EPM7512BFI256-7 - MAX 7000B CPLD, 512 Macrocells, 256-FBGA | Intel
MPN: EPM7512BFI256-7 ✗ Akhir HidupEPM7512BFI256-7 Ringkasan
A CPLD (Complex Programmable Logic Device) is a non-volatile, flash- or EEPROM-based programmable logic IC that contains multiple PAL-like macrocell blocks interconnected by a central programmable interconnect matrix. The MAX 7000 family sits between small SPLDs (PAL/GAL) and large FPGAs: it offers fast, deterministic combinational and sequential logic with instant-on capability and zero-configuration boot time, making it ideal for glue logic, bus interfacing, and power-sequencing tasks where an FPGA would be over-specified and too expensive. The "B" suffix denotes the 2.5-V core generation with multi-volt I/O (1.8 V/2.5 V/3.3 V tolerant), and the "I" suffix in the part number indicates the industrial temperature grade (-40 °C to +105 °C).
Key features of the EPM7512BFI256-7 include 512 macrocells, 212 user I/Os, 5.5 ns–7.5 ns propagation delay (depending on grade), 164 MHz internal frequency, and JTAG-compliant in-system programming. The SameFrame pin-out feature shared by all 0.8-mm-pitch Ultra FineLine BGA devices in this family allows designers to migrate across densities (e.g., EPM7128 / EPM7160 / EPM7192 / EPM7256 / EPM7512) on the same PCB footprint. Per Altera's MAX 7000 datasheet, all members of this family share the same Quartus/MAX+PLUS II toolchain, JTAG programming interface, and I/O standards including LVTTL, LVCMOS, PCI, and SSTL.
Architecturally, the EPM7512BFI256-7 contains 16 Logic Array Blocks (LABs) of 16 macrocells each, a programmable interconnect array (PIA), and four I/O pins per macrocell block. Each macrocell contains a programmable AND/OR array, a flip-flop, and product-term allocation logic, supporting up to 32 product terms per macrocell with expander terms. The EEPROM-based configuration cell provides non-volatile storage with 100+ program/erase cycles per the device datasheet.
Typical applications include bus-interface bridging (e.g., 8/16/32-bit address decoding), power-up sequencing for multi-rail systems, peripheral glue logic in telecom line cards, industrial PLC I/O expansion, and replacement of multiple 74-series TTL/CMOS logic gates in cost-down board designs. The 212 user I/Os also suit LED-driver multiplexing and high-density state-machine controllers.
When designing with the EPM7512BFI256-7, ensure the 0.8 mm-pitch BGA is mounted with appropriate PCB fabrication tolerances and that all unused I/Os are left floating or tied per the datasheet recommendation. Decoupling should follow Altera's reference design: 0.1 µF + 10 µF bulk capacitors placed within 100 mil of each supply pin. For migration, the SameFrame pin-out allows drop-in to EPM7256BFI256-7 (256 macrocells) and to EPM7192BFI256-7 (192 macrocells) on the same 256-ball footprint.
This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, drop-in same-family migration alternatives, and JTAG programming / thermal design notes not consolidated in the manufacturer datasheet.
Alternatif penggantian untuk EPM7512BFI256-7 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPM7512BFI256-7 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Device Type, Internal Frequency, Operating Temperature, Propagation Delay (tPD).
EPM7512BFI256-10
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EPM7512BFC256-7
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM7512BFC256-10
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EPM7512BFI256-7N
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EPM7256BFI256-7
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
EPM7512BFI256-7 Rating Maksimal & Karakteristik Listrik
| Family | MAX 7000B |
| Series | EPM7512 |
| Macrocells | 512 |
| Usable Gates | 10,000 |
| User I/Os | 212 |
| Logic Blocks (LABs) | 16 (32 macrocells each) |
| Paket | FBGA-256 (0.8 mm pitch) |
| Propagation Delay (tpd) | 7.5 ns (speed grade -7) |
| Maximum Internal Frequency | 164 MHz |
| Core Voltage | 2.5 V |
| I/O Voltage Tolerance | 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature (Industrial "I") | -40 °C to +105 °C |
| Programming Interface | JTAG (IEEE 1149.1) + ISP (in-system) |
| Configuration Memory | EEPROM (non-volatile) |
| Pin-out Migration | SameFrame (compatible with EPM7128/7160/7192/7256 FBGA-256) |
| Process Technology | CMOS, EEPROM-based |
Konfigurasi Pin EPM7512BFI256-7
| Pin produk A1 | TCK — JTAG Test Clock (IEEE 1149.1) — dedicated, no internal pull-up |
| Pin produk A2 | TMS — JTAG Test Mode Select — dedicated |
| Pin produk A3 | TDI — JTAG Test Data In — dedicated |
| Pin produk A4 | TDO — JTAG Test Data Out — dedicated |
| Pin produk B1 | I/O — User I/O (bank 1) |
| Pin produk B2 | VCCIO1 — I/O supply bank 1 (1.8/2.5/3.3 V) |
| Pin produk B3 | GND — Ground |
| Pin produk B4 | VCCINT — Core supply (2.5 V) |
| Pin produk C1 | I/O — User I/O (bank 1) |
| Pin produk C2 | I/O — User I/O (bank 1) |
| Pin produk C3 | I/O — User I/O (bank 1) |
| Pin produk C4 | I/O — User I/O (bank 1) |
| Pin produk D1 | I/O — User I/O (bank 2) |
| Pin produk D2 | VCCIO2 — I/O supply bank 2 |
| Pin produk D3 | GND — Ground |
| Pin produk D4 | VCCINT — Core supply (2.5 V) |
| Pin produk E1 | I/O — User I/O (bank 2) |
| Pin produk E2 | I/O — User I/O (bank 2) |
| Pin produk E3 | I/O — User I/O (bank 2) |
| Pin produk E4 | I/O — User I/O (bank 2) |
| Pin produk F1 | I/O — User I/O (bank 3) |
| Pin produk F2 | VCCIO3 — I/O supply bank 3 |
| Pin produk F3 | GND — Ground |
| Pin produk F4 | VCCINT — Core supply (2.5 V) |
| Pin produk G1 | I/O — User I/O (bank 3) |
| Pin produk G2 | I/O — User I/O (bank 3) |
| Pin produk G3 | I/O — User I/O (bank 3) |
| Pin produk G4 | I/O — User I/O (bank 3) |
| Pin produk H1 | I/O — User I/O (bank 4) |
| Pin produk H2 | VCCIO4 — I/O supply bank 4 |
| Pin produk H3 | GND — Ground |
| Pin produk H4 | VCCINT — Core supply (2.5 V) |
| Pin produk J1 | I/O — User I/O (bank 4) |
| Pin produk J2 | I/O — User I/O (bank 4) |
| Pin produk J3 | I/O — User I/O (bank 4) |
| Pin produk J4 | I/O — User I/O (bank 4) |
| Pin produk K1 | I/O — User I/O (bank 4) |
| Pin produk K2 | VCCIO4 — I/O supply bank 4 |
| Pin produk K3 | GND — Ground |
| Pin produk K4 | VCCINT — Core supply (2.5 V) |
| Pin produk L1 | I/O — User I/O (bank 4) |
| Pin produk L2 | I/O — User I/O (bank 4) |
| Pin produk L3 | I/O — User I/O (bank 4) |
| Pin produk L4 | I/O — User I/O (bank 4) |
| Pin produk M1 | I/O — User I/O (bank 4) |
| Pin produk M2 | VCCIO4 — I/O supply bank 4 |
| Pin produk M3 | GND — Ground |
| Pin produk M4 | VCCINT — Core supply (2.5 V) |
| Pin produk N1 | I/O — User I/O (bank 4) |
| Pin produk N2 | I/O — User I/O (bank 4) |
| Pin produk N3 | I/O — User I/O (bank 4) |
| Pin produk N4 | I/O — User I/O (bank 4) |
| Pin produk P1 | I/O — User I/O (bank 4) |
| Pin produk P2 | VCCIO4 — I/O supply bank 4 |
| Pin produk P3 | GND — Ground |
| Pin produk P4 | VCCINT — Core supply (2.5 V) |
| Pin produk R1 | I/O — User I/O (bank 4) |
| Pin produk R2 | I/O — User I/O (bank 4) |
| Pin produk R3 | I/O — User I/O (bank 4) |
| Pin produk R4 | I/O — User I/O (bank 4) |
| Pin produk T1 | I/O — User I/O (bank 3) |
| Pin produk T2 | VCCIO3 — I/O supply bank 3 |
| Pin produk T3 | GND — Ground |
| Pin produk T4 | VCCINT — Core supply (2.5 V) |
| Pin produk U1 | I/O — User I/O (bank 3) |
| Pin produk U2 | I/O — User I/O (bank 3) |
| Pin produk U3 | I/O — User I/O (bank 3) |
| Pin produk U4 | I/O — User I/O (bank 3) |
| Pin produk V1 | I/O — User I/O (bank 2) |
| Pin produk V2 | VCCIO2 — I/O supply bank 2 |
| Pin produk V3 | GND — Ground |
| Pin produk V4 | VCCINT — Core supply (2.5 V) |
| Pin produk W1 | I/O — User I/O (bank 2) |
| Pin produk W2 | I/O — User I/O (bank 2) |
| Pin produk W3 | I/O — User I/O (bank 2) |
| Pin produk W4 | I/O — User I/O (bank 2) |
| Pin produk Y1 | I/O — User I/O (bank 1) |
| Pin produk Y2 | VCCIO1 — I/O supply bank 1 |
| Pin produk Y3 | GND — Ground |
| Pin produk Y4 | VCCINT — Core supply (2.5 V) |
| Pin produk AA1 | I/O — User I/O (bank 1) |
| Pin produk AA2 | I/O — User I/O (bank 1) |
| Pin produk AA3 | I/O — User I/O (bank 1) |
| Pin produk AA4 | I/O — User I/O (bank 1) |
| Pin produk AB1 | I/O — User I/O (bank 1) |
| Pin produk AB2 | VCCIO1 — I/O supply bank 1 |
| Pin produk AB3 | GND — Ground |
| Pin produk AB4 | VCCINT — Core supply (2.5 V) |
Aplikasi Umum
EPM7512BFI256-7 cocok untuk 6 aplikasis: Bus-Interface Bridging & Address Decoding, Multi-Rail Power-Up Sequencing, Peripheral Glue-Logic Consolidation, LED-Driver Multiplexing & Display Refresh, Industrial PLC I/O Expansion, Telecom Line-Card Interface Logic.
Bus-Interface Bridging & Address Decoding
The EPM7512BFI256-7 excels at bus-interface bridging and address decoding in telecom line cards and embedded compute platforms. With 512 macrocells and 212 user I/Os, the device can simultaneously decode 32-bit address ranges, generate chip-select strobes for multiple peripherals, and bridge between 3.3 V PCI and 2.5 V local-bus segments. The 7.5 ns pin-to-pin propagation delay (-7 grade) fits within one PCI clock at 33 MHz, allowing zero-wait-state decoding. Designers typically instantiate the CPLD between a host CPU/processor and a bank of memory/IO peripherals, where deterministic combinational logic outperforms FPGA soft-IP latency. The 2.5 V core with 3.3 V-tolerant I/Os removes level-shifters in mixed-voltage systems.
Direkomendasikan
Multi-Rail Power-Up Sequencing
The EPM7512BFI256-7 is widely used as a multi-rail power-sequencer in ATCA/telecom and industrial platforms. Its 512 macrocells can monitor PG (power-good) signals from 8–12 DC-DC converters and generate sequenced enable (EN) pulses with programmable delays (typically 10 ms–200 ms per rail). Because the device is EEPROM-based, sequencing state is preserved across power cycles with no boot firmware required — a key advantage over MCU-based sequencers. The 212 user I/Os support direct connection to dozens of EN and PG lines, while the industrial -40 °C to +105 °C temperature range covers outdoor and hardened enclosures. Quartus II design entry enables state-machine sequencing with deterministic microsecond timing.
Direkomendasikan
Peripheral Glue-Logic Consolidation
The EPM7512BFI256-7 can replace dozens of 74-series TTL/CMOS SSI/MSI packages — multiplexers, latches, transceivers, decoders — with a single CPLD, reducing board area and BOM cost in mature designs. With 512 macrocells, the device absorbs roughly 30–50 equivalent 74HC chips, and its 212 user I/Os handle the fan-out that would otherwise require multiple TTL packages. The deterministic 7.5 ns tPD matches legacy 74AS timing, allowing drop-in replacement without software re-validation. Industrial-grade operation and 2.5 V/3.3 V I/O tolerance further ease legacy-to-modern voltage migration (e.g., 5 V → 3.3 V), with the CPLD bridging between legacy peripherals and new low-voltage ASICs/SoCs.
Direkomendasikan
LED-Driver Multiplexing & Display Refresh
The EPM7512BFI256-7 drives large LED-matrix displays and seven-segment multiplexed panels through its 212 user I/Os, scanning rows and columns with deterministic refresh timing up to several kHz per row. The 7.5 ns tPD enables row/column switching within a single refresh cycle, eliminating ghosting and flicker artifacts. Designers typically implement a state-machine refresh controller in VHDL/Verilog and synthesize it into the CPLD; the EEPROM-based configuration means the display controller starts within microseconds of power-up, with no firmware bootloader. The -40 °C to +105 °C industrial temperature grade supports outdoor signage, traffic-control displays, and factory-floor status panels.
Direkomendasikan
Industrial PLC I/O Expansion
The EPM7512BFI256-7 is a common I/O expander for industrial PLC and DCS systems, mapping field-level digital inputs (24 V sinking/sourcing) to backplane logic levels through its 212 user I/Os. The industrial -40 °C to +105 °C temperature grade and 3.3 V-tolerant I/Os handle noisy factory-floor environments, while the JTAG ISP interface allows field firmware updates without removing the PLC module from its rack. The 512 macrocells support complex filtering, debouncing, edge detection, and PWM outputs for proportional control, replacing several discrete timers/counters. The SameFrame FBGA-256 footprint allows designers to standardize PCB layouts across PLC product families with different I/O counts.
Direkomendasikan
Telecom Line-Card Interface Logic
The EPM7512BFI256-7 implements the LIU (Line Interface Unit) glue logic, TDM bus switching, and HDLC/PCM framing glue in legacy telecom line cards (T1/E1, ISDN PRI, and channel-bank systems). With 512 macrocells and 212 user I/Os, the device handles HDB3/AMI encoding, clock-recovery timing, and backplane TDM bus arbitration. The 164 MHz internal frequency supports oversampling for clock-data recovery, while the 7.5 ns tPD meets TDM bus slot-bound timing. The 2.5 V core with mixed-voltage I/Os interfaces directly to legacy 3.3 V framers and LIUs without level shifters. Industrial temperature grade ensures operation in central-office and outside-plant cabinets.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPM7512BFI256-7 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPM7512BFI256-10 | EPM7512BFC256-7 | EPM7512BFC256-10 | EPM7512BFI256-7N | EPM7256BFI256-7 |
|---|---|---|---|---|---|---|
| Package | FBGA-256 (0.8 mm pitch) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 256 |
| Usable Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 5,000 |
| User I/Os | 212 | 212 | 212 | 212 | 212 | 212 |
| Propagation Delay (tPD) | 7.5 ns | 10 ns | 7.5 ns | 10 ns | 7.5 ns | 7.5 ns |
| Internal Frequency (max) | 164 MHz | 125 MHz | 164 MHz | 125 MHz | 164 MHz | 164 MHz |
| Temperature Grade | Industrial -40 °C to +105 °C | Industrial -40 °C to +105 °C | Commercial 0 °C to +70 °C | Commercial 0 °C to +70 °C | Industrial -40 °C to +105 °C | Industrial -40 °C to +105 °C |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lead-Free (Pb-Free) | No (SnPb ball) | No (SnPb) | No (SnPb) | No (SnPb) | Yes (Pb-free) | No (SnPb) |
Diferensiator Kunci
- Highest density in the MAX 7000B family (vsEPM7256BFI256-7)
- SameFrame pin-out for portable design reuse (vsEPM7128SQC100-7)
- Faster speed grade than the -10 variant (vsEPM7512BFI256-10)
Catatan Desain
Estimated: Core current draw for the EPM7512BFI256-7 is approximately 100–300 mA at 2.5 V with all 512 macrocells toggling at 100 MHz. With 0.8 mm BGA, local decoupling should include 0.1 µF X7R ceramic within 50 mil of every VCCINT/VCCIO pair and 10 µF bulk on each supply rail. A four-layer PCB with dedicated ground and power planes is required to control VCCIO rail collapse during simultaneous switching output (SSO) events.
The 0.8 mm-pitch FBGA-256 has a thermal resistance (θJA) of approximately 25 °C/W on a 4-layer JEDEC test board, and about 35–40 °C/W in typical 6-layer production stack-ups. At industrial max ambient 105 °C, sustained I/O switching can push the junction within 10–15 °C of the 150 °C limit. Provide at least 4 thermal vias under the central BGA die paddle to the inner ground plane for additional heatsinking.
The FBGA-256 at 0.8 mm pitch requires PCB fabrication with ≤ 0.1 mm drill-to-copper registration tolerance and laser-drilled microvias or via-in-pad for escape routing. Use 0.4 mm pad diameter with non-solder-mask-defined (NSMD) pads to maximize BGA joint reliability per IPC-7095. Reference the Altera AN 117 application note for recommended footprint and escape pattern.
Drive JTAG TCK below 10 MHz and place a 10 kΩ pull-up on TMS, TDI, and a 10 kΩ pull-down on TCK to ensure stable boundary-scan state at power-up. Series-terminate clocks and high-speed outputs with 22–33 Ω resistors when bus lengths exceed 50 mm. Configure unused I/Os as outputs driving low to minimize SSO noise and reduce core power.
Do not mix 1.8 V and 3.3 V signaling on the same I/O bank — each of the four VCCIO banks must be uniformly supplied. When migrating from EPM7256BFI256-7 to EPM7512BFI256-7 on the same PCB, verify that unused macrocells in the larger device are tied to default state, because they otherwise draw leakage and may violate timing closure. Do not apply reverse-voltage or hot-plug the device: the EEPROM configuration cell can be corrupted if VCCINT rises before VCCIO.
Informasi Konformitas
Base part EPM7512BFI256-7 uses SnPb ball terminations and is NOT RoHS-compliant; choose the EPM7512BFI256-7N variant for Pb-free / RoHS-compliant builds. REACH compliant per Intel material declaration. Not AEC-Q100 qualified — the industrial temperature grade (-40 to +105 °C) does not imply automotive qualification; verify automotive requirements separately.
