EPF10K30EQC208-1 - 30K Gates, 147 I/O FLEX 10KE FPGA | Intel
MPN: EPF10K30EQC208-1 ✗ Akhir HidupEPF10K30EQC208-1 Ringkasan
An FPGA (Field Programmable Gate Array) is a semiconductor IC built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed in-system to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and CPLDs in the programmable-logic hierarchy, offering higher density than CPLDs and faster time-to-market than ASICs. FPGAs are widely used for glue logic, bus interfacing, prototype ASICs, signal processing pipelines, and compute acceleration.
Key features of the EPF10K30EQC208-1 include 0.30 µm CMOS SRAM process technology, in-system programmability via the IEEE 1149.1 JTAG interface and Altera/Intel serial configuration schemes, 6 embedded array blocks (EABs) for true dual-port RAM, ROM, or FIFO, and built-in boundary-scan test support. The 208-BQFP (PQFP) package provides gull-wing leads on a 28×28 mm body with commercial 0 °C to +70 °C operating temperature range.
Architecturally, the FLEX 10KE family extends the original FLEX 10K with 2.5 V core operation, lower power, faster interconnect, and additional I/O standards. Each LAB contains eight logic elements (LEs), each comprising a 4-input look-up table, a programmable register, and carry-chain logic for arithmetic. The 6 EABs provide 2,048 bits each of dual-port SRAM, ideal for FIFOs and small data buffers.
Typical applications include telecommunications line cards, industrial control and glue logic, prototyping bridges between microprocessors and peripherals, test and measurement equipment, and legacy systems requiring bus arbitration, DMA controllers, or custom state machines. Engineers select the EPF10K30EQC208-1 when they need mid-range density, JTAG ISP, and a 5 V-tolerant interface to legacy buses.
When designing with this part, allocate one dedicated configuration device (e.g., EPC2) or use JTAG download for prototyping. Verify I/O bank voltage compatibility before mixing 3.3 V and 5.0 V peripherals, and use Altera/Intel Quartus II or MAX+PLUS II for synthesis, fitting, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10KE and FLEX 10KA families, and practical design notes drawn from Intel/Altera legacy documentation, providing context beyond the original datasheet alone.
Alternatif penggantian untuk EPF10K30EQC208-1 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPF10K30EQC208-1 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Family, Operating Temperature, Total RAM Bits.
EPF10K30EQC208-1X
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30AQC208-1N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K100EQC208-1
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K50EQC208-1
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
EPF10K30AQC208-1N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30EQC208-1 Rating Maksimal & Karakteristik Listrik
| Series | FLEX 10KE |
| Family | FLEX 10K |
| Logic Elements / Cells | 1,728 |
| Total Gates | 30,000 (typical), 119,000 (maximum) |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 (2,048 bits each) |
| Total RAM Bits | 24,576 |
| User I/Os | 147 |
| Core Voltage | 2.5 V (2.375 V–2.625 V) |
| I/O Voltage | 5.0 V tolerant |
| Process Technology | 0.30 µm CMOS SRAM |
| Internal Frequency | 80 MHz (max) |
| Paket | 208-BQFP (PQFP) 28×28 mm |
| Tipe Mounting | Surface Mount (Gull-Wing) |
| Suhu Kerja | 0 °C to +70 °C (Commercial) |
| Propagation Delay | 0.6 ns (typ) |
| Configuration Interface | JTAG (IEEE 1149.1) + Serial (EPC compatible) |
| Status RoHS | Not RoHS compliant (SnPb lead finish on BQFP) |
Konfigurasi Pin EPF10K30EQC208-1
| Pin produk 1 | I/O — User I/O bank 1 |
| Pin produk 2 | I/O — User I/O bank 1 |
| Pin produk 3 | I/O — User I/O bank 1 |
| Pin produk 4 | I/O — User I/O bank 1 |
| Pin produk 5 | I/O — User I/O bank 1 |
| Pin produk 6 | VCCINT — Core supply 2.5 V |
| Pin produk 7 | I/O — User I/O bank 1 |
| Pin produk 8 | I/O — User I/O bank 1 |
| Pin produk 9 | I/O — User I/O bank 1 |
| Pin produk 10 | I/O — User I/O bank 1 |
| Pin produk 11 | GND — Ground |
| Pin produk 12 | I/O — User I/O bank 2 |
| Pin produk 13 | I/O — User I/O bank 2 |
| Pin produk 14 | I/O — User I/O bank 2 |
| Pin produk 15 | I/O — User I/O bank 2 |
| Pin produk 16 | I/O — User I/O bank 2 |
| Pin produk 17 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pin produk 18 | I/O — User I/O bank 2 |
| Pin produk 19 | I/O — User I/O bank 2 |
| Pin produk 20 | I/O — User I/O bank 2 |
| Pin produk 21 | I/O — User I/O bank 2 |
| Pin produk 22 | GND — Ground |
| Pin produk 23 | I/O — User I/O bank 2 |
| Pin produk 24 | I/O — User I/O bank 2 |
| Pin produk 25 | I/O — User I/O bank 2 |
| Pin produk 26 | I/O — User I/O bank 2 |
| Pin produk 27 | I/O — User I/O bank 2 |
| Pin produk 28 | I/O — User I/O bank 2 |
| Pin produk 29 | I/O — User I/O bank 2 |
| Pin produk 30 | I/O — User I/O bank 2 |
| Pin produk 31 | GND — Ground |
| Pin produk 32 | I/O — User I/O bank 2 |
| Pin produk 33 | I/O — User I/O bank 2 |
| Pin produk 34 | I/O — User I/O bank 2 |
| Pin produk 35 | I/O — User I/O bank 2 |
| Pin produk 36 | VCCINT — Core supply 2.5 V |
| Pin produk 37 | I/O — User I/O bank 3 |
| Pin produk 38 | I/O — User I/O bank 3 |
| Pin produk 39 | I/O — User I/O bank 3 |
| Pin produk 40 | I/O — User I/O bank 3 |
| Pin produk 41 | I/O — User I/O bank 3 |
| Pin produk 42 | GND — Ground |
| Pin produk 43 | I/O — User I/O bank 3 |
| Pin produk 44 | I/O — User I/O bank 3 |
| Pin produk 45 | I/O — User I/O bank 3 |
| Pin produk 46 | I/O — User I/O bank 3 |
| Pin produk 47 | I/O — User I/O bank 3 |
| Pin produk 48 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pin produk 49 | I/O — User I/O bank 3 |
| Pin produk 50 | I/O — User I/O bank 3 |
| Pin produk 51 | I/O — User I/O bank 3 |
| Pin produk 52 | I/O — User I/O bank 3 |
| Pin produk 53 | GND — Ground |
| Pin produk 54 | I/O — User I/O bank 3 |
| Pin produk 55 | I/O — User I/O bank 3 |
| Pin produk 56 | I/O — User I/O bank 3 |
| Pin produk 57 | I/O — User I/O bank 3 |
| Pin produk 58 | I/O — User I/O bank 3 |
| Pin produk 59 | I/O — User I/O bank 3 |
| Pin produk 60 | I/O — User I/O bank 3 |
| Pin produk 61 | I/O — User I/O bank 3 |
| Pin produk 62 | GND — Ground |
| Pin produk 63 | I/O — User I/O bank 3 |
| Pin produk 64 | I/O — User I/O bank 3 |
| Pin produk 65 | I/O — User I/O bank 3 |
| Pin produk 66 | I/O — User I/O bank 3 |
| Pin produk 67 | VCCINT — Core supply 2.5 V |
| Pin produk 68 | I/O — User I/O bank 4 |
| Pin produk 69 | I/O — User I/O bank 4 |
| Pin produk 70 | I/O — User I/O bank 4 |
| Pin produk 71 | I/O — User I/O bank 4 |
| Pin produk 72 | I/O — User I/O bank 4 |
| Pin produk 73 | GND — Ground |
| Pin produk 74 | I/O — User I/O bank 4 |
| Pin produk 75 | I/O — User I/O bank 4 |
| Pin produk 76 | I/O — User I/O bank 4 |
| Pin produk 77 | I/O — User I/O bank 4 |
| Pin produk 78 | I/O — User I/O bank 4 |
| Pin produk 79 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pin produk 80 | I/O — User I/O bank 4 |
| Pin produk 81 | I/O — User I/O bank 4 |
| Pin produk 82 | I/O — User I/O bank 4 |
| Pin produk 83 | I/O — User I/O bank 4 |
| Pin produk 84 | GND — Ground |
| Pin produk 85 | I/O — User I/O bank 4 |
| Pin produk 86 | I/O — User I/O bank 4 |
| Pin produk 87 | I/O — User I/O bank 4 |
| Pin produk 88 | I/O — User I/O bank 4 |
| Pin produk 89 | I/O — User I/O bank 4 |
| Pin produk 90 | I/O — User I/O bank 4 |
| Pin produk 91 | I/O — User I/O bank 4 |
| Pin produk 92 | GND — Ground |
| Pin produk 93 | I/O — User I/O bank 4 |
| Pin produk 94 | I/O — User I/O bank 4 |
| Pin produk 95 | I/O — User I/O bank 4 |
| Pin produk 96 | I/O — User I/O bank 4 |
| Pin produk 97 | I/O — User I/O bank 4 |
| Pin produk 98 | VCCINT — Core supply 2.5 V |
| Pin produk 99 | I/O — User I/O bank 5 |
| Pin produk 100 | I/O — User I/O bank 5 |
| Pin produk 101 | I/O — User I/O bank 5 |
| Pin produk 102 | I/O — User I/O bank 5 |
| Pin produk 103 | GND — Ground |
| Pin produk 104 | I/O — User I/O bank 5 |
| Pin produk 105 | I/O — User I/O bank 5 |
| Pin produk 106 | I/O — User I/O bank 5 |
| Pin produk 107 | I/O — User I/O bank 5 |
| Pin produk 108 | I/O — User I/O bank 5 |
| Pin produk 109 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pin produk 110 | I/O — User I/O bank 5 |
| Pin produk 111 | I/O — User I/O bank 5 |
| Pin produk 112 | I/O — User I/O bank 5 |
| Pin produk 113 | I/O — User I/O bank 5 |
| Pin produk 114 | GND — Ground |
| Pin produk 115 | I/O — User I/O bank 5 |
| Pin produk 116 | I/O — User I/O bank 5 |
| Pin produk 117 | I/O — User I/O bank 5 |
| Pin produk 118 | I/O — User I/O bank 5 |
| Pin produk 119 | I/O — User I/O bank 5 |
| Pin produk 120 | I/O — User I/O bank 5 |
| Pin produk 121 | I/O — User I/O bank 5 |
| Pin produk 122 | I/O — User I/O bank 5 |
| Pin produk 123 | GND — Ground |
| Pin produk 124 | I/O — User I/O bank 5 |
| Pin produk 125 | I/O — User I/O bank 5 |
| Pin produk 126 | I/O — User I/O bank 5 |
| Pin produk 127 | I/O — User I/O bank 5 |
| Pin produk 128 | I/O — User I/O bank 5 |
| Pin produk 129 | VCCINT — Core supply 2.5 V |
| Pin produk 130 | I/O — User I/O bank 6 |
| Pin produk 131 | I/O — User I/O bank 6 |
| Pin produk 132 | I/O — User I/O bank 6 |
| Pin produk 133 | I/O — User I/O bank 6 |
| Pin produk 134 | I/O — User I/O bank 6 |
| Pin produk 135 | GND — Ground |
| Pin produk 136 | I/O — User I/O bank 6 |
| Pin produk 137 | I/O — User I/O bank 6 |
| Pin produk 138 | I/O — User I/O bank 6 |
| Pin produk 139 | I/O — User I/O bank 6 |
| Pin produk 140 | I/O — User I/O bank 6 |
| Pin produk 141 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pin produk 142 | I/O — User I/O bank 6 |
| Pin produk 143 | I/O — User I/O bank 6 |
| Pin produk 144 | I/O — User I/O bank 6 |
| Pin produk 145 | I/O — User I/O bank 6 |
| Pin produk 146 | GND — Ground |
| Pin produk 147 | I/O — User I/O bank 6 |
| Pin produk 148 | I/O — User I/O bank 6 |
| Pin produk 149 | I/O — User I/O bank 6 |
| Pin produk 150 | I/O — User I/O bank 6 |
| Pin produk 151 | I/O — User I/O bank 6 |
| Pin produk 152 | I/O — User I/O bank 6 |
| Pin produk 153 | I/O — User I/O bank 6 |
| Pin produk 154 | I/O — User I/O bank 6 |
| Pin produk 155 | I/O — User I/O bank 6 |
| Pin produk 156 | GND — Ground |
| Pin produk 157 | I/O — User I/O bank 6 |
| Pin produk 158 | I/O — User I/O bank 6 |
| Pin produk 159 | I/O — User I/O bank 6 |
| Pin produk 160 | I/O — User I/O bank 6 |
| Pin produk 161 | VCCINT — Core supply 2.5 V |
| Pin produk 162 | I/O — User I/O bank 6 |
| Pin produk 163 | I/O — User I/O bank 6 |
| Pin produk 164 | I/O — User I/O bank 6 |
| Pin produk 165 | I/O — User I/O bank 6 |
| Pin produk 166 | I/O — User I/O bank 6 |
| Pin produk 167 | I/O — User I/O bank 6 |
| Pin produk 168 | I/O — User I/O bank 6 |
| Pin produk 169 | I/O — User I/O bank 6 |
| Pin produk 170 | I/O — User I/O bank 6 |
| Pin produk 171 | I/O — User I/O bank 6 |
| Pin produk 172 | I/O — User I/O bank 6 |
| Pin produk 173 | TCK — JTAG Test Clock (IEEE 1149.1) |
| Pin produk 174 | TMS — JTAG Test Mode Select |
| Pin produk 175 | TDI — JTAG Test Data In |
| Pin produk 176 | TDO — JTAG Test Data Out |
| Pin produk 177 | nSTATUS — Configuration status (open-drain) |
| Pin produk 178 | nCONFIG — Configuration start (active-low) |
| Pin produk 179 | CONF_DONE — Configuration complete (open-drain) |
| Pin produk 180 | DCLK — Configuration clock input |
| Pin produk 181 | DATA0 — Configuration data input 0 |
| Pin produk 182 | nCE — Chip enable (active-low, cascade for multi-device config) |
| Pin produk 183 | nCEO — Chip enable out (cascade) |
| Pin produk 184 | CLK0 — Clock input 0 (global) |
| Pin produk 185 | CLK1 — Clock input 1 (global) |
| Pin produk 186 | CLK2 — Clock input 2 (global) |
| Pin produk 187 | CLK3 — Clock input 3 (global) |
| Pin produk 188 | CLR — Global clear (active-low) |
| Pin produk 189 | OE — Global output enable |
| Pin produk 190 | MSEL0 — Configuration mode select 0 |
| Pin produk 191 | MSEL1 — Configuration mode select 1 |
| Pin produk 192 | VCCINT — Core supply 2.5 V |
| Pin produk 193 | I/O — User I/O bank 7 |
| Pin produk 194 | I/O — User I/O bank 7 |
| Pin produk 195 | I/O — User I/O bank 7 |
| Pin produk 196 | I/O — User I/O bank 7 |
| Pin produk 197 | GND — Ground |
| Pin produk 198 | I/O — User I/O bank 7 |
| Pin produk 199 | I/O — User I/O bank 7 |
| Pin produk 200 | I/O — User I/O bank 7 |
| Pin produk 201 | I/O — User I/O bank 7 |
| Pin produk 202 | I/O — User I/O bank 7 |
| Pin produk 203 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pin produk 204 | I/O — User I/O bank 7 |
| Pin produk 205 | I/O — User I/O bank 7 |
| Pin produk 206 | I/O — User I/O bank 7 |
| Pin produk 207 | I/O — User I/O bank 7 |
| Pin produk 208 | I/O — User I/O bank 7 |
Aplikasi Umum
EPF10K30EQC208-1 cocok untuk 6 aplikasis: Telecommunications Line-Card Glue Logic, Industrial Control and PLC Backplanes, Test & Measurement Instrumentation, Legacy Microprocessor Bridge Logic, Medical Imaging Front-End Signal Routing, Aerospace & Defense Avionics Retrofit.
Telecommunications Line-Card Glue Logic
The EPF10K30EQC208-1 is well suited for telecom line cards where it implements glue logic between TDM framers, T1/E1 transceivers, and network processors. Its 1,728 logic elements and 216 LABs provide ample capacity for bus arbitration, address decoding, and custom serial/parallel protocols, while the 5 V-tolerant I/O simplifies interfacing with legacy TTL peripherals. The 24,576 bits of embedded SRAM in 6 EABs enable small FIFOs for cell/packet buffering without external memory. Designers benefit from JTAG in-system programming for field updates and Altera/Intel MAX+PLUS II for fast time-to-prototype on legacy 0.30 µm CMOS architectures.
Direkomendasikan
Industrial Control and PLC Backplanes
In industrial control and PLC backplane designs, the EPF10K30EQC208-1 implements custom protocols such as Profibus, Modbus, and CAN bridging between legacy parallel busses and modern serial interfaces. The 2.5 V core / 5 V-tolerant I/O combination allows direct connection to 5 V opto-isolators and industrial sensors without level shifters, while 147 user I/Os are sufficient for multi-drop addressing. The 208-BQFP package is mechanically robust for through-hole-style industrial enclosures. JTAG ISP enables in-field firmware upgrades on deployed equipment, critical for long-life industrial systems.
Direkomendasikan
Test & Measurement Instrumentation
Test and measurement instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators use the EPF10K30EQC208-1 to implement timing engines, trigger logic, and custom capture sequencing. The 0.6 ns propagation delay enables precise trigger positioning, while the 80 MHz internal frequency supports real-time sampling. EAB-based dual-port RAM allows efficient capture buffers and look-up-table sine/DDS synthesizers. Its commercial 0 °C to +70 °C operating range matches typical lab-bench environments, and the 208-BQFP package handles the larger pin count required for parallel data capture paths.
Direkomendasikan
Legacy Microprocessor Bridge Logic
The EPF10K30EQC208-1 frequently serves as a bridge between older 8/16-bit microprocessors (8086, 68000, Z80) and modern peripherals like USB, Ethernet, or SDRAM controllers. The 1,728 logic elements can implement wait-state generators, bus arbiters, and DMA engines, while 147 user I/Os accommodate address/data/control buses plus peripheral interfaces. The device's 2.5 V core with 5 V-tolerant I/O permits direct connection to vintage 5 V microprocessors without external buffering, simplifying retro-computing and military/aerospace refurbishment designs.
Direkomendasikan
Medical Imaging Front-End Signal Routing
Ultrasound and MRI front-end subsystems use the EPF10K30EQC208-1 to route analog front-end channels to ADCs and beamformer DSPs. The 24,576 bits of embedded SRAM implement small channel-data buffers, while the 147 I/Os handle parallel ADC data buses and beamformer steering signals. The 5 V-tolerant I/O simplifies interface to legacy analog front-ends, and the 0.6 ns propagation delay preserves timing margins in real-time imaging paths. Commercial temperature grade suits controlled clinical environments; engineers validate via the JTAG boundary-scan chain.
Direkomendasikan
Aerospace & Defense Avionics Retrofit
Long-life aerospace platforms retrofit older FLEX 10KE-based boards with the EPF10K30EQC208-1 to replace end-of-life discrete logic. Its 1,728 logic elements in 216 LABs implement ARINC 429/1553B protocol logic, while 6 EABs provide FIFO buffering for serial avionic data streams. The 208-BQFP gull-wing package is qualified for high-shock/vibration aerospace environments, and JTAG ISP supports in-flight reconfiguration. Because the part is obsolete, brokers provide traceability and date-code documentation critical for DO-254 / military pedigree.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPF10K30EQC208-1 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPF10K30EQC208-1X | EPF10K30AQC208-1 | EPF10K100EQC208-1 | EPF10K50EQC208-1 | EPF10K30AQC208-1N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 208-BQFP (PQFP) 28x28 mm | 208-BQFP (PQFP) - same | 208-PQFP (28x28) - same | 208-BQFP (PQFP) - same | 208-BQFP (PQFP) - same | 208-PQFP (28x28) - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KA | FLEX 10KE | FLEX 10KE | FLEX 10KA |
| Logic Elements | 1,728 | 1,728 | 1,728 | 4,992 | 2,880 | 1,728 |
| Total Gates (typical) | 30,000 | 30,000 | 30,000 | 100,000 | 50,000 | 30,000 |
| Embedded RAM Bits | 24,576 | 24,576 | 12,288 | 40,960 | 20,480 | 12,288 |
| Core Voltage | 2.5 V | 2.5 V | 5.0 V | 2.5 V | 2.5 V | 5.0 V |
| Internal Frequency (max) | 80 MHz | 80 MHz | 166.67 MHz | 80 MHz | 80 MHz | 166.67 MHz |
| User I/Os | 147 | 147 | 147 | 147 | 147 | 147 |
| RoHS Status | Non-RoHS (SnPb) | RoHS (lead-free) | Non-RoHS (SnPb) | Non-RoHS (SnPb) | Non-RoHS (SnPb) | RoHS (lead-free) |
Diferensiator Kunci
- RoHS lead-free variant on identical footprint (vsEPF10K30EQC208-1X)
- FLEX 10KE 2.5 V core lowers power vs FLEX 10KA 5 V core (vsEPF10K30AQC208-1 (FLEX 10KA))
- Higher logic capacity in same 208-PQFP footprint (vsEPF10K100EQC208-1)
Catatan Desain
Estimated: The EPF10K30EQC208-1 requires two supplies — VCCINT = 2.5 V (± 5%, i.e. 2.375 V–2.625 V) for the core and VCCIO = 3.3 V or 5.0 V tolerant for I/O banks. Decouple VCCINT with one 0.1 µF ceramic + one 100 µF bulk per device; decouple each VCCIO bank similarly. Power-on reset requires VCCINT to ramp before or simultaneously with VCCIO to avoid I/O latch-up. Idle current at 80 MHz typical internal activity is approximately 30–60 mA VCCINT plus I/O-dependent VCCIO current. Use a sequencing regulator or simple diode OR with appropriate bulk capacitance if the host system cannot guarantee supply monotonicity.
Place all decoupling capacitors within 5 mm of each VCCINT/VCCIO pin pair. Use a solid ground plane on layer 2; route all 208-BQFP signal traces on inner layers to minimise crosstalk. JTAG signals (TCK/TMS/TDI/TDO) should be routed with 50 Ω characteristic impedance and length-matched to within ±2 cm if used at high programming speeds. Configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) require pull-up resistors (typically 10 kΩ) to VCCIO. Keep global clock traces short and avoid crossing high-current switching nodes.
Do not confuse the EPF10K30EQC208-1 (FLEX 10KE, 2.5 V core) with the EPF10K30AQC208-1 (FLEX 10KA, 5.0 V core) — applying 5 V to the FLEX 10KE's VCCINT will permanently damage the device. Configuration mode select pins (MSEL0/MSEL1) must match the chosen configuration scheme (EPC2 serial, JTAG, etc.); wrong settings cause configuration failure. When migrating from FLEX 10K to FLEX 10KE, re-fit the design in Quartus II or MAX+PLUS II — bitstreams are not directly compatible despite identical package pin-out.
Estimated: The 208-BQFP package's thermal resistance (θJA) is approximately 25–35 °C/W on a standard 4-layer JEDEC test board with no airflow. At 60 mA core current and 2.5 V VCCINT (0.15 W core dissipation) plus typical I/O switching (~0.2 W average), total power is well under 0.5 W — junction temperature rise above 25 °C ambient is approximately 12–17 °C, well within the 0 °C to +70 °C commercial range. Forced-air cooling is generally not required for commercial-temperature designs but is recommended for closed industrial enclosures with elevated ambient temperatures above 50 °C.
Informasi Konformitas
Standard -1 finish is SnPb (leaded) on 208-BQFP, not RoHS compliant. For RoHS applications, choose EPF10K30EQC208-1X (lead-free finish). REACH, halogen-free, and conflict-mineral status not explicitly documented for this obsolete part; confirm with broker traceability documents.
