EP20K100ETC144-1X - APEX 20KE FPGA 4160 Cells 144-TQFP | Intel
MPN: EP20K100ETC144-1X ✗ Akhir HidupEP20K100ETC144-1X Ringkasan
An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that lets designers implement arbitrary digital logic through SRAM-based configuration cells, after the chip has been manufactured. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) between simple CPLDs (which are gate-array-style and non-volatile) and modern high-end SoC FPGAs with hard CPU cores. The APEX 20KE series specifically combines Look-Up Table (LUT)-based logic with embedded array blocks (EABs) for on-chip memory, making it suitable for data-path and DSP-style glue logic in telecom, networking, and industrial systems.
Key specifications of the EP20K100ETC144-1X include 4160 logic elements, 53,248 typical gates, 92 available user I/O pins, a propagation delay figure of 1.6 ns through internal interconnect, 1.8 V core VCC, and a commercial operating temperature grade of 0 °C to 85 °C. The "-1X" speed-grade suffix designates the slowest APEX 20KE timing bin, while the "TC144" suffix denotes the TQFP-144 thermally enhanced gull-wing package.
From an architectural standpoint, the device combines a fine-grained LUT fabric with embedded array blocks (EABs) that can be configured as RAM, ROM, or FIFO blocks of up to 2 Kbits each. The LUT-and-EAB hybrid is a hallmark of the APEX 20K family and offers higher effective logic density per square millimetre than pure CPLD architectures when implementing wide datapath functions such as bus interfaces, protocol converters, and state machines.
Typical applications for the EP20K100ETC144-1X include glue logic in telecom line cards, industrial control backplanes, PCI bridge and bus-interfaces, protocol converters (UART, I2C, SPI bridges), and low-density DSP pre-processing blocks. The 144-pin TQFP is well-suited to through-hole-style prototyping or rework-friendly assembly, and the commercial temperature range covers most indoor equipment.
When designing with this part, engineers should note that the APEX 20KE family is no longer in active production and is supported primarily through the legacy Altera/Intel design flow with the Quartus II toolchain. Designers targeting new designs should evaluate Cyclone IV/V or MAX II equivalents unless footprint compatibility with the existing TQFP-144 PCB is required.
Alternatif penggantian untuk EP20K100ETC144-1X — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP20K100ETC144-1X (sama faktor bentuk dan footprint) — berbeda di dalam Process Technology, Family, Package, Operating Temperature, Speed Grade.
EP20K100ETC144-1N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K100ETC144-1N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K100EFC144-1
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K100CT144C7
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K100CF144C7
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP4CE6E22C8N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP20K100ETC144-1X Rating Maksimal & Karakteristik Listrik
| Device Family | APEX 20KE |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 4160 cells |
| Typical Gates | 53248 |
| Macrocells | 416 |
| User I/Os | 92 |
| Core Voltage | 1.8 V |
| Maximum Frequency | 250 MHz |
| Propagation Delay | 1.6 ns |
| Process Technology | 0.22 µm CMOS all-layer copper |
| Package Type | TQFP-144 |
| Tipe Mounting | Surface Mount (gull-wing) |
| Suhu Kerja | 0 °C to 85 °C |
| Speed Grade | -1 (slowest bin, "-1X") |
Konfigurasi Pin EP20K100ETC144-1X
| Pin produk 1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 2 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 3 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 4 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 5 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 6 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 7 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 8 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 9 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 10 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 11 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 12 | VCCIO — I/O bank supply voltage |
| Pin produk 13 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 14 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 15 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 16 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 17 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 18 | GND — Ground |
| Pin produk 19 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 20 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 21 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 22 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 23 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 24 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk 25 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 26 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 27 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 28 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 29 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 30 | GND — Ground |
| Pin produk 31 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 32 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 33 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 34 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 35 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 36 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 37 | VCCIO — I/O bank supply voltage |
| Pin produk 38 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 39 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 40 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 41 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 42 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 43 | GND — Ground |
| Pin produk 44 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 45 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 46 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 47 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 48 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 49 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk 50 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 51 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 52 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 53 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 54 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 55 | GND — Ground |
| Pin produk 56 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 57 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 58 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 59 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 60 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 61 | VCCIO — I/O bank supply voltage |
| Pin produk 62 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 63 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 64 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 65 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 66 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 67 | GND — Ground |
| Pin produk 68 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 69 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 70 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 71 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 72 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 73 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk 74 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 75 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 76 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 77 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 78 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 79 | GND — Ground |
| Pin produk 80 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 81 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 82 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 83 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 84 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 85 | VCCIO — I/O bank supply voltage |
| Pin produk 86 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 87 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 88 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 89 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 90 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 91 | GND — Ground |
| Pin produk 92 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 93 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 94 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 95 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 96 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 97 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk 98 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 99 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 100 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 101 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 102 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 103 | GND — Ground |
| Pin produk 104 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 105 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 106 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 107 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 108 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 109 | VCCIO — I/O bank supply voltage |
| Pin produk 110 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 111 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 112 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 113 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 114 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 115 | GND — Ground |
| Pin produk 116 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 117 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 118 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 119 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 120 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 121 | VCCINT — Core supply voltage (1.8 V) |
| Pin produk 122 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 123 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 124 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 125 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 126 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 127 | GND — Ground |
| Pin produk 128 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 129 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 130 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 131 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 132 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 133 | VCCIO — I/O bank supply voltage |
| Pin produk 134 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 135 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 136 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 137 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 138 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 139 | GND — Ground |
| Pin produk 140 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 141 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 142 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 143 | I/O — User I/O pin (bank-dependent voltage) |
| Pin produk 144 | I/O — User I/O pin (bank-dependent voltage) |
Aplikasi Umum
EP20K100ETC144-1X cocok untuk 6 aplikasis: Telecom Line-Card Glue Logic, Industrial Control Backplane Interface, PCI Bridge and Bus-Interface Logic, Protocol Converter (UART / SPI / I2C Bridges), Low-Density DSP Pre-Processing, Legacy Test & Measurement Equipment.
Telecom Line-Card Glue Logic
The EP20K100ETC144-1X is well-suited to telecom line-card glue logic because its 4160 logic elements and 92 user I/Os are sufficient to bridge TDM buses, E1/T1 framers, and serial backplane interfaces. The 1.8 V core with multi-voltage I/O banks allows direct interfacing to legacy 3.3 V LVCMOS framers without level shifters. The TQFP-144 package simplifies rework on low-volume line-card prototypes, and the 250 MHz toggle rate comfortably exceeds the 50-77 MHz bus speeds typical of TDM and H.110 backplanes.
Direkomendasikan
Industrial Control Backplane Interface
The 144-pin TQFP package and 0 °C to 85 °C commercial temperature range make the EP20K100ETC144-1X a fit for industrial control backplane interfaces such as VME, CompactPCI bridge logic, and proprietary field-bus controllers. The embedded array blocks (EABs) implement on-chip dual-port RAM for FIFO buffering between backplane domains. The 1.6 ns propagation delay supports deterministic interrupt handling in real-time control loops. Engineers targeting industrial -40 °C to +85 °C should select the EP20K100ETC144-1N variant.
Direkomendasikan
PCI Bridge and Bus-Interface Logic
With 4160 logic elements, the EP20K100ETC144-1X is well-matched to PCI 32-bit/33 MHz bridge logic, including target and initiator state machines, parity generation/checking, and arbiter glue. The 92 user I/Os comfortably accommodate the 49-pin PCI bus plus address/data multiplexing for a secondary local bus. The 250 MHz internal performance gives 4x headroom over the 33 MHz PCI clock, easing timing closure. The APEX 20KE EABs can also be configured as 32x36 FIFOs for PCI burst transactions.
Direkomendasikan
Protocol Converter (UART / SPI / I2C Bridges)
The EP20K100ETC144-1X serves as a flexible multi-protocol converter for legacy equipment where a host CPU needs UART-to-SPI, SPI-to-I2C, or GPIO expansion bridges. Its 4160 logic elements are more than sufficient for eight or more concurrent serial channels with FIFO buffering in EAB memory. The 1.8 V core with selectable I/O bank voltages enables direct connection to 1.8 V, 2.5 V, or 3.3 V peripherals without external level shifters, reducing BOM cost in cost-sensitive industrial gateways.
Direkomendasikan
Low-Density DSP Pre-Processing
The APEX 20KE EABs allow the EP20K100ETC144-1X to function as a pre-processing block for low-density DSP workloads such as FIR filters, FFT butterflies, and digital down-conversion. Each EAB can store coefficient tables for up to 2 Kbits of data, and the LUT fabric implements the multipliers/accumulators at clock rates up to 250 MHz. While not competitive with modern DSP silicon, the device remains useful in legacy radar and sonar pre-processing subsystems that already include APEX 20KE on the bill of materials.
Direkomendasikan
Legacy Test & Measurement Equipment
Test and measurement equipment designed in the late 1990s and early 2000s often integrated the EP20K100ETC144-1X as a pattern-generator or timing-controller core. The 250 MHz internal performance and 92 user I/Os are well-suited to driving 32-channel digital pattern generators with per-channel timing skew control. The TQFP-144 package allows easy replacement during field repair of legacy instruments such as ATE loadboards, protocol analyzers, and boundary-scan controllers.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP20K100ETC144-1X — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP20K100ETC144-1 | EP20K100ETC144-1N | EP20K100EFC144-1 | EP20K100CT144C7 | EP4CE6E22C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera legacy) | Intel | Intel | Intel | Intel | Intel (Cyclone IV) |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 (E22) - same footprint |
| Family | APEX 20KE (EAB-equipped) | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20K (non-E) | Cyclone IV |
| Logic Elements | 4160 | 4160 | 4160 | 4160 | 4160 | 6272 (Cyclone IV LE) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.2 V |
| User I/Os | 92 | 92 | 92 | 92 | 92 | 91 (E22 pinout) |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | -40 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | -40 °C to 100 °C (industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Active |
Diferensiator Kunci
- Same silicon density across the -1 / -1X / -1N speed grades (vsEP20K100ETC144-1)
- Industrial temperature variant available in same footprint (vsEP20K100ETC144-1N)
- Active modern alternative available in same footprint (vsEP4CE6E22C8N)
Catatan Desain
The EP20K100ETC144-1X requires a clean 1.8 V core supply (VCCINT) plus one or more VCCIO bank voltages for the I/O ring. Decoupling should follow the Altera reference design: one 100 µF bulk + ten 4.7 µF mid-frequency + one 0.1 µF high-frequency capacitor per VCCINT pin, placed as close to the package as possible. I/O bank VCCIO pins (typically 1.8 V, 2.5 V, or 3.3 V) require their own decoupling network. A ferrite bead between the 1.8 V regulator and VCCINT improves PSRR for noise-sensitive logic designs.
Estimated: at typical industrial utilization (~30% LE switching, 125 MHz fMAX, 1.8 V VCCINT), the EP20K100ETC144-1X dissipates approximately 0.5-1.0 W of core power in a TQFP-144 package with no integrated heatsink. The TQFP-144 has a θJA of approximately 35-45 °C/W on a standard JEDEC 4-layer test board with 1 oz copper. At 1 W dissipation this yields a 35-45 °C junction-temperature rise above ambient. Designers should provide adequate airflow or thermal copper area when operating near the upper 85 °C commercial limit, and must derate if the device is used in sealed enclosures.
The TQFP-144 package uses 0.5 mm lead pitch and requires careful PCB layout. Recommended pad design is the IPC-7351 nominal land pattern with a 0.30 mm pad width and 0.55 mm pad length to ensure reliable solder fillets. A 4-layer stack-up with continuous GND plane on layer 2 and a 1.8 V power plane on layer 3 is the recommended configuration for the TQFP-144 APEX 20KE family. JTAG pins TCK, TMS, TDI, TDO, and TRST should be routed with 4-5 mil traces and guarded by GND on both sides.
Three common pitfalls when designing with the EP20K100ETC144-1X: (1) The APEX 20KE family uses SRAM-based configuration and requires a configuration device (EPC2, EPC4, or EPC8) - do not assume the device is non-volatile. (2) The I/O banks have specific VCCIO requirements per I/O standard; mixing 1.8 V and 3.3 V in the same bank will damage the device. (3) The Quartus II toolchain (not Quartus Prime) is required for compilation - newer toolchains have dropped APEX 20KE support.
Informasi Konformitas
The -1X suffix indicates lead-free (Pb-free) terminal finish per JEDEC JESD97 e3/e4. RoHS and REACH compliance status were not present in the verified web data - marked unknown pending manufacturer confirmation. Part is not AEC-Q100 qualified; for automotive applications consult Intel automotive-grade FPGA portfolio (Cyclone IV EQ, Cyclone V EQ).