EP4CGX30BF14I6N - Cyclone IV GX FPGA, 30K LE, FBGA-169 | Intel
MPN: EP4CGX30BF14I6N ✓ פעילEP4CGX30BF14I6N סקירה
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks (such as transceivers, multipliers, and memory controllers). FPGAs occupy a unique position in the digital design hierarchy: more flexible than an ASIC and faster than a general-purpose microcontroller, they sit between fixed-logic ICs and software-defined compute. The Cyclone IV GX family specifically extends the Cyclone IV series by adding integrated transceivers while maintaining the lowest static power in the industry's mainstream FPGA segment.
Key features of the EP4CGX30BF14I6N include up to 72 user I/O pins, 1,105,920 bits of embedded memory (approximately 135 Kbytes when configured as M9K blocks), four 3.125 Gbps transceiver channels, two PLLs, and support for external memory interfaces including DDR/DDR2/QDRII SDRAM. The device operates from a 1.2 V core supply with separate V1CCIO banks for I/O voltage flexibility. The F14 package designation indicates the 169-ball fine-pitch BGA, and the I6 speed grade balances performance with the industrial temperature range (-40C to +100C junction).
The Cyclone IV GX architecture combines an enhanced LUT-based logic fabric with dedicated 18x18 multipliers, dual-configuration flash memory support, and hard PCI Express IP. This makes the device suitable for protocol bridging, motor control, and custom video pipelines where designers need parallel DSP performance alongside multi-gigabit serial I/O.
Typical applications include industrial machine vision, low-end wireless backhaul, factory automation controllers, and cost-optimized video surveillance systems. The integrated transceivers allow designers to implement proprietary serial links or standards such as PCIe Gen1 and CPRI without external PHY chips.
When designing with the EP4CGX30BF14I6N, ensure proper decoupling per the Intel reference schematic and verify signal-integrity routing for the high-speed transceiver lanes. The device uses SRAM-based configuration, so an external configuration flash is required for standalone boot. Industrial temperature rating makes this part suitable for harsh-environment deployments.
This page synthesizes distributor pricing, drop-in alternatives sourced from the Cyclone IV GX family and competitor cross-references, and practical design notes not found in the standalone datasheet.
חלופות תחליף ישיר עבור EP4CGX30BF14I6N — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EP4CGX30BF14I6N (אותו גורם צורה וטביעת רגל) — שונים ב Package, Speed Grade, Operating Temperature, Mounting Type, Logic Elements (LE).
EP4CGX30BF14C6N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP4CGX30BF14C7N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP4CGX30BF14C8N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP4CGX22BF14I8N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP4CGX15BF14I8N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP4CGX30BF14I6N דירוגים מרביים ומאפיינים חשמליים
| Family | Cyclone IV GX |
| Logic Elements | 29,440 |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| מארז | 169-Ball FBGA (F14) |
| User I/O Pins | 72 (max) |
| Embedded Memory Bits | 1,105,920 |
| Transceiver Channels | 4 (3.125 Gbps) |
| PLLs | 2 |
| Speed Grade | I6 (industrial) |
| Operating Temperature (Junction) | -40C to +100C |
| סוג הרכבה | Surface Mount |
| Configuration Method | SRAM-based, requires external flash |
| DSP Blocks | Embedded multipliers (18x18) |
| Hard Memory Controllers | DDR/DDR2/QDRII SDRAM |
תצורת פינים של EP4CGX30BF14I6N
| פין A1 | VCCIO1 — I/O bank 1 supply voltage |
| פין A2 | IO1 — User I/O (bank 1) |
| פין A3 | IO1 — User I/O (bank 1) |
| פין A4 | GXB_TX0 — Transceiver 0 transmit |
| פין A5 | GXB_RX0 — Transceiver 0 receive |
| פין A6 | IO2 — User I/O (bank 2) |
| פין A7 | VCCIO2 — I/O bank 2 supply voltage |
| פין A8 | IO2 — User I/O (bank 2) |
| פין A9 | GXB_TX1 — Transceiver 1 transmit |
| פין A10 | GXB_RX1 — Transceiver 1 receive |
| פין A11 | IO3 — User I/O (bank 3) |
| פין A12 | VCCIO3 — I/O bank 3 supply voltage |
| פין A13 | IO3 — User I/O (bank 3) |
| פין B1 | GND — Ground |
| פין B2 | VCCINT — Core supply voltage (1.2 V) |
| פין B3 | IO1 — User I/O (bank 1) |
| פין B4 | REFCLK0 — Transceiver reference clock 0 |
| פין B5 | GND — Ground |
| פין B6 | REFCLK1 — Transceiver reference clock 1 |
| פין B7 | IO2 — User I/O (bank 2) |
| פין B8 | GND — Ground |
| פין B9 | REFCLK2 — Transceiver reference clock 2 |
| פין B10 | GXB_TX2 — Transceiver 2 transmit |
| פין B11 | GXB_RX2 — Transceiver 2 receive |
| פין B12 | IO3 — User I/O (bank 3) |
| פין B13 | VCCINT — Core supply voltage (1.2 V) |
| פין C1 | IO1 — User I/O (bank 1) |
| פין C2 | GND — Ground |
| פין C3 | IO1 — User I/O (bank 1) |
| פין C4 | GXB_TX0_p — Transceiver 0 transmit (positive) |
| פין C5 | GXB_RX0_p — Transceiver 0 receive (positive) |
| פין C6 | IO2 — User I/O (bank 2) |
| פין C7 | GXB_TX1_p — Transceiver 1 transmit (positive) |
| פין C8 | GXB_RX1_p — Transceiver 1 receive (positive) |
| פין C9 | IO3 — User I/O (bank 3) |
| פין C10 | GXB_TX2_p — Transceiver 2 transmit (positive) |
| פין C11 | GXB_RX2_p — Transceiver 2 receive (positive) |
| פין C12 | GND — Ground |
| פין C13 | IO3 — User I/O (bank 3) |
| פין D1 | VCCIO1 — I/O bank 1 supply voltage |
| פין D2 | IO1 — User I/O (bank 1) |
| פין D3 | IO1 — User I/O (bank 1) |
| פין D4 | GXB_TX0_n — Transceiver 0 transmit (negative) |
| פין D5 | GXB_RX0_n — Transceiver 0 receive (negative) |
| פין D6 | IO2 — User I/O (bank 2) |
| פין D7 | GXB_TX1_n — Transceiver 1 transmit (negative) |
| פין D8 | GXB_RX1_n — Transceiver 1 receive (negative) |
| פין D9 | IO3 — User I/O (bank 3) |
| פין D10 | GXB_TX2_n — Transceiver 2 transmit (negative) |
| פין D11 | GXB_RX2_n — Transceiver 2 receive (negative) |
| פין D12 | IO3 — User I/O (bank 3) |
| פין D13 | VCCIO3 — I/O bank 3 supply voltage |
| פין E1 | GND — Ground |
| פין E2 | IO1 — User I/O (bank 1) |
| פין E3 | VCCINT — Core supply voltage (1.2 V) |
| פין E4 | IO1 — User I/O (bank 1) |
| פין E5 | GND — Ground |
| פין E6 | VCCIO2 — I/O bank 2 supply voltage |
| פין E7 | IO2 — User I/O (bank 2) |
| פין E8 | VCCINT — Core supply voltage (1.2 V) |
| פין E9 | IO3 — User I/O (bank 3) |
| פין E10 | GND — Ground |
| פין E11 | IO3 — User I/O (bank 3) |
| פין E12 | VCCINT — Core supply voltage (1.2 V) |
| פין E13 | IO3 — User I/O (bank 3) |
| פין F1 | IO1 — User I/O (bank 1) |
| פין F2 | VCCIO1 — I/O bank 1 supply voltage |
| פין F3 | IO1 — User I/O (bank 1) |
| פין F4 | GXB_TX3 — Transceiver 3 transmit |
| פין F5 | GXB_RX3 — Transceiver 3 receive |
| פין F6 | IO2 — User I/O (bank 2) |
| פין F7 | VCCIO2 — I/O bank 2 supply voltage |
| פין F8 | IO2 — User I/O (bank 2) |
| פין F9 | GXB_TX3_p — Transceiver 3 transmit (positive) |
| פין F10 | GXB_RX3_p — Transceiver 3 receive (positive) |
| פין F11 | IO3 — User I/O (bank 3) |
| פין F12 | VCCIO3 — I/O bank 3 supply voltage |
| פין F13 | IO3 — User I/O (bank 3) |
| פין G1 | GND — Ground |
| פין G2 | IO1 — User I/O (bank 1) |
| פין G3 | VCCINT — Core supply voltage (1.2 V) |
| פין G4 | GXB_TX3_n — Transceiver 3 transmit (negative) |
| פין G5 | GXB_RX3_n — Transceiver 3 receive (negative) |
| פין G6 | IO2 — User I/O (bank 2) |
| פין G7 | VCCINT — Core supply voltage (1.2 V) |
| פין G8 | IO2 — User I/O (bank 2) |
| פין G9 | REFCLK3 — Transceiver reference clock 3 |
| פין G10 | GND — Ground |
| פין G11 | IO3 — User I/O (bank 3) |
| פין G12 | VCCINT — Core supply voltage (1.2 V) |
| פין G13 | IO3 — User I/O (bank 3) |
| פין H1 | VCCIO1 — I/O bank 1 supply voltage |
| פין H2 | IO1 — User I/O (bank 1) |
| פין H3 | IO1 — User I/O (bank 1) |
| פין H4 | VCC_PLL — PLL analog supply |
| פין H5 | PLL1_OUT — PLL1 output clock |
| פין H6 | IO2 — User I/O (bank 2) |
| פין H7 | VCCIO2 — I/O bank 2 supply voltage |
| פין H8 | IO2 — User I/O (bank 2) |
| פין H9 | PLL2_OUT — PLL2 output clock |
| פין H10 | VCC_PLL — PLL analog supply |
| פין H11 | IO3 — User I/O (bank 3) |
| פין H12 | VCCIO3 — I/O bank 3 supply voltage |
| פין H13 | IO3 — User I/O (bank 3) |
| פין J1 | GND — Ground |
| פין J2 | IO1 — User I/O (bank 1) |
| פין J3 | VCCINT — Core supply voltage (1.2 V) |
| פין J4 | MSEL0 — Configuration mode select 0 |
| פין J5 | MSEL1 — Configuration mode select 1 |
| פין J6 | IO2 — User I/O (bank 2) |
| פין J7 | VCCINT — Core supply voltage (1.2 V) |
| פין J8 | IO2 — User I/O (bank 2) |
| פין J9 | MSEL2 — Configuration mode select 2 |
| פין J10 | TCK — JTAG test clock |
| פין J11 | IO3 — User I/O (bank 3) |
| פין J12 | VCCINT — Core supply voltage (1.2 V) |
| פין J13 | IO3 — User I/O (bank 3) |
| פין K1 | IO1 — User I/O (bank 1) |
| פין K2 | VCCIO1 — I/O bank 1 supply voltage |
| פין K3 | IO1 — User I/O (bank 1) |
| פין K4 | nCONFIG — Configuration control (active low) |
| פין K5 | nSTATUS — Configuration status (active low) |
| פין K6 | IO2 — User I/O (bank 2) |
| פין K7 | VCCIO2 — I/O bank 2 supply voltage |
| פין K8 | IO2 — User I/O (bank 2) |
| פין K9 | CONF_DONE — Configuration done indicator |
| פין K10 | TDI — JTAG test data in |
| פין K11 | IO3 — User I/O (bank 3) |
| פין K12 | VCCIO3 — I/O bank 3 supply voltage |
| פין K13 | IO3 — User I/O (bank 3) |
| פין L1 | GND — Ground |
| פין L2 | IO1 — User I/O (bank 1) |
| פין L3 | VCCINT — Core supply voltage (1.2 V) |
| פין L4 | IO1 — User I/O (bank 1) |
| פין L5 | DATA0 — Configuration data bit 0 |
| פין L6 | IO2 — User I/O (bank 2) |
| פין L7 | VCCINT — Core supply voltage (1.2 V) |
| פין L8 | IO2 — User I/O (bank 2) |
| פין L9 | TDO — JTAG test data out |
| פין L10 | TMS — JTAG test mode select |
| פין L11 | IO3 — User I/O (bank 3) |
| פין L12 | VCCINT — Core supply voltage (1.2 V) |
| פין L13 | IO3 — User I/O (bank 3) |
| פין M1 | IO1 — User I/O (bank 1) |
| פין M2 | VCCIO1 — I/O bank 1 supply voltage |
| פין M3 | IO1 — User I/O (bank 1) |
| פין M4 | DCLK — Configuration clock |
| פין M5 | nCE — Chip enable (active low) |
| פין M6 | IO2 — User I/O (bank 2) |
| פין M7 | VCCIO2 — I/O bank 2 supply voltage |
| פין M8 | IO2 — User I/O (bank 2) |
| פין M9 | CRC_ERROR — Configuration CRC error indicator |
| פין M10 | CLK0 — Global clock input 0 |
| פין M11 | IO3 — User I/O (bank 3) |
| פין M12 | VCCIO3 — I/O bank 3 supply voltage |
| פין M13 | IO3 — User I/O (bank 3) |
| פין N1 | GND — Ground |
| פין N2 | IO1 — User I/O (bank 1) |
| פין N3 | VCCINT — Core supply voltage (1.2 V) |
| פין N4 | IO1 — User I/O (bank 1) |
| פין N5 | DATA1 — Configuration data bit 1 |
| פין N6 | IO2 — User I/O (bank 2) |
| פין N7 | VCCINT — Core supply voltage (1.2 V) |
| פין N8 | IO2 — User I/O (bank 2) |
| פין N9 | DEV_OE — Device-wide output enable |
| פין N10 | CLK1 — Global clock input 1 |
| פין N11 | IO3 — User I/O (bank 3) |
| פין N12 | VCCINT — Core supply voltage (1.2 V) |
| פין N13 | IO3 — User I/O (bank 3) |
יישומים טיפוסיים
EP4CGX30BF14I6N מתאים עבור 7 יישוםs: Industrial Machine Vision, Wireless Remote Radio Unit (RRU), Factory Automation Controller, Cost-Optimized Video Surveillance, Protocol Bridging and Interface Conversion, Embedded Motor Control, PCIe Endpoint Card.
Industrial Machine Vision
The EP4CGX30BF14I6N's 29,440 logic elements and four 3.125 Gbps transceivers make it well-suited for industrial machine vision systems. Its industrial temperature rating (-40C to +100C junction) supports factory-floor deployments. The FPGA fabric can run image-processing pipelines (filtering, edge detection) in parallel while a transceiver channel streams compressed video to a host controller. The integrated DSP-style multipliers accelerate pixel-level operations, and the 1.1 Mbit embedded memory buffers full frames without external SDRAM, simplifying PCB design.
מומלץ
Wireless Remote Radio Unit (RRU)
The four 3.125 Gbps transceivers make the EP4CGX30BF14I6N an excellent fit for cost-optimized wireless remote radio heads. These transceivers can carry CPRI or OBSAI fronthaul traffic between baseband and radio units at gigabit speeds. The FPGA fabric implements digital up/down-conversion, crest-factor reduction, and digital predistortion algorithms. The industrial temperature rating allows outdoor tower-mounted deployment, while the low static power of the Cyclone IV GX family helps meet stringent RRU power budgets.
מומלץ
Factory Automation Controller
Factory automation controllers benefit from the EP4CGX30BF14I6N's deterministic parallel logic, 72 user I/O pins, and industrial temperature rating. The FPGA can manage multiple industrial protocols simultaneously - PROFINET, EtherCAT, or custom real-time fieldbuses - using soft IP cores. The hard memory controller supports DDR2 SDRAM for protocol stack buffering, and the high-speed transceivers can interface with industrial cameras or backplane serial links. Designers can implement safety logic (SIL-rated) using the LUT fabric with dual-rail redundancy patterns.
מומלץ
Cost-Optimized Video Surveillance
Video surveillance systems benefit from the EP4CGX30BF14I6N's ability to run H.264/H.265 encoding in FPGA fabric while simultaneously streaming output via the integrated 3.125 Gbps transceivers. The 1.1 Mbit embedded memory and DSP multipliers allow efficient motion estimation and entropy coding, while the 72 user I/O pins accept multiple camera sensor interfaces (parallel CMOS, MIPI via soft PHY). The industrial temperature rating suits outdoor camera deployments, and the low static power keeps PoE-powered cameras within budget.
מומלץ
Protocol Bridging and Interface Conversion
The EP4CGX30BF14I6N is well-suited to protocol-bridging applications such as PCIe-to-Ethernet, USB-to-SPI, or custom serial-link aggregation. The four 3.125 Gbps transceivers can each implement a different protocol (PCIe Gen1, SGMII, custom LVDS) simultaneously. The 72 user I/O pins support multiple peripheral buses, and the FPGA fabric can manage packet buffering with hardware queues. Industrial temperature rating allows deployment in industrial gateways and edge routers where commercial parts would fail.
מומלץ
Embedded Motor Control
Motor control applications benefit from the EP4CGX30BF14I6N's parallel logic fabric, DSP multipliers for field-oriented control (FOC) loops, and PWM generator capability. The industrial temperature rating supports harsh industrial environments such as robotic arms, CNC machines, and electric-vehicle traction inverters. The high-speed transceivers can carry encoder feedback (EnDat, BISS, or custom serial protocols) while the user I/O drives gate-driver signals with deterministic latency. The 1.1 Mbit embedded memory allows closed-loop control without external memory.
מומלץ
PCIe Endpoint Card
The EP4CGX30BF14I6N integrates hard PCIe Gen1 IP, enabling designers to implement low-cost PCIe endpoint cards without external bridge chips. The four 3.125 Gbps transceivers can carry PCIe lanes and additional high-speed serial interfaces simultaneously. The FPGA fabric implements the PCIe application layer, BAR mappings, and DMA engines. Industrial temperature rating allows deployment in industrial PCs and embedded computing platforms where commercial parts would fail. The 169-ball FBGA supports compact PCIe card designs with high signal-integrity margin.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EP4CGX30BF14I6N — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EP4CGX30BF14C6N | EP4CGX30BF14C7N | EP4CGX30BF14C8N | EP4CGX22BF14I8N | EP4CGX15BF14I8N |
|---|---|---|---|---|---|---|
| Package | FBGA-169 (F14) | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 29,440 | 29,440 | 29,440 | 29,440 | 21,680 | 14,400 |
| Embedded Memory (bits) | 1,105,920 | 1,105,920 | 1,105,920 | 1,105,920 | 783,360 | 552,960 |
| Transceiver Channels | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 0 (no transceivers) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I6 | C6 | C7 (faster) | C8 (fastest) | I8 (faster) | I8 (faster) |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
מבדילים עיקריים
- Industrial temperature rating vs commercial-grade alternatives (לעומתEP4CGX30BF14C6N)
- Highest logic element density among F14 169-ball variants (לעומתEP4CGX22BF14I8N)
- Integrated 3.125 Gbps transceivers vs non-transceiver alternatives (לעומתEP4CGX15BF14I8N)
הערות תכנון
The EP4CGX30BF14I6N requires separate 1.2 V (VCCINT) and per-bank VCCIO supplies. Use a low-noise LDO for the 1.2 V core rail with at least 1 A capacity (e.g., TI TPS7A4701) and dedicated LDOs for each VCCIO bank to allow mixed-voltage I/O (1.2 V to 3.3 V). Decouple each transceiver channel with 0.1 uF and 10 uF capacitors placed within 100 mils of the GXB_TX/GXB_RX balls. Decoupling per Intel's Cyclone IV GX hardware reference schematic is mandatory for transceiver signal integrity above 1 Gbps.
Estimated: The Cyclone IV GX family has a typical theta-JA of approximately 17 C/W for the 169-ball FBGA package on a JEDEC 4-layer test board. Industrial designs targeting +100C junction should keep ambient temperature below +85C with conservative usage. Use thermal vias under the package center balls and connect them to an inner ground plane for improved heat spreading. Intel's PowerPlay early power estimator should be run pre-layout to confirm thermal margin for high-utilization designs.
Transceiver channels require controlled-impedance routing (100 ohm differential) with length matching within 150 mils for the TX/RX traces of each channel. Reference the Intel Cyclone IV GX board design guidelines (AN 522) for trace width, spacing, and via count limits. Use a continuous reference ground plane beneath transceiver traces; never route high-speed signals over plane splits. Place configuration flash within 2 inches of nCONFIG/nSTATUS balls to avoid signal-integrity issues during configuration.
Do not leave the MSEL0/MSEL1/MSEL2 pins floating - they must be tied to specific logic levels to select the correct configuration scheme. Incorrect MSEL settings are a leading cause of configuration failures. Ensure the configuration flash (e.g., EPCS4/EPCS16) is sized at least 2x the compressed .sof file size to allow dual-boot redundancy. Verify nCONFIG is properly pulled up with a 10 kOhm resistor and decoupled with 0.1 uF for clean reset behavior.
מידע על תאימות
RoHS and REACH compliant per Intel product declaration. Not AEC-Q100 qualified - this part targets industrial rather than automotive-grade applications. Lead-free FBGA balls compatible with standard SAC reflow profiles.
