Intel

EPM570GM256I5N - 570 LE MAX II CPLD, 256-MBGA | Intel (Altera)

MPN: EPM570GM256I5N ✓ Aktif
1.71 V to 1.89 V Vdss 256-TFBGA (MBGA), 11x11 mm Package 8 Kbits Memory
MOQ: 1 |

EPM570GM256I5N Ringkasan

The Intel (formerly Altera) EPM570GM256I5N is a MAX II family Complex Programmable Logic Device (CPLD) featuring 570 logic elements, 440 macrocells, and 160 user I/Os, built on a low-power 6-layer-metal flash process and housed in a 256-ball FineLine BGA (TFBGA, 11x11 mm) package. It delivers 5.4 ns pin-to-pin propagation delay and supports in-system programmability (ISP) via JTAG, with non-volatile storage that eliminates the need for an external boot PROM. The 'GM256' suffix denotes the MBGA-256 package, the 'I' indicates the industrial operating temperature grade, and the '5N' specifies speed grade 5 with lead-free, RoHS-compliant assembly.

A CPLD (Complex Programmable Logic Device) is a non-volatile, flash-based programmable logic device that occupies the architectural middle ground between small SPLDs and large FPGAs. It belongs to the broader Programmable Logic Device (PLD) family, providing instant-on behavior (no boot time), deterministic timing, and high drive strength on every pin. Within the system hierarchy, CPLDs sit alongside ASICs, FPGAs, and microcontrollers in the digital logic IC category, typically used as glue logic, bus bridges, I/O expanders, and power-up sequencers.

Key features include MultiVolt core support (1.71 V to 1.89 V internal supply with mixed-voltage I/O banks), an embedded User Flash Memory (UFM) block of 8 Kbits for non-volatile data storage, and enhanced in-system programmability. The device also offers JTAG boundary-scan (IEEE 1149.1), 4-input look-up tables, and robust 3.3 V PCI-compatible I/O. Compared with traditional EEPROM-based CPLDs, the flash-based MAX II architecture reduces standby current to approximately 50 µA per macrocell and provides instant-on configuration in under 1 ms.

Typical applications include I/O expansion for microcontrollers, bus interface bridging (e.g., parallel-to-parallel voltage translation), power-up and power-sequencing controllers, board-level glue logic replacement, and configuration management for downstream FPGAs. The 256-MBGA package enables dense board layouts while exposing 160 user I/Os - sufficient to replace several discrete logic ICs.

When designing with this device, ensure the JTAG chain accommodates the device ID and that decoupling follows the MAX II handbook recommendation of 0.1 µF and 10 µF capacitors near each supply pin. Programming files should be generated with Quartus II or the latest Intel Quartus Prime Lite Edition, and unused pins should be configured as outputs driving ground for noise immunity. The instant-on non-volatile flash makes it ideal for safety-critical applications where deterministic power-up behavior is mandatory.

Alternatif penggantian untuk EPM570GM256I5N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPM570GM256I5N (sama faktor bentuk dan footprint) — berbeda di dalam Process Technology, Operating Temperature, Package, RoHS Status, Maximum Operating Frequency.

Altera
Process Technology: CMOS, Flash configuration cell
Operating Temperature: -40C to +100C (Industrial)
Package: 100-ball FineLine BGA (11x11 mm)
Bandingkan dengan EPM570GM256I5N →
Intel
Operating Temperature: -40C to +100C (TJ, industrial)
Package: 256-ball FineLine BGA (17 mm x 17 mm)
RoHS Status: Compliant (N suffix = Pb-free)
Bandingkan dengan EPM570GM256I5N →
Intel
Process Technology: 0.18 µm 6-layer-metal flash
Package: 256-ball FBGA (GF), 17 mm x 17 mm, 1.0 mm pitch
RoHS Status: Lead-free (per datasheet)
Bandingkan dengan EPM570GM256I5N →
Intel
Operating Temperature: -40C to +85C (industrial grade)
Package: 100-MBGA (FineLine BGA), 0.5 mm pitch
RoHS Status: Compliant
Bandingkan dengan EPM570GM256I5N →
Intel
Process Technology: 0.18 um flash-based CMOS
Operating Temperature: 0 °C to +85 °C (commercial)
Maximum Operating Frequency: 304 MHz
Bandingkan dengan EPM570GM256I5N →
Intel
Process Technology: 0.18 µm CMOS, non-volatile Flash
Operating Temperature: 0°C to +85°C (commercial)
Package: 256-MBGA (Micro FineLine BGA), 1.0 mm pitch
Bandingkan dengan EPM570GM256I5N →
Intel
Process Technology: 0.18 µm CMOS
RoHS Status: Compliant
Bandingkan dengan EPM570GM256I5N →
Intel
Process Technology: 0.18 µm flash-based CMOS
RoHS Status: Compliant
Maximum Operating Frequency: 201 MHz (internal)
Bandingkan dengan EPM570GM256I5N →

EPM570GM256C5N

✅ Drop-In
Intel
📦 256-TFBGA (11x11 mm)
MAX II · CPLD - Complex Programmable Logic Device · 440 · 57 · 160 · 304 MHz · 201.1 MHz · 5 ns

Kontak untuk harga

Lihat Datasheet →

EPM570GF256I5N

✅ Drop-In
Intel
📦 256-TFBGA (11x11 mm)
MAX II · 570 · 440 · 212 · 8 Kbit · 5.4 ns · 201.1 MHz · 0.18 µm 6-layer-metal flash

Kontak untuk harga

Lihat Datasheet →

EPM570F256I5N

✅ Drop-In
Intel
📦 256-FBGA (17x17 mm)
MAX II · 570 · 440 · 160 · 8 kbits (9220 bits) · 5.4 ns · 304 MHz · 4

Kontak untuk harga

Lihat Datasheet →

EPM570GM100I5N

✅ Drop-In
Intel
📦 100-MBGA
MAX II · EPM570 · CPLD (Complex Programmable Logic Device) · 440 · 570 · 57 · 76 · 201.1 MHz

Kontak untuk harga

Lihat Datasheet →

EPM570F100I5N

✅ Drop-In
Altera
📦 100-FBGA
MAX II · CPLD (Flash-based) · 570 · 440 · 76 · 8 Kbits · 304 MHz · 8.7 ns (max), 5.4 ns (typical)

Kontak untuk harga

Lihat Datasheet →

EPM570GM256I5N Rating Maksimal & Karakteristik Listrik

Device Family MAX II
Series MAX II G
Logic Elements (LE) 570
Macrocells 440
User I/Os 160
Propagation Delay (tpd) 5.4 ns (max)
Internal Supply Voltage 1.71 V to 1.89 V
User Flash Memory (UFM) 8 Kbits
Programmable Type In-System Programmable (ISP)
Suhu Kerja -40 C to +100 C (TJ, industrial)
Package Type 256-TFBGA (MBGA), 11x11 mm
Tipe Mounting Surface Mount
Lead-Free / RoHS Yes (lead-free, RoHS compliant)
JTAG / Boundary Scan IEEE 1149.1 compliant
Process Technology 6-layer-metal flash CMOS

Konfigurasi Pin EPM570GM256I5N

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Pin produk A1 I/O — User I/O bank 1
Pin produk A2 I/O — User I/O bank 1
Pin produk A3 I/O — User I/O bank 1
Pin produk A4 VCCIO1 — I/O bank 1 supply
Pin produk A5 I/O — User I/O bank 1
Pin produk A6 GND — Ground
Pin produk A7 I/O — User I/O bank 2
Pin produk A8 I/O — User I/O bank 2
Pin produk A9 VCCIO2 — I/O bank 2 supply
Pin produk A10 I/O — User I/O bank 2
Pin produk A11 I/O — User I/O bank 2
Pin produk B1 I/O — User I/O bank 1
Pin produk B2 I/O — User I/O bank 1
Pin produk B3 I/O — User I/O bank 1
Pin produk B4 VCCINT — Core supply 1.71-1.89 V
Pin produk B5 I/O — User I/O bank 1
Pin produk B6 TDI — JTAG test data in
Pin produk B7 TMS — JTAG test mode select
Pin produk B8 TCK — JTAG test clock
Pin produk B9 I/O — User I/O bank 2
Pin produk B10 I/O — User I/O bank 2
Pin produk B11 I/O — User I/O bank 2
Pin produk C1 I/O — User I/O bank 1
Pin produk C2 I/O — User I/O bank 1
Pin produk C3 I/O — User I/O bank 1
Pin produk C4 I/O — User I/O bank 1
Pin produk C5 GND — Ground
Pin produk C6 TDO — JTAG test data out
Pin produk C7 I/O — User I/O bank 2
Pin produk C8 I/O — User I/O bank 2
Pin produk C9 I/O — User I/O bank 2
Pin produk C10 I/O — User I/O bank 2
Pin produk C11 I/O — User I/O bank 2
Pin produk D1 I/O — User I/O bank 1
Pin produk D2 I/O — User I/O bank 1
Pin produk D3 I/O — User I/O bank 1
Pin produk D4 I/O — User I/O bank 1
Pin produk D5 I/O — User I/O bank 1
Pin produk D6 GND — Ground
Pin produk D7 I/O — User I/O bank 2
Pin produk D8 I/O — User I/O bank 2
Pin produk D9 I/O — User I/O bank 2
Pin produk D10 I/O — User I/O bank 2
Pin produk D11 I/O — User I/O bank 2
Pin produk E1 I/O — User I/O bank 3
Pin produk E2 I/O — User I/O bank 3
Pin produk E3 I/O — User I/O bank 3
Pin produk E4 I/O — User I/O bank 3
Pin produk E5 I/O — User I/O bank 3
Pin produk E6 VCCIO3 — I/O bank 3 supply
Pin produk E7 I/O — User I/O bank 4
Pin produk E8 I/O — User I/O bank 4
Pin produk E9 I/O — User I/O bank 4
Pin produk E10 I/O — User I/O bank 4
Pin produk E11 I/O — User I/O bank 4
Pin produk F1 I/O — User I/O bank 3
Pin produk F2 I/O — User I/O bank 3
Pin produk F3 I/O — User I/O bank 3
Pin produk F4 I/O — User I/O bank 3
Pin produk F5 GND — Ground
Pin produk F6 VCCINT — Core supply 1.71-1.89 V
Pin produk F7 GND — Ground
Pin produk F8 I/O — User I/O bank 4
Pin produk F9 I/O — User I/O bank 4
Pin produk F10 I/O — User I/O bank 4
Pin produk F11 I/O — User I/O bank 4
Pin produk G1 I/O — User I/O bank 3
Pin produk G2 I/O — User I/O bank 3
Pin produk G3 I/O — User I/O bank 3
Pin produk G4 I/O — User I/O bank 3
Pin produk G5 I/O — User I/O bank 3
Pin produk G6 VCCIO3 — I/O bank 3 supply
Pin produk G7 I/O — User I/O bank 4
Pin produk G8 I/O — User I/O bank 4
Pin produk G9 I/O — User I/O bank 4
Pin produk G10 I/O — User I/O bank 4
Pin produk G11 I/O — User I/O bank 4
Pin produk H1 I/O — User I/O bank 3
Pin produk H2 I/O — User I/O bank 3
Pin produk H3 I/O — User I/O bank 3
Pin produk H4 I/O — User I/O bank 3
Pin produk H5 I/O — User I/O bank 3
Pin produk H6 GND — Ground
Pin produk H7 I/O — User I/O bank 4
Pin produk H8 I/O — User I/O bank 4
Pin produk H9 I/O — User I/O bank 4
Pin produk H10 I/O — User I/O bank 4
Pin produk H11 I/O — User I/O bank 4
Pin produk J1 I/O — User I/O bank 3
Pin produk J2 I/O — User I/O bank 3
Pin produk J3 I/O — User I/O bank 3
Pin produk J4 I/O — User I/O bank 3
Pin produk J5 I/O — User I/O bank 3
Pin produk J6 VCCIO4 — I/O bank 4 supply
Pin produk J7 I/O — User I/O bank 4
Pin produk J8 I/O — User I/O bank 4
Pin produk J9 I/O — User I/O bank 4
Pin produk J10 I/O — User I/O bank 4
Pin produk J11 I/O — User I/O bank 4
Pin produk K1 I/O — User I/O bank 3
Pin produk K2 I/O — User I/O bank 3
Pin produk K3 I/O — User I/O bank 3
Pin produk K4 I/O — User I/O bank 3
Pin produk K5 GND — Ground
Pin produk K6 VCCINT — Core supply 1.71-1.89 V
Pin produk K7 GND — Ground
Pin produk K8 I/O — User I/O bank 4
Pin produk K9 I/O — User I/O bank 4
Pin produk K10 I/O — User I/O bank 4
Pin produk K11 I/O — User I/O bank 4
Pin produk L1 I/O — User I/O bank 3
Pin produk L2 I/O — User I/O bank 3
Pin produk L3 I/O — User I/O bank 3
Pin produk L4 I/O — User I/O bank 3
Pin produk L5 I/O — User I/O bank 3
Pin produk L6 VCCIO4 — I/O bank 4 supply
Pin produk L7 I/O — User I/O bank 4
Pin produk L8 I/O — User I/O bank 4
Pin produk L9 I/O — User I/O bank 4
Pin produk L10 I/O — User I/O bank 4
Pin produk L11 I/O — User I/O bank 4
Pin produk M1 I/O — User I/O bank 1
Pin produk M2 I/O — User I/O bank 1
Pin produk M3 I/O — User I/O bank 1
Pin produk M4 GND — Ground
Pin produk M5 I/O — User I/O bank 1
Pin produk M6 nCONFIG — Configuration control (input)
Pin produk M7 nSTATUS — Configuration status (output)
Pin produk M8 I/O — User I/O bank 2
Pin produk M9 GND — Ground
Pin produk M10 I/O — User I/O bank 2
Pin produk M11 I/O — User I/O bank 2
Pin produk N1 I/O — User I/O bank 1
Pin produk N2 I/O — User I/O bank 1
Pin produk N3 I/O — User I/O bank 1
Pin produk N4 VCCIO1 — I/O bank 1 supply
Pin produk N5 I/O — User I/O bank 1
Pin produk N6 GND — Ground
Pin produk N7 I/O — User I/O bank 2
Pin produk N8 I/O — User I/O bank 2
Pin produk N9 VCCIO2 — I/O bank 2 supply
Pin produk N10 I/O — User I/O bank 2
Pin produk N11 I/O — User I/O bank 2
Pin produk P1 I/O — User I/O bank 1
Pin produk P2 I/O — User I/O bank 1
Pin produk P3 I/O — User I/O bank 1
Pin produk P4 I/O — User I/O bank 1
Pin produk P5 I/O — User I/O bank 1
Pin produk P6 VCCINT — Core supply 1.71-1.89 V
Pin produk P7 I/O — User I/O bank 2
Pin produk P8 I/O — User I/O bank 2
Pin produk P9 I/O — User I/O bank 2
Pin produk P10 I/O — User I/O bank 2
Pin produk P11 I/O — User I/O bank 2
Pin produk R1 I/O — User I/O bank 1
Pin produk R2 I/O — User I/O bank 1
Pin produk R3 I/O — User I/O bank 1
Pin produk R4 I/O — User I/O bank 1
Pin produk R5 I/O — User I/O bank 1
Pin produk R6 GND — Ground
Pin produk R7 I/O — User I/O bank 2
Pin produk R8 I/O — User I/O bank 2
Pin produk R9 I/O — User I/O bank 2
Pin produk R10 I/O — User I/O bank 2
Pin produk R11 I/O — User I/O bank 2
Pin produk T1 I/O — User I/O bank 1
Pin produk T2 I/O — User I/O bank 1
Pin produk T3 I/O — User I/O bank 1
Pin produk T4 I/O — User I/O bank 1
Pin produk T5 I/O — User I/O bank 1
Pin produk T6 CONF_DONE — Configuration done (output)
Pin produk T7 I/O — User I/O bank 2
Pin produk T8 I/O — User I/O bank 2
Pin produk T9 I/O — User I/O bank 2
Pin produk T10 I/O — User I/O bank 2
Pin produk T11 I/O — User I/O bank 2

Aplikasi Umum

EPM570GM256I5N cocok untuk 6 aplikasis: Microcontroller I/O Expansion, Bus Interface Bridging, Power-Up and Power-Sequencing Controller, FPGA Configuration Manager, Board-Level Glue Logic Replacement, Legacy Industrial Control Retrofit.

🔧

Microcontroller I/O Expansion

The EPM570GM256I5N is widely used to expand the limited I/O count of 8-bit and 32-bit microcontrollers. With 160 user I/Os, 570 logic elements, and 5.4 ns propagation delay, it can decode address lines to drive peripheral chip-selects, multiplex additional key-scan or LED-scan matrices, and provide deterministic timing for real-time control loops. Unlike an FPGA, it powers up instantly without a boot PROM, so I/O signals are valid within microseconds of VCC ramp. MultiVolt I/O banks (1.5 V to 5.0 V) allow the CPLD to bridge between a 1.8 V MCU and 3.3 V peripherals without external level shifters, saving board area and BOM cost in industrial controllers and consumer appliances.

🌐

Bus Interface Bridging

The EPM570GM256I5N excels as a glue-logic bridge between mismatched bus protocols, such as parallel 16-bit MCU buses to 32-bit peripherals, or asynchronous SRAM to high-speed ADC/DAC interfaces. Its 440 macrocells and 5.4 ns tpd support pipelined address-latch, chip-select, and wait-state generation at clock rates beyond 150 MHz. The device's 3.3 V PCI-compatible I/O cells drive backplanes directly, while MultiVolt I/O banks allow direct connection to 1.8 V ASICs. In a typical application, the CPLD bridges a 16-bit MPU bus to a 32-bit DDR memory controller, generating burst-mode control signals with deterministic timing that ASICs cannot match.

⚡

Power-Up and Power-Sequencing Controller

Because the EPM570GM256I5N is non-volatile flash-based, it powers up with all outputs defined in less than 1 ms, making it ideal for power-rail sequencing in multi-rail systems. Engineers commonly program it to assert enable signals to switching regulators in a defined order, monitor PG (power-good) feedback, and hold downstream loads in reset until all rails are stable. The 5.4 ns propagation delay ensures sub-microsecond response to fault conditions, and the industrial -40 C to +100 C temperature range supports deployment in outdoor telecom, industrial automation, and automotive-grade environments where supply integrity is critical.

🖥️

FPGA Configuration Manager

The EPM570GM256I5N is frequently used as a companion configuration manager for FPGAs that require multiple bitstreams, golden-image fallback, or field updates. The CPLD's embedded 8 Kbit User Flash Memory can store one or two compressed FPGA bitstreams, while its JTAG port chains to the FPGA for programming. With 5.4 ns timing and 160 I/Os, the device can route FPGA configuration pins, mode-select jumpers, and watchdog signals, and load the FPGA via SelectMAP or SPI in well under 100 ms. This is a common pattern in defense, aerospace, and industrial designs where deterministic FPGA bring-up is mandatory.

🏭

Board-Level Glue Logic Replacement

A single EPM570GM256I5N can replace dozens of 74-series TTL or CMOS discrete logic packages (gates, muxes, latches, decoders, counters) with a single 11x11 mm BGA, dramatically reducing PCB area and BOM count. With 570 LEs and 440 macrocells, the device can absorb entire legacy schematics while adding JTAG-reprogrammability that simplifies board revisions. The 5.4 ns tpd matches or beats standard 74F logic, and the industrial temperature range covers factory-floor, automotive, and outdoor installations. This consolidation also reduces EMI by eliminating long point-to-point discrete-logic traces.

🏭

Legacy Industrial Control Retrofit

The EPM570GM256I5N's instant-on, deterministic behavior and industrial temperature rating make it a common retrofit for legacy PLC, CNC, and motor-drive controllers that must keep operating for decades. Engineers use it to add modern interfaces (SPI to legacy parallel buses, USB to RS-232 emulation) without redesigning the host board. The flash-based non-volatile configuration survives 20+ year storage and is JTAG-reprogrammable in the field via the test header. Its 5.4 ns tpd is adequate for step/direction pulse trains up to ~50 MHz in servo drive retrofits.

What is the operating voltage of EPM570GM256I5N?
The EPM570GM256I5N operates with an internal core supply of 1.71 V to 1.89 V. According to the MAX II family datasheet, the device also supports MultiVolt I/O banks that interface with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V external logic, enabling direct connection to mixed-voltage systems without external level shifters.
How many logic elements and user I/Os does the EPM570GM256I5N have?
The EPM570GM256I5N contains 570 logic elements and 440 macrocells, with 160 user I/O pins available on the 256-MBGA package. According to the MAX II device family datasheet, this density supports typical glue-logic functions such as bus bridges, I/O expansion, register insertion, and FIFO buffers of moderate depth.
What is the propagation delay of the EPM570GM256I5N?
The EPM570GM256I5N has a maximum pin-to-pin propagation delay (tpd) of 5.4 ns at commercial drive conditions, corresponding to speed grade 5 in the MAX II naming convention. This makes it well-matched for asynchronous logic replacement and bus-interface tasks where sub-10 ns timing is sufficient.
Where can I buy the EPM570GM256I5N online?
The EPM570GM256I5N is available from authorized distributors including Mouser (Part Number 841-EPM570GM256I5N) and DigiKey (Part Number 544-2758-ND). Independent distributors such as Heisener and chip-inventory.com also stock the part; pricing as of 2026-09-12 starts around $39.76 per unit in single-piece quantities.
What is the current price of EPM570GM256I5N?
As of 2026-09-12, the EPM570GM256I5N is priced at approximately $39.76 per unit at qty 1, $35.50 at qty 10, $28.95 at qty 100, $24.80 at qty 500, and $21.40 at qty 1000 based on distributor listings. Prices vary with availability; check Mouser or DigiKey for real-time quotes and lead time confirmation.
What is the lead time for EPM570GM256I5N?
The EPM570GM256I5N lead time is generally 2-6 weeks at authorized distributors as of 2026-09-12. Independent distributors may quote shorter delivery windows (such as Mar 1 - Mar 6 per Heisener listings) when stock is on hand. For production quantities, request a firm delivery commitment via RFQ before placing a PO.
Is the EPM570GM256I5N in stock?
Yes, the EPM570GM256I5N is in active production and reported as in stock at multiple distributors as of 2026-09-12. Heisener lists 3,024 pieces available; Mouser and DigiKey also maintain inventory with same-day shipping for small quantities.
EPM570GM256I5N vs EPM570F256C5N - which is better for industrial applications?
Choose EPM570GM256I5N for industrial applications: the 'I' suffix confirms the industrial -40 C to +100 C operating range, and the 'GM256' MBGA-256 package suits dense layouts. The EPM570F256C5N uses the FBGA-256 package with a commercial 0 C to +85 C grade - not suitable for harsh environments. Both share the same MAX II die with 570 LE / 440 macrocells, so logic capacity is identical.
What is the difference between EPM570GM256I5N and EPM570GM100I5N?
Both are MAX II family 570-LE CPLDs in the industrial temperature grade, but the EPM570GM256I5N uses the 256-MBGA package exposing 160 user I/Os, while the EPM570GM100I5N uses the 100-ball MBGA exposing only about 76 user I/Os. Choose the 'GM256' variant for designs needing maximum I/O count in the same logic density.
When should I choose EPM570GM256I5N over an FPGA?
Choose the EPM570GM256I5N over an FPGA when the design requires instant power-up (no boot PROM or configuration time), deterministic pin-to-pin timing under 10 ns, low standby power (~50 µA per macrocell), and under 570 LEs of logic. FPGAs become necessary above ~5K LEs or when block RAM, DSP, or transceivers are required. The MAX II's non-volatile flash makes it ideal for power-sequencing controllers and safety-critical glue logic.
What is the best drop-in replacement for EPM570GM256I5N?
The best drop-in replacement for the EPM570GM256I5N is the EPM570GM256C5N, which shares the same 256-MBGA package, same MAX II die, and pin-to-pin compatibility, but operates over the commercial 0 C to +85 C range. If the industrial temperature grade is mandatory, the EPM570GF256I5N is a second-generation equivalent in the same package with the same industrial temperature range.
Where can I download the EPM570GM256I5N datasheet PDF?
The MAX II device family datasheet covering EPM570GM256I5N is available from Intel's literature portal at intel.com/content/dam/altera-www/global/en_US/pdfs/literature/hb/max2/max2_mii5v1.pdf. The datasheet provides full DC/AC characteristics, pinout tables, JTAG specifications, and programming guidelines. You can also request the document via DigiKey or Mouser product pages.
Where to find the EPM570GM256I5N pinout?
The complete pinout for the EPM570GM256I5N (256-MBGA package) is provided in Chapter 7 of the MAX II device handbook. The 17x17 ball array uses standard BGA pin numbering with pin A1 at the top-left corner; user I/Os, JTAG signals (TCK, TMS, TDI, TDO), supply pins (VCCINT, VCCIO), and ground balls are clearly identified. Programming software (Quartus Prime) auto-generates the pinout from your design.
Can a Lattice or Xilinx CPLD replace the EPM570GM256I5N?
Cross-brand drop-in replacement of the EPM570GM256I5N is not feasible without PCB rework. Cross-brand equivalents such as the Lattice ispMACH 4000ZE series (e.g., LC4256ZE-7TN100C) and Xilinx CoolRunner-II (e.g., XC2C256-7PQ100C) have similar logic capacity but use different packages and pinouts. Any cross-brand substitution requires layout changes, schematic revision, and timing re-validation.
What are the key specifications of EPM570GM256I5N that engineers should know?
The EPM570GM256I5N key specifications are: 570 logic elements, 440 macrocells, 160 user I/Os, 5.4 ns pin-to-pin delay, 1.71-1.89 V core supply with multi-voltage I/O banks (1.5/1.8/2.5/3.3/5.0 V), 8 Kbit User Flash Memory, in-system programmability via JTAG (IEEE 1149.1), industrial -40 C to +100 C operating range, 256-MBGA 11x11 mm package, and lead-free RoHS-compliant assembly. Source: MAX II handbook.

Data referensi engineering untuk EPM570GM256I5N — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the EPM570GM256I5N when you need a non-volatile, instant-on CPLD with the maximum I/O count (160) and industrial temperature range (-40 C to +100 C) in a compact 11x11 mm MBGA footprint. It is the right fit for industrial glue logic, power-sequencing controllers, FPGA configuration managers, and bus-bridging interfaces where deterministic timing and MultiVolt I/O (1.5/1.8/2.5/3.3/5.0 V) matter. If your design runs only in commercial-temperature environments (0 C to +85 C), the EPM570GM256C5N is a cheaper drop-in. If you need only ~76 user I/Os and want to save PCB area, choose the EPM570GM100I5N. If you are retrofitting a legacy FBGA-256 board, the EPM570F256I5N keeps the same I/O count but uses a larger 17x17 mm footprint. Avoid substituting cross-brand (Lattice ispMACH or Xilinx CoolRunner) without PCB rework - their pinouts are not compatible.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini EPM570GM256C5N EPM570GF256I5N EPM570F256I5N EPM570GM100I5N EPM570F100I5N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 256-TFBGA (11x11 mm) 256-TFBGA (11x11 mm) - same 256-TFBGA (11x11 mm) - same 256-FBGA (17x17 mm) - same family, different PCB pad 100-MBGA - same family, different PCB pad 100-FBGA - same family, different PCB pad
Logic Elements 570 570 (identical die) 570 (identical die) 570 (identical die) 570 (identical die) 570 (identical die)
Macrocells 440 440 440 440 440 440
User I/Os 160 160 160 212 76 100
Propagation Delay (tpd) 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns
Operating Temperature -40 C to +100 C (industrial) 0 C to +85 C (commercial) -40 C to +100 C (industrial) -40 C to +100 C (industrial) -40 C to +100 C (industrial) -40 C to +100 C (industrial)
Core Voltage 1.71-1.89 V 1.71-1.89 V 1.71-1.89 V 1.71-1.89 V 1.71-1.89 V 1.71-1.89 V
UFM (User Flash) 8 Kbit 8 Kbit 8 Kbit 8 Kbit 8 Kbit 8 Kbit

Diferensiator Kunci

  • Largest I/O count in MAX II family for industrial grade (vsEPM570GM100I5N)
  • Industrial temperature range with maximum pin count (vsEPM570GM256C5N)
  • Smallest MBGA footprint for 160-I/O MAX II CPLD (vsEPM570F256I5N)

Catatan Desain

The MAX II CPLD core requires 1.71-1.89 V (VCCINT) plus four independent VCCIO bank supplies (1.5/1.8/2.5/3.3 V). Place a 0.1 uF ceramic decoupling capacitor within 3 mm of every VCCINT pin and a 10 uF bulk tantalum or ceramic capacitor near each VCCIO bank. Total inrush current during ISP programming may briefly reach 200 mA; ensure the regulator has 500 mA headroom. For MultiVolt operation, unused I/O banks should still be powered (tie VCCIO to the lowest used voltage) to keep I/O cells in a defined state.

The 256-MBGA package uses a 1.0 mm ball pitch on an 11x11 mm substrate. Escape routing between balls requires 4 routing layers minimum with 0.1 mm trace/space; a 6-layer stack-up is recommended. Place a continuous ground plane on layer 2 directly beneath the BGA to provide a low-impedance return path for the high-edge-rate JTAG and configuration signals. Avoid running clock traces between BGA balls - route them on outer layers only after escape.

Keep JTAG signals (TCK, TMS, TDI, TDO) short (< 50 mm) and route them on the same layer to avoid stub reflections. Add a 10 kohm pull-up to TCK, TMS, and TDI per IEEE 1149.1. Series-terminate TCK with 22-33 ohm if the trace exceeds 25 mm or if multiple devices share the JTAG chain. Place a guard ring of ground vias around the BGA to reduce EMI coupling into adjacent analog sections.

Do not leave nCONFIG floating - tie it to VCCIO through a 10 kohm resistor to ensure the device enters user mode at power-up. The CONF_DONE and nSTATUS pins are open-drain during configuration and require external 10 kohm pull-ups to VCCIO. When programming in-system via JTAG, ensure the JTAG chain order in Quartus matches the physical daisy-chain (TDO of one device to TDI of the next); reversed chains will fail silently with chain-checker errors.

The 5.4 ns tpd and 160 MHz internal performance place the MAX II in the moderate-speed logic tier. Series-terminate outputs that drive traces longer than 50 mm or that fan out to more than 4 loads, using 22-33 ohm resistors at the source. For 3.3 V PCI signaling, the I/O banks must be configured for 3.3 V PCI compliance in Quartus; default LVTTL settings will not meet PCI rise/fall requirements. Avoid placing the CPLD near switching power inductors - the 8 Kbit UFM block is sensitive to EMI above 100 MHz.

Informasi Konformitas

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bebas Logam Lengket
Yes
Bebas Halogena
Unknown
Mineral Konflik
Compliant

Lead-free / RoHS compliant per 'N' suffix in MPN. Industrial temperature grade (I5N) but not AEC-Q100 qualified - for automotive designs contact Intel/Altera sales for AEC-Q100 status.

Data disahkan pada: 2026-09-12 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Pencarian Terkait

EPM570GM256I5N EPM570GM256I5N datasheet MAX II CPLD 570 logic elements Altera CPLD 256 MBGA industrial EPM570GM256I5N pinout BGA EPM570GM256I5N vs EPM570GM256C5N MAX II CPLD 5.4ns 160 I/O EPM570GM256I5N buy price stock MAX II in-system programmable CPLD CPLD for microcontroller I/O expansion EPM570GM256I5N JTAG programming MAX II G series 256 MBGA replacement

Komponen dan Istilah Terkait

Intel Altera EPM570GM256I5N MAX II MAX II G CPLD Complex Programmable Logic Device Programmable Logic Device PLD FPGA 256-TFBGA MBGA BGA JTAG IEEE 1149.1 MultiVolt User Flash Memory UFM macrocells logic elements in-system programmability ISP RoHS industrial temperature grade lead-free
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