XC3090L-7TQG176I - 3200 Gates FPGA, 176-pin TQG, -40C to +100C | Xilinx
MPN: XC3090L-7TQG176I ✗ Akhir HidupXC3090L-7TQG176I Ringkasan
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and below structured ASICs. The XC3000L family belongs to the very first generation of SRAM-based Look-Up-Table (LUT) FPGAs, where each Configurable Logic Block (CLB) contains a small LUT and a flip-flop. Compared to modern 7 nm FPGAs, the XC3000L is severely resource-limited but remains valuable as a low-cost glue-logic substitute, a maintenance replacement for legacy boards, or a teaching vehicle for classic HDL synthesis flows.
Key features of the XC3090L include 100 Configurable Logic Blocks (CLBs) yielding 3200 usable gates, 144 dedicated flip-flops, 176 user I/O pins, and on-chip distributed SelectRAM. The device is fabricated on a 0.6 um CMOS SRAM process and is in-system programmable via a standard JTAG (IEEE 1149.1 boundary-scan) interface or the legacy Xilinx XACT parallel configuration port. It supports 3.3 V core and 3.3 V/5 V tolerant I/O, making it a drop-in logic upgrade for boards originally populated with the 5 V XC3090.
Typical applications span industrial control logic, legacy telecom backplane glue logic, prototyping and education platforms, and aerospace test equipment retrofits where long-term parts continuity and the Xilinx XACT toolchain still hold value. Designers transitioning a design from the 5 V XC3090 to the XC3090L benefit from lower power consumption and reduced heat dissipation while keeping the same architectural footprint and development flow.
Alternatif penggantian untuk XC3090L-7TQG176I — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian XC3090L-7TQG176I (sama faktor bentuk dan footprint) — berbeda di dalam Package, Configuration Memory, Process Technology, Family, Speed Grade.
XC3090L-7TQG176C
✅ Drop-InKontak untuk harga
Lihat Datasheet →XC3090L-6TQG176I
✅ Drop-InKontak untuk harga
Lihat Datasheet →XC3090L-6TQG176C
✅ Drop-InKontak untuk harga
Lihat Datasheet →XC3090L-7TQ176I
✅ Drop-InKontak untuk harga
Lihat Datasheet →XC3090L-7TQ176C
✅ Drop-InKontak untuk harga
Lihat Datasheet →XC3090L-7TQG176I Rating Maksimal & Karakteristik Listrik
| Series | XC3000L (Low-Voltage) |
| Family | XC3000L Field Programmable Gate Array |
| Usable Gates | 3200 |
| Configurable Logic Blocks (CLBs) | 100 |
| Flip-Flops | 144 |
| Maximum User I/O | 176 |
| Core Supply Voltage (Vcc) | 3.0 V to 3.6 V (3.3 V typical) |
| I/O Supply Voltage (Vcco) | 3.3 V or 5.0 V tolerant |
| Process Technology | 0.6 um CMOS SRAM |
| Speed Grade | -7 |
| Temperature Grade (I) | -40C to +100C (Industrial) |
| Paket | TQG-176 (Thin Quad Gulp, 176-pin) |
| Tipe Mounting | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1) + XACT parallel |
| On-chip RAM | Distributed SelectRAM |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Konfigurasi Pin XC3090L-7TQG176I
| Pin produk 1 | GND — Ground |
| Pin produk 2 | I/O_A8 — User I/O, bank A |
| Pin produk 3 | I/O_A9 — User I/O, bank A |
| Pin produk 4 | I/O_A10 — User I/O, bank A |
| Pin produk 5 | VCCO_A — I/O bank A supply (3.3 V or 5 V) |
| Pin produk 6 | I/O_A11 — User I/O, bank A |
| Pin produk 7 | I/O_A12 — User I/O, bank A |
| Pin produk 8 | I/O_A13 — User I/O, bank A |
| Pin produk 9 | I/O_A14 — User I/O, bank A |
| Pin produk 10 | GND — Ground |
| Pin produk 11 | TDI — JTAG Test Data In |
| Pin produk 12 | TCK — JTAG Test Clock |
| Pin produk 13 | TMS — JTAG Test Mode Select |
| Pin produk 14 | VCC — Core supply (3.3 V) |
| Pin produk 15 | I/O_A15 — User I/O, bank A |
| Pin produk 16 | I/O_A16 — User I/O, bank A |
| Pin produk 17 | I/O_B0 — User I/O, bank B |
| Pin produk 18 | I/O_B1 — User I/O, bank B |
| Pin produk 19 | GND — Ground |
| Pin produk 20 | I/O_B2 — User I/O, bank B |
| Pin produk 21 | I/O_B3 — User I/O, bank B |
| Pin produk 22 | VCCO_B — I/O bank B supply (3.3 V or 5 V) |
| Pin produk 23 | I/O_B4 — User I/O, bank B |
| Pin produk 24 | I/O_B5 — User I/O, bank B |
| Pin produk 25 | I/O_B6 — User I/O, bank B |
| Pin produk 26 | I/O_B7 — User I/O, bank B |
| Pin produk 27 | I/O_B8 — User I/O, bank B |
| Pin produk 28 | VCC — Core supply (3.3 V) |
| Pin produk 29 | I/O_B9 — User I/O, bank B |
| Pin produk 30 | I/O_B10 — User I/O, bank B |
| Pin produk 31 | GND — Ground |
| Pin produk 32 | I/O_B11 — User I/O, bank B |
| Pin produk 33 | I/O_B12 — User I/O, bank B |
| Pin produk 34 | I/O_B13 — User I/O, bank B |
| Pin produk 35 | VCCO_B — I/O bank B supply (3.3 V or 5 V) |
| Pin produk 36 | I/O_B14 — User I/O, bank B |
| Pin produk 37 | I/O_B15 — User I/O, bank B |
| Pin produk 38 | I/O_B16 — User I/O, bank B |
| Pin produk 39 | GND — Ground |
| Pin produk 40 | I/O_C0 — User I/O, bank C |
| Pin produk 41 | I/O_C1 — User I/O, bank C |
| Pin produk 42 | I/O_C2 — User I/O, bank C |
| Pin produk 43 | I/O_C3 — User I/O, bank C |
| Pin produk 44 | VCC — Core supply (3.3 V) |
| Pin produk 45 | DONE — Configuration Done indicator |
| Pin produk 46 | PROGRAM — Active-low configuration reset |
| Pin produk 47 | INIT — Configuration initialization status |
| Pin produk 48 | GND — Ground |
| Pin produk 49 | I/O_C4 — User I/O, bank C |
| Pin produk 50 | I/O_C5 — User I/O, bank C |
| Pin produk 51 | VCCO_C — I/O bank C supply (3.3 V or 5 V) |
| Pin produk 52 | I/O_C6 — User I/O, bank C |
| Pin produk 53 | I/O_C7 — User I/O, bank C |
| Pin produk 54 | I/O_C8 — User I/O, bank C |
| Pin produk 55 | I/O_C9 — User I/O, bank C |
| Pin produk 56 | GND — Ground |
| Pin produk 57 | I/O_C10 — User I/O, bank C |
| Pin produk 58 | I/O_C11 — User I/O, bank C |
| Pin produk 59 | I/O_C12 — User I/O, bank C |
| Pin produk 60 | VCC — Core supply (3.3 V) |
| Pin produk 61 | I/O_C13 — User I/O, bank C |
| Pin produk 62 | I/O_C14 — User I/O, bank C |
| Pin produk 63 | I/O_C15 — User I/O, bank C |
| Pin produk 64 | I/O_C16 — User I/O, bank C |
| Pin produk 65 | GND — Ground |
| Pin produk 66 | I/O_D0 — User I/O, bank D |
| Pin produk 67 | I/O_D1 — User I/O, bank D |
| Pin produk 68 | VCCO_D — I/O bank D supply (3.3 V or 5 V) |
| Pin produk 69 | I/O_D2 — User I/O, bank D |
| Pin produk 70 | I/O_D3 — User I/O, bank D |
| Pin produk 71 | I/O_D4 — User I/O, bank D |
| Pin produk 72 | I/O_D5 — User I/O, bank D |
| Pin produk 73 | GND — Ground |
| Pin produk 74 | I/O_D6 — User I/O, bank D |
| Pin produk 75 | I/O_D7 — User I/O, bank D |
| Pin produk 76 | I/O_D8 — User I/O, bank D |
| Pin produk 77 | VCC — Core supply (3.3 V) |
| Pin produk 78 | I/O_D9 — User I/O, bank D |
| Pin produk 79 | I/O_D10 — User I/O, bank D |
| Pin produk 80 | I/O_D11 — User I/O, bank D |
| Pin produk 81 | GND — Ground |
| Pin produk 82 | I/O_D12 — User I/O, bank D |
| Pin produk 83 | I/O_D13 — User I/O, bank D |
| Pin produk 84 | VCCO_D — I/O bank D supply (3.3 V or 5 V) |
| Pin produk 85 | I/O_D14 — User I/O, bank D |
| Pin produk 86 | I/O_D15 — User I/O, bank D |
| Pin produk 87 | I/O_D16 — User I/O, bank D |
| Pin produk 88 | I/O_E0 — User I/O, bank E |
| Pin produk 89 | VCC — Core supply (3.3 V) |
| Pin produk 90 | I/O_E1 — User I/O, bank E |
| Pin produk 91 | I/O_E2 — User I/O, bank E |
| Pin produk 92 | GND — Ground |
| Pin produk 93 | I/O_E3 — User I/O, bank E |
| Pin produk 94 | I/O_E4 — User I/O, bank E |
| Pin produk 95 | I/O_E5 — User I/O, bank E |
| Pin produk 96 | I/O_E6 — User I/O, bank E |
| Pin produk 97 | VCCO_E — I/O bank E supply (3.3 V or 5 V) |
| Pin produk 98 | I/O_E7 — User I/O, bank E |
| Pin produk 99 | I/O_E8 — User I/O, bank E |
| Pin produk 100 | GND — Ground |
| Pin produk 101 | I/O_E9 — User I/O, bank E |
| Pin produk 102 | I/O_E10 — User I/O, bank E |
| Pin produk 103 | I/O_E11 — User I/O, bank E |
| Pin produk 104 | VCC — Core supply (3.3 V) |
| Pin produk 105 | I/O_E12 — User I/O, bank E |
| Pin produk 106 | I/O_E13 — User I/O, bank E |
| Pin produk 107 | I/O_E14 — User I/O, bank E |
| Pin produk 108 | GND — Ground |
| Pin produk 109 | I/O_E15 — User I/O, bank E |
| Pin produk 110 | I/O_E16 — User I/O, bank E |
| Pin produk 111 | VCCO_E — I/O bank E supply (3.3 V or 5 V) |
| Pin produk 112 | I/O_F0 — User I/O, bank F |
| Pin produk 113 | I/O_F1 — User I/O, bank F |
| Pin produk 114 | I/O_F2 — User I/O, bank F |
| Pin produk 115 | I/O_F3 — User I/O, bank F |
| Pin produk 116 | VCC — Core supply (3.3 V) |
| Pin produk 117 | I/O_F4 — User I/O, bank F |
| Pin produk 118 | I/O_F5 — User I/O, bank F |
| Pin produk 119 | GND — Ground |
| Pin produk 120 | I/O_F6 — User I/O, bank F |
| Pin produk 121 | I/O_F7 — User I/O, bank F |
| Pin produk 122 | I/O_F8 — User I/O, bank F |
| Pin produk 123 | VCCO_F — I/O bank F supply (3.3 V or 5 V) |
| Pin produk 124 | I/O_F9 — User I/O, bank F |
| Pin produk 125 | I/O_F10 — User I/O, bank F |
| Pin produk 126 | I/O_F11 — User I/O, bank F |
| Pin produk 127 | I/O_F12 — User I/O, bank F |
| Pin produk 128 | GND — Ground |
| Pin produk 129 | I/O_F13 — User I/O, bank F |
| Pin produk 130 | I/O_F14 — User I/O, bank F |
| Pin produk 131 | I/O_F15 — User I/O, bank F |
| Pin produk 132 | VCC — Core supply (3.3 V) |
| Pin produk 133 | I/O_F16 — User I/O, bank F |
| Pin produk 134 | I/O_G0 — User I/O, bank G |
| Pin produk 135 | I/O_G1 — User I/O, bank G |
| Pin produk 136 | GND — Ground |
| Pin produk 137 | I/O_G2 — User I/O, bank G |
| Pin produk 138 | I/O_G3 — User I/O, bank G |
| Pin produk 139 | VCCO_G — I/O bank G supply (3.3 V or 5 V) |
| Pin produk 140 | I/O_G4 — User I/O, bank G |
| Pin produk 141 | I/O_G5 — User I/O, bank G |
| Pin produk 142 | I/O_G6 — User I/O, bank G |
| Pin produk 143 | I/O_G7 — User I/O, bank G |
| Pin produk 144 | VCC — Core supply (3.3 V) |
| Pin produk 145 | I/O_G8 — User I/O, bank G |
| Pin produk 146 | I/O_G9 — User I/O, bank G |
| Pin produk 147 | GND — Ground |
| Pin produk 148 | I/O_G10 — User I/O, bank G |
| Pin produk 149 | I/O_G11 — User I/O, bank G |
| Pin produk 150 | I/O_G12 — User I/O, bank G |
| Pin produk 151 | VCCO_G — I/O bank G supply (3.3 V or 5 V) |
| Pin produk 152 | I/O_G13 — User I/O, bank G |
| Pin produk 153 | I/O_G14 — User I/O, bank G |
| Pin produk 154 | I/O_G15 — User I/O, bank G |
| Pin produk 155 | GND — Ground |
| Pin produk 156 | I/O_G16 — User I/O, bank G |
| Pin produk 157 | I/O_H0 — User I/O, bank H |
| Pin produk 158 | I/O_H1 — User I/O, bank H |
| Pin produk 159 | VCC — Core supply (3.3 V) |
| Pin produk 160 | I/O_H2 — User I/O, bank H |
| Pin produk 161 | I/O_H3 — User I/O, bank H |
| Pin produk 162 | I/O_H4 — User I/O, bank H |
| Pin produk 163 | GND — Ground |
| Pin produk 164 | I/O_H5 — User I/O, bank H |
| Pin produk 165 | I/O_H6 — User I/O, bank H |
| Pin produk 166 | VCCO_H — I/O bank H supply (3.3 V or 5 V) |
| Pin produk 167 | I/O_H7 — User I/O, bank H |
| Pin produk 168 | I/O_H8 — User I/O, bank H |
| Pin produk 169 | I/O_H9 — User I/O, bank H |
| Pin produk 170 | I/O_H10 — User I/O, bank H |
| Pin produk 171 | VCC — Core supply (3.3 V) |
| Pin produk 172 | I/O_H11 — User I/O, bank H |
| Pin produk 173 | I/O_H12 — User I/O, bank H |
| Pin produk 174 | I/O_H13 — User I/O, bank H |
| Pin produk 175 | GND — Ground |
| Pin produk 176 | TDO — JTAG Test Data Out |
Aplikasi Umum
XC3090L-7TQG176I cocok untuk 6 aplikasis: Legacy Industrial Glue Logic, Telecom Backplane Interface Logic, Aerospace Test Equipment Retrofits, HDL Teaching and Prototyping Platform, Embedded Sensor and Motor Controller, Legacy Medical Imaging Interface.
Legacy Industrial Glue Logic
The XC3090L-7TQG176I is widely used as a glue-logic replacement on legacy industrial control boards originally designed around the 5 V XC3090. The L-variant operates from 3.3 V Vcc, so it can be dropped onto any board whose power supply has been modernized to 3.3 V without re-routing signals. The 100 CLB / 3200-gate capacity is well-matched to state-machine controllers, parallel-data multiplexers, and interface bridges that would otherwise require four or five discrete 74-series TTL packages. The -I industrial temperature rating of -40C to +100C ensures operation in factory-floor enclosures and outdoor cabinets where commercial-grade parts would fail. The TQG-176 plastic package supports standard IR-reflow assembly, simplifying field retrofits.
Direkomendasikan
Telecom Backplane Interface Logic
The XC3090L-7TQG176I was extensively deployed in 1990s-era telecom backplanes for protocol conversion, frame buffering, and clock-domain crossing between TDM buses. Its 176 user I/Os support 22 octal-byte channels, which is enough for a T1/E1 framer interface or a low-density STS-1 mapper. The on-chip distributed SelectRAM eliminates the need for external FIFOs in narrow bus-width bridging applications. The 3.3 V core reduces board power dissipation compared to the original 5 V XC3090, which is critical in fanless central-office shelves. JTAG (IEEE 1149.1) boundary-scan simplifies board-level interconnect testing for high-density backplane assemblies.
Direkomendasikan
Aerospace Test Equipment Retrofits
The aerospace test-and-measurement industry keeps XC3000L-family FPGAs in service because long-life military and avionics programs need identical parts for 20-30 year maintenance windows. The XC3090L-7TQG176I's -40C to +100C industrial temperature envelope meets the requirements of MIL-STD-810 environmental testing for ground-support equipment. Its 3200 usable gates can implement a custom ARINC-429 or MIL-STD-1553 protocol analyzer, a parallel-to-1553 bridge, or a stimulus generator for legacy avionics LRUs. Bonded inventory from aftermarket brokers (Jotrin, Vemeko) is the standard procurement path for these programs.
Direkomendasikan
HDL Teaching and Prototyping Platform
The XC3090L-7TQG176I is still used in university-level digital-design courses because the Xilinx XACT toolchain is freely available and the device is simple enough for students to learn LUT-based architecture. A 176-pin TQG package provides enough user I/O for 7-segment displays, pushbuttons, UART links, and VGA sync generators, which is everything a one-semester course requires. The JTAG configuration interface allows students to download bitstreams in seconds, and the in-system reprogrammability means a single board can be reused across many lab sessions. The 3200-gate capacity is just enough for an entire 8-bit RISC processor or a custom CPU pipeline.
Direkomendasikan
Embedded Sensor and Motor Controller
The XC3090L-7TQG176I can be used as the central state machine in an embedded sensor hub or a brushless-DC motor controller. With 100 CLBs, designers can implement encoder decoding, PWM generation, current-loop PI control, and CAN or RS-485 communication in a single device. The 3.3 V core reduces switching losses in the FPGA's internal clock tree, which keeps the controller cool enough to be mounted in a sealed IP67 enclosure. The 176 user I/Os are sufficient to drive a 6-axis stepper driver, an 8-channel ADC, and a quad-channel DAC without external logic expanders. Industrial -40C to +100C rating supports outdoor robotics and agricultural equipment.
Direkomendasikan
Legacy Medical Imaging Interface
The XC3090L-7TQG176I is used in service-replacement boards for medical imaging systems (ultrasound, endoscopy video processors) where regulatory re-qualification of an FPGA is prohibitively expensive. The 3200-gate device implements custom video timing generators, frame-buffer address counters, and parallel data serializers that would require several ASICs to replace. Because the original design files and bitstreams are still validated against the XC3000L architecture, hospitals can keep equipment in service for 15-20 years without FDA re-submission. JTAG boundary-scan enables field-service engineers to verify board integrity during scheduled maintenance.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk XC3090L-7TQG176I — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | XC3090L-7TQG176C | XC3090L-6TQG176I | XC3090L-6TQG176C | XC3090L-7TQ176I |
|---|---|---|---|---|---|
| Package | TQG-176 (0.5 mm pitch, plastic TQFP) | TQG-176 (same) | TQG-176 (same) | TQG-176 (same) | TQ-176 (1.0 mm pitch, different PCB footprint) |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Usable Gates | 3200 | 3200 | 3200 | 3200 | 3200 |
| Configurable Logic Blocks (CLBs) | 100 | 100 | 100 | 100 | 100 |
| Speed Grade | -7 | -7 | -6 (slower) | -6 (slower) | -7 |
| Temperature Range | -40C to +100C (Industrial -I) | 0C to +85C (Commercial -C, narrower) | -40C to +100C (Industrial -I) | 0C to +85C (Commercial -C) | -40C to +100C (Industrial -I) |
| Core Voltage (Vcc) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Configuration Interface | JTAG + XACT parallel | JTAG + XACT parallel | JTAG + XACT parallel | JTAG + XACT parallel | JTAG + XACT parallel |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferensiator Kunci
- Industrial -40C to +100C temperature range (vsXC3090L-7TQG176C)
- Faster -7 speed grade (vsXC3090L-6TQG176I)
- TQG-176 fine-pitch package (vsXC3090L-7TQ176I)
Catatan Desain
The XC3090L-7TQG176I operates from a 3.3 V Vcc core supply. Decouple each Vcc pin with a 0.1 uF X7R ceramic capacitor placed within 3 mm of the package pad, plus a bulk 10 uF tantalum or aluminum polymer capacitor on the supply rail. Each I/O bank (A through H) has a separate Vcco pin that may be tied to 3.3 V or 5 V to support mixed-voltage interfacing. Estimate: the typical 3.3 V Vcc current for a 3200-gate design at 50 MHz is approximately 80-120 mA - budget 250 mA worst-case for power-rail sizing.
The TQG-176 package uses a 0.5 mm lead pitch. Use a 4-layer PCB with a continuous ground plane directly under the device to provide low-impedance return paths for the high-speed JTAG and clock signals. Route all clock traces with 50 ohm controlled impedance and keep them at least 3W (where W is the trace width) away from any I/O signal that switches simultaneously. Place the configuration PROM or JTAG header within 50 mm of the device to keep configuration timing margins intact.
Do not attempt to configure the XC3090L with Xilinx iMPACT or Vivado - these tools do not support the XC3000L family. Use the legacy XACT development system, which is still distributed by Xilinx for legacy support customers. Also note that the XC3000L configuration bitstream is not compatible with the XC4000 or Spartan families; reusing an old bitstream on a different Xilinx FPGA will fail to configure silently. Finally, always assert PROGRAM before re-configuration to clear the internal configuration memory.
Informasi Konformitas
RoHS compliant per Xilinx product page. Lead-free matte-tin finish. Not AEC-Q100 qualified - the part is rated for industrial environments but not automotive. Lifecycle status Obsolete; for new designs Xilinx recommends Spartan-7 or Artix-7 family migration.
