EP20K100ETC144-1X - APEX 20KE FPGA 4160 Cells 144-TQFP | Intel
부품 번호: EP20K100ETC144-1X ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.85 | $2,985.00 |
| 500 | $26.4 | $13,200.00 |
| 1,000 | $23.1 | $23,100.00 |
EP20K100ETC144-1X 개요
An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that lets designers implement arbitrary digital logic through SRAM-based configuration cells, after the chip has been manufactured. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) between simple CPLDs (which are gate-array-style and non-volatile) and modern high-end SoC FPGAs with hard CPU cores. The APEX 20KE series specifically combines Look-Up Table (LUT)-based logic with embedded array blocks (EABs) for on-chip memory, making it suitable for data-path and DSP-style glue logic in telecom, networking, and industrial systems.
Key specifications of the EP20K100ETC144-1X include 4160 logic elements, 53,248 typical gates, 92 available user I/O pins, a propagation delay figure of 1.6 ns through internal interconnect, 1.8 V core VCC, and a commercial operating temperature grade of 0 °C to 85 °C. The "-1X" speed-grade suffix designates the slowest APEX 20KE timing bin, while the "TC144" suffix denotes the TQFP-144 thermally enhanced gull-wing package.
From an architectural standpoint, the device combines a fine-grained LUT fabric with embedded array blocks (EABs) that can be configured as RAM, ROM, or FIFO blocks of up to 2 Kbits each. The LUT-and-EAB hybrid is a hallmark of the APEX 20K family and offers higher effective logic density per square millimetre than pure CPLD architectures when implementing wide datapath functions such as bus interfaces, protocol converters, and state machines.
Typical applications for the EP20K100ETC144-1X include glue logic in telecom line cards, industrial control backplanes, PCI bridge and bus-interfaces, protocol converters (UART, I2C, SPI bridges), and low-density DSP pre-processing blocks. The 144-pin TQFP is well-suited to through-hole-style prototyping or rework-friendly assembly, and the commercial temperature range covers most indoor equipment.
When designing with this part, engineers should note that the APEX 20KE family is no longer in active production and is supported primarily through the legacy Altera/Intel design flow with the Quartus II toolchain. Designers targeting new designs should evaluate Cyclone IV/V or MAX II equivalents unless footprint compatibility with the existing TQFP-144 PCB is required.
드롭인 대체품: EP20K100ETC144-1X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K100ETC144-1X (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Family, Package, Operating Temperature, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K100ETC144-1N
✅ 드롭인✓ 재고 있음
$55.8 / 개
데이터시트 보기 →EP20K100ETC144-1N
✅ 드롭인✓ 재고 있음
$55.8 / 개
데이터시트 보기 →EP20K100EFC144-1
✅ 드롭인✓ 재고 있음
$61.75 / 개
데이터시트 보기 →EP20K100CT144C7
✅ 드롭인✓ 재고 있음
$9.75 / 개
데이터시트 보기 →EP20K100CF144C7
✅ 드롭인✓ 재고 있음
$28.4 / 개
데이터시트 보기 →EP4CE6E22C8N
✅ 드롭인✓ 재고 있음
$10.5 / 개
데이터시트 보기 →EP20K100ETC144-1X 최대 정격 & 전기적 특성
| Device Family | APEX 20KE |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 4160 cells |
| Typical Gates | 53248 |
| Macrocells | 416 |
| User I/Os | 92 |
| Core Voltage | 1.8 V |
| Maximum Frequency | 250 MHz |
| Propagation Delay | 1.6 ns |
| Process Technology | 0.22 µm CMOS all-layer copper |
| Package Type | TQFP-144 |
| 실장 유형 | Surface Mount (gull-wing) |
| 동작 온도 | 0 °C to 85 °C |
| Speed Grade | -1 (slowest bin, "-1X") |
EP20K100ETC144-1X 핀 구성
| 핀 1 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 2 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 3 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 4 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 5 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 6 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 7 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 8 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 9 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 10 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 11 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 12 | VCCIO — I/O bank supply voltage |
| 핀 13 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 14 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 15 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 16 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 17 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 18 | GND — Ground |
| 핀 19 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 20 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 21 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 22 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 23 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 24 | VCCINT — Core supply voltage (1.8 V) |
| 핀 25 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 26 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 27 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 28 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 29 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 30 | GND — Ground |
| 핀 31 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 32 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 33 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 34 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 35 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 36 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 37 | VCCIO — I/O bank supply voltage |
| 핀 38 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 39 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 40 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 41 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 42 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 43 | GND — Ground |
| 핀 44 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 45 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 46 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 47 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 48 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 49 | VCCINT — Core supply voltage (1.8 V) |
| 핀 50 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 51 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 52 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 53 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 54 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 55 | GND — Ground |
| 핀 56 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 57 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 58 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 59 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 60 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 61 | VCCIO — I/O bank supply voltage |
| 핀 62 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 63 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 64 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 65 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 66 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 67 | GND — Ground |
| 핀 68 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 69 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 70 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 71 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 72 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 73 | VCCINT — Core supply voltage (1.8 V) |
| 핀 74 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 75 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 76 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 77 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 78 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 79 | GND — Ground |
| 핀 80 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 81 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 82 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 83 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 84 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 85 | VCCIO — I/O bank supply voltage |
| 핀 86 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 87 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 88 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 89 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 90 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 91 | GND — Ground |
| 핀 92 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 93 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 94 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 95 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 96 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 97 | VCCINT — Core supply voltage (1.8 V) |
| 핀 98 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 99 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 100 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 101 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 102 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 103 | GND — Ground |
| 핀 104 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 105 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 106 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 107 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 108 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 109 | VCCIO — I/O bank supply voltage |
| 핀 110 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 111 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 112 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 113 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 114 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 115 | GND — Ground |
| 핀 116 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 117 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 118 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 119 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 120 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 121 | VCCINT — Core supply voltage (1.8 V) |
| 핀 122 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 123 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 124 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 125 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 126 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 127 | GND — Ground |
| 핀 128 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 129 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 130 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 131 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 132 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 133 | VCCIO — I/O bank supply voltage |
| 핀 134 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 135 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 136 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 137 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 138 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 139 | GND — Ground |
| 핀 140 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 141 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 142 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 143 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 144 | I/O — User I/O pin (bank-dependent voltage) |
일반적인 애플리케이션
EP20K100ETC144-1X 적합 용도: 6 애플리케이션s: Telecom Line-Card Glue Logic, Industrial Control Backplane Interface, PCI Bridge and Bus-Interface Logic, Protocol Converter (UART / SPI / I2C Bridges), Low-Density DSP Pre-Processing, Legacy Test & Measurement Equipment.
Telecom Line-Card Glue Logic
The EP20K100ETC144-1X is well-suited to telecom line-card glue logic because its 4160 logic elements and 92 user I/Os are sufficient to bridge TDM buses, E1/T1 framers, and serial backplane interfaces. The 1.8 V core with multi-voltage I/O banks allows direct interfacing to legacy 3.3 V LVCMOS framers without level shifters. The TQFP-144 package simplifies rework on low-volume line-card prototypes, and the 250 MHz toggle rate comfortably exceeds the 50-77 MHz bus speeds typical of TDM and H.110 backplanes.
추천
Industrial Control Backplane Interface
The 144-pin TQFP package and 0 °C to 85 °C commercial temperature range make the EP20K100ETC144-1X a fit for industrial control backplane interfaces such as VME, CompactPCI bridge logic, and proprietary field-bus controllers. The embedded array blocks (EABs) implement on-chip dual-port RAM for FIFO buffering between backplane domains. The 1.6 ns propagation delay supports deterministic interrupt handling in real-time control loops. Engineers targeting industrial -40 °C to +85 °C should select the EP20K100ETC144-1N variant.
추천
PCI Bridge and Bus-Interface Logic
With 4160 logic elements, the EP20K100ETC144-1X is well-matched to PCI 32-bit/33 MHz bridge logic, including target and initiator state machines, parity generation/checking, and arbiter glue. The 92 user I/Os comfortably accommodate the 49-pin PCI bus plus address/data multiplexing for a secondary local bus. The 250 MHz internal performance gives 4x headroom over the 33 MHz PCI clock, easing timing closure. The APEX 20KE EABs can also be configured as 32x36 FIFOs for PCI burst transactions.
추천
Protocol Converter (UART / SPI / I2C Bridges)
The EP20K100ETC144-1X serves as a flexible multi-protocol converter for legacy equipment where a host CPU needs UART-to-SPI, SPI-to-I2C, or GPIO expansion bridges. Its 4160 logic elements are more than sufficient for eight or more concurrent serial channels with FIFO buffering in EAB memory. The 1.8 V core with selectable I/O bank voltages enables direct connection to 1.8 V, 2.5 V, or 3.3 V peripherals without external level shifters, reducing BOM cost in cost-sensitive industrial gateways.
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Low-Density DSP Pre-Processing
The APEX 20KE EABs allow the EP20K100ETC144-1X to function as a pre-processing block for low-density DSP workloads such as FIR filters, FFT butterflies, and digital down-conversion. Each EAB can store coefficient tables for up to 2 Kbits of data, and the LUT fabric implements the multipliers/accumulators at clock rates up to 250 MHz. While not competitive with modern DSP silicon, the device remains useful in legacy radar and sonar pre-processing subsystems that already include APEX 20KE on the bill of materials.
추천
Legacy Test & Measurement Equipment
Test and measurement equipment designed in the late 1990s and early 2000s often integrated the EP20K100ETC144-1X as a pattern-generator or timing-controller core. The 250 MHz internal performance and 92 user I/Os are well-suited to driving 32-channel digital pattern generators with per-channel timing skew control. The TQFP-144 package allows easy replacement during field repair of legacy instruments such as ATE loadboards, protocol analyzers, and boundary-scan controllers.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K100ETC144-1X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K100ETC144-1 | EP20K100ETC144-1N | EP20K100EFC144-1 | EP20K100CT144C7 | EP4CE6E22C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera legacy) | Intel | Intel | Intel | Intel | Intel (Cyclone IV) |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 (E22) - same footprint |
| Family | APEX 20KE (EAB-equipped) | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20K (non-E) | Cyclone IV |
| Logic Elements | 4160 | 4160 | 4160 | 4160 | 4160 | 6272 (Cyclone IV LE) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.2 V |
| User I/Os | 92 | 92 | 92 | 92 | 92 | 91 (E22 pinout) |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | -40 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | -40 °C to 100 °C (industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Active |
주요 차별점
- Same silicon density across the -1 / -1X / -1N speed grades (vs EP20K100ETC144-1)
- Industrial temperature variant available in same footprint (vs EP20K100ETC144-1N)
- Active modern alternative available in same footprint (vs EP4CE6E22C8N)
설계 노트
The EP20K100ETC144-1X requires a clean 1.8 V core supply (VCCINT) plus one or more VCCIO bank voltages for the I/O ring. Decoupling should follow the Altera reference design: one 100 µF bulk + ten 4.7 µF mid-frequency + one 0.1 µF high-frequency capacitor per VCCINT pin, placed as close to the package as possible. I/O bank VCCIO pins (typically 1.8 V, 2.5 V, or 3.3 V) require their own decoupling network. A ferrite bead between the 1.8 V regulator and VCCINT improves PSRR for noise-sensitive logic designs.
Estimated: at typical industrial utilization (~30% LE switching, 125 MHz fMAX, 1.8 V VCCINT), the EP20K100ETC144-1X dissipates approximately 0.5-1.0 W of core power in a TQFP-144 package with no integrated heatsink. The TQFP-144 has a θJA of approximately 35-45 °C/W on a standard JEDEC 4-layer test board with 1 oz copper. At 1 W dissipation this yields a 35-45 °C junction-temperature rise above ambient. Designers should provide adequate airflow or thermal copper area when operating near the upper 85 °C commercial limit, and must derate if the device is used in sealed enclosures.
The TQFP-144 package uses 0.5 mm lead pitch and requires careful PCB layout. Recommended pad design is the IPC-7351 nominal land pattern with a 0.30 mm pad width and 0.55 mm pad length to ensure reliable solder fillets. A 4-layer stack-up with continuous GND plane on layer 2 and a 1.8 V power plane on layer 3 is the recommended configuration for the TQFP-144 APEX 20KE family. JTAG pins TCK, TMS, TDI, TDO, and TRST should be routed with 4-5 mil traces and guarded by GND on both sides.
Three common pitfalls when designing with the EP20K100ETC144-1X: (1) The APEX 20KE family uses SRAM-based configuration and requires a configuration device (EPC2, EPC4, or EPC8) - do not assume the device is non-volatile. (2) The I/O banks have specific VCCIO requirements per I/O standard; mixing 1.8 V and 3.3 V in the same bank will damage the device. (3) The Quartus II toolchain (not Quartus Prime) is required for compilation - newer toolchains have dropped APEX 20KE support.
규정 준수 정보
The -1X suffix indicates lead-free (Pb-free) terminal finish per JEDEC JESD97 e3/e4. RoHS and REACH compliance status were not present in the verified web data - marked unknown pending manufacturer confirmation. Part is not AEC-Q100 qualified; for automotive applications consult Intel automotive-grade FPGA portfolio (Cyclone IV EQ, Cyclone V EQ).
