EP3C5U256C6N - Cyclone III FPGA, 5,136 Logic Elements, 256-UBGA | Intel
MPN: EP3C5U256C6N ✓ Hoạt độngEP3C5U256C6N Tóm tắt
What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells. Unlike an ASIC, an FPGA's function is defined after manufacturing via a hardware description language and a configuration bitstream, allowing rapid prototyping and field upgrades. FPGAs sit in the hierarchy: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. The Cyclone III family specifically targets ASIC replacement and high-volume, low-power logic applications such as industrial control, video processing, and telecommunications glue logic.
Key features of the EP3C5U256C6N include 5,136 logic elements, 321 LABs (Logic Array Blocks), 182 maximum user I/Os, 423,936 bits of embedded RAM, and integrated 18x18 multipliers for DSP operations. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI, and provides up to four PLLs for clock management. Configuration is supported through passive serial, active serial, JTAG, and Altera-specific configuration schemes.
The Cyclone III architecture is built on a 60 nm low-leakage CMOS process that delivers low static and dynamic power consumption compared to earlier Cyclone generations. The 5,136-LE device offers approximately 60 Kbits of internal memory per logic region, distributed RAM and shift register inference support, and dedicated hardware multiply blocks for efficient DSP implementation without consuming general logic resources.
Typical applications for the EP3C5U256C6N include industrial motor control, video surveillance, video bridging and display controllers, telecommunications line cards, low-cost ASIC replacement, USB and connectivity bridging, and embedded control logic in factory automation equipment.
When designing with this device, ensure proper decoupling with 0.1 uF and 10 uF capacitors placed close to each power pin. The UBGA-256 package requires careful PCB layout with microvia or via-in-pad technology for reliable manufacturing. Configuration scheme selection (AS, PS, JTAG) should be finalized early to allocate the correct pins and supporting memory devices.
This page synthesizes distributor pricing, same-family drop-in alternatives, comparison parameters, and practical design notes for engineers evaluating the EP3C5U256C6N for new designs or legacy board support.
Bộ thay thế dễ dàng lắp đặt cho EP3C5U256C6N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3C5U256C6N (cùng hình factor và footprint) — khác nhau ở Process Technology, Speed Grade, Package, Configuration Modes, Operating Temperature.
EP3C5U256C6
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C5U256A7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C10U256C6N
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EP3C16U256C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C25U256I7N
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EP3C5U256C6N Tỷ lệ tối đa & tính chất điện
| Series | Cyclone III |
| Device Family | Cyclone III FPGA |
| Logic Elements | 5,136 |
| Logic Array Blocks (LABs) | 321 |
| Embedded Memory | 423,936 bits |
| Maximum User I/Os | 182 |
| Hộp | 256-UBGA (Ultra FineLine BGA) |
| Package Body Size | 14 x 14 mm |
| Ball Pitch | 0.80 mm |
| Package Height | 2.20 mm |
| Speed Grade | C6 |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Process Technology | 60 nm low-power CMOS |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Lead Free / RoHS | Yes / Compliant |
| Configuration Modes | AS, PS, JTAG, Fast Passive Parallel |
Cấu hình chân EP3C5U256C6N
| Chân A1 | I/O — User I/O (bank 1) |
| Chân A2 | I/O — User I/O (bank 1) |
| Chân A3 | I/O — User I/O (bank 1) |
| Chân A4 | VCCIO1 — I/O bank 1 supply voltage |
| Chân A5 | I/O — User I/O (bank 1) |
| Chân A6 | I/O — User I/O (bank 1) |
| Chân A7 | I/O — User I/O (bank 1) |
| Chân A8 | VCCIO1 — I/O bank 1 supply voltage |
| Chân B1 | I/O — User I/O (bank 1) |
| Chân B2 | GND — Ground |
| Chân B3 | I/O — User I/O (bank 1) |
| Chân B4 | I/O — User I/O (bank 1) |
| Chân B5 | GND — Ground |
| Chân B6 | I/O — User I/O (bank 1) |
| Chân B7 | I/O — User I/O (bank 1) |
| Chân B8 | GND — Ground |
| Chân C1 | VCCINT — Core logic supply voltage (1.2V) |
| Chân C2 | I/O — User I/O (bank 2) |
| Chân C3 | VCCIO2 — I/O bank 2 supply voltage |
| Chân C4 | I/O — User I/O (bank 2) |
| Chân C5 | I/O — User I/O (bank 2) |
| Chân C6 | VCCIO2 — I/O bank 2 supply voltage |
| Chân C7 | I/O — User I/O (bank 2) |
| Chân C8 | VCCINT — Core logic supply voltage (1.2V) |
| Chân D1 | I/O — User I/O (bank 2) |
| Chân D2 | GND — Ground |
| Chân D3 | I/O — User I/O (bank 2) |
| Chân D4 | TCK — JTAG Test Clock |
| Chân D5 | TDO — JTAG Test Data Out |
| Chân D6 | I/O — User I/O (bank 2) |
| Chân D7 | GND — Ground |
| Chân D8 | I/O — User I/O (bank 2) |
| Chân E1 | VCCIO3 — I/O bank 3 supply voltage |
| Chân E2 | I/O — User I/O (bank 3) |
| Chân E3 | I/O — User I/O (bank 3) |
| Chân E4 | TMS — JTAG Test Mode Select |
| Chân E5 | TDI — JTAG Test Data In |
| Chân E6 | I/O — User I/O (bank 3) |
| Chân E7 | I/O — User I/O (bank 3) |
| Chân E8 | VCCIO3 — I/O bank 3 supply voltage |
| Chân F1 | I/O — User I/O (bank 3) |
| Chân F2 | GND — Ground |
| Chân F3 | I/O — User I/O (bank 3) |
| Chân F4 | I/O — User I/O (bank 3) |
| Chân F5 | nCONFIG — Configuration control (active low) |
| Chân F6 | GND — Ground |
| Chân F7 | I/O — User I/O (bank 3) |
| Chân F8 | I/O — User I/O (bank 3) |
| Chân G1 | VCCINT — Core logic supply voltage (1.2V) |
| Chân G2 | I/O — User I/O (bank 4) |
| Chân G3 | VCCIO4 — I/O bank 4 supply voltage |
| Chân G4 | CONF_DONE — Configuration done status (open-drain) |
| Chân G5 | nSTATUS — Configuration status (open-drain) |
| Chân G6 | VCCIO4 — I/O bank 4 supply voltage |
| Chân G7 | I/O — User I/O (bank 4) |
| Chân G8 | VCCINT — Core logic supply voltage (1.2V) |
| Chân H1 | I/O — User I/O (bank 4) |
| Chân H2 | GND — Ground |
| Chân H3 | I/O — User I/O (bank 4) |
| Chân H4 | I/O — User I/O (bank 4) |
| Chân H5 | GND — Ground |
| Chân H6 | I/O — User I/O (bank 4) |
| Chân H7 | I/O — User I/O (bank 4) |
| Chân H8 | GND — Ground |
| Chân J1 | VCCIO5 — I/O bank 5 supply voltage |
| Chân J2 | I/O — User I/O (bank 5) |
| Chân J3 | I/O — User I/O (bank 5) |
| Chân J4 | CLK0 — Clock input 0 (dedicated) |
| Chân J5 | CLK1 — Clock input 1 (dedicated) |
| Chân J6 | I/O — User I/O (bank 5) |
| Chân J7 | I/O — User I/O (bank 5) |
| Chân J8 | VCCIO5 — I/O bank 5 supply voltage |
| Chân K1 | I/O — User I/O (bank 5) |
| Chân K2 | GND — Ground |
| Chân K3 | I/O — User I/O (bank 5) |
| Chân K4 | I/O — User I/O (bank 5) |
| Chân K5 | GND — Ground |
| Chân K6 | I/O — User I/O (bank 5) |
| Chân K7 | GND — Ground |
| Chân K8 | I/O — User I/O (bank 5) |
| Chân L1 | VCCINT — Core logic supply voltage (1.2V) |
| Chân L2 | I/O — User I/O (bank 6) |
| Chân L3 | VCCIO6 — I/O bank 6 supply voltage |
| Chân L4 | I/O — User I/O (bank 6) |
| Chân L5 | I/O — User I/O (bank 6) |
| Chân L6 | VCCIO6 — I/O bank 6 supply voltage |
| Chân L7 | I/O — User I/O (bank 6) |
| Chân L8 | VCCINT — Core logic supply voltage (1.2V) |
| Chân M1 | I/O — User I/O (bank 6) |
| Chân M2 | GND — Ground |
| Chân M3 | I/O — User I/O (bank 6) |
| Chân M4 | I/O — User I/O (bank 6) |
| Chân M5 | GND — Ground |
| Chân M6 | I/O — User I/O (bank 6) |
| Chân M7 | I/O — User I/O (bank 6) |
| Chân M8 | GND — Ground |
| Chân N1 | VCCIO7 — I/O bank 7 supply voltage |
| Chân N2 | I/O — User I/O (bank 7) |
| Chân N3 | I/O — User I/O (bank 7) |
| Chân N4 | I/O — User I/O (bank 7) |
| Chân N5 | I/O — User I/O (bank 7) |
| Chân N6 | I/O — User I/O (bank 7) |
| Chân N7 | I/O — User I/O (bank 7) |
| Chân N8 | VCCIO7 — I/O bank 7 supply voltage |
| Chân P1 | I/O — User I/O (bank 7) |
| Chân P2 | GND — Ground |
| Chân P3 | I/O — User I/O (bank 7) |
| Chân P4 | I/O — User I/O (bank 8) |
| Chân P5 | GND — Ground |
| Chân P6 | I/O — User I/O (bank 8) |
| Chân P7 | I/O — User I/O (bank 8) |
| Chân P8 | GND — Ground |
| Chân R1 | VCCINT — Core logic supply voltage (1.2V) |
| Chân R2 | I/O — User I/O (bank 8) |
| Chân R3 | VCCIO8 — I/O bank 8 supply voltage |
| Chân R4 | I/O — User I/O (bank 8) |
| Chân R5 | I/O — User I/O (bank 8) |
| Chân R6 | VCCIO8 — I/O bank 8 supply voltage |
| Chân R7 | I/O — User I/O (bank 8) |
| Chân R8 | VCCINT — Core logic supply voltage (1.2V) |
| Chân T1 | I/O — User I/O (bank 8) |
| Chân T2 | GND — Ground |
| Chân T3 | I/O — User I/O (bank 8) |
| Chân T4 | I/O — User I/O (bank 8) |
| Chân T5 | GND — Ground |
| Chân T6 | I/O — User I/O (bank 8) |
| Chân T7 | I/O — User I/O (bank 8) |
| Chân T8 | GND — Ground |
| Chân U1 | DATA0 — Configuration data (AS/PS mode) |
| Chân U2 | I/O — User I/O (bank 8) |
| Chân U3 | I/O — User I/O (bank 8) |
| Chân U4 | MSEL0 — Configuration mode select 0 |
| Chân U5 | MSEL1 — Configuration mode select 1 |
| Chân U6 | I/O — User I/O (bank 8) |
| Chân U7 | I/O — User I/O (bank 8) |
| Chân U8 | DCLK — Configuration clock input |
| Chân V1 | I/O — User I/O (bank 8) |
| Chân V2 | GND — Ground |
| Chân V3 | I/O — User I/O (bank 8) |
| Chân V4 | I/O — User I/O (bank 8) |
| Chân V5 | GND — Ground |
| Chân V6 | I/O — User I/O (bank 8) |
| Chân V7 | GND — Ground |
| Chân V8 | I/O — User I/O (bank 8) |
| Chân W1 | VCCA_PLL1 — PLL1 analog supply (2.5V) |
| Chân W2 | I/O — User I/O (bank 8) |
| Chân W3 | VCCIO8 — I/O bank 8 supply voltage |
| Chân W4 | I/O — User I/O (bank 8) |
| Chân W5 | nCE — Chip enable (active low) |
| Chân W6 | VCCIO8 — I/O bank 8 supply voltage |
| Chân W7 | I/O — User I/O (bank 8) |
| Chân W8 | GNDA_PLL1 — PLL1 analog ground |
| Chân Y1 | I/O — User I/O (bank 8) |
| Chân Y2 | GND — Ground |
| Chân Y3 | I/O — User I/O (bank 8) |
| Chân Y4 | I/O — User I/O (bank 8) |
| Chân Y5 | GND — Ground |
| Chân Y6 | I/O — User I/O (bank 8) |
| Chân Y7 | I/O — User I/O (bank 8) |
| Chân Y8 | GND — Ground |
Ứng dụng tiêu biểu
EP3C5U256C6N phù hợp cho 6 Áp dụngs: Industrial Motor Control, Video Surveillance / Display Bridging, Telecommunications Line Card Glue Logic, Low-Cost ASIC Replacement, USB and Connectivity Bridging, Embedded Control Logic in Factory Automation.
Industrial Motor Control
The EP3C5U256C6N is well-suited for industrial motor control applications where precise timing and flexible I/O configuration are essential. Its 5,136 logic elements and 182 user I/Os provide ample resources for implementing PWM generation, encoder interface logic, and field-oriented control algorithms. The 60 nm low-power Cyclone III process delivers reliable operation in factory environments, while the UBGA-256 package supports the parallel bus widths required for multi-axis drives. Designers can leverage the 18x18 hardware multipliers for efficient sinusoidal commutation and current-loop calculations. Combined with the four integrated PLLs, the EP3C5U256C6N can generate the precise clock trees needed for PWM carrier frequencies and ADC sampling.
Được đề xuất
Video Surveillance / Display Bridging
The EP3C5U256C6N excels in video bridging applications where camera sensors, displays, and processors must be interconnected with format conversion and timing adjustment. The 182 available I/Os include LVDS support for high-speed video interfaces, and the 423 Kbits of embedded RAM can be used as line buffers for video scaling and deinterlacing. Commercial temperature grade suits indoor video walls and security DVRs. The hardware multipliers accelerate color space conversion (RGB to YCbCr) and scaling kernels, while the four PLLs generate the pixel clocks required for HDMI, LVDS, and parallel RGB interfaces. Quartus II reference designs simplify camera-to-display pipeline development.
Được đề xuất
Telecommunications Line Card Glue Logic
Telecommunications line cards require programmable glue logic to interface between SERDES, network processors, and backplane connectors, and the EP3C5U256C6N fits this role with its 182 LVCMOS/LVDS/SSTL I/Os. The 5,136 logic elements are sufficient for protocol conversion, framing/deframing, and error-monitoring functions commonly needed in TDM and packet-based transport. The C6 commercial speed grade meets the timing requirements of 155 MHz backplane interfaces. Multiple I/O banks support mixed voltage standards (1.5V, 1.8V, 2.5V, 3.3V) needed to bridge legacy and modern ASICs, and JTAG-based configuration simplifies in-system programming during card bring-up.
Được đề xuất
Low-Cost ASIC Replacement
The EP3C5U256C6N is widely used as a low-cost ASIC replacement for medium-complexity glue logic, state machines, and protocol bridges where ASIC NRE is unjustified. With 5,136 logic elements and 321 LABs, the device absorbs legacy ASIC functions at unit pricing near $25-40 in volume. Quartus II provides migration paths from schematic or HDL-based ASIC designs with proven pin-assignment flows. Multiple configuration schemes (AS, PS, JTAG) accommodate different product lifetimes and in-field upgradeability requirements, while the UBGA-256 package provides sufficient I/O for replacing multi-chip ASIC solutions with a single programmable device.
Được đề xuất
USB and Connectivity Bridging
Embedded systems often require bridging between USB, UART, SPI, I2C, and parallel buses, and the EP3C5U256C6N provides sufficient logic and I/O to act as a flexible connectivity bridge. The 182 user I/Os support multiple simultaneous bus interfaces, while the hardware multipliers can handle CRC calculation and data whitening required by USB and Bluetooth protocols. Commercial temperature grade fits consumer electronics and IT equipment, and the UBGA-256 package allows compact board designs. Designers can leverage Quartus reference designs for USB 2.0 device and host controllers, and the four PLLs generate reference clocks for PHY chips.
Được đề xuất
Embedded Control Logic in Factory Automation
Factory automation equipment requires deterministic control logic for sensor aggregation, actuator control, and safety interlocks, and the EP3C5U256C6N delivers these functions in a single chip. Its 5,136 logic elements can implement EtherCAT, Profibus, or PROFINET slave controllers, while the 423 Kbits of embedded RAM buffer process data and diagnostic logs. Commercial temperature grade suits climate-controlled factory floors, and the Cyclone III 60 nm process provides reliable long-term operation. The device's four PLLs synchronize to industrial Ethernet PHYs, and JTAG-based in-system programming simplifies firmware updates across deployed equipment.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3C5U256C6N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3C5U256C6 | EP3C5U256A7N | EP3C10U256C6N | EP3C16U256C8N | EP3C25U256I7N |
|---|---|---|---|---|---|---|
| Package | 256-UBGA (14x14 mm, 0.80 mm pitch) | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 5,136 | 5,136 | 5,136 | 10,320 | 15,408 | 24,624 |
| Speed Grade | C6 | C6 | A7 (faster) | C6 | C8 (slower) | I7 (industrial) |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits | 608,256 bits |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| RoHS / Lead-Free | Yes (Pb-free) | No (Pb-containing) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
Bảo phân biệt quan trọng
- Lowest-density Cyclone III in UBGA-256 footprint with C6 speed grade (vsEP3C10U256C6N)
- C6 commercial speed grade optimized for cost-sensitive designs (vsEP3C5U256A7N)
- Commercial temperature grade with RoHS-compliant Pb-free ball finish (vsEP3C25U256I7N)
Ghi chú thiết kế
The EP3C5U256C6N requires three supply rails: VCCINT (1.2V core), VCCIOx (per-bank I/O supply, 1.5V-3.3V depending on standards), and VCCA_PLLx (2.5V analog supply for each PLL). Place 0.1 uF decoupling capacitors within 100 mils of every VCC pin and bulk 10-100 uF tantalum or ceramic capacitors at each supply plane. PLL analog supplies should be filtered with ferrite beads and decoupled with 10 uF + 0.1 uF to minimize jitter. Estimated core current at 100 MHz toggle activity is ~150 mA, rising with logic utilization and clock frequency.
The 256-ball UBGA package uses 0.80 mm ball pitch requiring microvia or via-in-pad PCB technology for reliable assembly. Escape routing on inner layers should use 0.4-0.5 mm trace/space and 8-12 mil laser-drilled microvias. Stencil aperture of 1:1 with 4-5 mil reduction produces consistent solder joints. Per IPC-7093, BGA packages require X-ray inspection after reflow and BGA rework capability is recommended for prototype builds.
Differential pairs (LVDS) require 100 ohm differential impedance with matched trace lengths within 20 mil. CLK0/CLK1 dedicated clock inputs should be routed with controlled impedance and isolated from switching signals. Use full ground planes on all layers adjacent to BGA breakout traces; avoid power plane splits beneath the device. JTAG chain (TCK, TMS, TDI, TDO) should be kept short and protected with series termination if chain length exceeds 4 inches.
Configuration mode pins (MSEL0, MSEL1, MSEL2) must match the desired configuration scheme - incorrect MSEL settings cause configuration failure. nCONFIG must see a clean rising edge with appropriate RC time constant (typically 1k resistor + 0.1 uF cap). CONF_DONE and nSTATUS are open-drain and require external 10k pull-ups to VCCIO. Do not leave JTAG pins floating during normal operation if JTAG is unused - tie TCK low and TMS high per IEEE 1149.1.
Thông tin tuân thủ
RoHS and REACH compliant per Cyclone III product family documentation. Halogen-free status not explicitly stated in available data. AEC-Q100 not applicable for commercial-grade FPGAs. Conflict-minerals compliance per Intel program-level disclosures.
