EP1K100FC256-2 - ACEX-1K FPGA, 4992 LE, 186 I/O, 2.5V | Altera
MPN: EP1K100FC256-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $43.5 | $43.50 |
| 10 | $39.2 | $392.00 |
| 100 | $33.8 | $3,380.00 |
| 500 | $30.15 | $15,075.00 |
| 1,000 | $27.6 | $27,600.00 |
Drop-in alternatives for EP1K100FC256-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K100FC256-2N
✅ Drop-In✓ In Stock
$78.1951 / Unit
View Datasheet →EP1K100FC256-1N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$22.1 / Unit
View Datasheet →EP1K100FC256-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$53.2 / Unit
View Datasheet →EP1K100FI256-2
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EP1K100FC256-3
✅ Drop-In✓ In Stock
$30.22 / Unit
View Datasheet →EP1K100FC256-2 Maximum Ratings & Electrical Characteristics
| Product Family | ACEX-1K |
| Product Type | Field Programmable Gate Array (FPGA) |
| Equivalent Logic Gates | 257000 |
| Logic Elements / Cells | 4992 |
| Logic Array Blocks (LABs) | 624 |
| Total RAM Bits | 49152 |
| User I/O Pins | 186 |
| Core Supply Voltage | 2.5 V |
| Technology | 0.22 um CMOS |
| Package | 256-Ball FBGA (256-BGA) |
| Number of Terminals | 256 |
| Terminal Form | Ball |
| Terminal Pitch | 1.00 mm |
| Package Shape | Square |
| Speed Grade | -2 |
| Maximum Internal Frequency | 250 MHz |
| Mounting Type | Surface Mount |
EP1K100FC256-2 square Pin Configuration Guide
Complete pinout information for EP1K100FC256-2 (square package) with 186 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K100FC256-2.
Refer to the datasheet for full pin configuration.
Estimated pin count: 186 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K100FC256-2 is suitable for 6 applications: Industrial Control and Automation Logic, Telecom Protocol Bridging and Packet Buffering, Test and Measurement Instrumentation, Legacy System Repair and Obsolescence Management, Multi-Voltage Digital System Integration, FPGA Prototyping and Laboratory Evaluation.
Industrial Control and Automation Logic
The EP1K100FC256-2 suits industrial control and automation tasks where moderate logic density, 186 user I/O, and embedded RAM are needed for glue logic, bus decoding, status monitoring, and motor-control state machines. Its 2.5 V core and 0.22 um CMOS process reduce power versus older 5 V FPGA families. In a typical factory control board, 186 I/O pins can interface with parallel ADCs, encoder counters, opto-isolators, and HMI bus controllers while retaining timing margins at the -2 speed grade. The 49152 RAM bits allow small FIFOs for asynchronous handshakes and sensor-data buffering. Because this is an SRAM FPGA, an external EPC2 configuration device reloads the logic at power-up, which is useful in equipment that must recover a known state quickly. For legacy industrial products already using ACEX-1K, this part is a manageable repair-sustaining choice if commercial temperature is acceptable.
Recommended
Telecom Protocol Bridging and Packet Buffering
In telecom line cards and small switching systems, the EP1K100FC256-2 can implement simple protocol bridges, cell header translators, and packet FIFOs. The 49152 embedded RAM bits are especially useful for dual-port RAM buffers that move data between asynchronous clock domains without external SRAM. The 186 I/O pins support parallel Utopia-style, 8/16-bit microprocessor buses, and simple serial backplane interfaces. At 2.5 V core voltage, the device fits systems that already use low-voltage ASICs or network processors. The ACEX embedded array supports megafunctions such as FIFO and RAM, reducing design time. Designers should account for the FPGA's need for a dedicated bitstream PROM and may prefer the lead-free EP1K100FC256-2N variant to meet modern RoHS procurement rules.
Recommended
Test and Measurement Instrumentation
Benchtop instruments and modular test equipment need flexible trigger logic, waveform-definition RAM, and high channel count. The EP1K100FC256-2 supplies 4992 logic elements and 186 user I/O pins for pattern generators, frequency counters, and instrument-control interfaces. Its embedded RAM can store lookup tables for arbitrary waveform generation or acquisition decimation. The 0.22 um, 2.5 V technology keeps core power lower than older 3.3 V PLDs, easing thermal management inside sealed enclosures. In a digital multimeter or logic analyzer, the FPGA can perform real-time comparison and data formatting before sending results to an ADC or host processor. Because ACEX-1K is an older family, this device is best suited for sustaining existing test products rather than new high-performance designs. For replacement boards, confirm that configuration PROM and programming files remain available.
Recommended
Legacy System Repair and Obsolescence Management
Many communications, medical, and industrial products designed in the early 2000s use ACEX-1K FPGAs. The EP1K100FC256-2 is a serviceable replacement for boards that were originally populated with the non-N commercial version. Its 256-ball FBGA package and 186 I/O pinout match the original footprint, so the same PCB, bitstream, and configuration device can usually be retained. Stock remains available through multiple distributors as of 2026-09-06, though lifetime availability is uncertain. For repair programs, qualified buyers should secure last-time-buy inventory and validate incoming parts against the existing programming file. If lead-free reflow is required, the EP1K100FC256-2N is the safer drop-in candidate because the N suffix indicates the RoHS-compliant finish.
Recommended
Multi-Voltage Digital System Integration
The EP1K100FC256-2 fits systems that combine 2.5 V digital logic with legacy 3.3 V peripheral devices. Operating from a 2.5 V core, the ACEX-1K can interface with standard logic families while providing a low-voltage internal fabric. The 186 I/O pins can be arranged to accept differential or single-ended signals commonly found in memories, controllers, and interface transceivers, subject to the pin-specific voltage standards in the ACEX datasheet. The 49152 RAM bits simplify data-width matching between buses of different widths and speeds. A designer can use this FPGA to replace multiple octal buffers, address decoders, and FIFO controllers with one programmable device. For new projects, verify that the I/O bank supply voltage levels are configured consistently and that the -2 grade timing still meets the mixed-clock system requirement.
Recommended
FPGA Prototyping and Laboratory Evaluation
For laboratory use and early system evaluation, the EP1K100FC256-2 gives engineers a low-cost entry point to ACEX-1K prototyping. The 4992 logic elements and 49152 RAM bits are sufficient to evaluate algorithms, counters, finite state machines, and small soft-core processors before migrating to a larger FPGA or ASIC. The 186 user I/O pins connect to logic analyzers, pattern generators, and external SRAM. Because the device is BGA-packaged, a custom evaluation board or an existing ACEX-1K demo board is needed for access to the balls. The -2 speed grade offers practical timing margins for bench prototypes, and the commercial temperature grade is acceptable in most laboratory environments. Program the part with Altera software through a ByteBlaster or USB-Blaster using the active-serial or passive-serial configuration mode.
Recommended
Recommended Products Summary
Engineering reference data for EP1K100FC256-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K100FC256-2N | EP1K100FC256-1N | EP1K100FI256-2 | EP1K100FC256-3 |
|---|---|---|---|---|---|
| Package | 256-BGA (FBGA-256) | 256-BGA (FBGA-256) - same | 256-BGA (FBGA-256) - same | 256-BGA (FBGA-256) - same | 256-BGA (FBGA-256) - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Speed Grade | -2 | -2 | -1 | -2 | -3 |
| Logic Elements | 4992 | 4992 | 4992 | 4992 | 4992 |
| Embedded RAM Bits | 49152 | 49152 | 49152 | 49152 | 49152 |
| User I/O | 186 | 186 | 186 | 186 | 186 |
| Core Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Temperature Grade | Commercial (C suffix) | Commercial (C suffix) | Commercial (C suffix) | Industrial (I suffix) | Commercial (C suffix) |
| Lead-Free Finish | No (non-N variant) | Yes (N suffix) | Yes (N suffix) | No (non-N variant) | No (non-N variant) |
| Logic Array Blocks | 624 | 624 | 624 | 624 | 624 |
Key Differentiators
- Balanced -2 speed grade for widespread legacy compatibility (vs EP1K100FC256-3)
- SameFrame footprint migration with same-family ACEX devices (vs EP1K100FI256-2)
- Availability of a lead-free N-suffix equivalent for RoHS production (vs EP1K100FC256-2N)
Design Notes
EP1K100FC256-2 is an SRAM-based FPGA, so it has no non-volatile configuration storage. It must be configured after each power-up by an external EPC1, EPC2, or compatible PROM, or by a host processor. If the configuration device is missing, the FPGA I/O pins remain tri-stated and the design will not operate. Always include a configuration-error indication in your board design and verify the programming file format matches the device density and speed grade.
The ACEX-1K core requires a 2.5 V supply. Place low-ESR 0.1 uF ceramic capacitors close to each power ball and add bulk capacitance such as 10 uF near the FPGA supply entry. The exact current depends on logic utilization and switching frequency; estimate the core current from the ACEX power calculator or measure the prototype. A poor 2.5 V supply can cause marginal timing and configuration failures, especially in BGA parts with long PCB traces.
The EP1K100FC256-2 uses a 256-ball FBGA with 1.00 mm pitch. Use accurate ball-pad design per the ACEX FineLine BGA package drawing and avoid blindly reusing a different BGA footprint. Breakout vias should be sized to allow a continuous ground plane beneath the center of the package. Keep high-speed I/O traces matched where needed and use via-in-pad or adjacent-via routing only after checking the solder mask and annular ring requirements.
Compliance Information
The non-N EP1K100FC256-2 product code usually indicates a leaded finish, while N-suffix variants such as EP1K100FC256-2N are intended as lead-free. RoHS/REACH status should be confirmed from the specific lot, packaging, and manufacturer certificate before compliance claims.
