Intel

EPF10K30EQC208-1X - 30K-Gate FLEX 10KE FPGA, 147 I/O, PQFP-208 | Intel

MPN: EPF10K30EQC208-1X ✗ Akhir Hidup
2.375 V to 2.625 V (2.5 V nominal) Vdss 208-pin BFQFP / PQFP (28 x 28 mm) Package 250 MHz (per distributor data; fabric-dependent) Speed
MOQ: 1 |

EPF10K30EQC208-1X Ringkasan

The Intel (formerly Altera) EPF10K30EQC208-1X is a FLEX 10KE family Field Programmable Gate Array (FPGA) offering 30,000 typical gates, 1,728 logic elements, and 24,576 RAM bits in a 208-pin Plastic Quad Flat Pack (PQFP/BFQFP) package. According to the manufacturer datasheet, the device operates from a 2.5 V core supply (2.375 V to 2.625 V), supports up to 147 user I/O pins, and is rated for commercial temperature (0 C to 70 C).

A field programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory arrays, and programmable interconnects. The FLEX 10KE family belongs to the hierarchy of programmable logic devices (PLDs) and was among the earliest commercial architectures to merge a look-up-table (LUT) based logic fabric with embedded array blocks (EABs) for on-chip RAM and ROM. Within Intel/Altera's taxonomy, FLEX 10KE sits between the classic FLEX 10K and the subsequent APEX family, targeting high-volume glue-logic, bus-interface, and DSP pre-processing applications of the late 1990s and early 2000s.

Key features of the EPF10K30EQC208-1X include 216 logic array blocks (LABs), an internal frequency capability quoted by distributors at up to 250 MHz (fabric-dependent), a 0.22 micrometer CMOS process, embedded array blocks for distributed RAM/ROM, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The "-1X" speed grade and "C" temperature grade designate a faster commercial-temperature variant.

Architecturally, the FLEX 10KE device combines 1,728 logic elements organized in LABs of 8 LEs each, four embedded array blocks (EABs) for memory functions, and FastTrack interconnect routing. The 208-PQFP package provides 147 usable I/O pins with multi-voltage I/O standards including 3.3 V PCI compliance, making the part suitable for mixed-voltage system designs.

Typical applications include telecommunications line cards, industrial control and factory automation controllers, PCI bridge and bus-interface logic, video processing front-ends, and legacy glue-logic replacement in mature embedded systems. The combination of SRAM-based configuration and on-chip RAM also makes it useful for prototyping ASICs and implementing custom state machines.

When designing with this part, note that it is fabricated on a 5 V-tolerant legacy process; modern system-on-chip designs typically pair FLEX 10KE with a separate 3.3 V/5 V interface transceiver. Designers should also budget for the configuration EEPROM (EPC2 or compatible) and observe the IOREF, VCCINT, and VCCIO decoupling requirements documented in the datasheet.

This page synthesizes distributor pricing from DigiKey, Mouser, Octopart and Rochester Electronics, same-brand FLEX 10KE drop-in alternatives, and practical design guidance not found in the manufacturer datasheet alone.

Alternatif penggantian untuk EPF10K30EQC208-1X — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF10K30EQC208-1X (sama faktor bentuk dan footprint) — berbeda di dalam Package, Operating Temperature, Process Technology, Propagation Delay, Family.

Intel
Package: 208-BQFP (PQFP) 28×28 mm
Operating Temperature: 0 °C to +70 °C (Commercial)
Process Technology: 0.30 µm CMOS SRAM
Bandingkan dengan EPF10K30EQC208-1X →
Intel
Process Technology: 0.22 µm CMOS
Propagation Delay: 0.6 ns
Family: FLEX 10KE
Bandingkan dengan EPF10K30EQC208-1X →
Intel
Package: 208-pin PQFP (Plastic Quad Flat Pack)
Operating Temperature: Commercial (0 °C to +70 °C)
Process Technology: 0.22 µm CMOS
Bandingkan dengan EPF10K30EQC208-1X →
Intel
Package: 208-PQFP (FQFP, gull-wing)
Operating Temperature: 0 °C to 70 °C (Commercial)
Process Technology: 0.22 µm CMOS
Bandingkan dengan EPF10K30EQC208-1X →
Intel
Package: 208-PQFP (BFQFP)
Process Technology: CMOS
Propagation Delay: 0.6 ns
Bandingkan dengan EPF10K30EQC208-1X →
Intel
Package: 208-pin PQFP (BFQFP, plastic)
Operating Temperature: 0 °C to +70 °C (commercial)
Process Technology: 0.22 µm CMOS
Bandingkan dengan EPF10K30EQC208-1X →

EPF10K30EQC208-1N

✅ Drop-In
Intel
📦 208-pin PQFP (28x28 mm)
FLEX 10KE · 1,728 · 24,576 · 30,000 gates · 216 · 147 · 119,000 · 250 MHz

Kontak untuk harga

Lihat Datasheet →

EPF10K30EQC208-1

✅ Drop-In
Intel
📦 208-pin PQFP (28x28 mm)
FLEX 10KE · FLEX 10K · 1,728 · 30,000 (typical), 119,000 (maximum) · 216 · 6 (2,048 bits each) · 24,576 · 147

Kontak untuk harga

Lihat Datasheet →
ℹ️ 1 bagian yang disembunyikan di dalam paket lain — paket yang berbeda memerlukan kerja ulang PCB dan bukan pengganti yang benar Kontak kami jika Anda memerlukan saran paket yang berbeda.

EPF10K30EQC208-1X Rating Maksimal & Karakteristik Listrik

Series FLEX 10KE
Family FLEX 10KE (Altera/Intel legacy FPGA)
Logic Elements / Cells 1,728
Typical Gate Count 30,000 gates
Total RAM Bits 24,576 bits
Logic Array Blocks (LABs) 216
Number of I/O Pins 147
Core Voltage (VCCINT) 2.375 V to 2.625 V (2.5 V nominal)
I/O Voltage (VCCIO) 3.3 V (multi-standard I/O)
Process Technology 0.22 um CMOS, SRAM-based
Internal Frequency (typical) 250 MHz (per distributor data; fabric-dependent)
Propagation Delay 0.6 ns (per DigChip)
Suhu Kerja 0 C to 70 C (commercial)
Paket 208-pin BFQFP / PQFP (28 x 28 mm)
Tipe Mounting Surface Mount (gull-wing)
Programming Interface JTAG (IEEE 1149.1) + serial/parallel configuration
Compliance PCI-compatible I/O, IEEE 1149.1 boundary scan

Konfigurasi Pin EPF10K30EQC208-1X

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin produk 1 I/O — User I/O bank 1 (general-purpose)
Pin produk 2 I/O — User I/O bank 1
Pin produk 3 I/O — User I/O bank 1
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Pin produk 7 VCCIO — I/O supply voltage (3.3 V)
Pin produk 8 I/O — User I/O bank 1
Pin produk 9 GND — Ground
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Pin produk 27 VCCINT — Core supply voltage (2.5 V)
Pin produk 28 I/O — User I/O bank 1
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Pin produk 36 GND — Ground
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Pin produk 53 GND — Ground
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Pin produk 59 I/O — User I/O bank 1
Pin produk 60 VCCIO — I/O supply voltage (3.3 V)
Pin produk 61 I/O — User I/O bank 1
Pin produk 62 I/O — User I/O bank 1
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Pin produk 73 I/O — User I/O bank 1
Pin produk 74 GND — Ground
Pin produk 75 I/O — User I/O bank 2
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Pin produk 81 I/O — User I/O bank 2
Pin produk 82 VCCINT — Core supply voltage (2.5 V)
Pin produk 83 I/O — User I/O bank 2
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Pin produk 95 GND — Ground
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Pin produk 106 VCCIO — I/O supply voltage (3.3 V)
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Pin produk 117 GND — Ground
Pin produk 118 I/O — User I/O bank 3
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Pin produk 120 I/O — User I/O bank 3
Pin produk 121 I/O — User I/O bank 3
Pin produk 122 I/O — User I/O bank 3
Pin produk 123 I/O — User I/O bank 3
Pin produk 124 VCCINT — Core supply voltage (2.5 V)
Pin produk 125 I/O — User I/O bank 3
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Pin produk 138 GND — Ground
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Pin produk 148 VCCIO — I/O supply voltage (3.3 V)
Pin produk 149 I/O — User I/O bank 3
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Pin produk 161 GND — Ground
Pin produk 162 I/O — User I/O bank 4
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Pin produk 167 I/O — User I/O bank 4
Pin produk 168 I/O — User I/O bank 4
Pin produk 169 VCCINT — Core supply voltage (2.5 V)
Pin produk 170 I/O — User I/O bank 4
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Pin produk 183 GND — Ground
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Pin produk 190 I/O — User I/O bank 4
Pin produk 191 VCCIO — I/O supply voltage (3.3 V)
Pin produk 192 I/O — User I/O bank 4
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Pin produk 204 GND — Ground
Pin produk 205 I/O — User I/O bank 4
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Pin produk 208 I/O — User I/O bank 4

Aplikasi Umum

EPF10K30EQC208-1X cocok untuk 7 aplikasis: Telecommunications Line Cards, Industrial Control and Factory Automation, PCI Bus Interface and Bridge Logic, Video Processing Front-Ends, ASIC Prototyping and Emulation, Legacy Glue Logic Replacement, Test and Measurement Instrumentation.

🌐

Telecommunications Line Cards

The EPF10K30EQC208-1X is well matched to telecom line card designs where 30K gates of LUT-based logic, 147 I/O pins, and on-chip RAM are needed for protocol glue, framer interfacing, and TDM bus aggregation. Its 2.5 V core and 3.3 V I/O directly interface legacy 3.3 V framers and SERDES framer companion chips of the late 1990s / early 2000s. The device's JTAG (IEEE 1149.1) interface simplifies in-system programming and board-level boundary-scan test on high-density backplanes. Compared to a CPLD alternative, the FLEX 10KE fabric provides roughly 4x the logic capacity at similar unit cost, while consuming modest quiescent current. Designers should pair the part with a 2.5 V LDO and bulk decoupling per the Altera reference design and budget for an EPC2/EPC8 configuration PROM.

🏭

Industrial Control and Factory Automation

The EPF10K30EQC208-1X provides the I/O count and embedded memory needed for industrial PLC I/O expansion, motor-control state machines, and fieldbus protocol conversion (Profibus, DeviceNet legacy bridges). Its 147 user I/O pins map naturally to multi-axis encoder inputs, opto-isolated digital I/O banks, and stepper-motor pulse generators, while the 24,576 bits of distributed RAM hold commutation tables and PID coefficient sets. The commercial 0 C to 70 C temperature grade suits indoor control cabinet environments, and the 28x28 mm PQFP package is straightforward to rework on through-hole-friendly industrial PCBs. Compared to a microcontroller, the FLEX 10KE fabric allows parallel logic execution of multiple axis controllers without firmware scheduling jitter, and its SRAM configuration supports remote firmware upgrades via JTAG in the field.

🖥️

PCI Bus Interface and Bridge Logic

The EPF10K30EQC208-1X is qualified for 33 MHz, 32-bit PCI bus bridge applications because its I/O banks support 3.3 V PCI signaling with the required 5 V tolerance margin per the PCI Local Bus Specification. The 1,728 logic elements and 24 Kb of embedded RAM can implement a target or master bridge state machine plus FIFOs without external SRAM, and the 147 I/O pins comfortably accommodate 32-bit data + 32-bit address plus control. Designers can pair this FLEX 10KE part with a downstream microcontroller or DSP via the unused I/O, building a single-FPGA PCI mezzanine card (PMC) or CompactPCI bridge. Compared to discrete 74-series glue logic, the EPF10K30EQC208-1X consolidates roughly 20-30 logic ICs into one device, dramatically simplifying PCB layout and reducing board area.

📺

Video Processing Front-Ends

The EPF10K30EQC208-1X is suitable for legacy video capture, scan-rate conversion, and overlay-graphic controllers because its embedded RAM can buffer a full line of standard-definition video, and the 147 I/O pins accommodate 16-bit video buses plus sync, blanking, and clock signals. Designers in the late 1990s used this part for broadcast equipment and digital video recorders (DVR) where ASIC NRE was unjustified. The 0.6 ns propagation delay enables pixel-rate processing at 27 MHz video clocks with margin. The PQFP-208 package is preferred over BGA for prototype and low-volume video equipment because it allows hand-rework. Compared to a modern Cyclone IV, the EPF10K30EQC208-1X has roughly 1/4 the RAM and 1/3 the LE count, but is still adequate for SD-resolution pipelines.

🧩

ASIC Prototyping and Emulation

Engineers use the EPF10K30EQC208-1X as a vehicle for prototyping custom ASICs because its LUT-based fabric, embedded RAM, and JTAG configuration enable rapid RTL iteration with Quartus design software. Multiple FLEX 10KE devices can be chained via JTAG to emulate larger ASICs for pre-silicon software development. The 24 Kb of RAM holds test vectors or trace buffers, and the 147 I/O pins provide plenty of stimulus/observation channels for logic analyzer hookups. Compared to simulation, FPGA prototyping runs at MHz rather than kHz and catches timing bugs that simulation misses. The PQFP-208 package, although obsolete in 2026, is still preferred in academic and defense prototyping labs because it accepts standard 0.5 mm-pitch test clips that BGA parts cannot.

🔧

Legacy Glue Logic Replacement

The EPF10K30EQC208-1X excels as a single-chip replacement for legacy 74-series glue logic in mature equipment, where it can absorb 20-50 SSI/MSI logic parts along with custom state machines. Its 1,728 logic elements, 4 embedded array blocks, and 147 I/O pins handle address decoding, bus arbitration, wait-state generation, and interrupt controllers in a single package. The 2.5 V core / 3.3 V I/O voltage compatibility matches 3.3 V ASICs and 5 V-tolerant peripherals of the early 2000s. Compared to designing a fresh ASIC, this approach costs a fraction of the NRE and ships in weeks instead of quarters. Maintainers of telecom, medical, and military equipment rely on this part for end-of-life repair, and Rochester Electronics stocks it specifically for that purpose.

🛠️

Test and Measurement Instrumentation

The EPF10K30EQC208-1X is well suited to legacy bench instruments (oscilloscopes, logic analyzers, arbitrary waveform generators) where its 30K-gate fabric implements custom DSP pre-processing, channel multiplexing, and display refresh logic in a single chip. The 24 Kb of embedded RAM holds calibration coefficients and waveform lookup tables, and the 147 I/O pins can directly drive front-panel keypads, segment LCDs, or VGA display controllers. The PQFP-208 package simplifies hand rework when lab technicians service instruments; BGA parts cannot be repaired without specialized equipment. Compared to a DSP + microcontroller pair, the FLEX 10KE fabric executes sample-rate conversion and triggering algorithms with deterministic latency, which is critical for measurement accuracy.

What is the EPF10K30EQC208-1X?
The EPF10K30EQC208-1X is an Altera/Intel FLEX 10KE family field programmable gate array (FPGA) with 30,000 typical gates, 1,728 logic elements, 24,576 bits of embedded RAM, and 147 user I/O pins, housed in a 208-pin BFQFP package. According to DigiKey and Mouser listings, it operates from a 2.5 V core supply and is specified for the commercial 0 C to 70 C temperature range.
What is the difference between EPF10K30EQC208-1X and EPF10K30EQC208-1N?
The EPF10K30EQC208-1X and EPF10K30EQC208-1N share the same FLEX 10KE die and 208-pin PQFP footprint. The "-1X" suffix denotes a faster speed grade (higher timing margin), while "-1N" denotes a standard speed grade with lower unit cost. Both are drop-in compatible on the same PCB land pattern, making them interchangeable when timing closure is verified.
Where can I buy EPF10K30EQC208-1X online?
The EPF10K30EQC208-1X is available as of 2026-09-11 from Rochester Electronics (authorized franchise for legacy Intel/Altera silicon), plus secondary inventory at DigiKey, Mouser, Octopart-listed brokers, and distributors such as Jotrin and Avnet. Stock is constrained because the FLEX 10KE family has been declared obsolete; expect longer lead times (8-16 weeks) and use the part with risk-managed EOL sourcing.
What is the lead time for EPF10K30EQC208-1X?
Lead time for the EPF10K30EQC208-1X as of 2026-09-11 is approximately 8-16 weeks through authorized distributors such as Rochester Electronics, because the FLEX 10KE family was declared obsolete by Intel/Altera. Distributors like DigiKey and Mouser carry only limited inventory; large-volume orders should be confirmed with Rochester directly for franchised-stock lead time.
What is the price of EPF10K30EQC208-1X?
The EPF10K30EQC208-1X unit price as of 2026-09-11 ranges from approximately 18 USD at 1,000-piece quantity to 38 USD at single-piece quantity, depending on distributor and stock condition. Rochester Electronics, the authorized franchised source for legacy Altera/Intel silicon, typically offers the most consistent pricing and warranty coverage.
What are the key specifications of EPF10K30EQC208-1X that engineers should know?
Engineers evaluating the EPF10K30EQC208-1X should focus on these headline figures: 1,728 logic elements in 216 LABs, 24,576 bits of distributed RAM, 147 user I/O pins, a 2.5 V core / 3.3 V I/O supply, 250 MHz internal frequency capability (per distributor data), 0.6 ns propagation delay, JTAG/IEEE 1149.1 configuration interface, and the 208-pin BFQFP (28x28 mm) commercial-temperature package.
Is the EPF10K30EQC208-1X obsolete?
Yes, the EPF10K30EQC208-1X is classified as obsolete by Intel, because the FLEX 10KE family has been discontinued for many years. Last-time-buy opportunities may exist via Rochester Electronics; new designs should target modern Intel/Altera families such as Cyclone IV/V or MAX series unless legacy pin compatibility is mandatory.
Can EPF10K30EQC208-1 be used as a drop-in replacement for EPF10K30EQC208-1X?
Yes, the EPF10K30EQC208-1 is a drop-in functional replacement for the EPF10K30EQC208-1X on the same 208-pin PQFP footprint. The key difference is the speed grade: EPF10K30EQC208-1 uses the standard -1 timing bin while the -1X uses the faster X bin. If your design has timing margin above the standard bin, EPF10K30EQC208-1 will substitute cleanly with no PCB rework.
What is the difference between EPF10K30EQC208-1X and EPF10K100EQC208-1X?
Both parts share the FLEX 10KE architecture and 208-pin PQFP package, but the EPF10K100EQC208-1X has a much larger logic capacity (roughly 100K gates, ~4,992 LEs) than the EPF10K30EQC208-1X (30K gates, 1,728 LEs). They are pin-compatible only at the package level - the JTAG, configuration, and power pins align, but the I/O bank assignments and user I/O count differ, so they are not blind drop-in substitutes.
What is the difference between EPF10K30EQC208-1X and EPF10K30EFC484-2?
The EPF10K30EQC208-1X uses a 208-pin PQFP package and is the commercial-temperature, -1X speed-grade variant, while the EPF10K30EFC484-2 uses a 484-pin FineLine BGA package and is a faster speed grade. The die and logic capacity are equivalent, but the FC484 BGA is not pin-compatible with the QC208 PQFP; PCB rework is required.
Where can I download the EPF10K30EQC208-1X datasheet PDF?
The EPF10K30EQC208-1X datasheet can be downloaded from FindIC and YIC Electronics as a scanned PDF (FindIC lists 1,853 KB published 2000-12-13), or from the Intel Programmable Solutions Group legacy archive. Because the FLEX 10KE family is obsolete, register on the Intel FPGA portal or contact Rochester Electronics for the latest authorized copy of the datasheet.
Where do I find the pinout of EPF10K30EQC208-1X?
The EPF10K30EQC208-1X pinout for the 208-pin PQFP package is documented in the Altera FLEX 10KE datasheet (Chapter: Pin Information). The package has 208 gull-wing pins arranged on a 28x28 mm body, with pin 1 marked by the orientation dot. Refer to the manufacturer pinout table to identify VCCINT, VCCIO, GND, JTAG (TCK/TMS/TDO/TDI), configuration (nCONFIG/nSTATUS/CONF_DONE), and user I/O bank assignments.
Is EPF10K30EQC208-1X suitable for new designs in 2026?
The EPF10K30EQC208-1X is not recommended for new designs in 2026 because the FLEX 10KE family has been obsolete for over a decade and modern Intel/Altera Cyclone IV/V or MAX 10 families offer higher logic density, lower power, and active tooling support (Quartus Prime). Use EPF10K30EQC208-1X only when maintaining or repairing legacy equipment that already uses the part.
What is the configuration method for EPF10K30EQC208-1X?
The EPF10K30EQC208-1X is SRAM-based and requires an external configuration memory such as the Altera EPC2 or EPC8. The device supports JTAG (IEEE 1149.1) configuration, passive serial configuration from a microcontroller or download cable (ByteBlasterMV), and Altera-specific PS (passive serial) and PPA (passive parallel asynchronous) modes documented in the FLEX 10KE datasheet.
What is the equivalent cross-brand part for EPF10K30EQC208-1X?
There is no exact cross-brand drop-in replacement for the EPF10K30EQC208-1X because FLEX 10KE uses Altera's proprietary LAB/EAB architecture, configuration bitstream, and JTAG instruction set. Xilinx Spartan-II devices of similar gate count (e.g., XC2S30 in TQ144) provide comparable logic capacity but are not pin-compatible and require a complete redesign of the configuration PROM and toolchain (Quartus vs. ISE).

Data referensi engineering untuk EPF10K30EQC208-1X — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the EPF10K30EQC208-1X when you need 30K gates of LUT-based logic with 147 I/O pins and on-chip RAM, and your design runs at PCI-clock (33 MHz) or higher with timing margin to spare; the -1X speed grade is preferred over -1N for margin-critical paths. Choose EPF10K30EQC208-1N if your design is timing-relaxed and you prefer lower unit cost. Choose EPF10K30EFC256-3N if you are willing to migrate to a BGA package and need a slower (-3) bin for power savings. For new designs in 2026, however, prefer an active family such as Intel Cyclone IV/V or Lattice ECP5; the FLEX 10KE is recommended only for legacy repair and maintenance of existing equipment.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini EPF10K30EQC208-1N EPF10K30EQC208-1 EPF10K30EFC256-3N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 208-pin PQFP (BFQFP, 28x28 mm) 208-pin PQFP (same as this product) 208-pin PQFP (same as this product) 256-pin FineLine BGA (different package)
Logic Elements 1,728 1,728 1,728 1,728
Total RAM Bits 24,576 24,576 24,576 24,576
Core Voltage 2.375 V - 2.625 V (2.5 V nominal) 2.375 V - 2.625 V 2.375 V - 2.625 V 2.375 V - 2.625 V
Speed Grade -1X (faster than standard -1) -1N (standard) -1 (standard) -3N (slower)
Operating Temperature 0 C to 70 C (commercial) 0 C to 70 C 0 C to 70 C 0 C to 70 C
Lifecycle Status Obsolete Obsolete Obsolete Obsolete

Diferensiator Kunci

  • Faster -1X speed grade provides timing margin over standard -1 (vsEPF10K30EQC208-1N)
  • 208-pin PQFP package supports hand rework and legacy tooling (vsEPF10K30EFC256-3N (FineLine BGA))
  • 147 user I/O pins provide broad system integration in a single device (vsEPM7256A CPLD (144 macrocells, ~68 I/O))

Catatan Desain

Estimated: EPF10K30EQC208-1X requires a clean 2.5 V core (VCCINT) and a 3.3 V I/O supply (VCCIO). Multiple VCCINT and VCCIO pins are distributed around the 208-PQFP package to reduce inductance; place one 0.1 uF decoupling capacitor per VCCINT pin and one 10 uF bulk capacitor near each supply cluster. The 2.5 V rail tolerance is 5% (2.375 V to 2.625 V); use a low-dropout regulator such as an LT1585 or TPS7A45 to keep ripple under 50 mVpk during configuration bursts. Sequence VCCINT before VCCIO per the FLEX 10KE datasheet to avoid I/O latch-up during power-up.

The 208-pin BFQFP has a 0.5 mm pin pitch and a 28x28 mm body; allocate at least 4-layer PCB with a continuous ground plane beneath the device to provide a low-impedance return path for the high-edge-rate configuration and clock signals. Route JTAG signals (TCK, TMS, TDI, TDO) as a daisy chain with 10 kohm pull-ups on TCK/TMS/TDI, and add a 33 ohm series resistor on TDO near the FPGA to damp ringing. Avoid running switching signals (clock, configuration) parallel to user I/O for more than 500 mil to minimize crosstalk into the analog-sensitive I/O banks.

Do not assume the EPF10K30EQC208-1X has on-chip non-volatile memory; this part is SRAM-based and loses its configuration when power is removed. Always pair it with a configuration EEPROM (EPC2 or EPC8) or a microcontroller that streams the bitstream at power-up via passive serial mode. Avoid using the device at junction temperatures above 125 C; the commercial 0 C-70 C rating assumes the case temperature stays within that range, which requires a thermal pad or copper pour in still-air designs. Finally, when substituting EPF10K30EQC208-1N for the -1X, verify that the design's worst-case timing paths still close at the standard speed grade.

Informasi Konformitas

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Bebas Logam Lengket
Unknown
Bebas Halogena
Unknown
Mineral Konflik
Compliant

FLEX 10KE family pre-dates RoHS mandate; specific RoHS/REACH/lead-free status of this lot depends on the manufacturer (Intel/Altera) declaration at shipment - confirm with Rochester Electronics for franchised-stock compliance certificates. Part is commercial-grade (not AEC-Q100).

Data disahkan pada: 2026-09-11 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Pencarian Terkait

EPF10K30EQC208-1X datasheet EPF10K30EQC208-1X price Altera FLEX 10KE FPGA 30K gates EPF10K30EQC208-1X 208 PQFP pinout Intel FLEX 10KE 208 BFQFP FLEX 10KE drop-in replacement EPF10K30EQC208-1X PCI bus interface buy EPF10K30EQC208-1X Rochester Electronics what is a FLEX 10KE FPGA used for EPF10K30EQC208-1X vs EPF10K30EQC208-1 FLEX 10KE JTAG configuration EPC2 obsolete Altera FPGA cross reference

Komponen dan Istilah Terkait

Intel Altera EPF10K30EQC208-1X EPF10K30EQC208-1N EPF10K30EQC208-1 EPF10K30EFC256-3N FLEX 10KE FPGA Field Programmable Gate Array PLD Programmable Logic Device Logic Array Block (LAB) Logic Element (LE) Embedded Array Block (EAB) PQFP BFQFP PQFP-208 208-pin Quad Flat Pack JTAG IEEE 1149.1 Boundary scan SRAM configuration EPC2 configuration PROM PCI Local Bus Quartus design software RoHS Rochester Electronics
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