Intel

EP20K1000CF672I8 - APEX 20KC FPGA, 1M Gates, 672-FBGA | Intel

MPN: EP20K1000CF672I8 ✗ Akhir Hidup

1.71 V to 1.89 V (1.8 V nominal) Vdss LVTTL, LVCMOS, PCI, SSTL, HSTL Rds(on) 672-pin FC-FBGA (FineLine BGA) Package 301.21 MHz Speed SRAM-based (volatile) Memory

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EP20K1000CF672I8 Ringkasan

The Intel (formerly Altera) EP20K1000CF672I8 is a high-density APEX 20KC family FPGA delivering 1,000,000 system gates and 38,400 logic elements in a 672-pin FineLine BGA package. Built on a 0.15 µm CMOS process, it operates from a 1.71 V to 1.89 V core supply (1.8 V nominal) and supports up to 508 user I/O plus 4 dedicated inputs, giving designers ample pins for high-bandwidth parallel interfaces.

An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture sits between PALs/CPLDs (low-density, non-volatile, fixed interconnect) and ASICs (high-density, fixed-function, high NRE). The APEX 20KC family belongs to Intel's high-density SRAM-based programmable logic hierarchy: FPGA → programmable logic device → PLD → semiconductor. Because APEX 20KC cells are SRAM-backed, the device is re-programmable in-system and supports the MultiCore interconnect with embedded array blocks (EABs) for on-chip memory and constant storage.

Key features include 1M system gates, 38,400 logic elements, embedded array blocks (EABs) for true dual-port RAM and FIFO, four phase-locked loops (PLLs) for clock management, and LVTTL/LVCMOS/PCI/SSTL/HSTL I/O standards. Internal performance supports designs up to 301.21 MHz, and the 672-ball FineLine BGA package uses a 1.00 mm ball pitch suited for high-density, multi-layer PCB layouts. The industrial temperature grade (-40 °C to +85 °C) and 8 ns pin-to-pin logic delay further broaden its applicability.

Architecturally, the EP20K1000CF672I8 combines a fine-grained logic element fabric with coarse-grained EABs, allowing efficient implementation of wide datapath functions, FIFOs, and DSP-style multipliers without consuming excessive logic. The MultiCore interconnect provides predictable routing delays, which is essential for closing timing on multi-megahertz designs. Four PLLs support clock multiplication, division, and phase shifting, enabling multiple clock domains within a single device.

Typical applications include telecommunications backplane glue logic, PCI/PCI-X bridge and bus-interface controllers, high-speed parallel DSP pre-processing, industrial motion control and vision processing, and replacement of multiple CPLDs and gate arrays with a single reconfigurable part. The 508 I/O count makes the EP20K1000CF672I8 well suited for legacy 32-bit/64-bit bus aggregation that would otherwise require several discrete components.

When designing with this device, ensure all configuration pins (MSEL, nCONFIG, nSTATUS, CONF_DONE, DCLK) are pulled to the correct logic levels before power-up, and provide a stable 1.8 V supply with adequate bulk decoupling because SRAM-based FPGAs draw large inrush currents during configuration. Plan for JTAG (IEEE 1149.1) boundary-scan access to simplify board test.

Alternatif penggantian untuk EP20K1000CF672I8 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EP20K1000CF672I8 (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Package, Speed Grade, Process Technology, Configuration Interface.

EP20K1000CF672C7

Intel

Operating Temperature: 0 °C to +85 °C (commercial, C suffix)

Package: 672-ball FC-FBGA (45 × 45 mm, 1.27 mm pitch)

Speed Grade: C7 (fastest)