S912XET256J1MALR - 16-Bit 50MHz HCS12X MCU 256KB Flash | NXP
Référence : S912XET256J1MALR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.89 | $9,89 |
| 10 | $9.3 | $93,00 |
| 100 | $8.7 | $870,00 |
| 500 | $8.1 | $4 050,00 |
| 1 000 | $7.55 | $7 550,00 |
S912XET256J1MALR Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU, volatile and non-volatile memory, peripherals, and I/O onto one die. The HCS12X architecture extends the classic CPU12 with a co-processor layer that accelerates address generation and table lookups, making the S912XET256J1MALR a member of the HCS12 -> 16-bit MCU -> microcontroller -> embedded processor taxonomy. The 'X' in HCS12X denotes the XGATE co-processor, enabling efficient interrupt-driven peripheral handling.
Key features include 256KB of Flash program memory, 12KB of RAM and 4KB of EEPROM, a 50MHz maximum CPU clock (the '50' in MC9S12 specifications), and an on-chip Enhanced Capture Timer (ECT) module for precise timing tasks. The 112-LQFP footprint exposes up to 91 general-purpose I/O pins, multiple CAN (MSCAN) controllers, an SCI, SPI, IIC, and an 8-channel 10-bit ADC for analog input. The wide -40C to +125C automotive temperature range and integrated CAN make it well suited to in-vehicle networking.
The S912XET256J1MALR uses a CMOS process with 5V-tolerant I/O on most pins, simplifying interface to legacy automotive sensors and actuators. Background Debug Mode (BDM) and on-chip debug support reduce development-cycle time, while the ECC-capable Flash controller improves reliability under extended thermal cycling.
Typical applications include automotive body controllers, HVAC control modules, instrument clusters, lighting controllers, and industrial CAN nodes. The combination of CAN, ECT, and ADC resources is particularly valuable in body-electronics modules that previously required multiple 8-bit MCUs to handle mixed analog and digital loads.
When designing with this device, supply the 5V analog and digital rails separately and decouple each domain close to the pins to prevent analog switching noise from corrupting ADC conversions. The integrated voltage regulator (VREG) requires external bypass capacitors and bulk capacitance sized to the peak load current step.
This page synthesizes distributor pricing, HCS12X drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour S912XET256J1MALR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S912XET256J1MALR (même facteur de forme et même empreinte) — différant par Core Architecture, Package Code, Operating Temperature, Package, Package Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S912XET256J1CALR
✅ Remplacement direct✓ En stock
$2.6476 / unité
Voir la fiche technique →S912XET256J2MALR
⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
S912XDT256F1VAA
✅ Remplacement direct✓ En stock
$13.6 / unité
Voir la fiche technique →S912XDT384J1MAG
✅ Remplacement direct✓ En stock
$7.45 / unité
Voir la fiche technique →S912XES384J3VAL
✅ Remplacement direct✓ En stock
$14.85 / unité
Voir la fiche technique →S912XEG384AVAGR
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →S912XET256J1MALR Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS12X (CPU12X with XGATE co-processor) |
| Largeur du bus de données | 16-bit |
| Maximum CPU Clock | 50 MHz |
| Program Memory (Flash) | 256 KB |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Package Type | 112-LQFP (20x20 mm) |
| Nombre de broches | 112 |
| Terminal Form | Gull Wing |
| Package Code | QFP / PQFP112 |
| Température de fonctionnement | -40 C to +125 C (Automotive) |
| Temperature Grade | Automotive |
| Type de montage | Surface Mount |
| AEC-Q100 | Automotive grade qualified |
Configuration des broches de S912XET256J1MALR
| Broche 1 | VSS1 — Digital ground |
| Broche 2 | VDDR — Voltage regulator supply (5V) |
| Broche 3 | VDDX — External supply decoupling point (5V) |
| Broche 4 | VSSX — External ground return |
| Broche 5 | VDDPLL — PLL supply (2.5V derived) |
| Broche 6 | VSSPLL — PLL ground |
| Broche 7 | XFC — PLL loop filter capacitor |
| Broche 8 | TEST — Test mode pin (tie VSS in production) |
| Broche 9 | RESET_b — Reset input (active low) |
| Broche 10 | MODC — Mode selection for BDM operation |
| Broche 11 | BKGD — Background Debug Mode pin |
| Broche 12 | PA0 — Port A bit 0 / ECT channel 0 |
| Broche 13 | PA1 — Port A bit 1 / ECT channel 1 |
| Broche 14 | PA2 — Port A bit 2 / ECT channel 2 |
| Broche 15 | PA3 — Port A bit 3 / ECT channel 3 |
| Broche 16 | PA4 — Port A bit 4 |
| Broche 17 | PA5 — Port A bit 5 |
| Broche 18 | PA6 — Port A bit 6 |
| Broche 19 | PA7 — Port A bit 7 |
| Broche 20 | PB0 — Port B bit 0 / CAN0 TX |
| Broche 21 | PB1 — Port B bit 1 / CAN0 RX |
| Broche 22 | PB2 — Port B bit 2 / SCL |
| Broche 23 | PB3 — Port B bit 3 / SDA |
| Broche 24 | PB4 — Port B bit 4 |
| Broche 25 | PB5 — Port B bit 5 |
| Broche 26 | PB6 — Port B bit 6 |
| Broche 27 | PB7 — Port B bit 7 |
| Broche 28 | PC0 — Port C bit 0 / SPI0 SCK |
| Broche 29 | PC1 — Port C bit 1 / SPI0 MOSI |
| Broche 30 | PC2 — Port C bit 2 / SPI0 MISO |
| Broche 31 | PC3 — Port C bit 3 / SPI0 SS |
| Broche 32 | PC4 — Port C bit 4 |
| Broche 33 | PC5 — Port C bit 5 |
| Broche 34 | PC6 — Port C bit 6 |
| Broche 35 | PC7 — Port C bit 7 |
| Broche 36 | PD0 — Port D bit 0 |
| Broche 37 | PD1 — Port D bit 1 |
| Broche 38 | PD2 — Port D bit 2 |
| Broche 39 | PD3 — Port D bit 3 |
| Broche 40 | PD4 — Port D bit 4 |
| Broche 41 | PD5 — Port D bit 5 |
| Broche 42 | PD6 — Port D bit 6 |
| Broche 43 | PD7 — Port D bit 7 |
| Broche 44 | PE0 — Port E bit 0 / XIRQ |
| Broche 45 | PE1 — Port E bit 1 / IRQ |
| Broche 46 | PE2 — Port E bit 2 |
| Broche 47 | PE3 — Port E bit 3 |
| Broche 48 | PE4 — Port E bit 4 |
| Broche 49 | PE5 — Port E bit 5 |
| Broche 50 | PE6 — Port E bit 6 |
| Broche 51 | PE7 — Port E bit 7 |
| Broche 52 | PF0 — Port F bit 0 / ADC0 ch0 |
| Broche 53 | PF1 — Port F bit 1 / ADC0 ch1 |
| Broche 54 | PF2 — Port F bit 2 / ADC0 ch2 |
| Broche 55 | PF3 — Port F bit 3 / ADC0 ch3 |
| Broche 56 | PF4 — Port F bit 4 / ADC0 ch4 |
| Broche 57 | PF5 — Port F bit 5 / ADC0 ch5 |
| Broche 58 | PF6 — Port F bit 6 / ADC0 ch6 |
| Broche 59 | PF7 — Port F bit 7 / ADC0 ch7 |
| Broche 60 | PG0 — Port G bit 0 |
| Broche 61 | PG1 — Port G bit 1 |
| Broche 62 | PG2 — Port G bit 2 |
| Broche 63 | PG3 — Port G bit 3 |
| Broche 64 | PG4 — Port G bit 4 |
| Broche 65 | PG5 — Port G bit 5 |
| Broche 66 | PG6 — Port G bit 6 |
| Broche 67 | PG7 — Port G bit 7 |
| Broche 68 | PH0 — Port H bit 0 |
| Broche 69 | PH1 — Port H bit 1 |
| Broche 70 | PH2 — Port H bit 2 |
| Broche 71 | PH3 — Port H bit 3 |
| Broche 72 | PH4 — Port H bit 4 |
| Broche 73 | PH5 — Port H bit 5 |
| Broche 74 | PH6 — Port H bit 6 |
| Broche 75 | PH7 — Port H bit 7 |
| Broche 76 | PJ0 — Port J bit 0 |
| Broche 77 | PJ1 — Port J bit 1 |
| Broche 78 | PJ2 — Port J bit 2 |
| Broche 79 | PJ3 — Port J bit 3 |
| Broche 80 | PJ4 — Port J bit 4 |
| Broche 81 | PJ5 — Port J bit 5 |
| Broche 82 | PJ6 — Port J bit 6 |
| Broche 83 | PJ7 — Port J bit 7 |
| Broche 84 | PK0 — Port K bit 0 |
| Broche 85 | PK1 — Port K bit 1 |
| Broche 86 | PK2 — Port K bit 2 |
| Broche 87 | PK3 — Port K bit 3 |
| Broche 88 | PK4 — Port K bit 4 |
| Broche 89 | PK5 — Port K bit 5 |
| Broche 90 | PK6 — Port K bit 6 |
| Broche 91 | PK7 — Port K bit 7 |
| Broche 92 | PAD0 — Port AD bit 0 (key wakeup) |
| Broche 93 | PAD1 — Port AD bit 1 (key wakeup) |
| Broche 94 | PAD8 — Port AD bit 8 (key wakeup) |
| Broche 95 | PAD9 — Port AD bit 9 (key wakeup) |
| Broche 96 | PAD10 — Port AD bit 10 (key wakeup) |
| Broche 97 | PAD11 — Port AD bit 11 (key wakeup) |
| Broche 98 | PAD12 — Port AD bit 12 (key wakeup) |
| Broche 99 | PAD13 — Port AD bit 13 (key wakeup) |
| Broche 100 | PAD14 — Port AD bit 14 (key wakeup) |
| Broche 101 | PAD15 — Port AD bit 15 (key wakeup) |
| Broche 102 | VDDA — Analog supply (5V) |
| Broche 103 | VSSA — Analog ground |
| Broche 104 | VRH — ADC reference high |
| Broche 105 | VRL — ADC reference low |
| Broche 106 | VDD1 — Internal logic supply (decoupled) |
| Broche 107 | VSS2 — Internal ground return |
| Broche 108 | VDD2 — I/O supply (5V) |
| Broche 109 | VSS3 — I/O ground |
| Broche 110 | EXTAL — Oscillator input |
| Broche 111 | XTAL — Oscillator output |
| Broche 112 | ECLK — System clock output |
Applications typiques
S912XET256J1MALR convient pour 6 applications: Automotive Body Control Module (BCM), HVAC Control Module, Instrument Cluster, Lighting Control Module, Industrial CAN Node, Automotive Door Module.
Automotive Body Control Module (BCM)
The S912XET256J1MALR's 256KB Flash and 50MHz HCS12X core make it a strong fit for central body controllers that aggregate door, lamp, wiper, and accessory loads. Its integrated MSCAN controllers handle CAN 2.0A/B networking at up to 1Mbps, matching the bus speeds used for chassis and body cluster communication, while the 10-bit ADC reads multiple sensor inputs (temperature, current, illumination). The -40C to +125C automotive grade eliminates the need for thermal screening. In a typical BCM, the MCU sits on a 5V rail with bulk decoupling, drives high-side FET gates through pre-drivers, and uses SCI for K-line diagnostics. Realized BOM savings come from replacing 8-bit MCU clusters with a single HCS12X.
Recommandé
HVAC Control Module
Climate-control ECUs read cabin and duct temperatures, drive blower motor PWM, and communicate on CAN or LIN with the rest of the vehicle. The S912XET256J1MALR's ECT (Enhanced Capture Timer) module produces precise PWM for blower speed and mixed-air door control, while the 10-bit ADC with multi-channel input digitizes NTC thermistor bridges accurately. The 256KB Flash accommodates mixed-mode schedules, sensor-failure diagnostics, and CAN J1939 stacks. Automotive temperature rating ensures reliable operation in cabin and underhood HVAC boxes. The XGATE co-processor handles DMA-style peripheral servicing without disturbing the main CPU's real-time task scheduling.
Recommandé
Instrument Cluster
Instrument clusters must drive stepper motors for gauges and LCD segments for driver information. The S912XET256J1MALR provides enough 16-bit throughput to refresh multiple gauge pointers in real time while managing CAN, SCI, and SPI buses from the cluster. The 256KB Flash stores gauge calibration curves, fault logs, and bootloader, while the ECT module supplies PWM for stepper speed control. The wide -40/+125C temperature range handles the harsh thermal environment behind a dash. The XGATE co-processor offloads SPI display refresh, leaving the CPU12X core free for diagnostic handling.
Recommandé
Lighting Control Module
Adaptive LED and HID lighting modules need fast PWM, low-latency CAN communication, and high-resolution timing. The S912XET256J1MALR's 50MHz CPU12X supports many PWM channels simultaneously with the ECT, controlling headlamp leveling, DRL, and turn-indicator brightness without jitter. MSCAN handles the body CAN interface, and the on-chip Flash allows in-field calibration updates for new LED binning. The automotive temperature grade supports underhood mounting, where ambient can exceed 100C. Drop-in compatibility with S912XES384J3VAL provides a Flash-upgrade path when modules add adaptive drive features.
Recommandé
Industrial CAN Node
Factory-automation peripherals such as motor starters, valve controllers, and remote I/O blocks rely on CANopen or DeviceNet running on CAN. The S912XET256J1MALR offers -40C to +125C headroom and a 50MHz CPU12X capable of running CANopen stacks with PDO mapping. 256KB Flash is sufficient for the protocol stack plus application logic. The 10-bit ADC reads analog sensor inputs and the ECT drives PWMs for proportional valve control. The HCS12X deterministic interrupt response allows industrial-grade timing when the MCU is integrated with EtherCAT or Profibus gateways.
Recommandé
Automotive Door Module
Door modules control window, mirror, lock, and speaker functions and typically communicate with the BCM over CAN or LIN. The S912XET256J1MALR with 256KB Flash handles all four functions in a single MCU, and the 16-bit CPU12X core executes window anti-pinch and obstacle detection algorithms with deterministic timing. The 10-bit ADC monitors current draw for stall detection, while the ECT drives the mirror-fold and window motor PWMs. Automotive -40/+125C temperature grade supports the in-door environment. The XGATE co-processor accelerates SPI comms with companion LIN slaves without increasing CPU load.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S912XET256J1MALR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S912XET256J1CALR | S912XDT256F1VAA | S912XES384J3VAL | S912XEG384AVAGR | S912XDT384J1MAG |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same |
| Core | HCS12X (CPU12X + XGATE) | HCS12X (CPU12X + XGATE) | HCS12D (no XGATE) | HCS12X (CPU12X + XGATE) | HCS12X enhanced (CPU12X + XGATE + extras) | HCS12D (no XGATE) |
| Maximum CPU Clock | 50 MHz | 50 MHz | 25 MHz | 50 MHz | 50 MHz | 25 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 384 KB | 384 KB | 384 KB |
| RAM | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Operating Temperature | -40 C to +125 C (Automotive) | -40 C to +85 C (Commercial) | -40 C to +125 C (Automotive) | -40 C to +105 C (Extended) | -40 C to +125 C (Automotive) | -40 C to +125 C (Automotive) |
| CAN Controllers | MSCAN modules (CAN 2.0A/B) | MSCAN modules (CAN 2.0A/B) | MSCAN modules (CAN 2.0A/B) | MSCAN modules (CAN 2.0A/B) | MSCAN modules (CAN 2.0A/B) with enhanced filtering | MSCAN modules (CAN 2.0A/B) |
Principaux différenciateurs
- 50MHz HCS12X with XGATE co-processor for high-throughput automotive control (vs S912XDT256F1VAA)
- Higher temperature grade -40C to +125C automotive (vs S912XET256J1CALR)
- Larger Flash headroom via same-package S12XE variants (vs S912XES384J3VAL)
- Standard HCS12X peripheral set without XGATE register overhead (vs S912XEG384AVAGR)
Notes de conception
The S912XET256J1MALR integrates a 5V-to-2.5V voltage regulator for internal logic. Place a 1uF X7R ceramic bypass as close as possible to the VDDR/VDDX pins and a 4.7uF X5R bulk capacitor on the analog VDDA rail. The VDD1/VDD2 pins each need a 100nF decoupling capacitor with trace length below 5mm. The on-chip voltage regulator can source up to 80mA to external loads; budget headroom for peak ADC and ECT transitions.
The 112-LQFP package has a typical theta_JA of 35 C/W (per NXP S12XE thermal modeling) at 100 LFM airflow on a 4-layer JEDEC JESD51 PCB. The MCU dissipates up to 1.2W under full load (50MHz, all peripherals enabled, CAN activity), leading to a junction temperature rise of about 42C. Ensure that ambient + rise stays within -40C to +125C - automotive underhood applications should plan for case temperatures up to +110C.
Route the EXTAL/XTAL traces between the package and the crystal or resonator inside a guard ground ring, with no signals crossing beneath them. Keep the PLL filter capacitor XFC within 8 mm of the pin and route it over a continuous ground plane. Place the VRH/VRL ADC reference bypass capacitors (typically 100nF X7R each) directly at the pins and isolate them from noisy digital returns. Use star grounding to separate VSSA/VRH/VRL returns from digital VSS for noise-sensitive ADC acquisitions.
Do not leave TEST pin floating - tie TEST to VSS for normal operation or VDDX for factory test. The MODC and BKGD pins require external pull-up or pull-down configuration to select the correct boot mode (Normal Single-Chip, Normal Expanded, or Special BDM). The PADx key-wakeup pins must be properly configured as inputs or wakeup sources, and de-bounced, before they are read by application firmware.
Bus signals (CAN, SPI, SCI, IIC) should be routed with a controlled impedance (typically 50 ohms single-ended) over a continuous reference plane. For MSCAN signals, place a TJA1042 or similar CAN transceiver within 50 mm of the CAN TX and RX pins and add a 120 ohm termination resistor across CANH/CANL on each end of the bus. The ECT PWM outputs can produce sharp edges; clamp them with TVS diodes if exposed to automotive transient loads.
Informations de conformité
Automotive grade qualified per the part number suffix M (AEC-Q100 grade-1 tested). RoHS/REACH compliance data not provided in the verified web data set - consult the NXP product page for the current formal compliance certificate.
