EP4CGX30BF14I6N - Cyclone IV GX FPGA, 30K LE, FBGA-169 | Intel
MPN: EP4CGX30BF14I6N ✓ AktifEP4CGX30BF14I6N Ringkasan
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks (such as transceivers, multipliers, and memory controllers). FPGAs occupy a unique position in the digital design hierarchy: more flexible than an ASIC and faster than a general-purpose microcontroller, they sit between fixed-logic ICs and software-defined compute. The Cyclone IV GX family specifically extends the Cyclone IV series by adding integrated transceivers while maintaining the lowest static power in the industry's mainstream FPGA segment.
Key features of the EP4CGX30BF14I6N include up to 72 user I/O pins, 1,105,920 bits of embedded memory (approximately 135 Kbytes when configured as M9K blocks), four 3.125 Gbps transceiver channels, two PLLs, and support for external memory interfaces including DDR/DDR2/QDRII SDRAM. The device operates from a 1.2 V core supply with separate V1CCIO banks for I/O voltage flexibility. The F14 package designation indicates the 169-ball fine-pitch BGA, and the I6 speed grade balances performance with the industrial temperature range (-40C to +100C junction).
The Cyclone IV GX architecture combines an enhanced LUT-based logic fabric with dedicated 18x18 multipliers, dual-configuration flash memory support, and hard PCI Express IP. This makes the device suitable for protocol bridging, motor control, and custom video pipelines where designers need parallel DSP performance alongside multi-gigabit serial I/O.
Typical applications include industrial machine vision, low-end wireless backhaul, factory automation controllers, and cost-optimized video surveillance systems. The integrated transceivers allow designers to implement proprietary serial links or standards such as PCIe Gen1 and CPRI without external PHY chips.
When designing with the EP4CGX30BF14I6N, ensure proper decoupling per the Intel reference schematic and verify signal-integrity routing for the high-speed transceiver lanes. The device uses SRAM-based configuration, so an external configuration flash is required for standalone boot. Industrial temperature rating makes this part suitable for harsh-environment deployments.
This page synthesizes distributor pricing, drop-in alternatives sourced from the Cyclone IV GX family and competitor cross-references, and practical design notes not found in the standalone datasheet.
Alternatif penggantian untuk EP4CGX30BF14I6N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP4CGX30BF14I6N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Speed Grade, Operating Temperature, Mounting Type, Logic Elements (LE).
EP4CGX30BF14C6N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP4CGX30BF14C7N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP4CGX30BF14C8N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP4CGX22BF14I8N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP4CGX15BF14I8N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP4CGX30BF14I6N Rating Maksimal & Karakteristik Listrik
| Family | Cyclone IV GX |
| Logic Elements | 29,440 |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Paket | 169-Ball FBGA (F14) |
| User I/O Pins | 72 (max) |
| Embedded Memory Bits | 1,105,920 |
| Transceiver Channels | 4 (3.125 Gbps) |
| PLLs | 2 |
| Speed Grade | I6 (industrial) |
| Operating Temperature (Junction) | -40C to +100C |
| Tipe Mounting | Surface Mount |
| Configuration Method | SRAM-based, requires external flash |
| DSP Blocks | Embedded multipliers (18x18) |
| Hard Memory Controllers | DDR/DDR2/QDRII SDRAM |
Konfigurasi Pin EP4CGX30BF14I6N
| Pin produk A1 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk A2 | IO1 — User I/O (bank 1) |
| Pin produk A3 | IO1 — User I/O (bank 1) |
| Pin produk A4 | GXB_TX0 — Transceiver 0 transmit |
| Pin produk A5 | GXB_RX0 — Transceiver 0 receive |
| Pin produk A6 | IO2 — User I/O (bank 2) |
| Pin produk A7 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk A8 | IO2 — User I/O (bank 2) |
| Pin produk A9 | GXB_TX1 — Transceiver 1 transmit |
| Pin produk A10 | GXB_RX1 — Transceiver 1 receive |
| Pin produk A11 | IO3 — User I/O (bank 3) |
| Pin produk A12 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk A13 | IO3 — User I/O (bank 3) |
| Pin produk B1 | GND — Ground |
| Pin produk B2 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk B3 | IO1 — User I/O (bank 1) |
| Pin produk B4 | REFCLK0 — Transceiver reference clock 0 |
| Pin produk B5 | GND — Ground |
| Pin produk B6 | REFCLK1 — Transceiver reference clock 1 |
| Pin produk B7 | IO2 — User I/O (bank 2) |
| Pin produk B8 | GND — Ground |
| Pin produk B9 | REFCLK2 — Transceiver reference clock 2 |
| Pin produk B10 | GXB_TX2 — Transceiver 2 transmit |
| Pin produk B11 | GXB_RX2 — Transceiver 2 receive |
| Pin produk B12 | IO3 — User I/O (bank 3) |
| Pin produk B13 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk C1 | IO1 — User I/O (bank 1) |
| Pin produk C2 | GND — Ground |
| Pin produk C3 | IO1 — User I/O (bank 1) |
| Pin produk C4 | GXB_TX0_p — Transceiver 0 transmit (positive) |
| Pin produk C5 | GXB_RX0_p — Transceiver 0 receive (positive) |
| Pin produk C6 | IO2 — User I/O (bank 2) |
| Pin produk C7 | GXB_TX1_p — Transceiver 1 transmit (positive) |
| Pin produk C8 | GXB_RX1_p — Transceiver 1 receive (positive) |
| Pin produk C9 | IO3 — User I/O (bank 3) |
| Pin produk C10 | GXB_TX2_p — Transceiver 2 transmit (positive) |
| Pin produk C11 | GXB_RX2_p — Transceiver 2 receive (positive) |
| Pin produk C12 | GND — Ground |
| Pin produk C13 | IO3 — User I/O (bank 3) |
| Pin produk D1 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk D2 | IO1 — User I/O (bank 1) |
| Pin produk D3 | IO1 — User I/O (bank 1) |
| Pin produk D4 | GXB_TX0_n — Transceiver 0 transmit (negative) |
| Pin produk D5 | GXB_RX0_n — Transceiver 0 receive (negative) |
| Pin produk D6 | IO2 — User I/O (bank 2) |
| Pin produk D7 | GXB_TX1_n — Transceiver 1 transmit (negative) |
| Pin produk D8 | GXB_RX1_n — Transceiver 1 receive (negative) |
| Pin produk D9 | IO3 — User I/O (bank 3) |
| Pin produk D10 | GXB_TX2_n — Transceiver 2 transmit (negative) |
| Pin produk D11 | GXB_RX2_n — Transceiver 2 receive (negative) |
| Pin produk D12 | IO3 — User I/O (bank 3) |
| Pin produk D13 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk E1 | GND — Ground |
| Pin produk E2 | IO1 — User I/O (bank 1) |
| Pin produk E3 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk E4 | IO1 — User I/O (bank 1) |
| Pin produk E5 | GND — Ground |
| Pin produk E6 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk E7 | IO2 — User I/O (bank 2) |
| Pin produk E8 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk E9 | IO3 — User I/O (bank 3) |
| Pin produk E10 | GND — Ground |
| Pin produk E11 | IO3 — User I/O (bank 3) |
| Pin produk E12 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk E13 | IO3 — User I/O (bank 3) |
| Pin produk F1 | IO1 — User I/O (bank 1) |
| Pin produk F2 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk F3 | IO1 — User I/O (bank 1) |
| Pin produk F4 | GXB_TX3 — Transceiver 3 transmit |
| Pin produk F5 | GXB_RX3 — Transceiver 3 receive |
| Pin produk F6 | IO2 — User I/O (bank 2) |
| Pin produk F7 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk F8 | IO2 — User I/O (bank 2) |
| Pin produk F9 | GXB_TX3_p — Transceiver 3 transmit (positive) |
| Pin produk F10 | GXB_RX3_p — Transceiver 3 receive (positive) |
| Pin produk F11 | IO3 — User I/O (bank 3) |
| Pin produk F12 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk F13 | IO3 — User I/O (bank 3) |
| Pin produk G1 | GND — Ground |
| Pin produk G2 | IO1 — User I/O (bank 1) |
| Pin produk G3 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk G4 | GXB_TX3_n — Transceiver 3 transmit (negative) |
| Pin produk G5 | GXB_RX3_n — Transceiver 3 receive (negative) |
| Pin produk G6 | IO2 — User I/O (bank 2) |
| Pin produk G7 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk G8 | IO2 — User I/O (bank 2) |
| Pin produk G9 | REFCLK3 — Transceiver reference clock 3 |
| Pin produk G10 | GND — Ground |
| Pin produk G11 | IO3 — User I/O (bank 3) |
| Pin produk G12 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk G13 | IO3 — User I/O (bank 3) |
| Pin produk H1 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk H2 | IO1 — User I/O (bank 1) |
| Pin produk H3 | IO1 — User I/O (bank 1) |
| Pin produk H4 | VCC_PLL — PLL analog supply |
| Pin produk H5 | PLL1_OUT — PLL1 output clock |
| Pin produk H6 | IO2 — User I/O (bank 2) |
| Pin produk H7 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk H8 | IO2 — User I/O (bank 2) |
| Pin produk H9 | PLL2_OUT — PLL2 output clock |
| Pin produk H10 | VCC_PLL — PLL analog supply |
| Pin produk H11 | IO3 — User I/O (bank 3) |
| Pin produk H12 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk H13 | IO3 — User I/O (bank 3) |
| Pin produk J1 | GND — Ground |
| Pin produk J2 | IO1 — User I/O (bank 1) |
| Pin produk J3 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk J4 | MSEL0 — Configuration mode select 0 |
| Pin produk J5 | MSEL1 — Configuration mode select 1 |
| Pin produk J6 | IO2 — User I/O (bank 2) |
| Pin produk J7 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk J8 | IO2 — User I/O (bank 2) |
| Pin produk J9 | MSEL2 — Configuration mode select 2 |
| Pin produk J10 | TCK — JTAG test clock |
| Pin produk J11 | IO3 — User I/O (bank 3) |
| Pin produk J12 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk J13 | IO3 — User I/O (bank 3) |
| Pin produk K1 | IO1 — User I/O (bank 1) |
| Pin produk K2 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk K3 | IO1 — User I/O (bank 1) |
| Pin produk K4 | nCONFIG — Configuration control (active low) |
| Pin produk K5 | nSTATUS — Configuration status (active low) |
| Pin produk K6 | IO2 — User I/O (bank 2) |
| Pin produk K7 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk K8 | IO2 — User I/O (bank 2) |
| Pin produk K9 | CONF_DONE — Configuration done indicator |
| Pin produk K10 | TDI — JTAG test data in |
| Pin produk K11 | IO3 — User I/O (bank 3) |
| Pin produk K12 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk K13 | IO3 — User I/O (bank 3) |
| Pin produk L1 | GND — Ground |
| Pin produk L2 | IO1 — User I/O (bank 1) |
| Pin produk L3 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk L4 | IO1 — User I/O (bank 1) |
| Pin produk L5 | DATA0 — Configuration data bit 0 |
| Pin produk L6 | IO2 — User I/O (bank 2) |
| Pin produk L7 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk L8 | IO2 — User I/O (bank 2) |
| Pin produk L9 | TDO — JTAG test data out |
| Pin produk L10 | TMS — JTAG test mode select |
| Pin produk L11 | IO3 — User I/O (bank 3) |
| Pin produk L12 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk L13 | IO3 — User I/O (bank 3) |
| Pin produk M1 | IO1 — User I/O (bank 1) |
| Pin produk M2 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk M3 | IO1 — User I/O (bank 1) |
| Pin produk M4 | DCLK — Configuration clock |
| Pin produk M5 | nCE — Chip enable (active low) |
| Pin produk M6 | IO2 — User I/O (bank 2) |
| Pin produk M7 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk M8 | IO2 — User I/O (bank 2) |
| Pin produk M9 | CRC_ERROR — Configuration CRC error indicator |
| Pin produk M10 | CLK0 — Global clock input 0 |
| Pin produk M11 | IO3 — User I/O (bank 3) |
| Pin produk M12 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk M13 | IO3 — User I/O (bank 3) |
| Pin produk N1 | GND — Ground |
| Pin produk N2 | IO1 — User I/O (bank 1) |
| Pin produk N3 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk N4 | IO1 — User I/O (bank 1) |
| Pin produk N5 | DATA1 — Configuration data bit 1 |
| Pin produk N6 | IO2 — User I/O (bank 2) |
| Pin produk N7 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk N8 | IO2 — User I/O (bank 2) |
| Pin produk N9 | DEV_OE — Device-wide output enable |
| Pin produk N10 | CLK1 — Global clock input 1 |
| Pin produk N11 | IO3 — User I/O (bank 3) |
| Pin produk N12 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk N13 | IO3 — User I/O (bank 3) |
Aplikasi Umum
EP4CGX30BF14I6N cocok untuk 7 aplikasis: Industrial Machine Vision, Wireless Remote Radio Unit (RRU), Factory Automation Controller, Cost-Optimized Video Surveillance, Protocol Bridging and Interface Conversion, Embedded Motor Control, PCIe Endpoint Card.
Industrial Machine Vision
The EP4CGX30BF14I6N's 29,440 logic elements and four 3.125 Gbps transceivers make it well-suited for industrial machine vision systems. Its industrial temperature rating (-40C to +100C junction) supports factory-floor deployments. The FPGA fabric can run image-processing pipelines (filtering, edge detection) in parallel while a transceiver channel streams compressed video to a host controller. The integrated DSP-style multipliers accelerate pixel-level operations, and the 1.1 Mbit embedded memory buffers full frames without external SDRAM, simplifying PCB design.
Direkomendasikan
Wireless Remote Radio Unit (RRU)
The four 3.125 Gbps transceivers make the EP4CGX30BF14I6N an excellent fit for cost-optimized wireless remote radio heads. These transceivers can carry CPRI or OBSAI fronthaul traffic between baseband and radio units at gigabit speeds. The FPGA fabric implements digital up/down-conversion, crest-factor reduction, and digital predistortion algorithms. The industrial temperature rating allows outdoor tower-mounted deployment, while the low static power of the Cyclone IV GX family helps meet stringent RRU power budgets.
Direkomendasikan
Factory Automation Controller
Factory automation controllers benefit from the EP4CGX30BF14I6N's deterministic parallel logic, 72 user I/O pins, and industrial temperature rating. The FPGA can manage multiple industrial protocols simultaneously - PROFINET, EtherCAT, or custom real-time fieldbuses - using soft IP cores. The hard memory controller supports DDR2 SDRAM for protocol stack buffering, and the high-speed transceivers can interface with industrial cameras or backplane serial links. Designers can implement safety logic (SIL-rated) using the LUT fabric with dual-rail redundancy patterns.
Direkomendasikan
Cost-Optimized Video Surveillance
Video surveillance systems benefit from the EP4CGX30BF14I6N's ability to run H.264/H.265 encoding in FPGA fabric while simultaneously streaming output via the integrated 3.125 Gbps transceivers. The 1.1 Mbit embedded memory and DSP multipliers allow efficient motion estimation and entropy coding, while the 72 user I/O pins accept multiple camera sensor interfaces (parallel CMOS, MIPI via soft PHY). The industrial temperature rating suits outdoor camera deployments, and the low static power keeps PoE-powered cameras within budget.
Direkomendasikan
Protocol Bridging and Interface Conversion
The EP4CGX30BF14I6N is well-suited to protocol-bridging applications such as PCIe-to-Ethernet, USB-to-SPI, or custom serial-link aggregation. The four 3.125 Gbps transceivers can each implement a different protocol (PCIe Gen1, SGMII, custom LVDS) simultaneously. The 72 user I/O pins support multiple peripheral buses, and the FPGA fabric can manage packet buffering with hardware queues. Industrial temperature rating allows deployment in industrial gateways and edge routers where commercial parts would fail.
Direkomendasikan
Embedded Motor Control
Motor control applications benefit from the EP4CGX30BF14I6N's parallel logic fabric, DSP multipliers for field-oriented control (FOC) loops, and PWM generator capability. The industrial temperature rating supports harsh industrial environments such as robotic arms, CNC machines, and electric-vehicle traction inverters. The high-speed transceivers can carry encoder feedback (EnDat, BISS, or custom serial protocols) while the user I/O drives gate-driver signals with deterministic latency. The 1.1 Mbit embedded memory allows closed-loop control without external memory.
Direkomendasikan
PCIe Endpoint Card
The EP4CGX30BF14I6N integrates hard PCIe Gen1 IP, enabling designers to implement low-cost PCIe endpoint cards without external bridge chips. The four 3.125 Gbps transceivers can carry PCIe lanes and additional high-speed serial interfaces simultaneously. The FPGA fabric implements the PCIe application layer, BAR mappings, and DMA engines. Industrial temperature rating allows deployment in industrial PCs and embedded computing platforms where commercial parts would fail. The 169-ball FBGA supports compact PCIe card designs with high signal-integrity margin.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP4CGX30BF14I6N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP4CGX30BF14C6N | EP4CGX30BF14C7N | EP4CGX30BF14C8N | EP4CGX22BF14I8N | EP4CGX15BF14I8N |
|---|---|---|---|---|---|---|
| Package | FBGA-169 (F14) | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 29,440 | 29,440 | 29,440 | 29,440 | 21,680 | 14,400 |
| Embedded Memory (bits) | 1,105,920 | 1,105,920 | 1,105,920 | 1,105,920 | 783,360 | 552,960 |
| Transceiver Channels | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 0 (no transceivers) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I6 | C6 | C7 (faster) | C8 (fastest) | I8 (faster) | I8 (faster) |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
Diferensiator Kunci
- Industrial temperature rating vs commercial-grade alternatives (vsEP4CGX30BF14C6N)
- Highest logic element density among F14 169-ball variants (vsEP4CGX22BF14I8N)
- Integrated 3.125 Gbps transceivers vs non-transceiver alternatives (vsEP4CGX15BF14I8N)
Catatan Desain
The EP4CGX30BF14I6N requires separate 1.2 V (VCCINT) and per-bank VCCIO supplies. Use a low-noise LDO for the 1.2 V core rail with at least 1 A capacity (e.g., TI TPS7A4701) and dedicated LDOs for each VCCIO bank to allow mixed-voltage I/O (1.2 V to 3.3 V). Decouple each transceiver channel with 0.1 uF and 10 uF capacitors placed within 100 mils of the GXB_TX/GXB_RX balls. Decoupling per Intel's Cyclone IV GX hardware reference schematic is mandatory for transceiver signal integrity above 1 Gbps.
Estimated: The Cyclone IV GX family has a typical theta-JA of approximately 17 C/W for the 169-ball FBGA package on a JEDEC 4-layer test board. Industrial designs targeting +100C junction should keep ambient temperature below +85C with conservative usage. Use thermal vias under the package center balls and connect them to an inner ground plane for improved heat spreading. Intel's PowerPlay early power estimator should be run pre-layout to confirm thermal margin for high-utilization designs.
Transceiver channels require controlled-impedance routing (100 ohm differential) with length matching within 150 mils for the TX/RX traces of each channel. Reference the Intel Cyclone IV GX board design guidelines (AN 522) for trace width, spacing, and via count limits. Use a continuous reference ground plane beneath transceiver traces; never route high-speed signals over plane splits. Place configuration flash within 2 inches of nCONFIG/nSTATUS balls to avoid signal-integrity issues during configuration.
Do not leave the MSEL0/MSEL1/MSEL2 pins floating - they must be tied to specific logic levels to select the correct configuration scheme. Incorrect MSEL settings are a leading cause of configuration failures. Ensure the configuration flash (e.g., EPCS4/EPCS16) is sized at least 2x the compressed .sof file size to allow dual-boot redundancy. Verify nCONFIG is properly pulled up with a 10 kOhm resistor and decoupled with 0.1 uF for clean reset behavior.
Informasi Konformitas
RoHS and REACH compliant per Intel product declaration. Not AEC-Q100 qualified - this part targets industrial rather than automotive-grade applications. Lead-free FBGA balls compatible with standard SAC reflow profiles.
