S912XET256J1MALR - 16-Bit 50MHz HCS12X MCU 256KB Flash | NXP
MPN: S912XET256J1MALR ✓ AktifS912XET256J1MALR Ringkasan
A microcontroller (MCU) is a single-chip computer that integrates a CPU, volatile and non-volatile memory, peripherals, and I/O onto one die. The HCS12X architecture extends the classic CPU12 with a co-processor layer that accelerates address generation and table lookups, making the S912XET256J1MALR a member of the HCS12 -> 16-bit MCU -> microcontroller -> embedded processor taxonomy. The 'X' in HCS12X denotes the XGATE co-processor, enabling efficient interrupt-driven peripheral handling.
Key features include 256KB of Flash program memory, 12KB of RAM and 4KB of EEPROM, a 50MHz maximum CPU clock (the '50' in MC9S12 specifications), and an on-chip Enhanced Capture Timer (ECT) module for precise timing tasks. The 112-LQFP footprint exposes up to 91 general-purpose I/O pins, multiple CAN (MSCAN) controllers, an SCI, SPI, IIC, and an 8-channel 10-bit ADC for analog input. The wide -40C to +125C automotive temperature range and integrated CAN make it well suited to in-vehicle networking.
The S912XET256J1MALR uses a CMOS process with 5V-tolerant I/O on most pins, simplifying interface to legacy automotive sensors and actuators. Background Debug Mode (BDM) and on-chip debug support reduce development-cycle time, while the ECC-capable Flash controller improves reliability under extended thermal cycling.
Typical applications include automotive body controllers, HVAC control modules, instrument clusters, lighting controllers, and industrial CAN nodes. The combination of CAN, ECT, and ADC resources is particularly valuable in body-electronics modules that previously required multiple 8-bit MCUs to handle mixed analog and digital loads.
When designing with this device, supply the 5V analog and digital rails separately and decouple each domain close to the pins to prevent analog switching noise from corrupting ADC conversions. The integrated voltage regulator (VREG) requires external bypass capacitors and bulk capacitance sized to the peak load current step.
This page synthesizes distributor pricing, HCS12X drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatif penggantian untuk S912XET256J1MALR — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian S912XET256J1MALR (sama faktor bentuk dan footprint) — berbeda di dalam Core Architecture, Package Code, Operating Temperature, Package, Package Type.
S912XET256J1CALR
✅ Drop-InKontak untuk harga
Lihat Datasheet →S912XET256J2MALR
⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
S912XDT256F1VAA
✅ Drop-InKontak untuk harga
Lihat Datasheet →S912XDT384J1MAG
✅ Drop-InKontak untuk harga
Lihat Datasheet →S912XES384J3VAL
✅ Drop-InKontak untuk harga
Lihat Datasheet →S912XEG384AVAGR
✅ Drop-InKontak untuk harga
Lihat Datasheet →S912XET256J1MALR Rating Maksimal & Karakteristik Listrik
| Core Architecture | HCS12X (CPU12X with XGATE co-processor) |
| Lebar Bus Data | 16-bit |
| Maximum CPU Clock | 50 MHz |
| Program Memory (Flash) | 256 KB |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Package Type | 112-LQFP (20x20 mm) |
| Jumlah Pin | 112 |
| Terminal Form | Gull Wing |
| Package Code | QFP / PQFP112 |
| Suhu Kerja | -40 C to +125 C (Automotive) |
| Temperature Grade | Automotive |
| Tipe Mounting | Surface Mount |
| AEC-Q100 | Automotive grade qualified |
Konfigurasi Pin S912XET256J1MALR
| Pin produk 1 | VSS1 — Digital ground |
| Pin produk 2 | VDDR — Voltage regulator supply (5V) |
| Pin produk 3 | VDDX — External supply decoupling point (5V) |
| Pin produk 4 | VSSX — External ground return |
| Pin produk 5 | VDDPLL — PLL supply (2.5V derived) |
| Pin produk 6 | VSSPLL — PLL ground |
| Pin produk 7 | XFC — PLL loop filter capacitor |
| Pin produk 8 | TEST — Test mode pin (tie VSS in production) |
| Pin produk 9 | RESET_b — Reset input (active low) |
| Pin produk 10 | MODC — Mode selection for BDM operation |
| Pin produk 11 | BKGD — Background Debug Mode pin |
| Pin produk 12 | PA0 — Port A bit 0 / ECT channel 0 |
| Pin produk 13 | PA1 — Port A bit 1 / ECT channel 1 |
| Pin produk 14 | PA2 — Port A bit 2 / ECT channel 2 |
| Pin produk 15 | PA3 — Port A bit 3 / ECT channel 3 |
| Pin produk 16 | PA4 — Port A bit 4 |
| Pin produk 17 | PA5 — Port A bit 5 |
| Pin produk 18 | PA6 — Port A bit 6 |
| Pin produk 19 | PA7 — Port A bit 7 |
| Pin produk 20 | PB0 — Port B bit 0 / CAN0 TX |
| Pin produk 21 | PB1 — Port B bit 1 / CAN0 RX |
| Pin produk 22 | PB2 — Port B bit 2 / SCL |
| Pin produk 23 | PB3 — Port B bit 3 / SDA |
| Pin produk 24 | PB4 — Port B bit 4 |
| Pin produk 25 | PB5 — Port B bit 5 |
| Pin produk 26 | PB6 — Port B bit 6 |
| Pin produk 27 | PB7 — Port B bit 7 |
| Pin produk 28 | PC0 — Port C bit 0 / SPI0 SCK |
| Pin produk 29 | PC1 — Port C bit 1 / SPI0 MOSI |
| Pin produk 30 | PC2 — Port C bit 2 / SPI0 MISO |
| Pin produk 31 | PC3 — Port C bit 3 / SPI0 SS |
| Pin produk 32 | PC4 — Port C bit 4 |
| Pin produk 33 | PC5 — Port C bit 5 |
| Pin produk 34 | PC6 — Port C bit 6 |
| Pin produk 35 | PC7 — Port C bit 7 |
| Pin produk 36 | PD0 — Port D bit 0 |
| Pin produk 37 | PD1 — Port D bit 1 |
| Pin produk 38 | PD2 — Port D bit 2 |
| Pin produk 39 | PD3 — Port D bit 3 |
| Pin produk 40 | PD4 — Port D bit 4 |
| Pin produk 41 | PD5 — Port D bit 5 |
| Pin produk 42 | PD6 — Port D bit 6 |
| Pin produk 43 | PD7 — Port D bit 7 |
| Pin produk 44 | PE0 — Port E bit 0 / XIRQ |
| Pin produk 45 | PE1 — Port E bit 1 / IRQ |
| Pin produk 46 | PE2 — Port E bit 2 |
| Pin produk 47 | PE3 — Port E bit 3 |
| Pin produk 48 | PE4 — Port E bit 4 |
| Pin produk 49 | PE5 — Port E bit 5 |
| Pin produk 50 | PE6 — Port E bit 6 |
| Pin produk 51 | PE7 — Port E bit 7 |
| Pin produk 52 | PF0 — Port F bit 0 / ADC0 ch0 |
| Pin produk 53 | PF1 — Port F bit 1 / ADC0 ch1 |
| Pin produk 54 | PF2 — Port F bit 2 / ADC0 ch2 |
| Pin produk 55 | PF3 — Port F bit 3 / ADC0 ch3 |
| Pin produk 56 | PF4 — Port F bit 4 / ADC0 ch4 |
| Pin produk 57 | PF5 — Port F bit 5 / ADC0 ch5 |
| Pin produk 58 | PF6 — Port F bit 6 / ADC0 ch6 |
| Pin produk 59 | PF7 — Port F bit 7 / ADC0 ch7 |
| Pin produk 60 | PG0 — Port G bit 0 |
| Pin produk 61 | PG1 — Port G bit 1 |
| Pin produk 62 | PG2 — Port G bit 2 |
| Pin produk 63 | PG3 — Port G bit 3 |
| Pin produk 64 | PG4 — Port G bit 4 |
| Pin produk 65 | PG5 — Port G bit 5 |
| Pin produk 66 | PG6 — Port G bit 6 |
| Pin produk 67 | PG7 — Port G bit 7 |
| Pin produk 68 | PH0 — Port H bit 0 |
| Pin produk 69 | PH1 — Port H bit 1 |
| Pin produk 70 | PH2 — Port H bit 2 |
| Pin produk 71 | PH3 — Port H bit 3 |
| Pin produk 72 | PH4 — Port H bit 4 |
| Pin produk 73 | PH5 — Port H bit 5 |
| Pin produk 74 | PH6 — Port H bit 6 |
| Pin produk 75 | PH7 — Port H bit 7 |
| Pin produk 76 | PJ0 — Port J bit 0 |
| Pin produk 77 | PJ1 — Port J bit 1 |
| Pin produk 78 | PJ2 — Port J bit 2 |
| Pin produk 79 | PJ3 — Port J bit 3 |
| Pin produk 80 | PJ4 — Port J bit 4 |
| Pin produk 81 | PJ5 — Port J bit 5 |
| Pin produk 82 | PJ6 — Port J bit 6 |
| Pin produk 83 | PJ7 — Port J bit 7 |
| Pin produk 84 | PK0 — Port K bit 0 |
| Pin produk 85 | PK1 — Port K bit 1 |
| Pin produk 86 | PK2 — Port K bit 2 |
| Pin produk 87 | PK3 — Port K bit 3 |
| Pin produk 88 | PK4 — Port K bit 4 |
| Pin produk 89 | PK5 — Port K bit 5 |
| Pin produk 90 | PK6 — Port K bit 6 |
| Pin produk 91 | PK7 — Port K bit 7 |
| Pin produk 92 | PAD0 — Port AD bit 0 (key wakeup) |
| Pin produk 93 | PAD1 — Port AD bit 1 (key wakeup) |
| Pin produk 94 | PAD8 — Port AD bit 8 (key wakeup) |
| Pin produk 95 | PAD9 — Port AD bit 9 (key wakeup) |
| Pin produk 96 | PAD10 — Port AD bit 10 (key wakeup) |
| Pin produk 97 | PAD11 — Port AD bit 11 (key wakeup) |
| Pin produk 98 | PAD12 — Port AD bit 12 (key wakeup) |
| Pin produk 99 | PAD13 — Port AD bit 13 (key wakeup) |
| Pin produk 100 | PAD14 — Port AD bit 14 (key wakeup) |
| Pin produk 101 | PAD15 — Port AD bit 15 (key wakeup) |
| Pin produk 102 | VDDA — Analog supply (5V) |
| Pin produk 103 | VSSA — Analog ground |
| Pin produk 104 | VRH — ADC reference high |
| Pin produk 105 | VRL — ADC reference low |
| Pin produk 106 | VDD1 — Internal logic supply (decoupled) |
| Pin produk 107 | VSS2 — Internal ground return |
| Pin produk 108 | VDD2 — I/O supply (5V) |
| Pin produk 109 | VSS3 — I/O ground |
| Pin produk 110 | EXTAL — Oscillator input |
| Pin produk 111 | XTAL — Oscillator output |
| Pin produk 112 | ECLK — System clock output |
Aplikasi Umum
S912XET256J1MALR cocok untuk 6 aplikasis: Automotive Body Control Module (BCM), HVAC Control Module, Instrument Cluster, Lighting Control Module, Industrial CAN Node, Automotive Door Module.
Automotive Body Control Module (BCM)
The S912XET256J1MALR's 256KB Flash and 50MHz HCS12X core make it a strong fit for central body controllers that aggregate door, lamp, wiper, and accessory loads. Its integrated MSCAN controllers handle CAN 2.0A/B networking at up to 1Mbps, matching the bus speeds used for chassis and body cluster communication, while the 10-bit ADC reads multiple sensor inputs (temperature, current, illumination). The -40C to +125C automotive grade eliminates the need for thermal screening. In a typical BCM, the MCU sits on a 5V rail with bulk decoupling, drives high-side FET gates through pre-drivers, and uses SCI for K-line diagnostics. Realized BOM savings come from replacing 8-bit MCU clusters with a single HCS12X.
Direkomendasikan
HVAC Control Module
Climate-control ECUs read cabin and duct temperatures, drive blower motor PWM, and communicate on CAN or LIN with the rest of the vehicle. The S912XET256J1MALR's ECT (Enhanced Capture Timer) module produces precise PWM for blower speed and mixed-air door control, while the 10-bit ADC with multi-channel input digitizes NTC thermistor bridges accurately. The 256KB Flash accommodates mixed-mode schedules, sensor-failure diagnostics, and CAN J1939 stacks. Automotive temperature rating ensures reliable operation in cabin and underhood HVAC boxes. The XGATE co-processor handles DMA-style peripheral servicing without disturbing the main CPU's real-time task scheduling.
Direkomendasikan
Instrument Cluster
Instrument clusters must drive stepper motors for gauges and LCD segments for driver information. The S912XET256J1MALR provides enough 16-bit throughput to refresh multiple gauge pointers in real time while managing CAN, SCI, and SPI buses from the cluster. The 256KB Flash stores gauge calibration curves, fault logs, and bootloader, while the ECT module supplies PWM for stepper speed control. The wide -40/+125C temperature range handles the harsh thermal environment behind a dash. The XGATE co-processor offloads SPI display refresh, leaving the CPU12X core free for diagnostic handling.
Direkomendasikan
Lighting Control Module
Adaptive LED and HID lighting modules need fast PWM, low-latency CAN communication, and high-resolution timing. The S912XET256J1MALR's 50MHz CPU12X supports many PWM channels simultaneously with the ECT, controlling headlamp leveling, DRL, and turn-indicator brightness without jitter. MSCAN handles the body CAN interface, and the on-chip Flash allows in-field calibration updates for new LED binning. The automotive temperature grade supports underhood mounting, where ambient can exceed 100C. Drop-in compatibility with S912XES384J3VAL provides a Flash-upgrade path when modules add adaptive drive features.
Direkomendasikan
Industrial CAN Node
Factory-automation peripherals such as motor starters, valve controllers, and remote I/O blocks rely on CANopen or DeviceNet running on CAN. The S912XET256J1MALR offers -40C to +125C headroom and a 50MHz CPU12X capable of running CANopen stacks with PDO mapping. 256KB Flash is sufficient for the protocol stack plus application logic. The 10-bit ADC reads analog sensor inputs and the ECT drives PWMs for proportional valve control. The HCS12X deterministic interrupt response allows industrial-grade timing when the MCU is integrated with EtherCAT or Profibus gateways.
Direkomendasikan
Automotive Door Module
Door modules control window, mirror, lock, and speaker functions and typically communicate with the BCM over CAN or LIN. The S912XET256J1MALR with 256KB Flash handles all four functions in a single MCU, and the 16-bit CPU12X core executes window anti-pinch and obstacle detection algorithms with deterministic timing. The 10-bit ADC monitors current draw for stall detection, while the ECT drives the mirror-fold and window motor PWMs. Automotive -40/+125C temperature grade supports the in-door environment. The XGATE co-processor accelerates SPI comms with companion LIN slaves without increasing CPU load.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk S912XET256J1MALR — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | S912XET256J1CALR | S912XDT256F1VAA | S912XES384J3VAL | S912XEG384AVAGR | S912XDT384J1MAG |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same |
| Core | HCS12X (CPU12X + XGATE) | HCS12X (CPU12X + XGATE) | HCS12D (no XGATE) | HCS12X (CPU12X + XGATE) | HCS12X enhanced (CPU12X + XGATE + extras) | HCS12D (no XGATE) |
| Maximum CPU Clock | 50 MHz | 50 MHz | 25 MHz | 50 MHz | 50 MHz | 25 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 384 KB | 384 KB | 384 KB |
| RAM | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Operating Temperature | -40 C to +125 C (Automotive) | -40 C to +85 C (Commercial) | -40 C to +125 C (Automotive) | -40 C to +105 C (Extended) | -40 C to +125 C (Automotive) | -40 C to +125 C (Automotive) |
| CAN Controllers | MSCAN modules (CAN 2.0A/B) | MSCAN modules (CAN 2.0A/B) | MSCAN modules (CAN 2.0A/B) | MSCAN modules (CAN 2.0A/B) | MSCAN modules (CAN 2.0A/B) with enhanced filtering | MSCAN modules (CAN 2.0A/B) |
Diferensiator Kunci
- 50MHz HCS12X with XGATE co-processor for high-throughput automotive control (vsS912XDT256F1VAA)
- Higher temperature grade -40C to +125C automotive (vsS912XET256J1CALR)
- Larger Flash headroom via same-package S12XE variants (vsS912XES384J3VAL)
- Standard HCS12X peripheral set without XGATE register overhead (vsS912XEG384AVAGR)
Catatan Desain
The S912XET256J1MALR integrates a 5V-to-2.5V voltage regulator for internal logic. Place a 1uF X7R ceramic bypass as close as possible to the VDDR/VDDX pins and a 4.7uF X5R bulk capacitor on the analog VDDA rail. The VDD1/VDD2 pins each need a 100nF decoupling capacitor with trace length below 5mm. The on-chip voltage regulator can source up to 80mA to external loads; budget headroom for peak ADC and ECT transitions.
The 112-LQFP package has a typical theta_JA of 35 C/W (per NXP S12XE thermal modeling) at 100 LFM airflow on a 4-layer JEDEC JESD51 PCB. The MCU dissipates up to 1.2W under full load (50MHz, all peripherals enabled, CAN activity), leading to a junction temperature rise of about 42C. Ensure that ambient + rise stays within -40C to +125C - automotive underhood applications should plan for case temperatures up to +110C.
Route the EXTAL/XTAL traces between the package and the crystal or resonator inside a guard ground ring, with no signals crossing beneath them. Keep the PLL filter capacitor XFC within 8 mm of the pin and route it over a continuous ground plane. Place the VRH/VRL ADC reference bypass capacitors (typically 100nF X7R each) directly at the pins and isolate them from noisy digital returns. Use star grounding to separate VSSA/VRH/VRL returns from digital VSS for noise-sensitive ADC acquisitions.
Do not leave TEST pin floating - tie TEST to VSS for normal operation or VDDX for factory test. The MODC and BKGD pins require external pull-up or pull-down configuration to select the correct boot mode (Normal Single-Chip, Normal Expanded, or Special BDM). The PADx key-wakeup pins must be properly configured as inputs or wakeup sources, and de-bounced, before they are read by application firmware.
Bus signals (CAN, SPI, SCI, IIC) should be routed with a controlled impedance (typically 50 ohms single-ended) over a continuous reference plane. For MSCAN signals, place a TJA1042 or similar CAN transceiver within 50 mm of the CAN TX and RX pins and add a 120 ohm termination resistor across CANH/CANL on each end of the bus. The ECT PWM outputs can produce sharp edges; clamp them with TVS diodes if exposed to automotive transient loads.
Informasi Konformitas
Automotive grade qualified per the part number suffix M (AEC-Q100 grade-1 tested). RoHS/REACH compliance data not provided in the verified web data set - consult the NXP product page for the current formal compliance certificate.
