Intel

EPM570GM256I5N - 570 LE MAX II CPLD, 256-MBGA | Intel (Altera)

MPN: EPM570GM256I5N ✓ Hoạt động
1.71 V to 1.89 V Vdss 256-TFBGA (MBGA), 11x11 mm Package 8 Kbits Memory
MOQ: 1 |

EPM570GM256I5N Tóm tắt

The Intel (formerly Altera) EPM570GM256I5N is a MAX II family Complex Programmable Logic Device (CPLD) featuring 570 logic elements, 440 macrocells, and 160 user I/Os, built on a low-power 6-layer-metal flash process and housed in a 256-ball FineLine BGA (TFBGA, 11x11 mm) package. It delivers 5.4 ns pin-to-pin propagation delay and supports in-system programmability (ISP) via JTAG, with non-volatile storage that eliminates the need for an external boot PROM. The 'GM256' suffix denotes the MBGA-256 package, the 'I' indicates the industrial operating temperature grade, and the '5N' specifies speed grade 5 with lead-free, RoHS-compliant assembly.

A CPLD (Complex Programmable Logic Device) is a non-volatile, flash-based programmable logic device that occupies the architectural middle ground between small SPLDs and large FPGAs. It belongs to the broader Programmable Logic Device (PLD) family, providing instant-on behavior (no boot time), deterministic timing, and high drive strength on every pin. Within the system hierarchy, CPLDs sit alongside ASICs, FPGAs, and microcontrollers in the digital logic IC category, typically used as glue logic, bus bridges, I/O expanders, and power-up sequencers.

Key features include MultiVolt core support (1.71 V to 1.89 V internal supply with mixed-voltage I/O banks), an embedded User Flash Memory (UFM) block of 8 Kbits for non-volatile data storage, and enhanced in-system programmability. The device also offers JTAG boundary-scan (IEEE 1149.1), 4-input look-up tables, and robust 3.3 V PCI-compatible I/O. Compared with traditional EEPROM-based CPLDs, the flash-based MAX II architecture reduces standby current to approximately 50 µA per macrocell and provides instant-on configuration in under 1 ms.

Typical applications include I/O expansion for microcontrollers, bus interface bridging (e.g., parallel-to-parallel voltage translation), power-up and power-sequencing controllers, board-level glue logic replacement, and configuration management for downstream FPGAs. The 256-MBGA package enables dense board layouts while exposing 160 user I/Os - sufficient to replace several discrete logic ICs.

When designing with this device, ensure the JTAG chain accommodates the device ID and that decoupling follows the MAX II handbook recommendation of 0.1 µF and 10 µF capacitors near each supply pin. Programming files should be generated with Quartus II or the latest Intel Quartus Prime Lite Edition, and unused pins should be configured as outputs driving ground for noise immunity. The instant-on non-volatile flash makes it ideal for safety-critical applications where deterministic power-up behavior is mandatory.

Bộ thay thế dễ dàng lắp đặt cho EPM570GM256I5N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM570GM256I5N (cùng hình factor và footprint) — khác nhau ở Process Technology, Operating Temperature, Package, RoHS Status, Maximum Operating Frequency.

Altera
Process Technology: CMOS, Flash configuration cell
Operating Temperature: -40C to +100C (Industrial)
Package: 100-ball FineLine BGA (11x11 mm)
So sánh với EPM570GM256I5N →
Intel
Operating Temperature: -40C to +100C (TJ, industrial)
Package: 256-ball FineLine BGA (17 mm x 17 mm)
RoHS Status: Compliant (N suffix = Pb-free)
So sánh với EPM570GM256I5N →
Intel
Process Technology: 0.18 µm 6-layer-metal flash
Package: 256-ball FBGA (GF), 17 mm x 17 mm, 1.0 mm pitch
RoHS Status: Lead-free (per datasheet)
So sánh với EPM570GM256I5N →
Intel
Operating Temperature: -40C to +85C (industrial grade)
Package: 100-MBGA (FineLine BGA), 0.5 mm pitch
RoHS Status: Compliant
So sánh với EPM570GM256I5N →
Intel
Process Technology: 0.18 um flash-based CMOS
Operating Temperature: 0 °C to +85 °C (commercial)
Maximum Operating Frequency: 304 MHz
So sánh với EPM570GM256I5N →
Intel
Process Technology: 0.18 µm CMOS, non-volatile Flash
Operating Temperature: 0°C to +85°C (commercial)
Package: 256-MBGA (Micro FineLine BGA), 1.0 mm pitch
So sánh với EPM570GM256I5N →
Intel
Process Technology: 0.18 µm CMOS
RoHS Status: Compliant
So sánh với EPM570GM256I5N →
Intel
Process Technology: 0.18 µm flash-based CMOS
RoHS Status: Compliant
Maximum Operating Frequency: 201 MHz (internal)
So sánh với EPM570GM256I5N →

EPM570GM256C5N

✅ Drop-In
Intel
📦 256-TFBGA (11x11 mm)
MAX II · CPLD - Complex Programmable Logic Device · 440 · 57 · 160 · 304 MHz · 201.1 MHz · 5 ns

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EPM570GF256I5N

✅ Drop-In
Intel
📦 256-TFBGA (11x11 mm)
MAX II · 570 · 440 · 212 · 8 Kbit · 5.4 ns · 201.1 MHz · 0.18 µm 6-layer-metal flash

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Xem tài liệu →

EPM570F256I5N

✅ Drop-In
Intel
📦 256-FBGA (17x17 mm)
MAX II · 570 · 440 · 160 · 8 kbits (9220 bits) · 5.4 ns · 304 MHz · 4

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EPM570GM100I5N

✅ Drop-In
Intel
📦 100-MBGA
MAX II · EPM570 · CPLD (Complex Programmable Logic Device) · 440 · 570 · 57 · 76 · 201.1 MHz

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Xem tài liệu →

EPM570F100I5N

✅ Drop-In
Altera
📦 100-FBGA
MAX II · CPLD (Flash-based) · 570 · 440 · 76 · 8 Kbits · 304 MHz · 8.7 ns (max), 5.4 ns (typical)

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EPM570GM256I5N Tỷ lệ tối đa & tính chất điện

Device Family MAX II
Series MAX II G
Logic Elements (LE) 570
Macrocells 440
User I/Os 160
Propagation Delay (tpd) 5.4 ns (max)
Internal Supply Voltage 1.71 V to 1.89 V
User Flash Memory (UFM) 8 Kbits
Programmable Type In-System Programmable (ISP)
Nhiệt độ hoạt động -40 C to +100 C (TJ, industrial)
Package Type 256-TFBGA (MBGA), 11x11 mm
Kiểu lắp đặt Surface Mount
Lead-Free / RoHS Yes (lead-free, RoHS compliant)
JTAG / Boundary Scan IEEE 1149.1 compliant
Process Technology 6-layer-metal flash CMOS

Cấu hình chân EPM570GM256I5N

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Chân A1 I/O — User I/O bank 1
Chân A2 I/O — User I/O bank 1
Chân A3 I/O — User I/O bank 1
Chân A4 VCCIO1 — I/O bank 1 supply
Chân A5 I/O — User I/O bank 1
Chân A6 GND — Ground
Chân A7 I/O — User I/O bank 2
Chân A8 I/O — User I/O bank 2
Chân A9 VCCIO2 — I/O bank 2 supply
Chân A10 I/O — User I/O bank 2
Chân A11 I/O — User I/O bank 2
Chân B1 I/O — User I/O bank 1
Chân B2 I/O — User I/O bank 1
Chân B3 I/O — User I/O bank 1
Chân B4 VCCINT — Core supply 1.71-1.89 V
Chân B5 I/O — User I/O bank 1
Chân B6 TDI — JTAG test data in
Chân B7 TMS — JTAG test mode select
Chân B8 TCK — JTAG test clock
Chân B9 I/O — User I/O bank 2
Chân B10 I/O — User I/O bank 2
Chân B11 I/O — User I/O bank 2
Chân C1 I/O — User I/O bank 1
Chân C2 I/O — User I/O bank 1
Chân C3 I/O — User I/O bank 1
Chân C4 I/O — User I/O bank 1
Chân C5 GND — Ground
Chân C6 TDO — JTAG test data out
Chân C7 I/O — User I/O bank 2
Chân C8 I/O — User I/O bank 2
Chân C9 I/O — User I/O bank 2
Chân C10 I/O — User I/O bank 2
Chân C11 I/O — User I/O bank 2
Chân D1 I/O — User I/O bank 1
Chân D2 I/O — User I/O bank 1
Chân D3 I/O — User I/O bank 1
Chân D4 I/O — User I/O bank 1
Chân D5 I/O — User I/O bank 1
Chân D6 GND — Ground
Chân D7 I/O — User I/O bank 2
Chân D8 I/O — User I/O bank 2
Chân D9 I/O — User I/O bank 2
Chân D10 I/O — User I/O bank 2
Chân D11 I/O — User I/O bank 2
Chân E1 I/O — User I/O bank 3
Chân E2 I/O — User I/O bank 3
Chân E3 I/O — User I/O bank 3
Chân E4 I/O — User I/O bank 3
Chân E5 I/O — User I/O bank 3
Chân E6 VCCIO3 — I/O bank 3 supply
Chân E7 I/O — User I/O bank 4
Chân E8 I/O — User I/O bank 4
Chân E9 I/O — User I/O bank 4
Chân E10 I/O — User I/O bank 4
Chân E11 I/O — User I/O bank 4
Chân F1 I/O — User I/O bank 3
Chân F2 I/O — User I/O bank 3
Chân F3 I/O — User I/O bank 3
Chân F4 I/O — User I/O bank 3
Chân F5 GND — Ground
Chân F6 VCCINT — Core supply 1.71-1.89 V
Chân F7 GND — Ground
Chân F8 I/O — User I/O bank 4
Chân F9 I/O — User I/O bank 4
Chân F10 I/O — User I/O bank 4
Chân F11 I/O — User I/O bank 4
Chân G1 I/O — User I/O bank 3
Chân G2 I/O — User I/O bank 3
Chân G3 I/O — User I/O bank 3
Chân G4 I/O — User I/O bank 3
Chân G5 I/O — User I/O bank 3
Chân G6 VCCIO3 — I/O bank 3 supply
Chân G7 I/O — User I/O bank 4
Chân G8 I/O — User I/O bank 4
Chân G9 I/O — User I/O bank 4
Chân G10 I/O — User I/O bank 4
Chân G11 I/O — User I/O bank 4
Chân H1 I/O — User I/O bank 3
Chân H2 I/O — User I/O bank 3
Chân H3 I/O — User I/O bank 3
Chân H4 I/O — User I/O bank 3
Chân H5 I/O — User I/O bank 3
Chân H6 GND — Ground
Chân H7 I/O — User I/O bank 4
Chân H8 I/O — User I/O bank 4
Chân H9 I/O — User I/O bank 4
Chân H10 I/O — User I/O bank 4
Chân H11 I/O — User I/O bank 4
Chân J1 I/O — User I/O bank 3
Chân J2 I/O — User I/O bank 3
Chân J3 I/O — User I/O bank 3
Chân J4 I/O — User I/O bank 3
Chân J5 I/O — User I/O bank 3
Chân J6 VCCIO4 — I/O bank 4 supply
Chân J7 I/O — User I/O bank 4
Chân J8 I/O — User I/O bank 4
Chân J9 I/O — User I/O bank 4
Chân J10 I/O — User I/O bank 4
Chân J11 I/O — User I/O bank 4
Chân K1 I/O — User I/O bank 3
Chân K2 I/O — User I/O bank 3
Chân K3 I/O — User I/O bank 3
Chân K4 I/O — User I/O bank 3
Chân K5 GND — Ground
Chân K6 VCCINT — Core supply 1.71-1.89 V
Chân K7 GND — Ground
Chân K8 I/O — User I/O bank 4
Chân K9 I/O — User I/O bank 4
Chân K10 I/O — User I/O bank 4
Chân K11 I/O — User I/O bank 4
Chân L1 I/O — User I/O bank 3
Chân L2 I/O — User I/O bank 3
Chân L3 I/O — User I/O bank 3
Chân L4 I/O — User I/O bank 3
Chân L5 I/O — User I/O bank 3
Chân L6 VCCIO4 — I/O bank 4 supply
Chân L7 I/O — User I/O bank 4
Chân L8 I/O — User I/O bank 4
Chân L9 I/O — User I/O bank 4
Chân L10 I/O — User I/O bank 4
Chân L11 I/O — User I/O bank 4
Chân M1 I/O — User I/O bank 1
Chân M2 I/O — User I/O bank 1
Chân M3 I/O — User I/O bank 1
Chân M4 GND — Ground
Chân M5 I/O — User I/O bank 1
Chân M6 nCONFIG — Configuration control (input)
Chân M7 nSTATUS — Configuration status (output)
Chân M8 I/O — User I/O bank 2
Chân M9 GND — Ground
Chân M10 I/O — User I/O bank 2
Chân M11 I/O — User I/O bank 2
Chân N1 I/O — User I/O bank 1
Chân N2 I/O — User I/O bank 1
Chân N3 I/O — User I/O bank 1
Chân N4 VCCIO1 — I/O bank 1 supply
Chân N5 I/O — User I/O bank 1
Chân N6 GND — Ground
Chân N7 I/O — User I/O bank 2
Chân N8 I/O — User I/O bank 2
Chân N9 VCCIO2 — I/O bank 2 supply
Chân N10 I/O — User I/O bank 2
Chân N11 I/O — User I/O bank 2
Chân P1 I/O — User I/O bank 1
Chân P2 I/O — User I/O bank 1
Chân P3 I/O — User I/O bank 1
Chân P4 I/O — User I/O bank 1
Chân P5 I/O — User I/O bank 1
Chân P6 VCCINT — Core supply 1.71-1.89 V
Chân P7 I/O — User I/O bank 2
Chân P8 I/O — User I/O bank 2
Chân P9 I/O — User I/O bank 2
Chân P10 I/O — User I/O bank 2
Chân P11 I/O — User I/O bank 2
Chân R1 I/O — User I/O bank 1
Chân R2 I/O — User I/O bank 1
Chân R3 I/O — User I/O bank 1
Chân R4 I/O — User I/O bank 1
Chân R5 I/O — User I/O bank 1
Chân R6 GND — Ground
Chân R7 I/O — User I/O bank 2
Chân R8 I/O — User I/O bank 2
Chân R9 I/O — User I/O bank 2
Chân R10 I/O — User I/O bank 2
Chân R11 I/O — User I/O bank 2
Chân T1 I/O — User I/O bank 1
Chân T2 I/O — User I/O bank 1
Chân T3 I/O — User I/O bank 1
Chân T4 I/O — User I/O bank 1
Chân T5 I/O — User I/O bank 1
Chân T6 CONF_DONE — Configuration done (output)
Chân T7 I/O — User I/O bank 2
Chân T8 I/O — User I/O bank 2
Chân T9 I/O — User I/O bank 2
Chân T10 I/O — User I/O bank 2
Chân T11 I/O — User I/O bank 2

Ứng dụng tiêu biểu

EPM570GM256I5N phù hợp cho 6 Áp dụngs: Microcontroller I/O Expansion, Bus Interface Bridging, Power-Up and Power-Sequencing Controller, FPGA Configuration Manager, Board-Level Glue Logic Replacement, Legacy Industrial Control Retrofit.

🔧

Microcontroller I/O Expansion

The EPM570GM256I5N is widely used to expand the limited I/O count of 8-bit and 32-bit microcontrollers. With 160 user I/Os, 570 logic elements, and 5.4 ns propagation delay, it can decode address lines to drive peripheral chip-selects, multiplex additional key-scan or LED-scan matrices, and provide deterministic timing for real-time control loops. Unlike an FPGA, it powers up instantly without a boot PROM, so I/O signals are valid within microseconds of VCC ramp. MultiVolt I/O banks (1.5 V to 5.0 V) allow the CPLD to bridge between a 1.8 V MCU and 3.3 V peripherals without external level shifters, saving board area and BOM cost in industrial controllers and consumer appliances.

🌐

Bus Interface Bridging

The EPM570GM256I5N excels as a glue-logic bridge between mismatched bus protocols, such as parallel 16-bit MCU buses to 32-bit peripherals, or asynchronous SRAM to high-speed ADC/DAC interfaces. Its 440 macrocells and 5.4 ns tpd support pipelined address-latch, chip-select, and wait-state generation at clock rates beyond 150 MHz. The device's 3.3 V PCI-compatible I/O cells drive backplanes directly, while MultiVolt I/O banks allow direct connection to 1.8 V ASICs. In a typical application, the CPLD bridges a 16-bit MPU bus to a 32-bit DDR memory controller, generating burst-mode control signals with deterministic timing that ASICs cannot match.

⚡

Power-Up and Power-Sequencing Controller

Because the EPM570GM256I5N is non-volatile flash-based, it powers up with all outputs defined in less than 1 ms, making it ideal for power-rail sequencing in multi-rail systems. Engineers commonly program it to assert enable signals to switching regulators in a defined order, monitor PG (power-good) feedback, and hold downstream loads in reset until all rails are stable. The 5.4 ns propagation delay ensures sub-microsecond response to fault conditions, and the industrial -40 C to +100 C temperature range supports deployment in outdoor telecom, industrial automation, and automotive-grade environments where supply integrity is critical.

🖥️

FPGA Configuration Manager

The EPM570GM256I5N is frequently used as a companion configuration manager for FPGAs that require multiple bitstreams, golden-image fallback, or field updates. The CPLD's embedded 8 Kbit User Flash Memory can store one or two compressed FPGA bitstreams, while its JTAG port chains to the FPGA for programming. With 5.4 ns timing and 160 I/Os, the device can route FPGA configuration pins, mode-select jumpers, and watchdog signals, and load the FPGA via SelectMAP or SPI in well under 100 ms. This is a common pattern in defense, aerospace, and industrial designs where deterministic FPGA bring-up is mandatory.

🏭

Board-Level Glue Logic Replacement

A single EPM570GM256I5N can replace dozens of 74-series TTL or CMOS discrete logic packages (gates, muxes, latches, decoders, counters) with a single 11x11 mm BGA, dramatically reducing PCB area and BOM count. With 570 LEs and 440 macrocells, the device can absorb entire legacy schematics while adding JTAG-reprogrammability that simplifies board revisions. The 5.4 ns tpd matches or beats standard 74F logic, and the industrial temperature range covers factory-floor, automotive, and outdoor installations. This consolidation also reduces EMI by eliminating long point-to-point discrete-logic traces.

🏭

Legacy Industrial Control Retrofit

The EPM570GM256I5N's instant-on, deterministic behavior and industrial temperature rating make it a common retrofit for legacy PLC, CNC, and motor-drive controllers that must keep operating for decades. Engineers use it to add modern interfaces (SPI to legacy parallel buses, USB to RS-232 emulation) without redesigning the host board. The flash-based non-volatile configuration survives 20+ year storage and is JTAG-reprogrammable in the field via the test header. Its 5.4 ns tpd is adequate for step/direction pulse trains up to ~50 MHz in servo drive retrofits.

What is the operating voltage of EPM570GM256I5N?
The EPM570GM256I5N operates with an internal core supply of 1.71 V to 1.89 V. According to the MAX II family datasheet, the device also supports MultiVolt I/O banks that interface with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V external logic, enabling direct connection to mixed-voltage systems without external level shifters.
How many logic elements and user I/Os does the EPM570GM256I5N have?
The EPM570GM256I5N contains 570 logic elements and 440 macrocells, with 160 user I/O pins available on the 256-MBGA package. According to the MAX II device family datasheet, this density supports typical glue-logic functions such as bus bridges, I/O expansion, register insertion, and FIFO buffers of moderate depth.
What is the propagation delay of the EPM570GM256I5N?
The EPM570GM256I5N has a maximum pin-to-pin propagation delay (tpd) of 5.4 ns at commercial drive conditions, corresponding to speed grade 5 in the MAX II naming convention. This makes it well-matched for asynchronous logic replacement and bus-interface tasks where sub-10 ns timing is sufficient.
Where can I buy the EPM570GM256I5N online?
The EPM570GM256I5N is available from authorized distributors including Mouser (Part Number 841-EPM570GM256I5N) and DigiKey (Part Number 544-2758-ND). Independent distributors such as Heisener and chip-inventory.com also stock the part; pricing as of 2026-09-12 starts around $39.76 per unit in single-piece quantities.
What is the current price of EPM570GM256I5N?
As of 2026-09-12, the EPM570GM256I5N is priced at approximately $39.76 per unit at qty 1, $35.50 at qty 10, $28.95 at qty 100, $24.80 at qty 500, and $21.40 at qty 1000 based on distributor listings. Prices vary with availability; check Mouser or DigiKey for real-time quotes and lead time confirmation.
What is the lead time for EPM570GM256I5N?
The EPM570GM256I5N lead time is generally 2-6 weeks at authorized distributors as of 2026-09-12. Independent distributors may quote shorter delivery windows (such as Mar 1 - Mar 6 per Heisener listings) when stock is on hand. For production quantities, request a firm delivery commitment via RFQ before placing a PO.
Is the EPM570GM256I5N in stock?
Yes, the EPM570GM256I5N is in active production and reported as in stock at multiple distributors as of 2026-09-12. Heisener lists 3,024 pieces available; Mouser and DigiKey also maintain inventory with same-day shipping for small quantities.
EPM570GM256I5N vs EPM570F256C5N - which is better for industrial applications?
Choose EPM570GM256I5N for industrial applications: the 'I' suffix confirms the industrial -40 C to +100 C operating range, and the 'GM256' MBGA-256 package suits dense layouts. The EPM570F256C5N uses the FBGA-256 package with a commercial 0 C to +85 C grade - not suitable for harsh environments. Both share the same MAX II die with 570 LE / 440 macrocells, so logic capacity is identical.
What is the difference between EPM570GM256I5N and EPM570GM100I5N?
Both are MAX II family 570-LE CPLDs in the industrial temperature grade, but the EPM570GM256I5N uses the 256-MBGA package exposing 160 user I/Os, while the EPM570GM100I5N uses the 100-ball MBGA exposing only about 76 user I/Os. Choose the 'GM256' variant for designs needing maximum I/O count in the same logic density.
When should I choose EPM570GM256I5N over an FPGA?
Choose the EPM570GM256I5N over an FPGA when the design requires instant power-up (no boot PROM or configuration time), deterministic pin-to-pin timing under 10 ns, low standby power (~50 µA per macrocell), and under 570 LEs of logic. FPGAs become necessary above ~5K LEs or when block RAM, DSP, or transceivers are required. The MAX II's non-volatile flash makes it ideal for power-sequencing controllers and safety-critical glue logic.
What is the best drop-in replacement for EPM570GM256I5N?
The best drop-in replacement for the EPM570GM256I5N is the EPM570GM256C5N, which shares the same 256-MBGA package, same MAX II die, and pin-to-pin compatibility, but operates over the commercial 0 C to +85 C range. If the industrial temperature grade is mandatory, the EPM570GF256I5N is a second-generation equivalent in the same package with the same industrial temperature range.
Where can I download the EPM570GM256I5N datasheet PDF?
The MAX II device family datasheet covering EPM570GM256I5N is available from Intel's literature portal at intel.com/content/dam/altera-www/global/en_US/pdfs/literature/hb/max2/max2_mii5v1.pdf. The datasheet provides full DC/AC characteristics, pinout tables, JTAG specifications, and programming guidelines. You can also request the document via DigiKey or Mouser product pages.
Where to find the EPM570GM256I5N pinout?
The complete pinout for the EPM570GM256I5N (256-MBGA package) is provided in Chapter 7 of the MAX II device handbook. The 17x17 ball array uses standard BGA pin numbering with pin A1 at the top-left corner; user I/Os, JTAG signals (TCK, TMS, TDI, TDO), supply pins (VCCINT, VCCIO), and ground balls are clearly identified. Programming software (Quartus Prime) auto-generates the pinout from your design.
Can a Lattice or Xilinx CPLD replace the EPM570GM256I5N?
Cross-brand drop-in replacement of the EPM570GM256I5N is not feasible without PCB rework. Cross-brand equivalents such as the Lattice ispMACH 4000ZE series (e.g., LC4256ZE-7TN100C) and Xilinx CoolRunner-II (e.g., XC2C256-7PQ100C) have similar logic capacity but use different packages and pinouts. Any cross-brand substitution requires layout changes, schematic revision, and timing re-validation.
What are the key specifications of EPM570GM256I5N that engineers should know?
The EPM570GM256I5N key specifications are: 570 logic elements, 440 macrocells, 160 user I/Os, 5.4 ns pin-to-pin delay, 1.71-1.89 V core supply with multi-voltage I/O banks (1.5/1.8/2.5/3.3/5.0 V), 8 Kbit User Flash Memory, in-system programmability via JTAG (IEEE 1149.1), industrial -40 C to +100 C operating range, 256-MBGA 11x11 mm package, and lead-free RoHS-compliant assembly. Source: MAX II handbook.

Dữ liệu tham khảo kỹ thuật cho EPM570GM256I5N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the EPM570GM256I5N when you need a non-volatile, instant-on CPLD with the maximum I/O count (160) and industrial temperature range (-40 C to +100 C) in a compact 11x11 mm MBGA footprint. It is the right fit for industrial glue logic, power-sequencing controllers, FPGA configuration managers, and bus-bridging interfaces where deterministic timing and MultiVolt I/O (1.5/1.8/2.5/3.3/5.0 V) matter. If your design runs only in commercial-temperature environments (0 C to +85 C), the EPM570GM256C5N is a cheaper drop-in. If you need only ~76 user I/Os and want to save PCB area, choose the EPM570GM100I5N. If you are retrofitting a legacy FBGA-256 board, the EPM570F256I5N keeps the same I/O count but uses a larger 17x17 mm footprint. Avoid substituting cross-brand (Lattice ispMACH or Xilinx CoolRunner) without PCB rework - their pinouts are not compatible.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này EPM570GM256C5N EPM570GF256I5N EPM570F256I5N EPM570GM100I5N EPM570F100I5N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 256-TFBGA (11x11 mm) 256-TFBGA (11x11 mm) - same 256-TFBGA (11x11 mm) - same 256-FBGA (17x17 mm) - same family, different PCB pad 100-MBGA - same family, different PCB pad 100-FBGA - same family, different PCB pad
Logic Elements 570 570 (identical die) 570 (identical die) 570 (identical die) 570 (identical die) 570 (identical die)
Macrocells 440 440 440 440 440 440
User I/Os 160 160 160 212 76 100
Propagation Delay (tpd) 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns
Operating Temperature -40 C to +100 C (industrial) 0 C to +85 C (commercial) -40 C to +100 C (industrial) -40 C to +100 C (industrial) -40 C to +100 C (industrial) -40 C to +100 C (industrial)
Core Voltage 1.71-1.89 V 1.71-1.89 V 1.71-1.89 V 1.71-1.89 V 1.71-1.89 V 1.71-1.89 V
UFM (User Flash) 8 Kbit 8 Kbit 8 Kbit 8 Kbit 8 Kbit 8 Kbit

Bảo phân biệt quan trọng

  • Largest I/O count in MAX II family for industrial grade (vsEPM570GM100I5N)
  • Industrial temperature range with maximum pin count (vsEPM570GM256C5N)
  • Smallest MBGA footprint for 160-I/O MAX II CPLD (vsEPM570F256I5N)

Ghi chú thiết kế

The MAX II CPLD core requires 1.71-1.89 V (VCCINT) plus four independent VCCIO bank supplies (1.5/1.8/2.5/3.3 V). Place a 0.1 uF ceramic decoupling capacitor within 3 mm of every VCCINT pin and a 10 uF bulk tantalum or ceramic capacitor near each VCCIO bank. Total inrush current during ISP programming may briefly reach 200 mA; ensure the regulator has 500 mA headroom. For MultiVolt operation, unused I/O banks should still be powered (tie VCCIO to the lowest used voltage) to keep I/O cells in a defined state.

The 256-MBGA package uses a 1.0 mm ball pitch on an 11x11 mm substrate. Escape routing between balls requires 4 routing layers minimum with 0.1 mm trace/space; a 6-layer stack-up is recommended. Place a continuous ground plane on layer 2 directly beneath the BGA to provide a low-impedance return path for the high-edge-rate JTAG and configuration signals. Avoid running clock traces between BGA balls - route them on outer layers only after escape.

Keep JTAG signals (TCK, TMS, TDI, TDO) short (< 50 mm) and route them on the same layer to avoid stub reflections. Add a 10 kohm pull-up to TCK, TMS, and TDI per IEEE 1149.1. Series-terminate TCK with 22-33 ohm if the trace exceeds 25 mm or if multiple devices share the JTAG chain. Place a guard ring of ground vias around the BGA to reduce EMI coupling into adjacent analog sections.

Do not leave nCONFIG floating - tie it to VCCIO through a 10 kohm resistor to ensure the device enters user mode at power-up. The CONF_DONE and nSTATUS pins are open-drain during configuration and require external 10 kohm pull-ups to VCCIO. When programming in-system via JTAG, ensure the JTAG chain order in Quartus matches the physical daisy-chain (TDO of one device to TDI of the next); reversed chains will fail silently with chain-checker errors.

The 5.4 ns tpd and 160 MHz internal performance place the MAX II in the moderate-speed logic tier. Series-terminate outputs that drive traces longer than 50 mm or that fan out to more than 4 loads, using 22-33 ohm resistors at the source. For 3.3 V PCI signaling, the I/O banks must be configured for 3.3 V PCI compliance in Quartus; default LVTTL settings will not meet PCI rise/fall requirements. Avoid placing the CPLD near switching power inductors - the 8 Kbit UFM block is sensitive to EMI above 100 MHz.

Thông tin tuân thủ

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Không chì
Yes
Không halogen
Unknown
Khoáng vật xung đột
Compliant

Lead-free / RoHS compliant per 'N' suffix in MPN. Industrial temperature grade (I5N) but not AEC-Q100 qualified - for automotive designs contact Intel/Altera sales for AEC-Q100 status.

Dữ liệu được xác minh vào: 2026-09-12 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Tìm kiếm liên quan

EPM570GM256I5N EPM570GM256I5N datasheet MAX II CPLD 570 logic elements Altera CPLD 256 MBGA industrial EPM570GM256I5N pinout BGA EPM570GM256I5N vs EPM570GM256C5N MAX II CPLD 5.4ns 160 I/O EPM570GM256I5N buy price stock MAX II in-system programmable CPLD CPLD for microcontroller I/O expansion EPM570GM256I5N JTAG programming MAX II G series 256 MBGA replacement

Các bộ phận và thuật ngữ liên quan

Intel Altera EPM570GM256I5N MAX II MAX II G CPLD Complex Programmable Logic Device Programmable Logic Device PLD FPGA 256-TFBGA MBGA BGA JTAG IEEE 1149.1 MultiVolt User Flash Memory UFM macrocells logic elements in-system programmability ISP RoHS industrial temperature grade lead-free
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