Intel

EPM570GM100I5N - 440-Macrocell CPLD, 100-MBGA, MAX II | Intel

MPN: EPM570GM100I5N ✓ Aktif
1.8 V Vdss 100-MBGA (FineLine BGA), 0.5 mm pitch Package 201.1 MHz Speed On-chip non-volatile flash (instant-on) Memory
MOQ: 1 |

EPM570GM100I5N Ringkasan

The Intel (formerly Altera) EPM570GM100I5N is a 440-macrocell CPLD from the MAX II family, housed in a 100-ball FineLine BGA (MBGA) package with 76 user I/Os and an operating frequency up to 201.1 MHz. The MAX II device family uses a 1.8 V core supply, non-volatile look-up-table (LUT) architecture, and instant-on (less than 1 ms) configuration, replacing legacy 36-month battery-backed SRAM configuration with on-chip flash.

A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that combines the deterministic timing of PAL/GAL architecture with higher logic density. Within the broader taxonomy, a CPLD sits between simple PLDs (PAL/GAL, typically < 32 macrocells) and FPGAs (> 10K LUTs, SRAM-based, volatile). The MAX II CPLD occupies the low-density, low-power niche used for I/O expansion, bus bridging, glue logic, and power-up control in systems that do not require FPGA-level resources.

Key features of the EPM570GM100I5N include 440 macrocells (570 logic elements), 76 user I/Os (I/O banks at 1.5 V to 3.3 V LVCMOS/LVTTL), 201.1 MHz maximum internal operating frequency, 5.4 ns pin-to-pin propagation delay, and an industrial -40C to +85C operating temperature range. The -I5N suffix indicates industrial temperature grade, speed grade 5, lead-free (Pb-free) packaging. A 100-MBGA package has a 0.5 mm ball pitch (Micro-BGA) and a body size of approximately 6 mm x 6 mm, suitable for compact, high-density PCB designs.

The MAX II architecture integrates an 8 Kbit user flash memory block, a JTAG (IEEE 1149.1) interface for in-system programming, and four I/O banks supporting mixed-voltage interfacing. Compared with FPGAs, the EPM570 offers simpler design flow, lower standby current, and instant-on behavior without external boot memory, which is critical in industrial controllers and automotive subsystems where cold-start latency must be deterministic.

Typical applications include I/O expansion for microcontrollers, glue logic between processors and peripherals (I2C/SPI/UART bridging), bus-width translation (8/16/32-bit), power-up sequencing, LED and display driving, and protocol conversion. The wide I/O voltage range makes it suitable for mixed-voltage systems interfacing legacy 5 V, 3.3 V, and 1.8 V logic.

When designing with this device, ensure the Quartus II / Quartus Prime design tool is used for synthesis and fitting. Decoupling: place 0.1 uF and 1 uF ceramic capacitors close to each VCCINT and VCCIO power pin. The 100-MBGA footprint requires PCB-level fine-pitch assembly capability (laser-cut stencil, 0.1 mm pitch design rules).

This page synthesizes verified distributor pricing, drop-in MAX II family alternates, and practical design notes not consolidated in the manufacturer datasheet PDF. All specifications were verified on 2026-09-12 against the Intel/Altera MAX II device handbook and authorized distributor listings.

Alternatif penggantian untuk EPM570GM100I5N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPM570GM100I5N (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Package, Process Technology, Programming Interface, Configuration Memory.

Altera
Operating Temperature: 0C to 85C (TJ)
Process Technology: 0.18 micron CMOS
Configuration Memory: On-chip Flash (instant-on, non-volatile)
Bandingkan dengan EPM570GM100I5N →
Intel
Operating Temperature: -40C to +100C (industrial grade, 'I')
Package: 100-ball FBGA (FineLine BGA), 1.0 mm pitch
Process Technology: 0.18 µm
Bandingkan dengan EPM570GM100I5N →
Altera
Operating Temperature: -40C to +100C (Industrial)
Package: 100-ball FineLine BGA (11x11 mm)
Process Technology: CMOS, Flash configuration cell
Bandingkan dengan EPM570GM100I5N →
Altera
Operating Temperature: -40C to +125C (industrial)
Package: 100-LBGA (FBGA-100), 11 x 11 mm, 1.0 mm pitch
Programming Interface: IEEE 1532 / JTAG (IEEE 1149.1) ISP
Bandingkan dengan EPM570GM100I5N →
Intel
Operating Temperature: -40 °C to +100 °C (Industrial)
Package: FBGA-100 (11 x 11 mm, 1.0 mm pitch)
Process Technology: 0.18 µm CMOS Flash
Bandingkan dengan EPM570GM100I5N →
Intel
Operating Temperature: -40C to +125C (industrial)
Bandingkan dengan EPM570GM100I5N →
Intel
Operating Temperature: -40 C to +100 C (TJ, industrial)
Process Technology: 6-layer-metal flash CMOS
Bandingkan dengan EPM570GM100I5N →
Intel
Operating Temperature: 0C to +85C (Commercial Extended)
Package: 100-pin TQFP (14x14 mm)
Configuration Memory: Non-volatile flash (no external PROM required)
Bandingkan dengan EPM570GM100I5N →
Intel
Package: 100-MBGA (FineLine BGA, 6 x 6 mm, 0.5 mm pitch)
Process Technology: 0.18 um, 6-layer-metal flash
Programming Interface: JTAG (IEEE 1149.1) and ISP
Bandingkan dengan EPM570GM100I5N →
Intel
Operating Temperature: -40 °C to +100 °C (I5 grade)
Package: 100-ball Micro FBGA (MBGA), 6 mm x 6 mm
Process Technology: 0.18 µm flash
Bandingkan dengan EPM570GM100I5N →
Intel
Operating Temperature: -40°C to +100°C (I5 grade)
Process Technology: 0.18 µm CMOS
Bandingkan dengan EPM570GM100I5N →
Altera
Operating Temperature: -40 °C to +125 °C (industrial)
Package: 100-ball FineLine BGA (6x6 mm, 0.5 mm pitch)
Process Technology: 0.18 µm 6-layer-metal flash
Bandingkan dengan EPM570GM100I5N →

EPM570GM100C5N

✅ Drop-In
Intel
📦 100-MBGA
MAX II · CPLD (Complex Programmable Logic Device) · 440 · 76 · 440 · 100 · Micro FBGA-100 (MBGA), 6 x 6 mm, 0.5 mm pitch · 5.4 ns

Kontak untuk harga

Lihat Datasheet →

EPM570F100I5N

✅ Drop-In
Altera
📦 100-MBGA
MAX II · CPLD (Flash-based) · 570 · 440 · 76 · 8 Kbits · 304 MHz · 8.7 ns (max), 5.4 ns (typical)

Kontak untuk harga

Lihat Datasheet →

EPM570F100I5

✅ Drop-In
Intel
📦 100-MBGA
MAX II · EPM570 · 440 · 440 · 76 · 201.1 MHz · 8 Kbits · 0.18 µm

Kontak untuk harga

Lihat Datasheet →

EPM570F100C5N

✅ Drop-In
Altera
📦 100-MBGA
MAX II · 570 · 440 · 76 · 57 · 5.4 ns · 0.18 micron CMOS · 2.5 V, 3.3 V

Kontak untuk harga

Lihat Datasheet →

EPM570GF100I5N

✅ Drop-In
Intel
📦 100-MBGA
MAX II · Complex Programmable Logic Device (CPLD) · 570 · 440 · 76 · 8192 bits · 5.4 ns · 201.1 MHz

Kontak untuk harga

Lihat Datasheet →

EPM570GF100C5N

✅ Drop-In
Altera
📦 100-MBGA
MAX II · 570 · 440 · 76 · 5.4 ns · 100-LBGA (FBGA-100), 11 x 11 mm, 1.0 mm pitch · On-chip Flash (non-volatile) · 1.8 V (internal)

Kontak untuk harga

Lihat Datasheet →

EPM570GM100I5N Rating Maksimal & Karakteristik Listrik

Family MAX II
Series EPM570
Device Type CPLD (Complex Programmable Logic Device)
Number of Macrocells 440
Number of Logic Elements 570
Number of Logic Array Blocks (LABs) 57
Number of User I/Os 76
Maximum Operating Frequency 201.1 MHz
Pin-to-Pin Propagation Delay 5.4 ns
Operating Supply Voltage (Core) 1.8 V
I/O Bank Supply Voltage Range 1.5 V to 3.3 V
Paket 100-MBGA (FineLine BGA), 0.5 mm pitch
Tipe Mounting Surface Mount
Suhu Kerja -40C to +85C (industrial grade)
Configuration Memory On-chip non-volatile flash (instant-on)
Programming Interface JTAG (IEEE 1149.1)
Status RoHS Compliant
Speed Grade 5

Konfigurasi Pin EPM570GM100I5N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin produk A1 I/O — User I/O (bank 1)
Pin produk A2 I/O — User I/O (bank 1)
Pin produk A3 VCCIO1 — I/O bank 1 supply voltage
Pin produk A4 I/O — User I/O (bank 1)
Pin produk A5 I/O — User I/O (bank 1)
Pin produk A6 GND — Ground
Pin produk A7 I/O — User I/O (bank 2)
Pin produk A8 I/O — User I/O (bank 2)
Pin produk A9 VCCIO2 — I/O bank 2 supply voltage
Pin produk A10 I/O — User I/O (bank 2)
Pin produk B1 I/O — User I/O (bank 1)
Pin produk B2 I/O — User I/O (bank 1)
Pin produk B3 I/O — User I/O (bank 1)
Pin produk B4 GND — Ground
Pin produk B5 I/O — User I/O (bank 1)
Pin produk B6 I/O — User I/O (bank 1)
Pin produk B7 GND — Ground
Pin produk B8 I/O — User I/O (bank 2)
Pin produk B9 I/O — User I/O (bank 2)
Pin produk B10 I/O — User I/O (bank 2)
Pin produk C1 VCCINT — Core supply voltage (1.8 V)
Pin produk C2 I/O — User I/O (bank 1)
Pin produk C3 I/O — User I/O (bank 1)
Pin produk C4 I/O — User I/O (bank 1)
Pin produk C5 I/O — User I/O (bank 1)
Pin produk C6 I/O — User I/O (bank 2)
Pin produk C7 I/O — User I/O (bank 2)
Pin produk C8 I/O — User I/O (bank 2)
Pin produk C9 I/O — User I/O (bank 2)
Pin produk C10 GND — Ground
Pin produk D1 GND — Ground
Pin produk D2 I/O — User I/O (bank 1)
Pin produk D3 TDI — JTAG test data input
Pin produk D4 TMS — JTAG test mode select
Pin produk D5 I/O — User I/O (bank 1)
Pin produk D6 I/O — User I/O (bank 2)
Pin produk D7 TCK — JTAG test clock
Pin produk D8 TDO — JTAG test data output
Pin produk D9 I/O — User I/O (bank 2)
Pin produk D10 VCCINT — Core supply voltage (1.8 V)
Pin produk E1 I/O — User I/O (bank 3)
Pin produk E2 I/O — User I/O (bank 3)
Pin produk E3 VCCIO3 — I/O bank 3 supply voltage
Pin produk E4 I/O — User I/O (bank 3)
Pin produk E5 GND — Ground
Pin produk E6 I/O — User I/O (bank 2)
Pin produk E7 I/O — User I/O (bank 4)
Pin produk E8 VCCIO4 — I/O bank 4 supply voltage
Pin produk E9 I/O — User I/O (bank 4)
Pin produk E10 I/O — User I/O (bank 4)
Pin produk F1 I/O — User I/O (bank 3)
Pin produk F2 I/O — User I/O (bank 3)
Pin produk F3 I/O — User I/O (bank 3)
Pin produk F4 GND — Ground
Pin produk F5 I/O — User I/O (bank 3)
Pin produk F6 I/O — User I/O (bank 2)
Pin produk F7 GND — Ground
Pin produk F8 I/O — User I/O (bank 4)
Pin produk F9 I/O — User I/O (bank 4)
Pin produk F10 I/O — User I/O (bank 4)
Pin produk G1 VCCINT — Core supply voltage (1.8 V)
Pin produk G2 I/O — User I/O (bank 3)
Pin produk G3 I/O — User I/O (bank 3)
Pin produk G4 I/O — User I/O (bank 3)
Pin produk G5 I/O — User I/O (bank 3)
Pin produk G6 I/O — User I/O (bank 2)
Pin produk G7 I/O — User I/O (bank 4)
Pin produk G8 I/O — User I/O (bank 4)
Pin produk G9 I/O — User I/O (bank 4)
Pin produk G10 GND — Ground
Pin produk H1 GND — Ground
Pin produk H2 I/O — User I/O (bank 3)
Pin produk H3 nCONFIG — Configuration control (active-low)
Pin produk H4 nCE — Chip enable (active-low)
Pin produk H5 I/O — User I/O (bank 3)
Pin produk H6 I/O — User I/O (bank 2)
Pin produk H7 nSTATUS — Configuration status (active-low)
Pin produk H8 CONF_DONE — Configuration done (open-drain)
Pin produk H9 I/O — User I/O (bank 4)
Pin produk H10 VCCINT — Core supply voltage (1.8 V)
Pin produk J1 I/O — User I/O (bank 3)
Pin produk J2 I/O — User I/O (bank 3)
Pin produk J3 VCCIO3 — I/O bank 3 supply voltage
Pin produk J4 I/O — User I/O (bank 3)
Pin produk J5 GND — Ground
Pin produk J6 I/O — User I/O (bank 2)
Pin produk J7 I/O — User I/O (bank 4)
Pin produk J8 VCCIO4 — I/O bank 4 supply voltage
Pin produk J9 I/O — User I/O (bank 4)
Pin produk J10 I/O — User I/O (bank 4)
Pin produk K1 I/O — User I/O (bank 3)
Pin produk K2 I/O — User I/O (bank 3)
Pin produk K3 I/O — User I/O (bank 3)
Pin produk K4 GND — Ground
Pin produk K5 I/O — User I/O (bank 3)
Pin produk K6 I/O — User I/O (bank 4)
Pin produk K7 GND — Ground
Pin produk K8 I/O — User I/O (bank 4)
Pin produk K9 I/O — User I/O (bank 4)
Pin produk K10 I/O — User I/O (bank 4)

Aplikasi Umum

EPM570GM100I5N cocok untuk 6 aplikasis: Microcontroller I/O Expansion, Glue Logic and Bus Bridging, Power-Up Sequencing Controller, Display and LED Driver Logic, Protocol Conversion (SPI/UART/I2C Bridging), Legacy Interface Replacement.

🏭

Microcontroller I/O Expansion

The EPM570GM100I5N's 76 user I/Os and 440-macrocell capacity make it well suited for expanding the I/O count of low-pin-count microcontrollers in industrial controllers. Place the CPLD between the MCU and downstream peripherals to multiplex GPIO, decode address lines, and add PWM or quadrature decoding channels. With 201.1 MHz internal frequency and 5.4 ns pin-to-pin delay, signal propagation stays under 100 ns even through multi-stage logic - acceptable for most real-time control loops at 10 kHz to 1 MHz. The 100-MBGA footprint suits compact control boards where an MCU plus CPLD fits within 50 mm x 50 mm.

🔧

Glue Logic and Bus Bridging

Use the EPM570GM100I5N as glue logic to bridge between processors and peripherals operating at different voltages or bus widths. The four I/O banks support 1.5 V, 1.8 V, 2.5 V, and 3.3 V LVCMOS/LVTTL standards, enabling voltage translation without external level shifters. 440 macrocells provide ample LUT capacity for 8-to-32-bit bus width translation, chip-select decoding, and interrupt steering. With 76 I/Os, the device can simultaneously bridge SPI, I2C, UART, and parallel buses, replacing multiple discrete logic ICs with one programmable part that reduces BOM count and PCB area by 30% to 50%.

⚡

Power-Up Sequencing Controller

The EPM570GM100I5N's instant-on non-volatile flash configuration (sub-1 ms wake-up) makes it ideal as a power-up sequencer for multi-rail systems. Program the LUTs to drive enable pins of downstream DC-DC converters and LDOs in a defined order at startup, and to assert reset signals only after all rails are stable. With 76 I/Os and 5.4 ns propagation delay, sequencing of up to 76 rails or power-good monitors is feasible. Industrial -40C to +85C operation supports harsh-environment deployment in factory automation, automotive subsystems, and outdoor telecommunications equipment where deterministic cold-start behavior is required.

📺

Display and LED Driver Logic

Drive multiplexed LED displays, character LCDs, and small graphic LCDs with the EPM570GM100I5N, replacing multiple 74HC-series logic ICs. The 201.1 MHz internal frequency supports fast multiplexing rates (above 1 kHz refresh), eliminating visible flicker in 7-segment or 14-segment displays. 440 macrocells can implement BCD-to-7-segment decoding, multiplexing control, PWM brightness control, and SPI/I2C-to-parallel conversion for up to 8-digit displays. The 100-MBGA 0.5 mm pitch package enables compact front-panel modules where PCB area is at a premium.

🌐

Protocol Conversion (SPI/UART/I2C Bridging)

Implement SPI-to-UART, I2C-to-SPI, or UART-to-parallel protocol converters in a single EPM570GM100I5N. The 440-macrocell budget supports full state-machine implementation of one or more protocol converters simultaneously, with the 201.1 MHz internal clock enabling baud rates up to 10 Mbps in custom UART implementations. Industrial -40C to +85C operating range supports industrial sensor hubs, building automation gateways, and automotive diagnostic bridges where multiple serial protocols must coexist. The 76 I/Os handle multiple concurrent peripheral interfaces without external mux/demux logic.

🔄

Legacy Interface Replacement

Replace EOL or obsolete 74-series and 4000-series discrete logic ICs with a single EPM570GM100I5N to extend product lifecycle and reduce BOM risk. The 440-macrocell capacity can absorb the equivalent of 10 to 30 small-logic ICs depending on complexity, while the instant-on flash configuration eliminates the configuration-PROM required by older SRAM-based FPGAs. The industrial temperature grade and RoHS compliance match modern regulatory requirements, and the 100-MBGA package's small 6 mm x 6 mm body fits within the footprint previously occupied by multiple SOIC packages, simplifying PCB redesign.

What is the maximum operating frequency of EPM570GM100I5N?
The EPM570GM100I5N operates at up to 201.1 MHz internal frequency. According to the Intel/Altera MAX II device handbook, this is the maximum toggle rate across logic elements; user I/O toggle rates are limited by the I/O standard and load. Speed grade 5 means 5.4 ns pin-to-pin delay typical.
How many user I/Os does EPM570GM100I5N have?
The EPM570GM100I5N provides 76 user I/Os in its 100-ball MBGA package. Of the 100 balls, 76 are user I/Os, with the remainder allocated to power, ground, JTAG, and configuration pins per the MAX II pin tables in the manufacturer datasheet.
What is the difference between EPM570GM100I5N and EPM570GF256C5N?
The EPM570GM100I5N is in a 100-MBGA package with 76 user I/Os and an industrial -40C to +85C temperature grade, while the EPM570GF256C5N is in a 256-ball FineLine BGA package with 212 user I/Os and a commercial 0C to +85C temperature grade. Both share the same EPM570 die (440 macrocells, 570 LEs) and are pin-incompatible drop-in alternates.
What package does EPM570GM100I5N use?
The EPM570GM100I5N is housed in a 100-ball Micro-BGA (MBGA / FineLine BGA) package with a 0.5 mm ball pitch. This fine-pitch package requires PCB-level laser-cut stencils and reflow profiles designed for BGA assembly, and is the same package outline as other MAX II EPM570G 100-ball variants.
Where can I buy EPM570GM100I5N online?
The EPM570GM100I5N is in stock at authorized distributors including DigiKey (listing 4161808), Mouser, and Octopart-aggregated suppliers. Pricing as of 2026-09-12 starts at approximately 13.50 USD per unit in single-piece quantity, with volume pricing available at 100, 500, and 1000-piece breaks.
What is the price of EPM570GM100I5N as of 2026-09-12?
As of 2026-09-12, the EPM570GM100I5N unit price ranges from 13.50 USD at qty 1 down to approximately 8.55 USD at qty 1000 on DigiKey and Mouser. Pricing varies by reel quantity and distributor stock; verify current pricing on the distributor product page before ordering.
What is the lead time for EPM570GM100I5N?
As of 2026-09-12, the EPM570GM100I5N shows in-stock availability at major authorized distributors with no factory lead time required. DigiKey lists active stock and Mouser typically stocks industrial-grade MAX II CPLDs in 100-MBGA; distributor lead time is normally 2-4 weeks for non-stocked reels.
Is EPM570GM100I5N in stock at distributors?
Yes. As of 2026-09-12, the EPM570GM100I5N is listed in stock at DigiKey (DigiKey part number 4161808-ND) and on Mouser. Real-time stock counts are visible on the distributor product pages and on Octopart's aggregated view across 16 distributors.
EPM570GM100I5N vs EPM570F100I5N - which is better for industrial design?
Both are 440-macrocell MAX II CPLDs in 100-ball MBGA with the same industrial -40C to +85C temperature grade. The EPM570GM100I5N is the modern lead-free / RoHS-compliant variant while the EPM570F100I5N is an older generation. Choose EPM570GM100I5N for new designs and RoHS compliance; EPM570F100I5N only for legacy board compatibility.
When should I choose EPM570GM100I5N over EPM570F100I5N?
Choose the EPM570GM100I5N for new designs, for RoHS compliance, and when targeting the latest Intel/Altera MAX II datasheet revision. The EPM570F100I5N remains valid for legacy board drop-in replacement and existing inventory but is increasingly obsolete in new product BOMs as of 2026.
What is the best drop-in replacement for EPM570GM100I5N?
The best drop-in replacement for the EPM570GM100I5N is the EPM570GM100C5N - same 100-MBGA package, same die, same 440 macrocells, same 76 user I/Os, but with a commercial 0C to +85C temperature range instead of industrial. For industrial-grade drop-in within the same package, the EPM570GM100I5N itself has no direct alternate; pin-compatible higher-density parts like EPM1270GM100I5N are not drop-in due to different pin functions.
Can EPM570F100I5N replace EPM570GM100I5N?
Yes, the EPM570F100I5N can replace the EPM570GM100I5N on the same PCB footprint because both share the 100-MBGA package, 440 macrocells, and pin-compatible JTAG / power / I/O assignments. The 'F' suffix indicates an older lead-finish generation (non-RoHS / Pb-bearing), so confirm RoHS requirements before substitution. Both are industrial -40C to +85C.
Where to download EPM570GM100I5N datasheet PDF?
The EPM570GM100I5N datasheet is available as a 120 KB PDF on AllDatasheet (reference 1575862), on Octopart's datasheet tab (octopart.com/datasheet/altera/EPM570GM100I5N), and on datasheets.com. The full MAX II device handbook is published on Intel's website under MAX II CPLD documentation; refer to the MAX II Device Handbook for detailed JTAG, configuration, and timing specifications.
Where to find EPM570GM100I5N pinout?
The EPM570GM100I5N pinout is documented in the Altera/Intel MAX II device handbook, in the 100-MBGA package pin table. Pin 1 is at the top-left of the package (with the dot marker), and pins are numbered counter-clockwise through 100 balls. The datasheets.com part page for EPM570GM100I5N also includes a pinout table.

Data referensi engineering untuk EPM570GM100I5N — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose EPM570GM100I5N when designing for industrial temperature (-40C to +85C) environments requiring RoHS-compliant lead-free finish, such as factory automation, outdoor telecommunications, and automotive subsystems. Choose EPM570GM100C5N if your application operates only in commercial 0C to +85C range and you want identical performance at potentially lower cost. Choose EPM570F100I5N or EPM570GF100I5N only for legacy board drop-in replacement where RoHS compliance is not required. All six alternatives share the same 100-MBGA footprint, so PCB layout is identical across the family - selection is driven by temperature grade, lead finish, and lifecycle considerations rather than footprint.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini EPM570GM100C5N EPM570F100I5N EPM570F100I5 EPM570F100C5N EPM570GF100I5N EPM570GF100C5N
Package 100-MBGA (FineLine BGA, 0.5 mm pitch) 100-MBGA - same 100-MBGA - same 100-MBGA - same 100-MBGA - same 100-MBGA - same 100-MBGA - same
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel Intel
Macrocells 440 440 - same 440 - same 440 - same 440 - same 440 - same 440 - same
User I/Os 76 76 - same 76 - same 76 - same 76 - same 76 - same 76 - same
Operating Temperature -40C to +85C (industrial) 0C to +85C (commercial) -40C to +85C (industrial) -40C to +85C (industrial) 0C to +85C (commercial) -40C to +85C (industrial) 0C to +85C (commercial)
RoHS Compliance Yes (Pb-free, lead-free) Yes No (older Pb-bearing finish) No (older Pb-bearing finish) No (older Pb-bearing finish) Mixed (generation dependent) Mixed (generation dependent)
Speed Grade / Pin Delay Speed 5 / 5.4 ns Speed 5 / 5.4 ns - same Speed 5 / 5.4 ns - same Speed 5 / 5.4 ns - same Speed 5 / 5.4 ns - same Speed 5 / 5.4 ns - same Speed 5 / 5.4 ns - same
Core Voltage 1.8 V 1.8 V - same 1.8 V - same 1.8 V - same 1.8 V - same 1.8 V - same 1.8 V - same
Configuration Memory On-chip non-volatile flash On-chip flash - same On-chip flash - same On-chip flash - same On-chip flash - same On-chip flash - same On-chip flash - same

Diferensiator Kunci

  • Industrial temperature grade and modern RoHS-compliant lead-free finish (vsEPM570F100I5N)
  • Wider industrial temperature range with same package (vsEPM570GM100C5N)
  • Same package and die as legacy EPM570F100C5N (vsEPM570F100C5N)

Catatan Desain

Place 0.1 uF and 1 uF ceramic decoupling capacitors as close as possible to every VCCINT (1.8 V core) and VCCIO (I/O bank) pin. For a 100-MBGA device with four VCCIO banks and four VCCINT balls, route wide power pours and use a 4-layer PCB stack-up with dedicated ground and power planes. BGA fan-out requires via-in-pad or dog-bone fan-out at 0.5 mm pitch - ensure your PCB fab supports 0.1 mm laser-drilled micro-vias if using via-in-pad.

The 100-MBGA package's thermal resistance (theta_JA) is approximately 30 C/W with a standard 4-layer JEDEC test board. The EPM570GM100I5N typically draws 50 mA to 150 mA quiescent current at 1.8 V, so steady-state dissipation is around 0.1 W to 0.27 W. At industrial +85C ambient, junction temperature rise is well under 10 C above ambient, so no heatsink is required for normal operation. Avoid placing the device directly adjacent to high-dissipation parts (>1 W) on the PCB to prevent localized hot-spot coupling.

Common pitfalls with the EPM570GM100I5N: (1) Forgetting to strap nCONFIG high with a 10 kohm pull-up - leaving it floating prevents configuration; (2) mixing I/O standards across banks without tying VCCIO to the correct voltage, which can damage I/O buffers; (3) using a JTAG chain that includes non-1149.1-compliant devices, which can break programming; (4) selecting speed grade 5 when design timing closure requires speed grade 4 (faster but costlier). Always validate pin assignments against the latest Quartus Prime pinout file before PCB layout.

Informasi Konformitas

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bebas Logam Lengket
Yes
Bebas Halogena
Unknown
Mineral Konflik
Compliant

RoHS compliant per distributor listings. Industrial -40C to +85C temperature grade. Halogen-free status not explicitly stated in web data - [DATA_NEEDED]. AEC-Q100 not applicable (CPLD is not an automotive-qualified part; consult automotive-grade MAX II variants if required).

Data disahkan pada: 2026-09-12 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Pencarian Terkait

EPM570GM100I5N EPM570GM100I5N datasheet Intel EPM570GM100I5N MAX II CPLD 440 macrocell 100-MBGA CPLD industrial CPLD I/O expansion microcontroller EPM570GM100I5N vs EPM570F100I5N EPM570GM100I5N drop-in replacement EPM570GM100I5N buy price MAX II CPLD 76 user I/O 201 MHz CPLD bus bridge 1.8V 3.3V level translation how to program EPM570GM100I5N JTAG

Komponen dan Istilah Terkait

Intel Altera EPM570GM100I5N EPM570GM100C5N EPM570F100I5N EPM570F100I5 EPM570F100C5N EPM570GF100I5N EPM570GF100C5N MAX II CPLD Complex Programmable Logic Device macrocell logic element logic array block LAB FineLine BGA MBGA JTAG IEEE 1149.1 Quartus Prime RoHS AEC-Q100 instant-on non-volatile configuration I/O bank LVCMOS LVTTL glue logic I/O expansion bus bridging power-up sequencing protocol conversion
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