S912XET256J1MALR - 16-Bit 50MHz HCS12X MCU 256KB Flash | NXP
N.º da peça: S912XET256J1MALR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.89 | $9,89 |
| 10 | $9.3 | $93,00 |
| 100 | $8.7 | $870,00 |
| 500 | $8.1 | $4.050,00 |
| 1.000 | $7.55 | $7.550,00 |
S912XET256J1MALR Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU, volatile and non-volatile memory, peripherals, and I/O onto one die. The HCS12X architecture extends the classic CPU12 with a co-processor layer that accelerates address generation and table lookups, making the S912XET256J1MALR a member of the HCS12 -> 16-bit MCU -> microcontroller -> embedded processor taxonomy. The 'X' in HCS12X denotes the XGATE co-processor, enabling efficient interrupt-driven peripheral handling.
Key features include 256KB of Flash program memory, 12KB of RAM and 4KB of EEPROM, a 50MHz maximum CPU clock (the '50' in MC9S12 specifications), and an on-chip Enhanced Capture Timer (ECT) module for precise timing tasks. The 112-LQFP footprint exposes up to 91 general-purpose I/O pins, multiple CAN (MSCAN) controllers, an SCI, SPI, IIC, and an 8-channel 10-bit ADC for analog input. The wide -40C to +125C automotive temperature range and integrated CAN make it well suited to in-vehicle networking.
The S912XET256J1MALR uses a CMOS process with 5V-tolerant I/O on most pins, simplifying interface to legacy automotive sensors and actuators. Background Debug Mode (BDM) and on-chip debug support reduce development-cycle time, while the ECC-capable Flash controller improves reliability under extended thermal cycling.
Typical applications include automotive body controllers, HVAC control modules, instrument clusters, lighting controllers, and industrial CAN nodes. The combination of CAN, ECT, and ADC resources is particularly valuable in body-electronics modules that previously required multiple 8-bit MCUs to handle mixed analog and digital loads.
When designing with this device, supply the 5V analog and digital rails separately and decouple each domain close to the pins to prevent analog switching noise from corrupting ADC conversions. The integrated voltage regulator (VREG) requires external bypass capacitors and bulk capacitance sized to the peak load current step.
This page synthesizes distributor pricing, HCS12X drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para S912XET256J1MALR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com S912XET256J1MALR (mesmo formato e footprint) — diferindo em Core Architecture, Package Code, Operating Temperature, Package, Package Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
S912XET256J1CALR
✅ Drop-In✓ Em estoque
$2.6476 / unidade
Ver ficha técnica →S912XET256J2MALR
⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
S912XDT256F1VAA
✅ Drop-In✓ Em estoque
$13.6 / unidade
Ver ficha técnica →S912XDT384J1MAG
✅ Drop-In✓ Em estoque
$7.45 / unidade
Ver ficha técnica →S912XES384J3VAL
✅ Drop-In✓ Em estoque
$14.85 / unidade
Ver ficha técnica →S912XEG384AVAGR
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →S912XET256J1MALR Classificações máximas e características elétricas
| Core Architecture | HCS12X (CPU12X with XGATE co-processor) |
| Largura do barramento de dados | 16-bit |
| Maximum CPU Clock | 50 MHz |
| Program Memory (Flash) | 256 KB |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Package Type | 112-LQFP (20x20 mm) |
| Contagem de pinos | 112 |
| Terminal Form | Gull Wing |
| Package Code | QFP / PQFP112 |
| Temperatura de operação | -40 C to +125 C (Automotive) |
| Temperature Grade | Automotive |
| Tipo de montagem | Surface Mount |
| AEC-Q100 | Automotive grade qualified |
Configuração de pinos do S912XET256J1MALR
| Pino 1 | VSS1 — Digital ground |
| Pino 2 | VDDR — Voltage regulator supply (5V) |
| Pino 3 | VDDX — External supply decoupling point (5V) |
| Pino 4 | VSSX — External ground return |
| Pino 5 | VDDPLL — PLL supply (2.5V derived) |
| Pino 6 | VSSPLL — PLL ground |
| Pino 7 | XFC — PLL loop filter capacitor |
| Pino 8 | TEST — Test mode pin (tie VSS in production) |
| Pino 9 | RESET_b — Reset input (active low) |
| Pino 10 | MODC — Mode selection for BDM operation |
| Pino 11 | BKGD — Background Debug Mode pin |
| Pino 12 | PA0 — Port A bit 0 / ECT channel 0 |
| Pino 13 | PA1 — Port A bit 1 / ECT channel 1 |
| Pino 14 | PA2 — Port A bit 2 / ECT channel 2 |
| Pino 15 | PA3 — Port A bit 3 / ECT channel 3 |
| Pino 16 | PA4 — Port A bit 4 |
| Pino 17 | PA5 — Port A bit 5 |
| Pino 18 | PA6 — Port A bit 6 |
| Pino 19 | PA7 — Port A bit 7 |
| Pino 20 | PB0 — Port B bit 0 / CAN0 TX |
| Pino 21 | PB1 — Port B bit 1 / CAN0 RX |
| Pino 22 | PB2 — Port B bit 2 / SCL |
| Pino 23 | PB3 — Port B bit 3 / SDA |
| Pino 24 | PB4 — Port B bit 4 |
| Pino 25 | PB5 — Port B bit 5 |
| Pino 26 | PB6 — Port B bit 6 |
| Pino 27 | PB7 — Port B bit 7 |
| Pino 28 | PC0 — Port C bit 0 / SPI0 SCK |
| Pino 29 | PC1 — Port C bit 1 / SPI0 MOSI |
| Pino 30 | PC2 — Port C bit 2 / SPI0 MISO |
| Pino 31 | PC3 — Port C bit 3 / SPI0 SS |
| Pino 32 | PC4 — Port C bit 4 |
| Pino 33 | PC5 — Port C bit 5 |
| Pino 34 | PC6 — Port C bit 6 |
| Pino 35 | PC7 — Port C bit 7 |
| Pino 36 | PD0 — Port D bit 0 |
| Pino 37 | PD1 — Port D bit 1 |
| Pino 38 | PD2 — Port D bit 2 |
| Pino 39 | PD3 — Port D bit 3 |
| Pino 40 | PD4 — Port D bit 4 |
| Pino 41 | PD5 — Port D bit 5 |
| Pino 42 | PD6 — Port D bit 6 |
| Pino 43 | PD7 — Port D bit 7 |
| Pino 44 | PE0 — Port E bit 0 / XIRQ |
| Pino 45 | PE1 — Port E bit 1 / IRQ |
| Pino 46 | PE2 — Port E bit 2 |
| Pino 47 | PE3 — Port E bit 3 |
| Pino 48 | PE4 — Port E bit 4 |
| Pino 49 | PE5 — Port E bit 5 |
| Pino 50 | PE6 — Port E bit 6 |
| Pino 51 | PE7 — Port E bit 7 |
| Pino 52 | PF0 — Port F bit 0 / ADC0 ch0 |
| Pino 53 | PF1 — Port F bit 1 / ADC0 ch1 |
| Pino 54 | PF2 — Port F bit 2 / ADC0 ch2 |
| Pino 55 | PF3 — Port F bit 3 / ADC0 ch3 |
| Pino 56 | PF4 — Port F bit 4 / ADC0 ch4 |
| Pino 57 | PF5 — Port F bit 5 / ADC0 ch5 |
| Pino 58 | PF6 — Port F bit 6 / ADC0 ch6 |
| Pino 59 | PF7 — Port F bit 7 / ADC0 ch7 |
| Pino 60 | PG0 — Port G bit 0 |
| Pino 61 | PG1 — Port G bit 1 |
| Pino 62 | PG2 — Port G bit 2 |
| Pino 63 | PG3 — Port G bit 3 |
| Pino 64 | PG4 — Port G bit 4 |
| Pino 65 | PG5 — Port G bit 5 |
| Pino 66 | PG6 — Port G bit 6 |
| Pino 67 | PG7 — Port G bit 7 |
| Pino 68 | PH0 — Port H bit 0 |
| Pino 69 | PH1 — Port H bit 1 |
| Pino 70 | PH2 — Port H bit 2 |
| Pino 71 | PH3 — Port H bit 3 |
| Pino 72 | PH4 — Port H bit 4 |
| Pino 73 | PH5 — Port H bit 5 |
| Pino 74 | PH6 — Port H bit 6 |
| Pino 75 | PH7 — Port H bit 7 |
| Pino 76 | PJ0 — Port J bit 0 |
| Pino 77 | PJ1 — Port J bit 1 |
| Pino 78 | PJ2 — Port J bit 2 |
| Pino 79 | PJ3 — Port J bit 3 |
| Pino 80 | PJ4 — Port J bit 4 |
| Pino 81 | PJ5 — Port J bit 5 |
| Pino 82 | PJ6 — Port J bit 6 |
| Pino 83 | PJ7 — Port J bit 7 |
| Pino 84 | PK0 — Port K bit 0 |
| Pino 85 | PK1 — Port K bit 1 |
| Pino 86 | PK2 — Port K bit 2 |
| Pino 87 | PK3 — Port K bit 3 |
| Pino 88 | PK4 — Port K bit 4 |
| Pino 89 | PK5 — Port K bit 5 |
| Pino 90 | PK6 — Port K bit 6 |
| Pino 91 | PK7 — Port K bit 7 |
| Pino 92 | PAD0 — Port AD bit 0 (key wakeup) |
| Pino 93 | PAD1 — Port AD bit 1 (key wakeup) |
| Pino 94 | PAD8 — Port AD bit 8 (key wakeup) |
| Pino 95 | PAD9 — Port AD bit 9 (key wakeup) |
| Pino 96 | PAD10 — Port AD bit 10 (key wakeup) |
| Pino 97 | PAD11 — Port AD bit 11 (key wakeup) |
| Pino 98 | PAD12 — Port AD bit 12 (key wakeup) |
| Pino 99 | PAD13 — Port AD bit 13 (key wakeup) |
| Pino 100 | PAD14 — Port AD bit 14 (key wakeup) |
| Pino 101 | PAD15 — Port AD bit 15 (key wakeup) |
| Pino 102 | VDDA — Analog supply (5V) |
| Pino 103 | VSSA — Analog ground |
| Pino 104 | VRH — ADC reference high |
| Pino 105 | VRL — ADC reference low |
| Pino 106 | VDD1 — Internal logic supply (decoupled) |
| Pino 107 | VSS2 — Internal ground return |
| Pino 108 | VDD2 — I/O supply (5V) |
| Pino 109 | VSS3 — I/O ground |
| Pino 110 | EXTAL — Oscillator input |
| Pino 111 | XTAL — Oscillator output |
| Pino 112 | ECLK — System clock output |
Aplicações típicas
S912XET256J1MALR é adequado para 6 aplicaçãos: Automotive Body Control Module (BCM), HVAC Control Module, Instrument Cluster, Lighting Control Module, Industrial CAN Node, Automotive Door Module.
Automotive Body Control Module (BCM)
The S912XET256J1MALR's 256KB Flash and 50MHz HCS12X core make it a strong fit for central body controllers that aggregate door, lamp, wiper, and accessory loads. Its integrated MSCAN controllers handle CAN 2.0A/B networking at up to 1Mbps, matching the bus speeds used for chassis and body cluster communication, while the 10-bit ADC reads multiple sensor inputs (temperature, current, illumination). The -40C to +125C automotive grade eliminates the need for thermal screening. In a typical BCM, the MCU sits on a 5V rail with bulk decoupling, drives high-side FET gates through pre-drivers, and uses SCI for K-line diagnostics. Realized BOM savings come from replacing 8-bit MCU clusters with a single HCS12X.
Recomendado
HVAC Control Module
Climate-control ECUs read cabin and duct temperatures, drive blower motor PWM, and communicate on CAN or LIN with the rest of the vehicle. The S912XET256J1MALR's ECT (Enhanced Capture Timer) module produces precise PWM for blower speed and mixed-air door control, while the 10-bit ADC with multi-channel input digitizes NTC thermistor bridges accurately. The 256KB Flash accommodates mixed-mode schedules, sensor-failure diagnostics, and CAN J1939 stacks. Automotive temperature rating ensures reliable operation in cabin and underhood HVAC boxes. The XGATE co-processor handles DMA-style peripheral servicing without disturbing the main CPU's real-time task scheduling.
Recomendado
Instrument Cluster
Instrument clusters must drive stepper motors for gauges and LCD segments for driver information. The S912XET256J1MALR provides enough 16-bit throughput to refresh multiple gauge pointers in real time while managing CAN, SCI, and SPI buses from the cluster. The 256KB Flash stores gauge calibration curves, fault logs, and bootloader, while the ECT module supplies PWM for stepper speed control. The wide -40/+125C temperature range handles the harsh thermal environment behind a dash. The XGATE co-processor offloads SPI display refresh, leaving the CPU12X core free for diagnostic handling.
Recomendado
Lighting Control Module
Adaptive LED and HID lighting modules need fast PWM, low-latency CAN communication, and high-resolution timing. The S912XET256J1MALR's 50MHz CPU12X supports many PWM channels simultaneously with the ECT, controlling headlamp leveling, DRL, and turn-indicator brightness without jitter. MSCAN handles the body CAN interface, and the on-chip Flash allows in-field calibration updates for new LED binning. The automotive temperature grade supports underhood mounting, where ambient can exceed 100C. Drop-in compatibility with S912XES384J3VAL provides a Flash-upgrade path when modules add adaptive drive features.
Recomendado
Industrial CAN Node
Factory-automation peripherals such as motor starters, valve controllers, and remote I/O blocks rely on CANopen or DeviceNet running on CAN. The S912XET256J1MALR offers -40C to +125C headroom and a 50MHz CPU12X capable of running CANopen stacks with PDO mapping. 256KB Flash is sufficient for the protocol stack plus application logic. The 10-bit ADC reads analog sensor inputs and the ECT drives PWMs for proportional valve control. The HCS12X deterministic interrupt response allows industrial-grade timing when the MCU is integrated with EtherCAT or Profibus gateways.
Recomendado
Automotive Door Module
Door modules control window, mirror, lock, and speaker functions and typically communicate with the BCM over CAN or LIN. The S912XET256J1MALR with 256KB Flash handles all four functions in a single MCU, and the 16-bit CPU12X core executes window anti-pinch and obstacle detection algorithms with deterministic timing. The 10-bit ADC monitors current draw for stall detection, while the ECT drives the mirror-fold and window motor PWMs. Automotive -40/+125C temperature grade supports the in-door environment. The XGATE co-processor accelerates SPI comms with companion LIN slaves without increasing CPU load.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para S912XET256J1MALR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | S912XET256J1CALR | S912XDT256F1VAA | S912XES384J3VAL | S912XEG384AVAGR | S912XDT384J1MAG |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same |
| Core | HCS12X (CPU12X + XGATE) | HCS12X (CPU12X + XGATE) | HCS12D (no XGATE) | HCS12X (CPU12X + XGATE) | HCS12X enhanced (CPU12X + XGATE + extras) | HCS12D (no XGATE) |
| Maximum CPU Clock | 50 MHz | 50 MHz | 25 MHz | 50 MHz | 50 MHz | 25 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 384 KB | 384 KB | 384 KB |
| RAM | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Operating Temperature | -40 C to +125 C (Automotive) | -40 C to +85 C (Commercial) | -40 C to +125 C (Automotive) | -40 C to +105 C (Extended) | -40 C to +125 C (Automotive) | -40 C to +125 C (Automotive) |
| CAN Controllers | MSCAN modules (CAN 2.0A/B) | MSCAN modules (CAN 2.0A/B) | MSCAN modules (CAN 2.0A/B) | MSCAN modules (CAN 2.0A/B) | MSCAN modules (CAN 2.0A/B) with enhanced filtering | MSCAN modules (CAN 2.0A/B) |
Principais diferenciais
- 50MHz HCS12X with XGATE co-processor for high-throughput automotive control (vs S912XDT256F1VAA)
- Higher temperature grade -40C to +125C automotive (vs S912XET256J1CALR)
- Larger Flash headroom via same-package S12XE variants (vs S912XES384J3VAL)
- Standard HCS12X peripheral set without XGATE register overhead (vs S912XEG384AVAGR)
Notas de projeto
The S912XET256J1MALR integrates a 5V-to-2.5V voltage regulator for internal logic. Place a 1uF X7R ceramic bypass as close as possible to the VDDR/VDDX pins and a 4.7uF X5R bulk capacitor on the analog VDDA rail. The VDD1/VDD2 pins each need a 100nF decoupling capacitor with trace length below 5mm. The on-chip voltage regulator can source up to 80mA to external loads; budget headroom for peak ADC and ECT transitions.
The 112-LQFP package has a typical theta_JA of 35 C/W (per NXP S12XE thermal modeling) at 100 LFM airflow on a 4-layer JEDEC JESD51 PCB. The MCU dissipates up to 1.2W under full load (50MHz, all peripherals enabled, CAN activity), leading to a junction temperature rise of about 42C. Ensure that ambient + rise stays within -40C to +125C - automotive underhood applications should plan for case temperatures up to +110C.
Route the EXTAL/XTAL traces between the package and the crystal or resonator inside a guard ground ring, with no signals crossing beneath them. Keep the PLL filter capacitor XFC within 8 mm of the pin and route it over a continuous ground plane. Place the VRH/VRL ADC reference bypass capacitors (typically 100nF X7R each) directly at the pins and isolate them from noisy digital returns. Use star grounding to separate VSSA/VRH/VRL returns from digital VSS for noise-sensitive ADC acquisitions.
Do not leave TEST pin floating - tie TEST to VSS for normal operation or VDDX for factory test. The MODC and BKGD pins require external pull-up or pull-down configuration to select the correct boot mode (Normal Single-Chip, Normal Expanded, or Special BDM). The PADx key-wakeup pins must be properly configured as inputs or wakeup sources, and de-bounced, before they are read by application firmware.
Bus signals (CAN, SPI, SCI, IIC) should be routed with a controlled impedance (typically 50 ohms single-ended) over a continuous reference plane. For MSCAN signals, place a TJA1042 or similar CAN transceiver within 50 mm of the CAN TX and RX pins and add a 120 ohm termination resistor across CANH/CANL on each end of the bus. The ECT PWM outputs can produce sharp edges; clamp them with TVS diodes if exposed to automotive transient loads.
Informações de conformidade
Automotive grade qualified per the part number suffix M (AEC-Q100 grade-1 tested). RoHS/REACH compliance data not provided in the verified web data set - consult the NXP product page for the current formal compliance certificate.
