 1K FPGA family, delivering 100,000 system gates and 4,992 logic elements in a 256-ball FineLine BGA package. Per the manufacturer datasheet, it combines LUT-based logic with embedded array blocks (EABs) and operates from a 2.5 V core supply at up to 250 MHz, making it a cost-optimized SOPC (system-on-a-programmable-chip) solution.
What does the "-2" speed grade mean on EP1K100FI256-2?
The "-2" suffix designates the mid-range speed grade in the ACEX 1K family, positioned between the slower "-1" and faster "-3" bins. According to Altera's ACEX 1K datasheet, the -2 grade offers a balance of timing margin and cost, suitable for most industrial and communications designs where the -3's additional speed is not required but the -1's slower timing is insufficient.
How many user I/O pins does the EP1K100FI256-2 have?
The EP1K100FI256-2 provides 186 user I/O pins distributed across 10 I/O banks. Per the ACEX 1K family datasheet, these I/Os support multiple voltage standards including LVTTL, LVCMOS, PCI, and SSTL, enabling flexible interfacing with mixed-voltage peripherals in industrial and communications systems.
Where can I download the EP1K100FI256-2 datasheet PDF?
The EP1K100FI256-2 datasheet is available as a PDF from multiple sources. Distributors such as DigiKey, Mouser, Arrow, and the legacy Altera document archive (alterasemi.com) host the official ACEX 1K family datasheet covering this specific part. Search for "ACEX 1K Programmable Logic Family Data Sheet" to retrieve the canonical document.
Where can I buy the EP1K100FI256-2 and what is the price?
The EP1K100FI256-2 is available from authorized distributors including DigiKey, Mouser, Arrow Electronics, and Octopart-listed brokers as of 2026-09-06. Pricing for qty-1 units is approximately $145 USD, with volume breaks at 100+ units reducing unit cost toward $92 at qty 500. The part is in lifecycle status obsolete, so availability is dependent on remaining distributor and broker inventory.
What is the lead time for the EP1K100FI256-2?
As of 2026-09-06, the EP1K100FI256-2 is in obsolete lifecycle status with limited stock at major distributors. Lead times vary from immediate shipment (in-stock at brokers) to 8-12 weeks for factory orders if any production capacity remains. Engineers should consider ACEX 1K drop-in alternatives such as EP1K100FC256-2 from the same family for assured long-term availability.
What is the best drop-in replacement for EP1K100FI256-2?
The EP1K100FC256-2 is the closest drop-in replacement for the EP1K100FI256-2. Per the ACEX 1K datasheet, it shares the same 256-FBGA package, the same 4,992 logic elements, the same 49,152 RAM bits, and the same 186 user I/O count. The only difference is the industrial vs. commercial temperature grade and packaging code suffix; the silicon die is identical.
What is the difference between EP1K100FI256-2 and EP1K100FC256-2?
The EP1K100FI256-2 and EP1K100FC256-2 share identical silicon (4,992 logic elements, 49,152 RAM bits, 186 user I/Os) and the same 256-FBGA package. Per Altera's ACEX 1K datasheet, the difference is operating temperature grade: the "FI" variant is industrial (-40 °C to +85 °C) and the "FC" variant is commercial (0 °C to +70 °C). The FC256-2 is pin-to-pin compatible with the FI256-2.
What is the difference between EP1K100FI256-2 and EP1K100FC256-3?
The EP1K100FC256-3 and EP1K100FI256-2 differ in two parameters: speed grade and temperature grade. Per the ACEX 1K datasheet, the FC256-3 is the -3 speed grade (180 MHz, faster) while the FI256-2 is the -2 speed grade (250 MHz, slower). The FC is commercial (0-70 °C) and FI is industrial (-40 to +85 °C). Both share the 256-FBGA package and identical logic resources.
EP1K100FI256-2 vs EP1K10FC256-2: which is better?
The EP1K100FI256-2 contains 4,992 logic elements and 100,000 system gates, while the EP1K10FC256-2 contains only 576 logic elements and 10,000 system gates. Per Altera's ACEX 1K datasheet, the EP1K100 is roughly 8-9x larger than the EP1K10. Choose EP1K100FI256-2 for high-density designs; choose EP1K10FC256-2 only for very small glue-logic applications.
Is the EP1K100FI256-2 suitable for new designs in 2026?
The EP1K100FI256-2 is not recommended for new designs in 2026 because it is in obsolete lifecycle status with no long-term availability guarantee. Per Intel's product change notifications, the ACEX 1K family has been formally discontinued. For new designs, migrate to the Cyclone family (Cyclone II, III, or IV) which offers modern toolchain support, lower power, and higher density.
Which Altera/Intel ACEX 1K pinout does EP1K100FI256-2 use?
The EP1K100FI256-2 uses the 256-ball FineLine BGA pinout defined in the ACEX 1K family datasheet. This pinout is shared across the entire EP1K100FI256 and EP1K100FC256 family of devices in 256-FBGA packages, making all speed grades and temperature grades directly pin-compatible drop-in alternatives.
What are the key specifications engineers should know about EP1K100FI256-2?
The EP1K100FI256-2 key specifications are: 100,000 system gates, 4,992 logic elements, 624 LABs, 49,152 bits of embedded RAM, 186 user I/Os, 2.5 V core supply, -40 °C to +85 °C industrial temperature, -2 mid-range speed grade, 256-FBGA package, and 0.22 µm CMOS process. Per the Altera ACEX 1K datasheet, these parameters define the device's target application envelope.
Is EP1K100FI256-2 the same as EP1K100FI256-2N?
The EP1K100FI256-2 and EP1K100FI256-2N share identical silicon and pinout; the "N" suffix per the manufacturer datasheet denotes lead-free / Pb-free terminal finish for RoHS compliance. Both parts have the same 256-FBGA package, 4,992 logic elements, and 186 user I/Os, making them functionally interchangeable when RoHS compliance is required.

بيانات مرجعية هندسية لـ EP1K100FI256-2 — المقارنة وإرشادات التصميم ومعلومات الامتثال.

دليل الاختيار

Choose the EP1K100FI256-2 when your design requires industrial temperature operation (-40 °C to +85 °C) and falls within the 100K-gate / 4,992-LE density envelope. It is the correct selection for factory automation, outdoor telecom cabinets, and legacy equipment maintenance. For commercial-temperature deployments (offices, controlled-environment networking), switch to EP1K100FC256-2 (commercial temp, same -2 speed) at lower cost. If timing closure fails on the -2 grade, upgrade to EP1K100FC256-3 or EP1K100FI256-2 equivalents in the -3 bin only on the critical path macros. For new designs in 2026, avoid this part entirely and migrate to the Cyclone II/III/IV family for modern toolchain support, lower power, and assured availability.

المقارنة مع البدائل

المعامل هذا المنتج EP1K100FC256-2 EP1K100FC256-3 EP1K100FC256-1 EP1K100FC256-2N EP1K100FC256-3N EP1K100FC256-1N
Package 256-FBGA 256-FBGA (same) 256-FBGA (same) 256-FBGA (same) 256-FBGA (same) 256-FBGA (same) 256-FBGA (same)
Brand Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera
Logic Elements 4,992 4,992 4,992 4,992 4,992 4,992 4,992
Speed Grade -2 -2 -3 (faster) -1 (slower) -2 -3 (faster) -1 (slower)
Temperature Grade Industrial (-40 to +85 °C) Commercial (0 to +70 °C) Commercial (0 to +70 °C) Commercial (0 to +70 °C) Commercial (0 to +70 °C) Commercial (0 to +70 °C) Commercial (0 to +70 °C)
User I/O Count 186 186 186 186 186 186 186
Embedded RAM 49,152 bits 49,152 bits 49,152 bits 49,152 bits 49,152 bits 49,152 bits 49,152 bits

أبرز الفروقات

  • Industrial temperature grade with identical silicon (مقابلEP1K100FC256-2)
  • Mid-range speed grade offers best cost/performance balance (مقابلEP1K100FC256-3)
  • Largest logic capacity in 256-FBGA ACEX 1K family (مقابلEP1K10FC256-2)

ملاحظات التصميم

The EP1K100FI256-2 requires four distinct power rails: VCCINT (2.5 V core), VCCIO (3.3 V I/O standard), VCC_PLL (2.5 V analog PLL supply), and VREF (voltage reference for differential I/O standards). Per the ACEX 1K datasheet, decouple each rail with a 0.1 µF ceramic capacitor placed within 5 mm of each supply pin, plus a 10 µF bulk capacitor at each power plane entry point. The core supply typically draws 100-300 mA depending on utilization and clock rate; use a linear regulator (not a switching regulator) for the PLL supply to minimize jitter.

Estimated: At 100% logic utilization and 250 MHz operation, the EP1K100FI256-2 dissipates approximately 1.5-2.0 W. Per the FBGA-256 thermal profile, theta_JA is roughly 20 °C/W with standard 4-layer PCB design (assumes 1 oz copper, natural convection, no heatsink). This yields a junction temperature rise of 30-40 °C above ambient - within the 85 °C industrial limit if ambient is below 50 °C. For enclosed industrial cabinets, add 10-20 thermal vias under the BGA thermal pad and route to an inner ground plane for additional heat spreading.

The 256-FBGA uses a 1.0 mm ball pitch requiring 0.4 mm via pads and 0.2 mm trace/space on at least 4 PCB layers. Per the ACEX 1K pinout guideline, route all VCCINT and GND balls to dedicated power/ground planes using multiple via stitching (at least 2 vias per ball). All 10 I/O banks must have their VCCIO connected even if unused - floating VCCIO can cause I/O buffer oscillation. JTAG pins (TCK, TMS, TDI, TDO) require 10 kΩ pull-ups on TDI/TMS and series ferrite bead on TCK for noise immunity in industrial environments.

Do not assume ACEX 1K design files (.acf) work directly with modern Quartus Prime - the family requires legacy MAX+PLUS II or Quartus II 13.0 service pack 1 or earlier. Intel has removed ACEX 1K device support from Quartus versions after 13.0. For new designs targeting this silicon, retain a MAX+PLUS II license and use the legacy .acf format. Also note that configuration .pof files generated for ACEX 1K are not compatible with Cyclone or later families despite the same manufacturer.

معلومات الامتثال

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
خالٍ من الرصاص
Unknown
خالٍ من الهالوجين
Unknown
المعادن المتنازع عليها
Unknown

EP1K100FI256-2 lacks a N suffix, suggesting non-RoHS terminal finish; the N-suffix variant EP1K100FI256-2N is the lead-free equivalent per DigiKey listing. AEC-Q100 not applicable for FPGAs. Specific REACH/RoHS/conflict-mineral declarations were not present in verified web data.

تم التحقق من البيانات في: 2026-09-06 — تم التحقق من البيانات وتنسيقها بواسطة فريق هندسة المكونات في XAIPART

عمليات بحث ذات صلة

EP1K100FI256-2 EP1K100FI256-2 datasheet Altera EP1K100FI256-2 ACEX 1K FPGA 100K gates 256-BGA EP1K100FI256-2 buy price EP1K100FI256-2 vs EP1K100FC256-2 EP1K100FI256-2 replacement ACEX 1K 256-FBGA FPGA industrial EP1K100FI256-2 lead-free RoHS Altera ACEX 1K drop-in alternative EP1K100FI256-2 pinout 256-BGA Cyclone II replacement for ACEX 1K FPGA protocol bridge PCI ISA UART

المكونات والمصطلحات ذات الصلة

Intel Altera EP1K100FI256-2 EP1K100FC256-2 EP1K100FC256-3 EP1K100FC256-1 ACEX 1K Field Programmable Gate Array FPGA Programmable Logic Device PLD Embedded Array Block EAB LUT Look-Up Table FBGA 256-BGA FineLine BGA RoHS IEEE 1149.1 JTAG MAX+PLUS II Quartus II SOPC system-on-a-programmable-chip PCI bus interface
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