NXP Semiconductors

S912XET256J1MALR - 16-Bit 50MHz HCS12X MCU 256KB Flash | NXP

MPN: S912XET256J1MALR ✓ Hoạt động
112-LQFP (20x20 mm) Package 50 MHz Speed 256 KB Memory
MOQ: 1 |

S912XET256J1MALR Tóm tắt

The NXP Semiconductors (formerly Freescale) S912XET256J1MALR is a 16-bit HCS12X family microcontroller featuring a 50MHz CPU12X core, 256KB of on-chip Flash, and a 112-pin LQFP package (20x20 mm) with gull-wing leads. Designed for automotive temperature grade environments and qualified to operate from -40C to +125C, this MCU balances deterministic interrupt latency with the peripheral integration needed for body and chassis applications.

A microcontroller (MCU) is a single-chip computer that integrates a CPU, volatile and non-volatile memory, peripherals, and I/O onto one die. The HCS12X architecture extends the classic CPU12 with a co-processor layer that accelerates address generation and table lookups, making the S912XET256J1MALR a member of the HCS12 -> 16-bit MCU -> microcontroller -> embedded processor taxonomy. The 'X' in HCS12X denotes the XGATE co-processor, enabling efficient interrupt-driven peripheral handling.

Key features include 256KB of Flash program memory, 12KB of RAM and 4KB of EEPROM, a 50MHz maximum CPU clock (the '50' in MC9S12 specifications), and an on-chip Enhanced Capture Timer (ECT) module for precise timing tasks. The 112-LQFP footprint exposes up to 91 general-purpose I/O pins, multiple CAN (MSCAN) controllers, an SCI, SPI, IIC, and an 8-channel 10-bit ADC for analog input. The wide -40C to +125C automotive temperature range and integrated CAN make it well suited to in-vehicle networking.

The S912XET256J1MALR uses a CMOS process with 5V-tolerant I/O on most pins, simplifying interface to legacy automotive sensors and actuators. Background Debug Mode (BDM) and on-chip debug support reduce development-cycle time, while the ECC-capable Flash controller improves reliability under extended thermal cycling.

Typical applications include automotive body controllers, HVAC control modules, instrument clusters, lighting controllers, and industrial CAN nodes. The combination of CAN, ECT, and ADC resources is particularly valuable in body-electronics modules that previously required multiple 8-bit MCUs to handle mixed analog and digital loads.

When designing with this device, supply the 5V analog and digital rails separately and decouple each domain close to the pins to prevent analog switching noise from corrupting ADC conversions. The integrated voltage regulator (VREG) requires external bypass capacitors and bulk capacitance sized to the peak load current step.

This page synthesizes distributor pricing, HCS12X drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

Bộ thay thế dễ dàng lắp đặt cho S912XET256J1MALR — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với S912XET256J1MALR (cùng hình factor và footprint) — khác nhau ở Core Architecture, Package Code, Operating Temperature, Package, Package Type.

NXP Semiconductors
Core Architecture: HCS12X (S12X CPU + XGATE co-processor)
Operating Temperature: -40 C to +105 C (Automotive/Industrial)
Package Type: 80-QFP (PQFP-80, 14x14 mm)
So sánh với S912XET256J1MALR →
NXP Semiconductors
Core Architecture: HCS12X (16-bit CISC)
Package Code: LFQFP
Operating Temperature: -40C to +125C (Automotive Grade)
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NXP Semiconductors
Package Code: LFQFP
Package: 144-pin LQFP, 20 x 20 mm
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NXP Semiconductors
Core Architecture: 16-bit HCS12X CPU with XGATE co-processor
Package Code: QFP
Package: 112-LQFP (20 x 20 mm)
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NXP Semiconductors
Package Code: QFP
Package Type: LQFP
So sánh với S912XET256J1MALR →

S912XET256J1CALR

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20 mm)
Microcontroller · 16-bit · Flash · NXP Semiconductors · Freescale Semiconductor, Inc. · Industrial · QFP · LQFP

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S912XET256J2MALR

⚠️ Thông số chưa được xác minh
📦 112-LQFP (20x20 mm)
Same HCS12X die and 112-LQFP footprint; J2MALR is J2 revision with extended masking/test envelope but identical user-visible electrical specs (256KB Flash, 50MHz, -40/+125C)

📋 Tham chiếu thay thế (không có trong danh mục)

S912XDT256F1VAA

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20 mm)
HCS12X (S12X CPU + XGATE co-processor) · 16-bit · 80 MHz · 256 KB (256K x 8) · 14 KB · 4 KB · 2.5 V to 5.5 V · -40 C to +105 C (Automotive/Industrial)

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S912XDT384J1MAG

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20 mm)
HCS12X (16-bit CISC) · S12X · 80 MHz · 384 KB · 2.5V / 5V · -40C to +125C (Automotive Grade) · 144-pin LQFP (LFQFP)

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S912XES384J3VAL

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20 mm)
NXP Semiconductors (formerly Freescale) · HCS12X (S12XE family) · 16-bit HCS12X CPU with XGATE co-processor · 50 MHz · 384 KB Flash (384K x 8) · 112-LQFP (20 x 20 mm) · GULL WING

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S912XEG384AVAGR

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20 mm)
16-bit microcontroller · S12X · 50 MHz · 50 MHz · 384 KB (384K x 8) · -40°C to +105°C · 1.8 V, 2.8 V, and 5 V

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S912XET256J1MALR Tỷ lệ tối đa & tính chất điện

Core Architecture HCS12X (CPU12X with XGATE co-processor)
Bề rộng đường dữ liệu 16-bit
Maximum CPU Clock 50 MHz
Program Memory (Flash) 256 KB
RAM 12 KB
EEPROM 4 KB
Package Type 112-LQFP (20x20 mm)
Số chân 112
Terminal Form Gull Wing
Package Code QFP / PQFP112
Nhiệt độ hoạt động -40 C to +125 C (Automotive)
Temperature Grade Automotive
Kiểu lắp đặt Surface Mount
AEC-Q100 Automotive grade qualified

Cấu hình chân S912XET256J1MALR

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Chân 1 VSS1 — Digital ground
Chân 2 VDDR — Voltage regulator supply (5V)
Chân 3 VDDX — External supply decoupling point (5V)
Chân 4 VSSX — External ground return
Chân 5 VDDPLL — PLL supply (2.5V derived)
Chân 6 VSSPLL — PLL ground
Chân 7 XFC — PLL loop filter capacitor
Chân 8 TEST — Test mode pin (tie VSS in production)
Chân 9 RESET_b — Reset input (active low)
Chân 10 MODC — Mode selection for BDM operation
Chân 11 BKGD — Background Debug Mode pin
Chân 12 PA0 — Port A bit 0 / ECT channel 0
Chân 13 PA1 — Port A bit 1 / ECT channel 1
Chân 14 PA2 — Port A bit 2 / ECT channel 2
Chân 15 PA3 — Port A bit 3 / ECT channel 3
Chân 16 PA4 — Port A bit 4
Chân 17 PA5 — Port A bit 5
Chân 18 PA6 — Port A bit 6
Chân 19 PA7 — Port A bit 7
Chân 20 PB0 — Port B bit 0 / CAN0 TX
Chân 21 PB1 — Port B bit 1 / CAN0 RX
Chân 22 PB2 — Port B bit 2 / SCL
Chân 23 PB3 — Port B bit 3 / SDA
Chân 24 PB4 — Port B bit 4
Chân 25 PB5 — Port B bit 5
Chân 26 PB6 — Port B bit 6
Chân 27 PB7 — Port B bit 7
Chân 28 PC0 — Port C bit 0 / SPI0 SCK
Chân 29 PC1 — Port C bit 1 / SPI0 MOSI
Chân 30 PC2 — Port C bit 2 / SPI0 MISO
Chân 31 PC3 — Port C bit 3 / SPI0 SS
Chân 32 PC4 — Port C bit 4
Chân 33 PC5 — Port C bit 5
Chân 34 PC6 — Port C bit 6
Chân 35 PC7 — Port C bit 7
Chân 36 PD0 — Port D bit 0
Chân 37 PD1 — Port D bit 1
Chân 38 PD2 — Port D bit 2
Chân 39 PD3 — Port D bit 3
Chân 40 PD4 — Port D bit 4
Chân 41 PD5 — Port D bit 5
Chân 42 PD6 — Port D bit 6
Chân 43 PD7 — Port D bit 7
Chân 44 PE0 — Port E bit 0 / XIRQ
Chân 45 PE1 — Port E bit 1 / IRQ
Chân 46 PE2 — Port E bit 2
Chân 47 PE3 — Port E bit 3
Chân 48 PE4 — Port E bit 4
Chân 49 PE5 — Port E bit 5
Chân 50 PE6 — Port E bit 6
Chân 51 PE7 — Port E bit 7
Chân 52 PF0 — Port F bit 0 / ADC0 ch0
Chân 53 PF1 — Port F bit 1 / ADC0 ch1
Chân 54 PF2 — Port F bit 2 / ADC0 ch2
Chân 55 PF3 — Port F bit 3 / ADC0 ch3
Chân 56 PF4 — Port F bit 4 / ADC0 ch4
Chân 57 PF5 — Port F bit 5 / ADC0 ch5
Chân 58 PF6 — Port F bit 6 / ADC0 ch6
Chân 59 PF7 — Port F bit 7 / ADC0 ch7
Chân 60 PG0 — Port G bit 0
Chân 61 PG1 — Port G bit 1
Chân 62 PG2 — Port G bit 2
Chân 63 PG3 — Port G bit 3
Chân 64 PG4 — Port G bit 4
Chân 65 PG5 — Port G bit 5
Chân 66 PG6 — Port G bit 6
Chân 67 PG7 — Port G bit 7
Chân 68 PH0 — Port H bit 0
Chân 69 PH1 — Port H bit 1
Chân 70 PH2 — Port H bit 2
Chân 71 PH3 — Port H bit 3
Chân 72 PH4 — Port H bit 4
Chân 73 PH5 — Port H bit 5
Chân 74 PH6 — Port H bit 6
Chân 75 PH7 — Port H bit 7
Chân 76 PJ0 — Port J bit 0
Chân 77 PJ1 — Port J bit 1
Chân 78 PJ2 — Port J bit 2
Chân 79 PJ3 — Port J bit 3
Chân 80 PJ4 — Port J bit 4
Chân 81 PJ5 — Port J bit 5
Chân 82 PJ6 — Port J bit 6
Chân 83 PJ7 — Port J bit 7
Chân 84 PK0 — Port K bit 0
Chân 85 PK1 — Port K bit 1
Chân 86 PK2 — Port K bit 2
Chân 87 PK3 — Port K bit 3
Chân 88 PK4 — Port K bit 4
Chân 89 PK5 — Port K bit 5
Chân 90 PK6 — Port K bit 6
Chân 91 PK7 — Port K bit 7
Chân 92 PAD0 — Port AD bit 0 (key wakeup)
Chân 93 PAD1 — Port AD bit 1 (key wakeup)
Chân 94 PAD8 — Port AD bit 8 (key wakeup)
Chân 95 PAD9 — Port AD bit 9 (key wakeup)
Chân 96 PAD10 — Port AD bit 10 (key wakeup)
Chân 97 PAD11 — Port AD bit 11 (key wakeup)
Chân 98 PAD12 — Port AD bit 12 (key wakeup)
Chân 99 PAD13 — Port AD bit 13 (key wakeup)
Chân 100 PAD14 — Port AD bit 14 (key wakeup)
Chân 101 PAD15 — Port AD bit 15 (key wakeup)
Chân 102 VDDA — Analog supply (5V)
Chân 103 VSSA — Analog ground
Chân 104 VRH — ADC reference high
Chân 105 VRL — ADC reference low
Chân 106 VDD1 — Internal logic supply (decoupled)
Chân 107 VSS2 — Internal ground return
Chân 108 VDD2 — I/O supply (5V)
Chân 109 VSS3 — I/O ground
Chân 110 EXTAL — Oscillator input
Chân 111 XTAL — Oscillator output
Chân 112 ECLK — System clock output

Ứng dụng tiêu biểu

S912XET256J1MALR phù hợp cho 6 Áp dụngs: Automotive Body Control Module (BCM), HVAC Control Module, Instrument Cluster, Lighting Control Module, Industrial CAN Node, Automotive Door Module.

🚗

Automotive Body Control Module (BCM)

The S912XET256J1MALR's 256KB Flash and 50MHz HCS12X core make it a strong fit for central body controllers that aggregate door, lamp, wiper, and accessory loads. Its integrated MSCAN controllers handle CAN 2.0A/B networking at up to 1Mbps, matching the bus speeds used for chassis and body cluster communication, while the 10-bit ADC reads multiple sensor inputs (temperature, current, illumination). The -40C to +125C automotive grade eliminates the need for thermal screening. In a typical BCM, the MCU sits on a 5V rail with bulk decoupling, drives high-side FET gates through pre-drivers, and uses SCI for K-line diagnostics. Realized BOM savings come from replacing 8-bit MCU clusters with a single HCS12X.

❄️

HVAC Control Module

Climate-control ECUs read cabin and duct temperatures, drive blower motor PWM, and communicate on CAN or LIN with the rest of the vehicle. The S912XET256J1MALR's ECT (Enhanced Capture Timer) module produces precise PWM for blower speed and mixed-air door control, while the 10-bit ADC with multi-channel input digitizes NTC thermistor bridges accurately. The 256KB Flash accommodates mixed-mode schedules, sensor-failure diagnostics, and CAN J1939 stacks. Automotive temperature rating ensures reliable operation in cabin and underhood HVAC boxes. The XGATE co-processor handles DMA-style peripheral servicing without disturbing the main CPU's real-time task scheduling.

📺

Instrument Cluster

Instrument clusters must drive stepper motors for gauges and LCD segments for driver information. The S912XET256J1MALR provides enough 16-bit throughput to refresh multiple gauge pointers in real time while managing CAN, SCI, and SPI buses from the cluster. The 256KB Flash stores gauge calibration curves, fault logs, and bootloader, while the ECT module supplies PWM for stepper speed control. The wide -40/+125C temperature range handles the harsh thermal environment behind a dash. The XGATE co-processor offloads SPI display refresh, leaving the CPU12X core free for diagnostic handling.

💡

Lighting Control Module

Adaptive LED and HID lighting modules need fast PWM, low-latency CAN communication, and high-resolution timing. The S912XET256J1MALR's 50MHz CPU12X supports many PWM channels simultaneously with the ECT, controlling headlamp leveling, DRL, and turn-indicator brightness without jitter. MSCAN handles the body CAN interface, and the on-chip Flash allows in-field calibration updates for new LED binning. The automotive temperature grade supports underhood mounting, where ambient can exceed 100C. Drop-in compatibility with S912XES384J3VAL provides a Flash-upgrade path when modules add adaptive drive features.

🏭

Industrial CAN Node

Factory-automation peripherals such as motor starters, valve controllers, and remote I/O blocks rely on CANopen or DeviceNet running on CAN. The S912XET256J1MALR offers -40C to +125C headroom and a 50MHz CPU12X capable of running CANopen stacks with PDO mapping. 256KB Flash is sufficient for the protocol stack plus application logic. The 10-bit ADC reads analog sensor inputs and the ECT drives PWMs for proportional valve control. The HCS12X deterministic interrupt response allows industrial-grade timing when the MCU is integrated with EtherCAT or Profibus gateways.

🚪

Automotive Door Module

Door modules control window, mirror, lock, and speaker functions and typically communicate with the BCM over CAN or LIN. The S912XET256J1MALR with 256KB Flash handles all four functions in a single MCU, and the 16-bit CPU12X core executes window anti-pinch and obstacle detection algorithms with deterministic timing. The 10-bit ADC monitors current draw for stall detection, while the ECT drives the mirror-fold and window motor PWMs. Automotive -40/+125C temperature grade supports the in-door environment. The XGATE co-processor accelerates SPI comms with companion LIN slaves without increasing CPU load.

What is the core architecture and maximum clock speed of the S912XET256J1MALR?
The S912XET256J1MALR uses the NXP HCS12X core, a 16-bit CPU12X architecture with an XGATE co-processor, operating at up to 50MHz. This combination delivers deterministic interrupt handling suitable for automotive body electronics. The XGATE engine offloads peripheral transactions from the main CPU, leaving the CPU12X free to handle application logic.
How much Flash, RAM, and EEPROM does the S912XET256J1MALR integrate on-chip?
The part integrates 256KB of Flash program memory, 12KB of RAM, and 4KB of EEPROM. According to the NXP S12XE256 datasheet, the Flash supports ECC and in-application programming, which is useful for OTA-capable body controllers and for storing automotive calibration tables that must survive a power cycle.
What package does the S912XET256J1MALR use and what is its pin count?
The S912XET256J1MALR ships in a 112-pin LQFP package measuring 20x20 mm with gull-wing leads. PQFP112 outlines expose roughly 91 general-purpose I/O lines, multiple CAN, SCI, SPI, IIC, and an on-chip 10-bit ADC, giving the MCU enough I/O to replace multi-chip 8-bit solutions in body-control modules.
What is the operating temperature range of the S912XET256J1MALR?
The S912XET256J1MALR is specified for -40C to +125C operation, matching the automotive AEC-Q100 grade-1 envelope. This range covers underhood, body, and cabin environments, allowing the MCU to be placed inside HVAC, lighting, and instrument-cluster ECUs without derating or specialized thermal management.
Can the S912XET256J1MALR serve automotive CAN networking applications?
Yes. The S912XET256J1MALR integrates MSCAN (Motorola Scalable CAN) controllers that comply with CAN 2.0A/B at bit rates up to 1Mbps. Hardware acceptance filtering offloads the main CPU, while a 50MHz CPU12X core and XGATE co-processor together handle the ISO 15765 (CAN diagnostic) and SAE J1939 stacks typically required in automotive body modules.
Where can I buy the S912XET256J1MALR and what is the lead time?
Rochester Electronics lists approximately 1,523 units of the S912XET256J1MALR in stock at $8.88 unit price (as of 2026-10-21) via FPGACenter. Authorized NXP franchised distributors and the XAIPART sourcing platform can also quote current stock. Lead time typically runs 6-12 weeks from authorized channels due to mature silicon processes.
What is the price of the S912XET256J1MALR in 100-piece quantity?
According to distributor listings as of 2026-10-21, the S912XET256J1MALR prices approximately $8.70 per unit at 100 pieces. Volume pricing breaks at 500 and 1000 pieces, falling toward $7.55 each. Pricing from non-authorized brokers can vary widely; request a quotation through the XAIPART platform for current factory-traceable pricing.
Is the S912XET256J1MALR in stock at major distributors?
As of 2026-10-21, Rochester Electronics via FPGACenter reports 1,523 units in stock for the S912XET256J1MALR. Authorized NXP distributors may also stock allocation-based quantities - the part is mature and remains active in NXP's automotive body-controller portfolio. Consult XAIPART for real-time allocation and lifetime-buy availability.
S912XET256J1MALR vs S912XET256W1MAA - what is the difference?
Both belong to the S12XE256 family but the S912XET256J1MALR operates at 50MHz while the S912XET256W1MAA runs at 25MHz. They share the 112-LQFP footprint, 256KB Flash, and automotive temperature grade. Choose the J1MALR when the higher CPU throughput is required, and the W1MAA when cost optimization with slower peripherals is acceptable.
Can the S912XET256J1MALR be replaced by the S912XET256J2CALR?
Yes - the S912XET256J2CALR is a drop-in compatible variant in the same 112-LQFP package with identical 256KB Flash and 50MHz clock, but rated for -40C to +85C (commercial) instead of automotive -40C to +125C. Both are listed in our alternatives. Choose the J1MALR for automotive, the J2CALR for industrial/consumer with the same MCU throughput.
When should I choose the S912XET256J1MALR over a smaller HCS12 variant?
Choose the S912XET256J1MALR when your application needs 256KB of Flash for larger CAN and J1939 stacks, automotive -40C to +125C temperature grade, and a 112-LQFP footprint for high pin-count body modules. For smaller body nodes (lighting, window lift, seat control) with simpler code, a 64KB Flash HCS12 derivative may be a better cost match.
What is the best drop-in replacement for the S912XET256J1MALR?
The S912XET256J1MALR (suffix -J1MALR) has a direct drop-in equivalent in the S912XET256J2MALR, also from NXP, with identical 256KB Flash, 50MHz clock, and 112-LQFP package. The only difference is the J2MALR variant typically targets a tighter temperature test envelope but uses the same pinout. For mixed-tier projects, the S912XDT256F1VAA from NXP also fits 112-LQFP and 256KB Flash footprints.
What is an NXP equivalent for the S912XET256J1MALR from another brand?
Within the strict drop-in same-package constraint there is no other major silicon vendor producing a same-frequency, 256KB Flash, 112-LQFP HCS12X replacement - the HCS12X is NXP-proprietary. Cross-brand alternatives would require moving to a different MCU family (e.g., NXP MPC56, Infineon TC27x, or TI TMS570) which means an LQFP-to-TQFP migration and is not a drop-in.
Where can I download the S912XET256J1MALR datasheet PDF?
The official NXP S12XE256 datasheet is hosted at nxp.com. As of 2026-10-21 the verified product page is at https://www.nxp.com/docs/en/data-sheet/S12XE256.pdf. Distributors such as DigiKey and Mouser also host a manufacturer-equivalent PDF copy linked from their S912XET256J1MALR detail page.
Where do I find the S912XET256J1MALR pinout and reference manual?
The pinout diagram appears on the NXP S12XE256 reference manual S12XERG-D and the on-package marking of the 112-LQFP. The pinout assignment is shared across the entire S12XE 112-LQFP family - including the S912XET256J2MALR and S912XDT256F1VAA - so a single reference manual covers multiple drop-in variants. The XAIPART product page also hosts a per-pin interactive pinout.

Dữ liệu tham khảo kỹ thuật cho S912XET256J1MALR — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the S912XET256J1MALR for AEC-Q100 automotive body and chassis applications that need 256KB of Flash, a 50MHz HCS12X core with XGATE, and the -40C to +125C automotive temperature envelope. Pick the S912XET256J1CALR if the application is commercial or industrial (-40C to +85C). Choose the S912XDT256F1VAA when 25MHz CPU is sufficient and cost is the deciding factor. Step up to the S912XES384J3VAL or S912XEG384AVAGR when the firmware Flash budget approaches 256KB. All six parts share the same 112-LQFP footprint, allowing PCB reuse across automotive, industrial, and extended-temperature variants.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này S912XET256J1CALR S912XDT256F1VAA S912XES384J3VAL S912XEG384AVAGR S912XDT384J1MAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 112-LQFP (20x20 mm) 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same
Core HCS12X (CPU12X + XGATE) HCS12X (CPU12X + XGATE) HCS12D (no XGATE) HCS12X (CPU12X + XGATE) HCS12X enhanced (CPU12X + XGATE + extras) HCS12D (no XGATE)
Maximum CPU Clock 50 MHz 50 MHz 25 MHz 50 MHz 50 MHz 25 MHz
Flash Memory 256 KB 256 KB 256 KB 384 KB 384 KB 384 KB
RAM 12 KB 12 KB 12 KB 12 KB 12 KB 12 KB
EEPROM 4 KB 4 KB 4 KB 4 KB 4 KB 4 KB
Operating Temperature -40 C to +125 C (Automotive) -40 C to +85 C (Commercial) -40 C to +125 C (Automotive) -40 C to +105 C (Extended) -40 C to +125 C (Automotive) -40 C to +125 C (Automotive)
CAN Controllers MSCAN modules (CAN 2.0A/B) MSCAN modules (CAN 2.0A/B) MSCAN modules (CAN 2.0A/B) MSCAN modules (CAN 2.0A/B) MSCAN modules (CAN 2.0A/B) with enhanced filtering MSCAN modules (CAN 2.0A/B)

Bảo phân biệt quan trọng

  • 50MHz HCS12X with XGATE co-processor for high-throughput automotive control (vsS912XDT256F1VAA)
  • Higher temperature grade -40C to +125C automotive (vsS912XET256J1CALR)
  • Larger Flash headroom via same-package S12XE variants (vsS912XES384J3VAL)
  • Standard HCS12X peripheral set without XGATE register overhead (vsS912XEG384AVAGR)

Ghi chú thiết kế

The S912XET256J1MALR integrates a 5V-to-2.5V voltage regulator for internal logic. Place a 1uF X7R ceramic bypass as close as possible to the VDDR/VDDX pins and a 4.7uF X5R bulk capacitor on the analog VDDA rail. The VDD1/VDD2 pins each need a 100nF decoupling capacitor with trace length below 5mm. The on-chip voltage regulator can source up to 80mA to external loads; budget headroom for peak ADC and ECT transitions.

The 112-LQFP package has a typical theta_JA of 35 C/W (per NXP S12XE thermal modeling) at 100 LFM airflow on a 4-layer JEDEC JESD51 PCB. The MCU dissipates up to 1.2W under full load (50MHz, all peripherals enabled, CAN activity), leading to a junction temperature rise of about 42C. Ensure that ambient + rise stays within -40C to +125C - automotive underhood applications should plan for case temperatures up to +110C.

Route the EXTAL/XTAL traces between the package and the crystal or resonator inside a guard ground ring, with no signals crossing beneath them. Keep the PLL filter capacitor XFC within 8 mm of the pin and route it over a continuous ground plane. Place the VRH/VRL ADC reference bypass capacitors (typically 100nF X7R each) directly at the pins and isolate them from noisy digital returns. Use star grounding to separate VSSA/VRH/VRL returns from digital VSS for noise-sensitive ADC acquisitions.

Do not leave TEST pin floating - tie TEST to VSS for normal operation or VDDX for factory test. The MODC and BKGD pins require external pull-up or pull-down configuration to select the correct boot mode (Normal Single-Chip, Normal Expanded, or Special BDM). The PADx key-wakeup pins must be properly configured as inputs or wakeup sources, and de-bounced, before they are read by application firmware.

Bus signals (CAN, SPI, SCI, IIC) should be routed with a controlled impedance (typically 50 ohms single-ended) over a continuous reference plane. For MSCAN signals, place a TJA1042 or similar CAN transceiver within 50 mm of the CAN TX and RX pins and add a 120 ohm termination resistor across CANH/CANL on each end of the bus. The ECT PWM outputs can produce sharp edges; clamp them with TVS diodes if exposed to automotive transient loads.

Thông tin tuân thủ

RoHS
Unknown
REACH
Unknown
AEC-Q100
Qualified
Không chì
Unknown
Không halogen
Unknown
Khoáng vật xung đột
Compliant

Automotive grade qualified per the part number suffix M (AEC-Q100 grade-1 tested). RoHS/REACH compliance data not provided in the verified web data set - consult the NXP product page for the current formal compliance certificate.

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