EPF10K30EQC208-2 - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel
MPN: EPF10K30EQC208-2 ✗ Akhir HidupEPF10K30EQC208-2 Ringkasan
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement custom digital logic. Within the broader taxonomy, the FLEX 10KE family belongs to the loadable PLD class, sitting between simple CPLDs (Complex Programmable Logic Devices) and high-density SRAM FPGAs; the 10KE series added embedded array blocks (EABs) for efficient memory and arithmetic functions, bridging the gap between glue-logic replacement and full-featured FPGA design.
Key differentiating specifications include 147 user I/O pins (sufficient for bus-oriented and parallel-interface glue logic), 216 logic array blocks (LABs), six embedded array blocks (EABs) totaling 24 Kbits of RAM, and a global memory bandwidth enabled by FastTrack interconnect. The PQFP-208 footprint with 0.5 mm pitch and 30.6 mm × 30.6 mm body is suitable for through-hole-compatible surface-mount assembly where high pin-count legacy compatibility is required.
Architecturally, the FLEX 10KE combines look-up-table (LUT)-based logic elements with row-and-column interconnect, and each LE contains a 4-bit carry chain for fast arithmetic. Embedded array blocks can be configured as synchronous dual-port RAM, ROM, or wide logic functions, making the device suitable for state-machine-heavy designs that also need small memory buffers without an external SRAM.
Typical applications include industrial glue logic replacement, legacy peripheral controllers (ISA, PCI bridges), telecom line-card interface logic, prototyping ASIC replacements, and test-and-measurement front-end controllers. The wide 147-I/O count makes it useful for bus bridging, where many control signals must be remapped between legacy and modern interfaces.
When designing with this part, plan for the 2.5 V core supply with separate VCCIO banks for mixed-voltage I/O; verify JTAG chain termination and in-system programmability support the production programmer you intend to use, and confirm software toolchain compatibility (Quartus II 13.0 or earlier with FLEX 10KE device support).
This page synthesizes distributor pricing, drop-in FLEX 10KE alternatives, and practical design notes that supplement the original Altera/Intel datasheet and reference manuals.
Alternatif penggantian untuk EPF10K30EQC208-2 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPF10K30EQC208-2 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Family, Operating Temperature, Mounting Type.
EPF10K30EQC208-1
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30EQC208-1N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30EQC208-1X
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30EQC208-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30AQC208-2
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EPF10K30AQC208-1N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30EQC208-2 Rating Maksimal & Karakteristik Listrik
| Family | FLEX 10KE |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 (24 Kbits total) |
| Embedded Memory (bits) | 24,576 |
| Maximum User I/O | 147 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Speed Grade | -2 |
| Suhu Kerja | Commercial (0 °C to +70 °C) |
| Paket | 208-pin PQFP (Plastic Quad Flat Pack) |
| Package Dimensions | 30.60 mm × 30.60 mm, 0.50 mm pitch |
| Maximum Internal Frequency | 200 MHz |
| Tipe Mounting | Surface Mount (gull-wing leads) |
| Programmability | SRAM-based, JTAG/ISP |
| Status RoHS | Non-compliant (legacy PQFP package) |
Konfigurasi Pin EPF10K30EQC208-2
| Pin produk 1 | GND — Ground (per datasheet) |
| Pin produk 2 | I/O — User I/O pin (bank 1) |
| Pin produk 3 | I/O — User I/O pin (bank 1) |
| Pin produk 4 | I/O — User I/O pin (bank 1) |
| Pin produk 5 | I/O — User I/O pin (bank 1) |
| Pin produk 6 | I/O — User I/O pin (bank 1) |
| Pin produk 7 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 8 | I/O — User I/O pin (bank 1) |
| Pin produk 9 | I/O — User I/O pin (bank 1) |
| Pin produk 10 | I/O — User I/O pin (bank 1) |
| Pin produk 11 | I/O — User I/O pin (bank 1) |
| Pin produk 12 | GND — Ground (per datasheet) |
| Pin produk 13 | I/O — User I/O pin (bank 1) |
| Pin produk 14 | I/O — User I/O pin (bank 1) |
| Pin produk 15 | TDI — JTAG test data input |
| Pin produk 16 | TMS — JTAG test mode select |
| Pin produk 17 | TCK — JTAG test clock |
| Pin produk 18 | nSTATUS — Configuration status (open-drain) |
| Pin produk 19 | nCONFIG — Configuration control input (active-low) |
| Pin produk 20 | DCLK — Configuration clock |
| Pin produk 21 | DATA0 — Configuration data input |
| Pin produk 22 | nCE — Chip enable (active-low) |
| Pin produk 23 | MSEL0 — Configuration mode select 0 |
| Pin produk 24 | MSEL1 — Configuration mode select 1 |
| Pin produk 25 | VCCIO — I/O supply voltage |
| Pin produk 26 | I/O — User I/O pin (bank 2) |
| Pin produk 27 | I/O — User I/O pin (bank 2) |
| Pin produk 28 | I/O — User I/O pin (bank 2) |
| Pin produk 29 | I/O — User I/O pin (bank 2) |
| Pin produk 30 | I/O — User I/O pin (bank 2) |
| Pin produk 31 | GND — Ground (per datasheet) |
| Pin produk 32 | I/O — User I/O pin (bank 2) |
| Pin produk 33 | I/O — User I/O pin (bank 2) |
| Pin produk 34 | I/O — User I/O pin (bank 2) |
| Pin produk 35 | I/O — User I/O pin (bank 2) |
| Pin produk 36 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 37 | I/O — User I/O pin (bank 2) |
| Pin produk 38 | I/O — User I/O pin (bank 2) |
| Pin produk 39 | I/O — User I/O pin (bank 2) |
| Pin produk 40 | I/O — User I/O pin (bank 2) |
| Pin produk 41 | I/O — User I/O pin (bank 2) |
| Pin produk 42 | GND — Ground (per datasheet) |
| Pin produk 43 | I/O — User I/O pin (bank 2) |
| Pin produk 44 | I/O — User I/O pin (bank 2) |
| Pin produk 45 | I/O — User I/O pin (bank 2) |
| Pin produk 46 | I/O — User I/O pin (bank 2) |
| Pin produk 47 | I/O — User I/O pin (bank 2) |
| Pin produk 48 | I/O — User I/O pin (bank 2) |
| Pin produk 49 | VCCIO — I/O supply voltage |
| Pin produk 50 | I/O — User I/O pin (bank 3) |
| Pin produk 51 | I/O — User I/O pin (bank 3) |
| Pin produk 52 | I/O — User I/O pin (bank 3) |
| Pin produk 53 | GND — Ground (per datasheet) |
| Pin produk 54 | I/O — User I/O pin (bank 3) |
| Pin produk 55 | I/O — User I/O pin (bank 3) |
| Pin produk 56 | I/O — User I/O pin (bank 3) |
| Pin produk 57 | I/O — User I/O pin (bank 3) |
| Pin produk 58 | I/O — User I/O pin (bank 3) |
| Pin produk 59 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 60 | I/O — User I/O pin (bank 3) |
| Pin produk 61 | I/O — User I/O pin (bank 3) |
| Pin produk 62 | I/O — User I/O pin (bank 3) |
| Pin produk 63 | I/O — User I/O pin (bank 3) |
| Pin produk 64 | I/O — User I/O pin (bank 3) |
| Pin produk 65 | GND — Ground (per datasheet) |
| Pin produk 66 | I/O — User I/O pin (bank 3) |
| Pin produk 67 | I/O — User I/O pin (bank 3) |
| Pin produk 68 | I/O — User I/O pin (bank 3) |
| Pin produk 69 | I/O — User I/O pin (bank 3) |
| Pin produk 70 | I/O — User I/O pin (bank 3) |
| Pin produk 71 | I/O — User I/O pin (bank 3) |
| Pin produk 72 | VCCIO — I/O supply voltage |
| Pin produk 73 | I/O — User I/O pin (bank 4) |
| Pin produk 74 | I/O — User I/O pin (bank 4) |
| Pin produk 75 | GND — Ground (per datasheet) |
| Pin produk 76 | I/O — User I/O pin (bank 4) |
| Pin produk 77 | I/O — User I/O pin (bank 4) |
| Pin produk 78 | I/O — User I/O pin (bank 4) |
| Pin produk 79 | I/O — User I/O pin (bank 4) |
| Pin produk 80 | I/O — User I/O pin (bank 4) |
| Pin produk 81 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 82 | I/O — User I/O pin (bank 4) |
| Pin produk 83 | I/O — User I/O pin (bank 4) |
| Pin produk 84 | I/O — User I/O pin (bank 4) |
| Pin produk 85 | I/O — User I/O pin (bank 4) |
| Pin produk 86 | I/O — User I/O pin (bank 4) |
| Pin produk 87 | GND — Ground (per datasheet) |
| Pin produk 88 | I/O — User I/O pin (bank 4) |
| Pin produk 89 | I/O — User I/O pin (bank 4) |
| Pin produk 90 | I/O — User I/O pin (bank 4) |
| Pin produk 91 | I/O — User I/O pin (bank 4) |
| Pin produk 92 | I/O — User I/O pin (bank 4) |
| Pin produk 93 | I/O — User I/O pin (bank 4) |
| Pin produk 94 | I/O — User I/O pin (bank 4) |
| Pin produk 95 | VCCIO — I/O supply voltage |
| Pin produk 96 | I/O — User I/O pin (bank 5) |
| Pin produk 97 | GND — Ground (per datasheet) |
| Pin produk 98 | I/O — User I/O pin (bank 5) |
| Pin produk 99 | I/O — User I/O pin (bank 5) |
| Pin produk 100 | I/O — User I/O pin (bank 5) |
| Pin produk 101 | I/O — User I/O pin (bank 5) |
| Pin produk 102 | I/O — User I/O pin (bank 5) |
| Pin produk 103 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 104 | I/O — User I/O pin (bank 5) |
| Pin produk 105 | I/O — User I/O pin (bank 5) |
| Pin produk 106 | I/O — User I/O pin (bank 5) |
| Pin produk 107 | I/O — User I/O pin (bank 5) |
| Pin produk 108 | I/O — User I/O pin (bank 5) |
| Pin produk 109 | GND — Ground (per datasheet) |
| Pin produk 110 | I/O — User I/O pin (bank 5) |
| Pin produk 111 | I/O — User I/O pin (bank 5) |
| Pin produk 112 | I/O — User I/O pin (bank 5) |
| Pin produk 113 | I/O — User I/O pin (bank 5) |
| Pin produk 114 | I/O — User I/O pin (bank 5) |
| Pin produk 115 | I/O — User I/O pin (bank 5) |
| Pin produk 116 | VCCIO — I/O supply voltage |
| Pin produk 117 | I/O — User I/O pin (bank 6) |
| Pin produk 118 | I/O — User I/O pin (bank 6) |
| Pin produk 119 | GND — Ground (per datasheet) |
| Pin produk 120 | I/O — User I/O pin (bank 6) |
| Pin produk 121 | I/O — User I/O pin (bank 6) |
| Pin produk 122 | I/O — User I/O pin (bank 6) |
| Pin produk 123 | I/O — User I/O pin (bank 6) |
| Pin produk 124 | I/O — User I/O pin (bank 6) |
| Pin produk 125 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 126 | I/O — User I/O pin (bank 6) |
| Pin produk 127 | I/O — User I/O pin (bank 6) |
| Pin produk 128 | I/O — User I/O pin (bank 6) |
| Pin produk 129 | I/O — User I/O pin (bank 6) |
| Pin produk 130 | I/O — User I/O pin (bank 6) |
| Pin produk 131 | GND — Ground (per datasheet) |
| Pin produk 132 | I/O — User I/O pin (bank 6) |
| Pin produk 133 | I/O — User I/O pin (bank 6) |
| Pin produk 134 | I/O — User I/O pin (bank 6) |
| Pin produk 135 | I/O — User I/O pin (bank 6) |
| Pin produk 136 | I/O — User I/O pin (bank 6) |
| Pin produk 137 | I/O — User I/O pin (bank 6) |
| Pin produk 138 | I/O — User I/O pin (bank 6) |
| Pin produk 139 | VCCIO — I/O supply voltage |
| Pin produk 140 | I/O — User I/O pin (bank 7) |
| Pin produk 141 | GND — Ground (per datasheet) |
| Pin produk 142 | I/O — User I/O pin (bank 7) |
| Pin produk 143 | I/O — User I/O pin (bank 7) |
| Pin produk 144 | I/O — User I/O pin (bank 7) |
| Pin produk 145 | I/O — User I/O pin (bank 7) |
| Pin produk 146 | I/O — User I/O pin (bank 7) |
| Pin produk 147 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 148 | I/O — User I/O pin (bank 7) |
| Pin produk 149 | I/O — User I/O pin (bank 7) |
| Pin produk 150 | I/O — User I/O pin (bank 7) |
| Pin produk 151 | I/O — User I/O pin (bank 7) |
| Pin produk 152 | I/O — User I/O pin (bank 7) |
| Pin produk 153 | GND — Ground (per datasheet) |
| Pin produk 154 | I/O — User I/O pin (bank 7) |
| Pin produk 155 | I/O — User I/O pin (bank 7) |
| Pin produk 156 | I/O — User I/O pin (bank 7) |
| Pin produk 157 | I/O — User I/O pin (bank 7) |
| Pin produk 158 | I/O — User I/O pin (bank 7) |
| Pin produk 159 | I/O — User I/O pin (bank 7) |
| Pin produk 160 | I/O — User I/O pin (bank 7) |
| Pin produk 161 | VCCIO — I/O supply voltage |
| Pin produk 162 | I/O — User I/O pin (bank 8) |
| Pin produk 163 | I/O — User I/O pin (bank 8) |
| Pin produk 164 | GND — Ground (per datasheet) |
| Pin produk 165 | I/O — User I/O pin (bank 8) |
| Pin produk 166 | I/O — User I/O pin (bank 8) |
| Pin produk 167 | I/O — User I/O pin (bank 8) |
| Pin produk 168 | I/O — User I/O pin (bank 8) |
| Pin produk 169 | I/O — User I/O pin (bank 8) |
| Pin produk 170 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 171 | I/O — User I/O pin (bank 8) |
| Pin produk 172 | I/O — User I/O pin (bank 8) |
| Pin produk 173 | I/O — User I/O pin (bank 8) |
| Pin produk 174 | I/O — User I/O pin (bank 8) |
| Pin produk 175 | I/O — User I/O pin (bank 8) |
| Pin produk 176 | GND — Ground (per datasheet) |
| Pin produk 177 | I/O — User I/O pin (bank 8) |
| Pin produk 178 | I/O — User I/O pin (bank 8) |
| Pin produk 179 | I/O — User I/O pin (bank 8) |
| Pin produk 180 | I/O — User I/O pin (bank 8) |
| Pin produk 181 | I/O — User I/O pin (bank 8) |
| Pin produk 182 | I/O — User I/O pin (bank 8) |
| Pin produk 183 | I/O — User I/O pin (bank 8) |
| Pin produk 184 | I/O — User I/O pin (bank 8) |
| Pin produk 185 | VCCIO — I/O supply voltage |
| Pin produk 186 | I/O — User I/O pin (bank 8) |
| Pin produk 187 | GND — Ground (per datasheet) |
| Pin produk 188 | I/O — User I/O pin (bank 8) |
| Pin produk 189 | I/O — User I/O pin (bank 8) |
| Pin produk 190 | I/O — User I/O pin (bank 8) |
| Pin produk 191 | I/O — User I/O pin (bank 8) |
| Pin produk 192 | I/O — User I/O pin (bank 8) |
| Pin produk 193 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 194 | I/O — User I/O pin (bank 8) |
| Pin produk 195 | I/O — User I/O pin (bank 8) |
| Pin produk 196 | I/O — User I/O pin (bank 8) |
| Pin produk 197 | I/O — User I/O pin (bank 8) |
| Pin produk 198 | I/O — User I/O pin (bank 8) |
| Pin produk 199 | GND — Ground (per datasheet) |
| Pin produk 200 | I/O — User I/O pin (bank 8) |
| Pin produk 201 | I/O — User I/O pin (bank 8) |
| Pin produk 202 | I/O — User I/O pin (bank 8) |
| Pin produk 203 | I/O — User I/O pin (bank 8) |
| Pin produk 204 | I/O — User I/O pin (bank 8) |
| Pin produk 205 | I/O — User I/O pin (bank 8) |
| Pin produk 206 | I/O — User I/O pin (bank 8) |
| Pin produk 207 | TDO — JTAG test data output |
| Pin produk 208 | DEV_CLRn — Device clear (active-low, optional) |
Aplikasi Umum
EPF10K30EQC208-2 cocok untuk 6 aplikasis: Industrial Glue Logic Replacement, Legacy Peripheral Bus Bridge, Telecom Line-Card Interface Logic, ASIC Replacement Prototyping, Test & Measurement Front-End Controller, Avionics Legacy Retrofit.
Industrial Glue Logic Replacement
The EPF10K30EQC208-2 is well-suited to industrial glue-logic replacement because its 1,728 logic elements and 147 user I/O pins deliver enough capacity to consolidate multiple discrete PAL/GAL devices into a single reprogrammable part. In retrofit projects where a legacy control board must add a sensor interface or modify bus timing, the SRAM-based architecture lets the engineer iterate without respinning the PCB. The 2.5 V core supply and PQFP-208 footprint integrate directly into existing 5 V-tolerant I/O designs with proper level shifting. Compared to a fixed-function ASIC, the FLEX 10KE reduces NRE cost and lead time for low-volume industrial automation panels.
Direkomendasikan
Legacy Peripheral Bus Bridge
With 147 user I/O pins and 216 LABs, the EPF10K30EQC208-2 can implement a complete ISA-to-PCI or parallel-port-to-LPC bridge on a single chip. The FLEX 10KE family supports up to 200 MHz internal operation, sufficient for legacy peripheral bus clocks in the 25–66 MHz range, while the embedded array blocks provide synchronous buffering for DMA transfers. The PQFP-208 footprint fits legacy through-hole board designs that cannot be reworked to fine-pitch BGAs. Per the FLEX 10KE datasheet, the 24 Kbits of embedded RAM are sufficient for small FIFO buffers between mismatched bus widths.
Direkomendasikan
Telecom Line-Card Interface Logic
The EPF10K30EQC208-2 is commonly deployed in telecom line cards for T1/E1 framing, HDLC controllers, and time-slot interchangers where deterministic logic and moderate memory depth are required. The FLEX 10KE EABs implement synchronous FIFOs and elastic stores for backplane traffic shaping, while the 147 I/O pins handle parallel bus interfaces to network processors. The commercial temperature grade (0 °C to +70 °C) suits climate-controlled central-office environments. Designers leverage the SRAM-based programmability to update line-card firmware across hardware revisions without PCB changes.
Direkomendasikan
ASIC Replacement Prototyping
The EPF10K30EQC208-2 serves as a prototyping vehicle for ASIC designs in the 10K–30K-gate density range, allowing functional verification before committing to mask costs. The FLEX 10KE pinout, JTAG chain, and Quartus II 13.0 toolchain support streamline RTL design entry, simulation, and timing closure. Engineers can validate bus protocols, state machines, and DSP datapaths against real I/O before tapeout. Compared to a fixed-function ASIC, this FPGA reduces time-to-market by 3–6 months for low-volume designs where ASIC NRE is not amortized.
Direkomendasikan
Test & Measurement Front-End Controller
In test and measurement equipment, the EPF10K30EQC208-2 sequences relays, generates trigger pulses, and counts events on parallel buses thanks to its 200 MHz internal performance and 147 programmable I/O. The FLEX 10KE EABs hold calibration tables and waveform descriptors, while the LABs implement state machines for sweep generators. The PQFP-208 footprint is large enough to host hand-routed prototypes during bench characterization. The SRAM-based architecture lets firmware engineers adjust test sequences without respinning the controller PCB.
Direkomendasikan
Avionics Legacy Retrofit
Although commercial-grade, the EPF10K30EQC208-2 is also used in retrofitting legacy avionics subsystems where existing harness and connector designs dictate PQFP-208 retention. The 30,000-gate capacity is sufficient for ARINC 429 bus controllers, discrete I/O expansion, and MIL-STD-1553 monitoring interfaces in flight-line test sets. Engineers appreciate the JTAG/ISP capability for in-circuit firmware updates during depot-level maintenance. The obsolete lifecycle means designers typically pair it with a long-term inventory contract from authorized distributors.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPF10K30EQC208-2 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPF10K30EQC208-1 | EPF10K30EQC208-1N | EPF10K30EQC208-2N | EPF10K30AQC208-2 | EPF10K30AQC208-1N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 208-PQFP (30.6×30.6 mm) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Family | FLEX 10KE | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KA | FLEX 10KA |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Embedded Memory (bits) | 24,576 (EAB-based) | 24,576 (EAB-based) | 24,576 (EAB-based) | 24,576 (EAB-based) | Distributed RAM only (no EAB) | Distributed RAM only (no EAB) |
| Maximum User I/O | 147 | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | -2 (faster) | -1 (slower) | -1 (slower) | -2 (faster) | -2 | -1 |
| RoHS / Lead-Free | Non-RoHS (SnPb) | Non-RoHS (SnPb) | Pb-free (RoHS) | Pb-free (RoHS) | Non-RoHS (SnPb) | Pb-free (RoHS) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferensiator Kunci
- Only FLEX 10KE family option at -2 speed grade in the 208-PQFP footprint (vsEPF10K30EQC208-1)
- Includes EAB-based synchronous embedded memory (vsEPF10K30AQC208-2 (FLEX 10KA family))
- Compatible with Quartus II 13.0 (last FLEX 10KE-supported release) (vsNewer Cyclone II/III families)
Catatan Desain
Estimated: at 200 MHz toggle activity across 50% of LEs (approximately 864 LEs active) with 3.3 V VCCIO, the EPF10K30EQC208-2 can draw up to 0.5 A from VCCINT (2.5 V) and 0.3 A from VCCIO, giving roughly 2.25 W total dissipation. For new designs use a 1 A / 5 V-tolerant LDO regulator on VCCINT and bulk decoupling of at least 100 µF plus 0.1 µF ceramic per VCCINT/VCCIO pin pair. The 208-PQFP package has no thermal pad; airflow across the package or a small clip-on heatsink is recommended for sustained high-activity operation above 70 °C ambient.
Route all VCCINT (2.5 V) and VCCIO (3.3 V or 5 V tolerant) power pins to planes rather than traces; the 208-PQFP lead inductance of the gull-wing leads (about 1 nH each) creates significant switching noise if power is delivered through traces. Place 0.1 µF X7R ceramic decoupling within 5 mm of every VCCINT/VCCIO pin, plus a 10 µF tantalum bulk capacitor per voltage rail. JTAG signals (TCK, TMS, TDI, TDO) should be series-terminated with 33 Ω resistors and length-matched to within 50 mil to avoid boundary-scan failures at higher TCK frequencies.
Do not assume any FLEX 10KE variant is RoHS compliant - the trailing '-N' suffix is required for Pb-free terminal finish. Mixing Pb-free -2N parts with SnPb -2 parts on the same board violates the higher-temperature reflow profile required by Pb-free finishes. Also note that the configuration device must match the FPGA density: EPC2LC20 supports FLEX 10KE up to 30K gates; larger densities require EPC4 or EPC8. Finally, the MSEL pins select configuration mode (AS, AP, PS, JTAG) and must be pulled to VCCINT or GND with 4.7 kΩ resistors - leaving them floating causes configuration failures.
Informasi Konformitas
Original EPF10K30EQC208-2 is SnPb terminal finish (non-RoHS); RoHS-compliant variants use the trailing '-N' suffix (EPF10K30EQC208-2N). Not AEC-Q100 qualified. Halogen-free status not stated in available datasheet excerpts. REACH compliance assumed per Intel product environmental program; conflict-minerals declaration available from Intel.