EP4CGX30BF14I6N - Cyclone IV GX FPGA, 30K LE, FBGA-169 | Intel
MPN: EP4CGX30BF14I6N ✓ Hoạt độngEP4CGX30BF14I6N Tóm tắt
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks (such as transceivers, multipliers, and memory controllers). FPGAs occupy a unique position in the digital design hierarchy: more flexible than an ASIC and faster than a general-purpose microcontroller, they sit between fixed-logic ICs and software-defined compute. The Cyclone IV GX family specifically extends the Cyclone IV series by adding integrated transceivers while maintaining the lowest static power in the industry's mainstream FPGA segment.
Key features of the EP4CGX30BF14I6N include up to 72 user I/O pins, 1,105,920 bits of embedded memory (approximately 135 Kbytes when configured as M9K blocks), four 3.125 Gbps transceiver channels, two PLLs, and support for external memory interfaces including DDR/DDR2/QDRII SDRAM. The device operates from a 1.2 V core supply with separate V1CCIO banks for I/O voltage flexibility. The F14 package designation indicates the 169-ball fine-pitch BGA, and the I6 speed grade balances performance with the industrial temperature range (-40C to +100C junction).
The Cyclone IV GX architecture combines an enhanced LUT-based logic fabric with dedicated 18x18 multipliers, dual-configuration flash memory support, and hard PCI Express IP. This makes the device suitable for protocol bridging, motor control, and custom video pipelines where designers need parallel DSP performance alongside multi-gigabit serial I/O.
Typical applications include industrial machine vision, low-end wireless backhaul, factory automation controllers, and cost-optimized video surveillance systems. The integrated transceivers allow designers to implement proprietary serial links or standards such as PCIe Gen1 and CPRI without external PHY chips.
When designing with the EP4CGX30BF14I6N, ensure proper decoupling per the Intel reference schematic and verify signal-integrity routing for the high-speed transceiver lanes. The device uses SRAM-based configuration, so an external configuration flash is required for standalone boot. Industrial temperature rating makes this part suitable for harsh-environment deployments.
This page synthesizes distributor pricing, drop-in alternatives sourced from the Cyclone IV GX family and competitor cross-references, and practical design notes not found in the standalone datasheet.
Bộ thay thế dễ dàng lắp đặt cho EP4CGX30BF14I6N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP4CGX30BF14I6N (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Operating Temperature, Mounting Type, Logic Elements (LE).
EP4CGX30BF14C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP4CGX30BF14C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP4CGX30BF14C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP4CGX22BF14I8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP4CGX15BF14I8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP4CGX30BF14I6N Tỷ lệ tối đa & tính chất điện
| Family | Cyclone IV GX |
| Logic Elements | 29,440 |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Hộp | 169-Ball FBGA (F14) |
| User I/O Pins | 72 (max) |
| Embedded Memory Bits | 1,105,920 |
| Transceiver Channels | 4 (3.125 Gbps) |
| PLLs | 2 |
| Speed Grade | I6 (industrial) |
| Operating Temperature (Junction) | -40C to +100C |
| Kiểu lắp đặt | Surface Mount |
| Configuration Method | SRAM-based, requires external flash |
| DSP Blocks | Embedded multipliers (18x18) |
| Hard Memory Controllers | DDR/DDR2/QDRII SDRAM |
Cấu hình chân EP4CGX30BF14I6N
| Chân A1 | VCCIO1 — I/O bank 1 supply voltage |
| Chân A2 | IO1 — User I/O (bank 1) |
| Chân A3 | IO1 — User I/O (bank 1) |
| Chân A4 | GXB_TX0 — Transceiver 0 transmit |
| Chân A5 | GXB_RX0 — Transceiver 0 receive |
| Chân A6 | IO2 — User I/O (bank 2) |
| Chân A7 | VCCIO2 — I/O bank 2 supply voltage |
| Chân A8 | IO2 — User I/O (bank 2) |
| Chân A9 | GXB_TX1 — Transceiver 1 transmit |
| Chân A10 | GXB_RX1 — Transceiver 1 receive |
| Chân A11 | IO3 — User I/O (bank 3) |
| Chân A12 | VCCIO3 — I/O bank 3 supply voltage |
| Chân A13 | IO3 — User I/O (bank 3) |
| Chân B1 | GND — Ground |
| Chân B2 | VCCINT — Core supply voltage (1.2 V) |
| Chân B3 | IO1 — User I/O (bank 1) |
| Chân B4 | REFCLK0 — Transceiver reference clock 0 |
| Chân B5 | GND — Ground |
| Chân B6 | REFCLK1 — Transceiver reference clock 1 |
| Chân B7 | IO2 — User I/O (bank 2) |
| Chân B8 | GND — Ground |
| Chân B9 | REFCLK2 — Transceiver reference clock 2 |
| Chân B10 | GXB_TX2 — Transceiver 2 transmit |
| Chân B11 | GXB_RX2 — Transceiver 2 receive |
| Chân B12 | IO3 — User I/O (bank 3) |
| Chân B13 | VCCINT — Core supply voltage (1.2 V) |
| Chân C1 | IO1 — User I/O (bank 1) |
| Chân C2 | GND — Ground |
| Chân C3 | IO1 — User I/O (bank 1) |
| Chân C4 | GXB_TX0_p — Transceiver 0 transmit (positive) |
| Chân C5 | GXB_RX0_p — Transceiver 0 receive (positive) |
| Chân C6 | IO2 — User I/O (bank 2) |
| Chân C7 | GXB_TX1_p — Transceiver 1 transmit (positive) |
| Chân C8 | GXB_RX1_p — Transceiver 1 receive (positive) |
| Chân C9 | IO3 — User I/O (bank 3) |
| Chân C10 | GXB_TX2_p — Transceiver 2 transmit (positive) |
| Chân C11 | GXB_RX2_p — Transceiver 2 receive (positive) |
| Chân C12 | GND — Ground |
| Chân C13 | IO3 — User I/O (bank 3) |
| Chân D1 | VCCIO1 — I/O bank 1 supply voltage |
| Chân D2 | IO1 — User I/O (bank 1) |
| Chân D3 | IO1 — User I/O (bank 1) |
| Chân D4 | GXB_TX0_n — Transceiver 0 transmit (negative) |
| Chân D5 | GXB_RX0_n — Transceiver 0 receive (negative) |
| Chân D6 | IO2 — User I/O (bank 2) |
| Chân D7 | GXB_TX1_n — Transceiver 1 transmit (negative) |
| Chân D8 | GXB_RX1_n — Transceiver 1 receive (negative) |
| Chân D9 | IO3 — User I/O (bank 3) |
| Chân D10 | GXB_TX2_n — Transceiver 2 transmit (negative) |
| Chân D11 | GXB_RX2_n — Transceiver 2 receive (negative) |
| Chân D12 | IO3 — User I/O (bank 3) |
| Chân D13 | VCCIO3 — I/O bank 3 supply voltage |
| Chân E1 | GND — Ground |
| Chân E2 | IO1 — User I/O (bank 1) |
| Chân E3 | VCCINT — Core supply voltage (1.2 V) |
| Chân E4 | IO1 — User I/O (bank 1) |
| Chân E5 | GND — Ground |
| Chân E6 | VCCIO2 — I/O bank 2 supply voltage |
| Chân E7 | IO2 — User I/O (bank 2) |
| Chân E8 | VCCINT — Core supply voltage (1.2 V) |
| Chân E9 | IO3 — User I/O (bank 3) |
| Chân E10 | GND — Ground |
| Chân E11 | IO3 — User I/O (bank 3) |
| Chân E12 | VCCINT — Core supply voltage (1.2 V) |
| Chân E13 | IO3 — User I/O (bank 3) |
| Chân F1 | IO1 — User I/O (bank 1) |
| Chân F2 | VCCIO1 — I/O bank 1 supply voltage |
| Chân F3 | IO1 — User I/O (bank 1) |
| Chân F4 | GXB_TX3 — Transceiver 3 transmit |
| Chân F5 | GXB_RX3 — Transceiver 3 receive |
| Chân F6 | IO2 — User I/O (bank 2) |
| Chân F7 | VCCIO2 — I/O bank 2 supply voltage |
| Chân F8 | IO2 — User I/O (bank 2) |
| Chân F9 | GXB_TX3_p — Transceiver 3 transmit (positive) |
| Chân F10 | GXB_RX3_p — Transceiver 3 receive (positive) |
| Chân F11 | IO3 — User I/O (bank 3) |
| Chân F12 | VCCIO3 — I/O bank 3 supply voltage |
| Chân F13 | IO3 — User I/O (bank 3) |
| Chân G1 | GND — Ground |
| Chân G2 | IO1 — User I/O (bank 1) |
| Chân G3 | VCCINT — Core supply voltage (1.2 V) |
| Chân G4 | GXB_TX3_n — Transceiver 3 transmit (negative) |
| Chân G5 | GXB_RX3_n — Transceiver 3 receive (negative) |
| Chân G6 | IO2 — User I/O (bank 2) |
| Chân G7 | VCCINT — Core supply voltage (1.2 V) |
| Chân G8 | IO2 — User I/O (bank 2) |
| Chân G9 | REFCLK3 — Transceiver reference clock 3 |
| Chân G10 | GND — Ground |
| Chân G11 | IO3 — User I/O (bank 3) |
| Chân G12 | VCCINT — Core supply voltage (1.2 V) |
| Chân G13 | IO3 — User I/O (bank 3) |
| Chân H1 | VCCIO1 — I/O bank 1 supply voltage |
| Chân H2 | IO1 — User I/O (bank 1) |
| Chân H3 | IO1 — User I/O (bank 1) |
| Chân H4 | VCC_PLL — PLL analog supply |
| Chân H5 | PLL1_OUT — PLL1 output clock |
| Chân H6 | IO2 — User I/O (bank 2) |
| Chân H7 | VCCIO2 — I/O bank 2 supply voltage |
| Chân H8 | IO2 — User I/O (bank 2) |
| Chân H9 | PLL2_OUT — PLL2 output clock |
| Chân H10 | VCC_PLL — PLL analog supply |
| Chân H11 | IO3 — User I/O (bank 3) |
| Chân H12 | VCCIO3 — I/O bank 3 supply voltage |
| Chân H13 | IO3 — User I/O (bank 3) |
| Chân J1 | GND — Ground |
| Chân J2 | IO1 — User I/O (bank 1) |
| Chân J3 | VCCINT — Core supply voltage (1.2 V) |
| Chân J4 | MSEL0 — Configuration mode select 0 |
| Chân J5 | MSEL1 — Configuration mode select 1 |
| Chân J6 | IO2 — User I/O (bank 2) |
| Chân J7 | VCCINT — Core supply voltage (1.2 V) |
| Chân J8 | IO2 — User I/O (bank 2) |
| Chân J9 | MSEL2 — Configuration mode select 2 |
| Chân J10 | TCK — JTAG test clock |
| Chân J11 | IO3 — User I/O (bank 3) |
| Chân J12 | VCCINT — Core supply voltage (1.2 V) |
| Chân J13 | IO3 — User I/O (bank 3) |
| Chân K1 | IO1 — User I/O (bank 1) |
| Chân K2 | VCCIO1 — I/O bank 1 supply voltage |
| Chân K3 | IO1 — User I/O (bank 1) |
| Chân K4 | nCONFIG — Configuration control (active low) |
| Chân K5 | nSTATUS — Configuration status (active low) |
| Chân K6 | IO2 — User I/O (bank 2) |
| Chân K7 | VCCIO2 — I/O bank 2 supply voltage |
| Chân K8 | IO2 — User I/O (bank 2) |
| Chân K9 | CONF_DONE — Configuration done indicator |
| Chân K10 | TDI — JTAG test data in |
| Chân K11 | IO3 — User I/O (bank 3) |
| Chân K12 | VCCIO3 — I/O bank 3 supply voltage |
| Chân K13 | IO3 — User I/O (bank 3) |
| Chân L1 | GND — Ground |
| Chân L2 | IO1 — User I/O (bank 1) |
| Chân L3 | VCCINT — Core supply voltage (1.2 V) |
| Chân L4 | IO1 — User I/O (bank 1) |
| Chân L5 | DATA0 — Configuration data bit 0 |
| Chân L6 | IO2 — User I/O (bank 2) |
| Chân L7 | VCCINT — Core supply voltage (1.2 V) |
| Chân L8 | IO2 — User I/O (bank 2) |
| Chân L9 | TDO — JTAG test data out |
| Chân L10 | TMS — JTAG test mode select |
| Chân L11 | IO3 — User I/O (bank 3) |
| Chân L12 | VCCINT — Core supply voltage (1.2 V) |
| Chân L13 | IO3 — User I/O (bank 3) |
| Chân M1 | IO1 — User I/O (bank 1) |
| Chân M2 | VCCIO1 — I/O bank 1 supply voltage |
| Chân M3 | IO1 — User I/O (bank 1) |
| Chân M4 | DCLK — Configuration clock |
| Chân M5 | nCE — Chip enable (active low) |
| Chân M6 | IO2 — User I/O (bank 2) |
| Chân M7 | VCCIO2 — I/O bank 2 supply voltage |
| Chân M8 | IO2 — User I/O (bank 2) |
| Chân M9 | CRC_ERROR — Configuration CRC error indicator |
| Chân M10 | CLK0 — Global clock input 0 |
| Chân M11 | IO3 — User I/O (bank 3) |
| Chân M12 | VCCIO3 — I/O bank 3 supply voltage |
| Chân M13 | IO3 — User I/O (bank 3) |
| Chân N1 | GND — Ground |
| Chân N2 | IO1 — User I/O (bank 1) |
| Chân N3 | VCCINT — Core supply voltage (1.2 V) |
| Chân N4 | IO1 — User I/O (bank 1) |
| Chân N5 | DATA1 — Configuration data bit 1 |
| Chân N6 | IO2 — User I/O (bank 2) |
| Chân N7 | VCCINT — Core supply voltage (1.2 V) |
| Chân N8 | IO2 — User I/O (bank 2) |
| Chân N9 | DEV_OE — Device-wide output enable |
| Chân N10 | CLK1 — Global clock input 1 |
| Chân N11 | IO3 — User I/O (bank 3) |
| Chân N12 | VCCINT — Core supply voltage (1.2 V) |
| Chân N13 | IO3 — User I/O (bank 3) |
Ứng dụng tiêu biểu
EP4CGX30BF14I6N phù hợp cho 7 Áp dụngs: Industrial Machine Vision, Wireless Remote Radio Unit (RRU), Factory Automation Controller, Cost-Optimized Video Surveillance, Protocol Bridging and Interface Conversion, Embedded Motor Control, PCIe Endpoint Card.
Industrial Machine Vision
The EP4CGX30BF14I6N's 29,440 logic elements and four 3.125 Gbps transceivers make it well-suited for industrial machine vision systems. Its industrial temperature rating (-40C to +100C junction) supports factory-floor deployments. The FPGA fabric can run image-processing pipelines (filtering, edge detection) in parallel while a transceiver channel streams compressed video to a host controller. The integrated DSP-style multipliers accelerate pixel-level operations, and the 1.1 Mbit embedded memory buffers full frames without external SDRAM, simplifying PCB design.
Được đề xuất
Wireless Remote Radio Unit (RRU)
The four 3.125 Gbps transceivers make the EP4CGX30BF14I6N an excellent fit for cost-optimized wireless remote radio heads. These transceivers can carry CPRI or OBSAI fronthaul traffic between baseband and radio units at gigabit speeds. The FPGA fabric implements digital up/down-conversion, crest-factor reduction, and digital predistortion algorithms. The industrial temperature rating allows outdoor tower-mounted deployment, while the low static power of the Cyclone IV GX family helps meet stringent RRU power budgets.
Được đề xuất
Factory Automation Controller
Factory automation controllers benefit from the EP4CGX30BF14I6N's deterministic parallel logic, 72 user I/O pins, and industrial temperature rating. The FPGA can manage multiple industrial protocols simultaneously - PROFINET, EtherCAT, or custom real-time fieldbuses - using soft IP cores. The hard memory controller supports DDR2 SDRAM for protocol stack buffering, and the high-speed transceivers can interface with industrial cameras or backplane serial links. Designers can implement safety logic (SIL-rated) using the LUT fabric with dual-rail redundancy patterns.
Được đề xuất
Cost-Optimized Video Surveillance
Video surveillance systems benefit from the EP4CGX30BF14I6N's ability to run H.264/H.265 encoding in FPGA fabric while simultaneously streaming output via the integrated 3.125 Gbps transceivers. The 1.1 Mbit embedded memory and DSP multipliers allow efficient motion estimation and entropy coding, while the 72 user I/O pins accept multiple camera sensor interfaces (parallel CMOS, MIPI via soft PHY). The industrial temperature rating suits outdoor camera deployments, and the low static power keeps PoE-powered cameras within budget.
Được đề xuất
Protocol Bridging and Interface Conversion
The EP4CGX30BF14I6N is well-suited to protocol-bridging applications such as PCIe-to-Ethernet, USB-to-SPI, or custom serial-link aggregation. The four 3.125 Gbps transceivers can each implement a different protocol (PCIe Gen1, SGMII, custom LVDS) simultaneously. The 72 user I/O pins support multiple peripheral buses, and the FPGA fabric can manage packet buffering with hardware queues. Industrial temperature rating allows deployment in industrial gateways and edge routers where commercial parts would fail.
Được đề xuất
Embedded Motor Control
Motor control applications benefit from the EP4CGX30BF14I6N's parallel logic fabric, DSP multipliers for field-oriented control (FOC) loops, and PWM generator capability. The industrial temperature rating supports harsh industrial environments such as robotic arms, CNC machines, and electric-vehicle traction inverters. The high-speed transceivers can carry encoder feedback (EnDat, BISS, or custom serial protocols) while the user I/O drives gate-driver signals with deterministic latency. The 1.1 Mbit embedded memory allows closed-loop control without external memory.
Được đề xuất
PCIe Endpoint Card
The EP4CGX30BF14I6N integrates hard PCIe Gen1 IP, enabling designers to implement low-cost PCIe endpoint cards without external bridge chips. The four 3.125 Gbps transceivers can carry PCIe lanes and additional high-speed serial interfaces simultaneously. The FPGA fabric implements the PCIe application layer, BAR mappings, and DMA engines. Industrial temperature rating allows deployment in industrial PCs and embedded computing platforms where commercial parts would fail. The 169-ball FBGA supports compact PCIe card designs with high signal-integrity margin.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP4CGX30BF14I6N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP4CGX30BF14C6N | EP4CGX30BF14C7N | EP4CGX30BF14C8N | EP4CGX22BF14I8N | EP4CGX15BF14I8N |
|---|---|---|---|---|---|---|
| Package | FBGA-169 (F14) | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 29,440 | 29,440 | 29,440 | 29,440 | 21,680 | 14,400 |
| Embedded Memory (bits) | 1,105,920 | 1,105,920 | 1,105,920 | 1,105,920 | 783,360 | 552,960 |
| Transceiver Channels | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 0 (no transceivers) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I6 | C6 | C7 (faster) | C8 (fastest) | I8 (faster) | I8 (faster) |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
Bảo phân biệt quan trọng
- Industrial temperature rating vs commercial-grade alternatives (vsEP4CGX30BF14C6N)
- Highest logic element density among F14 169-ball variants (vsEP4CGX22BF14I8N)
- Integrated 3.125 Gbps transceivers vs non-transceiver alternatives (vsEP4CGX15BF14I8N)
Ghi chú thiết kế
The EP4CGX30BF14I6N requires separate 1.2 V (VCCINT) and per-bank VCCIO supplies. Use a low-noise LDO for the 1.2 V core rail with at least 1 A capacity (e.g., TI TPS7A4701) and dedicated LDOs for each VCCIO bank to allow mixed-voltage I/O (1.2 V to 3.3 V). Decouple each transceiver channel with 0.1 uF and 10 uF capacitors placed within 100 mils of the GXB_TX/GXB_RX balls. Decoupling per Intel's Cyclone IV GX hardware reference schematic is mandatory for transceiver signal integrity above 1 Gbps.
Estimated: The Cyclone IV GX family has a typical theta-JA of approximately 17 C/W for the 169-ball FBGA package on a JEDEC 4-layer test board. Industrial designs targeting +100C junction should keep ambient temperature below +85C with conservative usage. Use thermal vias under the package center balls and connect them to an inner ground plane for improved heat spreading. Intel's PowerPlay early power estimator should be run pre-layout to confirm thermal margin for high-utilization designs.
Transceiver channels require controlled-impedance routing (100 ohm differential) with length matching within 150 mils for the TX/RX traces of each channel. Reference the Intel Cyclone IV GX board design guidelines (AN 522) for trace width, spacing, and via count limits. Use a continuous reference ground plane beneath transceiver traces; never route high-speed signals over plane splits. Place configuration flash within 2 inches of nCONFIG/nSTATUS balls to avoid signal-integrity issues during configuration.
Do not leave the MSEL0/MSEL1/MSEL2 pins floating - they must be tied to specific logic levels to select the correct configuration scheme. Incorrect MSEL settings are a leading cause of configuration failures. Ensure the configuration flash (e.g., EPCS4/EPCS16) is sized at least 2x the compressed .sof file size to allow dual-boot redundancy. Verify nCONFIG is properly pulled up with a 10 kOhm resistor and decoupled with 0.1 uF for clean reset behavior.
Thông tin tuân thủ
RoHS and REACH compliant per Intel product declaration. Not AEC-Q100 qualified - this part targets industrial rather than automotive-grade applications. Lead-free FBGA balls compatible with standard SAC reflow profiles.
