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EP3C5U256A7N - Cyclone III FPGA 5K LE 256-BGA | Intel / Altera
EP3C5U256A7N

EP3C5U256A7N - Cyclone III FPGA 5K LE 256-BGA | Intel / Altera

The Intel (formerly Altera) EP3C5U256A7N is a low-power Cyclone III Field-Programmable Gate Array (FPGA) with 5,136 logic elements, 423,936 embedded memory bits, and 182 user I/Os, housed in a 256-ball Ultra FineLine BGA (U256) package. The device targets cost-sensitive, high-volume applications where designers need programmable logic, embedded memory, and DSP blocks without the cost of a high-end FPGA. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and I/O cells, all of which can be reconfigured by the designer after manufacture. FPGAs sit between ASICs (custom silicon) and general-purpose processors in the hierarchy: IC -> programmable logic -> FPGA. Cyclone III devices are fabricated on a 60 nm low-power CMOS process, giving them a low static power footprint ideal for battery-powered and thermally constrained systems. Key features include 5,136 logic elements, 423,936 bits of embedded RAM (M9K blocks), 23 embedded 18x18 multipliers for DSP, four general-purpose PLLs, and a maximum user I/O count of 182. The device operates from a 1.15 V to 1.25 V core supply with hot-socketing support, allowing live insertion into a powered backplane. Speed grade -7 places this part in the mid-speed bin of the Cyclone III family, suitable for designs targeting up to approximately 200 MHz fabric performance. Typical applications include industrial motor control, video processing bridges, low-cost software-defined radio front-ends, LED video walls, and consumer electronics glue logic. Designers migrating from CPLDs gain thousands of additional logic elements and embedded multiplier blocks, enabling the integration of DSP and soft-core processors such as Nios II on a single device. When designing with this part, ensure decoupling capacitors are placed close to every VCCINT and VCCIO pin, and follow Intel's PCB layout guidelines for BGA fan-out to maintain signal integrity on DDR/QSPI memory interfaces. Configuration can be sourced from an external flash, JTAG, or Altera EPCS serial configuration device. This page consolidates distributor stock, same-family drop-in alternatives, and practical design notes not collected in a single place elsewhere, giving engineers a faster path from specification to BOM decision.

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EP3C5U256C6 - Cyclone III FPGA, 5K LE, 256-UBGA | Intel / Altera
EP3C5U256C6

EP3C5U256C6 - Cyclone III FPGA, 5K LE, 256-UBGA | Intel / Altera

The Intel / Altera EP3C5U256C6 is a low-cost, low-power Cyclone® III Field Programmable Gate Array (FPGA) housed in a 256-ball Ultra FineLine BGA (U256 / UBGA) package. It integrates 5,136 logic elements, 423,936 bits of embedded memory (RAM), and 182 user I/O pins in a compact, lead-free surface-mount form factor. Speed grade 6 reflects its commercial temperature and timing characterization within the Cyclone III family. A Cyclone III FPGA is a programmable logic device that combines look-up tables (LUTs), embedded memory blocks, embedded multipliers, and a programmable interconnect fabric on a single low-power silicon die. Within the broader semiconductor taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit alongside ASICs and microcontrollers as flexible digital-implementation alternatives. Cyclone III devices are widely used for I/O expansion, custom interface bridging, glue logic, and parallel DSP functions in cost-sensitive industrial, automotive, and consumer designs. Key features of the EP3C5U256C6 include 5,136 logic elements, 423,936 embedded RAM bits organized in M9K blocks, 23 embedded 18x18 multipliers, four general-purpose PLLs, and 182 maximum user I/O pins. The device supports multiple I/O standards including LVDS, LVCMOS, LVTTL, SSTL, and HSTL, making it suitable for interfacing to external DDR/DDR2 memory devices via soft IP controllers. The U256 package exposes a high pin count in a small footprint suitable for space-constrained boards. Built on a low-power process, Cyclone III devices offer static power consumption an order of magnitude lower than earlier Cyclone generations, allowing fanless operation in embedded designs. The architecture combines distributed and block RAM with dedicated multiplier blocks, enabling efficient implementation of DSP pipelines, video processing, and high-speed serial interface protocols when paired with external PHYs. Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment and driver-assistance subsystems, telecom line cards, and portable medical instrumentation. Engineers also use Cyclone III devices for I/O expansion around application processors and as cost-effective prototyping vehicles before ASIC conversion. When designing with this device, verify that the Quartus II / Quartus Prime toolchain supports the U256 package variant in your software version, and confirm that the I/O bank voltage configuration matches the connected memory or peripheral standards. The U256 package has a fine 1.0 mm ball pitch, requiring ENIG surface finish and precise PCB fabrication tolerances. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a one-stop reference for sourcing and substitution decisions.

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EP3C5U256C6N - Cyclone III FPGA, 5,136 Logic Elements, 256-UBGA | Intel
EP3C5U256C6N

EP3C5U256C6N - Cyclone III FPGA, 5,136 Logic Elements, 256-UBGA | Intel

The Intel EP3C5U256C6N is a Cyclone III family Field Programmable Gate Array (FPGA) featuring 5,136 logic elements, 182 user I/O pins, and 423,936 bits of embedded memory, housed in a 256-ball Ultra FineLine BGA (UBGA-256) package with 0.8 mm pitch and 14 x 14 mm body. The device is fabricated on a low-power 60 nm process and operates with a commercial temperature grade and C6 speed grade, targeting cost-sensitive, low-power programmable logic applications. What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells. Unlike an ASIC, an FPGA's function is defined after manufacturing via a hardware description language and a configuration bitstream, allowing rapid prototyping and field upgrades. FPGAs sit in the hierarchy: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. The Cyclone III family specifically targets ASIC replacement and high-volume, low-power logic applications such as industrial control, video processing, and telecommunications glue logic. Key features of the EP3C5U256C6N include 5,136 logic elements, 321 LABs (Logic Array Blocks), 182 maximum user I/Os, 423,936 bits of embedded RAM, and integrated 18x18 multipliers for DSP operations. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI, and provides up to four PLLs for clock management. Configuration is supported through passive serial, active serial, JTAG, and Altera-specific configuration schemes. The Cyclone III architecture is built on a 60 nm low-leakage CMOS process that delivers low static and dynamic power consumption compared to earlier Cyclone generations. The 5,136-LE device offers approximately 60 Kbits of internal memory per logic region, distributed RAM and shift register inference support, and dedicated hardware multiply blocks for efficient DSP implementation without consuming general logic resources. Typical applications for the EP3C5U256C6N include industrial motor control, video surveillance, video bridging and display controllers, telecommunications line cards, low-cost ASIC replacement, USB and connectivity bridging, and embedded control logic in factory automation equipment. When designing with this device, ensure proper decoupling with 0.1 uF and 10 uF capacitors placed close to each power pin. The UBGA-256 package requires careful PCB layout with microvia or via-in-pad technology for reliable manufacturing. Configuration scheme selection (AS, PS, JTAG) should be finalized early to allocate the correct pins and supporting memory devices. This page synthesizes distributor pricing, same-family drop-in alternatives, comparison parameters, and practical design notes for engineers evaluating the EP3C5U256C6N for new designs or legacy board support.

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EP3C5U256C7 - Cyclone III FPGA, 5K LE, 256-UBGA | Altera
EP3C5U256C7

EP3C5U256C7 - Cyclone III FPGA, 5K LE, 256-UBGA | Altera

The Intel (formerly Altera) EP3C5U256C7 is a low-power Cyclone III Field-Programmable Gate Array (FPGA) built on a 65nm low-k process, delivering 5,136 logic elements, 423,936 bits of embedded memory, and 182 maximum user I/O pins in a 256-ball Ultra FineLine BGA (UBGA) package. It operates across a commercial 0C to 85C junction temperature range with a -7 speed grade, targeting cost-sensitive, power-aware volume production. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacturing, rather than at the fab. FPGAs sit alongside microcontrollers, microprocessors, ASICs, and CPLDs in the programmable logic hierarchy, and they are the dominant solution when time-to-market, parallelism, hardware re-programmability, or high I/O bandwidth outweigh the absolute lowest unit cost of an ASIC. The Cyclone III family from Intel/Altera occupies the low-end, low-power segment of that hierarchy, optimized for high-volume consumer, industrial, automotive, communications, and broadcast applications. The EP3C5U256C7 features 5,136 logic elements, 321 logic array blocks, 46 embedded 18x18 multipliers, 23 embedded M9K memory blocks (423,936 total RAM bits), and four general-purpose PLLs. Its 256-ball UBGA package provides 182 available user I/Os arranged in eight I/O banks supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, PCI, and SSTL. The device supports Nios II embedded processor soft cores and is configured via serial or parallel flash using the active serial (AS) configuration scheme. Typical applications for the EP3C5U256C7 span consumer video processing (display controllers, video bridging, low-end set-top boxes), industrial control and machine-to-machine (M2M) gateways, automotive infotainment and driver-assist subsystems, communications line cards and bridges, broadcast video encoding, and portable/mobile systems where the low-power 65nm process and wide I/O flexibility deliver the best price/performance balance. When designing with this device, plan power sequencing carefully: the Cyclone III core and I/O banks operate from multiple supply rails (VCCINT, VCCIO per bank, VCCA, VCCD_PLL), and decoupling bulk capacitors must be placed adjacent to each power pin per the pin connection guidelines. Confirm Quartus II or Quartus Prime software support for the -7 speed grade and your target I/O standard before PCB fabrication. This page synthesizes distributor pricing as of 2026-09-09, drop-in alternatives from the same Altera/Intel Cyclone III family, and practical design notes not aggregated on any single manufacturer or distributor page.

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EP3C5U256C7N - Cyclone III FPGA 5K LE 256-BGA | Intel / Altera
EP3C5U256C7N

EP3C5U256C7N - Cyclone III FPGA 5K LE 256-BGA | Intel / Altera

The Intel / Altera EP3C5U256C7N is a Cyclone III low-power Field Programmable Gate Array (FPGA) containing 5,136 logic elements (LEs), 423,936 bits of embedded memory, and 182 user I/Os, housed in a 256-ball FineLine BGA (UBGA) package. Built on a 60 nm TSMC low-power CMOS process, the Cyclone III family targets cost-sensitive applications that require moderate logic density, generous block memory, and flexible DSP blocks without the power budget of competing families. A Field Programmable Gate Array is a programmable integrated circuit whose logic fabric, interconnect, and I/O cells are configurable through SRAM-based configuration memory. Within the broader semiconductor taxonomy, an FPGA sits at the top of the digital logic hierarchy alongside ASICs and CPLDs, providing higher logic density than CPLDs while offering faster time-to-market and lower NRE cost than ASICs. Cyclone III specifically addresses the volume-priced, power-constrained segment between CPLDs and high-end FPGAs. Key features of the EP3C5U256C7N include 5,136 LEs, 423,936 embedded RAM bits organized into M9K blocks, up to 23 embedded 18x18 multipliers for DSP, four PLLs for clock management, and 182 maximum user I/Os. The device operates from a 1.15 V to 1.25 V core supply and supports commercial temperature grades. Cyclone III FPGAs are designed for sub-100 mW static power dissipation depending on configuration. The architecture combines Look-Up Tables (LUTs) for combinational logic, dedicated carry chains for fast arithmetic, and M9K memory blocks capable of true dual-port operation. This combination allows designers to implement both glue logic and DSP-intensive functions such as filters, FFTs, and protocol bridges on a single device. The four PLLs support clock multiplication, division, and phase shifting across the device's clock networks. Typical applications include industrial motor control, video processing and image preprocessing, automotive infotainment, consumer electronics with custom interfaces, low-cost software-defined radio, and portable instrumentation. Cyclone III FPGAs are also widely used in educational platforms and prototype ASIC emulation where fast iteration matters more than absolute performance. When designing with this part, pay close attention to the I/O bank supply voltages and the configuration scheme (AS, PS, JTAG). Cyclone III devices are configured through Quartus II or the Quartus Prime toolchain, and the BSDL files are generated automatically. The 256-ball UBGA package requires careful PCB layout with controlled-impedance traces and a sufficient ground/power via array under the BGA. This page synthesizes distributor pricing, drop-in same-package Cyclone III alternatives, practical design notes, and a parametric comparison table that goes beyond the manufacturer datasheet summary, giving engineers a single source for evaluation and sourcing decisions.

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EP3C5U256C8 - Cyclone III FPGA 5K LE 256-BGA | Intel / Altera
EP3C5U256C8

EP3C5U256C8 - Cyclone III FPGA 5K LE 256-BGA | Intel / Altera

The Intel / Altera EP3C5U256C8 is a Cyclone® III low-power Field Programmable Gate Array (FPGA) fabricated in a 60 nm process and packaged in a 256-ball FineLine BGA (UBGA) with 182 user I/O. The device integrates 5,136 logic elements, 423,936 bits of embedded memory (RAM), and 23 embedded 18x18 multipliers, delivering a balanced logic/memory/DSP mix for cost-sensitive applications. The "C8" speed grade corresponds to a commercial temperature grade (0C to 85°C) with an 8 ns internal timing requirement, and the "U" suffix denotes the UBGA-256 package. An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard-IP blocks such as block RAM, DSP slices, PLLs, and high-speed transceivers. Within the broader semiconductor hierarchy, FPGAs sit between microcontrollers/CPUs (fixed-function, software-defined) and ASICs (application-specific, hardware-defined). Cyclone III sits within the programmable logic taxonomy: FPGA -> low-power FPGA -> Cyclone family -> Cyclone III generation, optimized for cost and power efficiency rather than raw performance. Key features of the EP3C5U256C8 include 23 true 18-bit x 18-bit hardware multipliers for DSP operations, 4 PLLs providing flexible clock synthesis, and 1.0 V core operation with multi-voltage I/O support for LVDS, LVCMOS, SSTL, and HSTL standards. The Cyclone III architecture supports the Nios II embedded processor for soft-core CPU integration, and configuration can be loaded via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes. Suspend mode allows power-down of unused logic to reduce quiescent consumption. Technical depth is provided by 2 PLLs with eight output banks (when paired with the 65 nm Cyclone III LS family) and dedicated per-pin serialization/deserialization (SERDES) blocks for LVDS signaling up to 875 Mbps. The device supports up to 8 input clocks and provides on-chip termination (OCT) for impedance matching, simplifying PCB design. Configuration bitstream is stored in external flash and loaded by the FPGA at power-up, with built-in error detection via CRC check and decompression for compressed bitstreams. Typical applications include industrial motor control, video surveillance and image processing, low-cost ASIC prototyping, consumer handheld devices, and automotive infotainment pre-development. The 5,136 LE count maps well to glue-logic replacement, parallel-to-serial bridges, and small protocol conversion IPs. Pair the EP3C5U256C8 with external DDR/DDR2 SDRAM and an Altera EPCS configuration device for a complete low-cost system. A key design consideration when using the EP3C5U256C8 is power budgeting: although Cyclone III is the lowest-power 60 nm FPGA family, dense designs at high toggle rates can still draw 1-2 W of core power. Plan thermal relief on the UBGA-256 land pattern with via-in-pad or thermal vias under the center ball array, and use the Quartus II PowerPlay analyzer to estimate static and dynamic losses before PCB layout commitment. This page synthesizes distributor pricing, drop-in same-package Cyclone III alternatives, and practical design notes not found in the standalone manufacturer datasheet, providing engineering context for selecting the right density and speed grade within the Cyclone III family.

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EP3C5U256C8N - Cyclone III FPGA, 5K LE, 256-UBGA | Altera / Intel
EP3C5U256C8N

EP3C5U256C8N - Cyclone III FPGA, 5K LE, 256-UBGA | Altera / Intel

The Altera (Intel) EP3C5U256C8N is a Cyclone® III family FPGA featuring 5,136 logic elements (LEs), 423,936 bits of embedded memory, and 182 maximum user I/O pins, housed in a 256-ball Ultra FineLine BGA (UBGA) package. Built on a low-power 60 nm process, this Cyclone III device delivers up to 200 MHz performance with a maximum embedded multiplier count of 46 (18x18) blocks and supports configuration via passive serial, fast passive parallel, active serial, and JTAG modes. The "8" speed grade designates a commercial 8 ns timing spec. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement any digital logic function, from glue logic and state machines to full processor subsystems and DSP pipelines. FPGAs belong to the broader programmable logic device hierarchy (CPLD -> FPGA -> SoC FPGA) and offer far higher logic density than CPLDs thanks to an array of configurable logic blocks (CLBs), programmable routing channels, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. The Cyclone III family specifically targets cost-sensitive, high-volume applications requiring low static and dynamic power. Key features of the EP3C5U256C8N include 5,136 logic elements arranged in 5136 CLBs (one LE per CLB in this architecture), 46 embedded 18x18 multipliers for high-throughput DSP operations, and four general-purpose PLLs for clock management. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards, with each I/O bank programmable for the required voltage level. Configuration can be loaded from a low-cost EPCS serial configuration device or via JTAG during development. The Cyclone III architecture uses an SRAM-based configuration cell powered from a separate VCCINT core rail (typically 1.2 V), while VCCIO pins configure I/O bank voltages (1.2 V to 3.3 V). This split-rail approach minimizes dynamic power in I/O while preserving signal-integrity flexibility for mixed-voltage interfaces such as legacy 5 V-tolerant or 1.5 V SSTL memory buses. The EP3C5 is positioned at the low-density end of the family, making it ideal for cost-optimized designs that need more I/O than a CPLD but less than a Cyclone III 25 or higher. Typical applications include industrial control and HMI boards, motor control and encoder interfaces, low-cost video processing and image aggregation, factory automation and protocol bridging (UART/SPI/I2C to Ethernet or USB), and educational / prototyping platforms where the low LE count keeps toolchain compile times short and per-unit cost minimal. The 256-UBGA 14x14 mm package provides 182 usable pins with 0.8 mm ball pitch, balancing board-routing density with assembly yield. When designing with the EP3C5U256C8N, allocate separate ground islands for PLL analog supplies and decouple every VCCIO/VCCINT pin with 0.1 µF capacitors placed within 100 mils of the package ball. Use the Altera Quartus II (or the Altera edition of Quartus Prime Lite) for synthesis, fitting, and timing closure; the device is supported by all Cyclone III device files in Quartus 13.1 and earlier. This page synthesizes current distributor pricing, drop-in same-package alternatives, and practical layout/timing guidance not found in the standalone manufacturer datasheet.

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EP3C5U256I7 - Cyclone III FPGA 5K LE 256-UBGA | Altera (Intel)
EP3C5U256I7

EP3C5U256I7 - Cyclone III FPGA 5K LE 256-UBGA | Altera (Intel)

The Altera (Intel) EP3C5U256I7 is a Cyclone III low-power Field Programmable Gate Array (FPGA) offering 5,136 logic elements, 423,936 bits of embedded memory, and 182 maximum user I/O pins in a 256-ball Ultra FineLine BGA package. Built on a 65 nm TSMC process and powered by a 1.2 V core supply, this device targets cost-sensitive, high-volume applications where low static and dynamic power consumption are critical design constraints. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, PLLs, and DSP slices. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and below ASICs in terms of integration density and per-unit cost. The Cyclone III family specifically positioned Altera in the low-power FPGA market, competing directly with Xilinx Spartan-6 and Lattice ECP3 families for industrial, automotive, and consumer designs. Key features include up to 5,136 logic elements, 46 embedded 9-Kbit M9K memory blocks for a total of 414 Kbits (423,936 bits) of RAM, 23 embedded 18x18 multipliers for DSP operations, two general-purpose PLLs per device, and a maximum user I/O count of 182. The device also supports configuration via serial passive (EPCS), JTAG, or Active Serial schemes, and operates over the industrial -40 °C to +100 °C junction temperature range per the I7 speed/grade code. Architecturally, Cyclone III uses a four-input look-up table (LUT) based logic element with dedicated carry chains for arithmetic and dedicated routing for fast adder trees. The 65 nm process node combined with Altera's power-aware compiler yields typical static power under 100 mW, while the programmable power technology can selectively power down unused logic elements to extend battery life in portable applications. Typical applications include industrial motor control and machine vision, low-cost video processing for surveillance and consumer displays, software-defined radio (SDR) front-end signal conditioning, automotive infotainment and driver-assistance subsystems, and portable medical device controllers. The Cyclone III device family is well-suited for high-volume production designs that require reprogrammability in the field. When designing with the EP3C5U256I7, designers must pay attention to I/O bank voltage grouping, since the device supports mixed-voltage I/O standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL) across eight I/O banks. Decoupling capacitor placement, signal integrity, and proper configuration mode selection (AS, PS, JTAG) are critical to first-pass success on the 256-ball Ultra FineLine BGA. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III family and selected same-footprint Altera parts, and practical design considerations not consolidated in the manufacturer datasheet. It is intended for hardware engineers, BOM managers, and FAE teams evaluating Cyclone III FPGA sourcing.

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EP3C5U256I7N - Cyclone III FPGA 5K LE 256-UBGA | Intel
EP3C5U256I7N

EP3C5U256I7N - Cyclone III FPGA 5K LE 256-UBGA | Intel

The Intel (formerly Altera) EP3C5U256I7N is a low-power Cyclone III Field Programmable Gate Array (FPGA) with 5,136 logic elements, 423,936 bits of embedded memory, and 182 maximum user I/O pins, housed in a 256-ball Ultra FineLine BGA (UFBGA) package. The device is fabricated on a 65 nm low-k copper process, operates from a 1.2 V core supply, and supports 437.5 MHz internal operation with up to 23 embedded 18x18 multipliers for DSP workloads. The part is specified for the industrial temperature range (-40C to +100C junction) and ships in tray packaging. A Cyclone III FPGA is a reprogrammable logic device that sits in the programmable logic hierarchy between a CPLD (typically <2K logic elements, non-volatile) and a high-end FPGA such as Stratix or Arria (hundreds of thousands of LE, transceivers, hardcore processors). Cyclone III targets cost- and power-sensitive applications such as industrial control, video bridging, and I/O expansion. Within the broader system hierarchy it is a programmable logic IC -> logic semiconductor -> integrated circuit, complementing microcontrollers and ASICs when parallel processing, custom I/O timing, or hardware acceleration is required. Key features of the EP3C5U256I7N include 5,136 logic elements, 423,936 total RAM bits organized into M9K blocks, 182 user I/O pins across 8 I/O banks, 2 PLLs for clock management, 23 embedded 18x18 multipliers, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device integrates configuration memory (SRAM-based) and supports multiple configuration schemes including JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes. The EP3C5U256I7N leverages a 65 nm SRAM-based architecture with on-chip voltage regulation and a static core power of approximately 50 mW at nominal conditions. Designers can use the Quartus II / Quartus Prime design suite (web edition or subscription) for synthesis, place-and-route, and timing closure. The 256-ball UFBGA package exposes 8 I/O banks with independent VCCIO rails, allowing mixed-voltage interfacing (1.2 V to 3.3 V) without external level shifters. Typical applications include industrial motor control, video format conversion, protocol bridging (UART/SPI/I2C to Ethernet or USB), LED display controllers, machine vision pre-processing, and low-density ASIC prototyping. The 5K LE density comfortably fits soft-core processors such as Nios II/e or Nios II/f along with custom peripherals in a single device. When designing with the EP3C5U256I7N, plan for at least four PCB layers with a continuous ground plane beneath the BGA, and provide 0.1 uF + 10 uF decoupling near every VCC/VCCIO pin pair. The configuration mode pins (MSEL) must be tied to the correct pattern for the selected programming mode (AS = 00, AP = 01, PS = 10, JTAG = 11 in many Cyclone III references). For long-term reliability, observe the maximum junction temperature of 100C for the industrial speed grade I7. This page synthesizes real-time distributor pricing, same-package drop-in alternatives from the Cyclone III family, and practical design notes that go beyond the manufacturer handbook.

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EP3C80F484C6 - Cyclone III FPGA 81K LE 484-FBGA | Altera
EP3C80F484C6

EP3C80F484C6 - Cyclone III FPGA 81K LE 484-FBGA | Altera

The Altera (now Intel) EP3C80F484C6 is a Cyclone III family Field Programmable Gate Array (FPGA) with 81,264 logic elements, 2,810,880 bits of embedded memory, and 295 user I/O pins, housed in a 484-ball FineLine BGA (FBGA) package measuring 23 x 23 mm with 1.0 mm pitch. Built on a 65 nm CMOS process, this FPGA operates at a 1.2 V core supply and supports commercial temperature grades. A Field Programmable Gate Array (FPGA) is a programmable logic device that allows engineers to implement custom digital circuits through configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as embedded multipliers, memory blocks, and high-speed transceivers. FPGAs sit in the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits, offering hardware-level parallelism and reconfigurability that microcontrollers and ASICs cannot match for high-throughput or evolving-design applications. Key features of the EP3C80F484C6 include up to 472.5 MHz maximum operating frequency, 488 (18x18) embedded multipliers for DSP workloads, four phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR, DDR2, SDRAM, and QDRII SRAM. The device supports popular I/O standards such as LVDS, SSTL, HSTL, and PCI/PCI-X through its 484-ball FBGA interface, enabling flexible system integration. The Cyclone III architecture leverages a 65 nm low-power process and an efficient logic fabric to deliver high logic density at low static power. Embedded memory blocks (M9K) total 2,810,880 bits, distributed across the die for high-bandwidth local storage. The combination of logic density, DSP blocks, and memory makes the EP3C80F484C6 well suited for digital signal processing, video bridging, industrial control, and communications infrastructure. Typical applications include industrial motor control, video surveillance and image processing, software-defined radio front-ends, and embedded vision systems. The Cyclone III family was a popular low-power choice for cost-sensitive, high-volume designs during the late 2000s, and parts remain available through authorized distributors supporting long-lifecycle programs. When designing with this device, ensure proper decoupling on each power rail (VCCINT, VCCA, VCCIO) and follow Altera's recommended FPGA PCB layout guidelines for BGA packages. Engineers should also verify the latest Quartus II support status, as Intel/Altera has since introduced Cyclone IV and Cyclone V successors; however, EP3C80F484C6 remains widely deployed in existing designs. This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers select, source, and design with this legacy FPGA confidently.

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EP3C80F484C6N - Cyclone III FPGA 81K LE 484-FBGA | Intel
EP3C80F484C6N

EP3C80F484C6N - Cyclone III FPGA 81K LE 484-FBGA | Intel

The Intel (Altera) EP3C80F484C6N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) featuring 81,264 logic elements, 2,810,880 bits of embedded memory, and 295 user I/O pins in a 484-ball FineLine BGA package. Built on a 65nm process and rated for the commercial 0°C to +85°C temperature range, the device delivers up to 500 MHz core performance from a 1.2V core supply. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows hardware designers to implement custom digital circuits through configuration of an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O. Cyclone III devices sit within the broader taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors, and are typically used as flexible alternatives to ASICs for medium-volume, high-functional-density designs. Key features include four phase-locked loops (PLLs) for clock management, 4 Mbits of embedded SRAM, 244 embedded 18x18 multipliers for DSP workloads, and support for external memory interfaces such as DDR, DDR2, SDRAM, and QDRII SRAM. The 484-FBGA package measures 23x23 mm with a 1.0 mm ball pitch and exposes up to 295 general-purpose I/O across eight I/O banks. Cyclone III architecture combines an efficient routing fabric with hard IP for memory controllers and PLLs, enabling designers to balance logic, memory, and DSP resources without paying for features that will not be used. Compared with Cyclone II, the Cyclone III family roughly doubles logic density at substantially lower static power, making it well suited for power-conscious industrial, video, and communications equipment. Typical applications include industrial motor control and machine vision, video processing and display controllers, wireline communications line cards, software-defined radio baseband, and PCIe endpoint or embedded processor glue logic. The combination of low cost per logic element and rich DSP/memory resources also makes Cyclone III popular for prototyping ASIC and SoC designs. When designing with this device, pay attention to the 1.2V core and multiple bank I/O supply rails (1.5V, 1.8V, 2.5V, 3.3V). Decouple each rail close to the balls and follow the Quartus II pin-out file for bank assignments to avoid signal-integrity issues on LVDS or DDR memory interfaces. This page synthesizes distributor pricing, drop-in same-package alternatives within the Cyclone III family, and practical design notes not collated on a single manufacturer page.

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EP3C80F484C7 - 295 I/O Cyclone III FPGA | Altera
EP3C80F484C7

EP3C80F484C7 - 295 I/O Cyclone III FPGA | Altera

Altera EP3C80F484C7 is a Cyclone III field-programmable gate array (FPGA) providing 295 user I/O, 81,264 logic cells, 2,810,880 bits of memory, a 437.5 MHz stated frequency, and a 484-ball FBGA package. The device belongs to the FPGA > programmable logic > integrated circuit hierarchy and is designed for configurable digital logic, interface bridging, control processing, and embedded system prototyping. Its 65 nm technology and 1.2 V supply position it as a low-voltage programmable logic device for designs that require substantial logic capacity and high pin availability. An FPGA is a semiconductor integrated circuit containing configurable logic blocks, programmable interconnects, input/output resources, and memory elements. Unlike an application-specific integrated circuit, an FPGA can be electrically configured after PCB assembly. This makes it useful when a design requires rapid iteration, multiple interface protocols, parallel datapaths, or hardware functions that are not efficiently served by a fixed-function processor or controller. Cyclone III devices are part of the Altera programmable-logic family and are intended for cost-sensitive digital systems. The headline resource figures are 81,264 logic cells, 2,810,880 memory bits, 295 I/O, and 437.5 MHz stated frequency. These values indicate a device suitable for moderately complex control logic, communications interfaces, image or data preprocessing, and test equipment. The 484-ball FBGA package supports the high I/O count while using a surface-mount ball-grid-array format. The package designation must be checked against the PCB footprint and ball map before substitution because ball numbering and package orientation are critical. The supplied data identifies the device as a 65 nm FPGA operating at 1.2 V. It also identifies 5,079 LABs in one distributor result. The architecture is not described in the verified snippets, so detailed values for logic elements, embedded multipliers, phase-locked loops, transceiver count, operating temperature, speed grade, and thermal resistance are not asserted here. Those parameters should be confirmed from the manufacturer documentation or a current authorized source before design release. Typical applications include industrial control and automation, communications-interface aggregation, video or imaging preprocessing, test and measurement, and embedded digital signal processing. The 295 I/O resources can support multiple parallel interfaces, while the stated 437.5 MHz value provides a useful design target for timing analysis. Because programmable devices can be constrained by routing, I/O standards, memory bandwidth, power integrity, and tool configuration, system-level validation remains necessary. For design-in, verify the exact 484-ball FBGA footprint, power rails, configuration interface, supported I/O standards, bank restrictions, clocking resources, and recommended decoupling network from the manufacturer documentation. Treat the listed 1.2 V and 437.5 MHz values as verified device facts, but do not assume timing closure at that frequency in every design. The final design should include timing analysis, signal-integrity review, thermal analysis, and configuration-file validation. This product data combines verified distributor specifications, package and resource information, sourcing observations, and explicit uncertainty markers. It is intended to help engineers distinguish confirmed facts from parameters that require manufacturer-document verification, reducing the risk of assuming unsupported electrical or pin-level details.

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EP3C80F484C7N - Cyclone III FPGA, 81264 LE | Altera
EP3C80F484C7N

EP3C80F484C7N - Cyclone III FPGA, 81264 LE | Altera

The Altera EP3C80F484C7N is a Cyclone III field-programmable gate array (FPGA) that provides 81,264 logic elements, 295 user I/O pins, and 2.68 Mbit of embedded memory in a lead-free 484-ball FBGA package measuring 23 x 23 mm with 1.0 mm ball pitch. The C7 speed grade and commercial-temperature option support 0 C to +70 C operation, and the N suffix indicates lead-free finish. An FPGA is an integrated circuit whose logic fabric, routing, and I/O behavior can be configured after manufacturing using a hardware description language such as Verilog or VHDL. It sits above mask-programmed ASICs in flexibility but provides lower non-recurring engineering cost and faster time-to-market. In the component taxonomy, this device is an FPGA, which is a programmable logic device, an integrated circuit, and a digital semiconductor product. Cyclone III FPGAs are positioned as low-cost, high-volume programmable logic for applications where ASSPs do not provide enough customization. Key features include 81,264 LEs for implementing soft processors and DSP datapaths, 295 user I/O pins for parallel buses and external memory interfaces, and 2.68 Mbit of on-chip RAM. DigiKey and Mouser list this part as a 484-BGA product with immediate availability. The FindIC aggregator lists a maximum internal clock frequency of 472.5 MHz, while the operating supply voltage range is 1.15 V to 1.25 V. This density is well suited for designs that require moderate logic capacity and high pin count but do not need the high-speed serial transceivers found on larger FPGAs. The FBGA-484 package provides a 1.0 mm ball pitch and 2.60 mm package height, which keeps PCB routing practical on a 4- to 6-layer board. The 295 user I/O pins can be assigned to multiple I/O banks with different voltage standards. For configuration, Cyclone III devices are typically paired with Altera serial configuration devices or download cables. The device's logic fabric is volatile and must be loaded from an external configuration source during power-up. Typical applications include industrial machine vision, broadcast video processing, telecom protocol bridging, medical imaging front-ends, and test-and-measurement instrumentation. These uses benefit from the 295-I/O capacity for parallel video buses and external SDRAM/DDR interfaces, the 81264 LEs for pixel processing, and the commercial temperature range for indoor equipment. When designing with this FPGA, pay careful attention to the core supply tolerance of 1.15 V to 1.25 V and to power sequencing. Decouple every power ball with ceramic capacitors close to the BGA, and use the manufacturer's power estimator to determine current demand at your actual utilization and clock rate. This page synthesizes distributor pricing, cross-reference candidates, and practical design guidance not found in a single datasheet listing. It is intended to help engineers evaluate EP3C80F484C7N against family variants and recognized functional equivalents before beginning PCB design.

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EP3C80F484C8 - Cyclone III FPGA 81K LE 484-FBGA | Intel (Altera)
EP3C80F484C8

EP3C80F484C8 - Cyclone III FPGA 81K LE 484-FBGA | Intel (Altera)

The Intel (formerly Altera) Cyclone III EP3C80F484C8 is a low-power, high-volume Field Programmable Gate Array built on a 65 nm CMOS process and housed in a 484-ball FineLine BGA (FBGA-484, 23x23 mm, 1.0 mm pitch) package. The device delivers 81,264 logic elements (LEs), 2,810,880 bits of embedded memory (2810 Kb), and 295 maximum user I/O pins, with a core voltage of 1.2 V and internal operating performance up to 402 MHz per published Cyclone III family specifications. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that lets engineers implement arbitrary digital logic - from glue logic and state machines to entire processor subsystems - via a programmable fabric of logic elements, embedded memory blocks, DSP blocks, and programmable I/O. FPGAs sit hierarchically under programmable logic devices (PLDs), alongside complex programmable logic devices (CPLDs), within the broader integrated circuit (IC) taxonomy, and are widely used as prototyping, low-volume production, and DSP/parallel-processing alternatives to ASICs and microcontrollers. Key features of the EP3C80F484C8 include 244 embedded 18x18 multipliers (DSP blocks) for high-throughput fixed-point arithmetic, four phase-locked loops (PLLs) for clock synthesis and skew management, support for external memory interfaces including DDR/DDR2/QDRII SDRAM, and a low-power architecture that targets consumer, industrial, and communications applications. The 'C8' speed grade denotes a commercial temperature device with the slowest of the Cyclone III speed grades, balancing cost and performance for non-timing-critical designs. Architecturally, the Cyclone III family leverages a logic-element fabric of 4-input look-up tables (LUTs), M9K embedded memory blocks, and dedicated DSP slices. The EP3C80 variant occupies the upper-middle of the family, providing roughly twice the LE count of the EP3C40 while remaining notably smaller and lower-cost than the EP3C120, making it the typical sweet-spot for mid-density designs. Typical applications include industrial motor control, video processing pipelines, software-defined radio (SDR) front ends, telecommunications baseband processing, and embedded control systems. The EP3C80F484C8 specifically suits designs that need DDR controller support, abundant DSP bandwidth, and a large FPGA fabric without crossing into the higher-cost EP3C120 tier. When designing with this device, plan I/O bank assignments and pin-out early because the 484-FBGA package leaves no room for late-stage changes. Use the Altera/Intel Quartus II design suite (Cyclone III device support) for synthesis, place-and-route, and timing closure; signal-integrity and power-integrity analysis are recommended for DDR interfaces. This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III family (same brand Intel/Altera), and practical design notes not collected on a single manufacturer or distributor page.

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EP3C80F484C8N - 81K LE Cyclone III FPGA, 484-FBGA | Intel
EP3C80F484C8N

EP3C80F484C8N - 81K LE Cyclone III FPGA, 484-FBGA | Intel

The Intel (formerly Altera) EP3C80F484C8N is a Cyclone III family Field-Programmable Gate Array (FPGA) fabricated on a low-power 65 nm process, offering 81,264 logic elements, 2,810,880 bits of embedded memory, and 295 user I/O pins in a 484-ball FineLine BGA package. The device integrates 244 embedded 18x18 multipliers and a rich mix of PLLs, global clock networks, and high-speed LVDS interfaces that are well-suited for cost-sensitive, high-volume digital designs. An FPGA is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. In the system hierarchy it sits between ASICs (highest performance, highest NRE) and microcontrollers (lowest flexibility, lowest unit cost) and is the workhorse for parallel data paths, custom interfaces, and DSP pipelines. The Cyclone III family specifically targets applications that need tens of thousands of logic elements, embedded memory and multipliers without the power and cost of a mid-range FPGA. Key features include 81,264 logic elements, 2,810,880 RAM bits distributed in M9K blocks, 244 embedded 18 x 18 multipliers, four general-purpose PLLs, 20 global clock networks, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports up to 402 MHz internal operation and operates from a 1.2 V core supply. Configuration can be loaded through JTAG, Active Serial (AS), or Passive Serial (PS) modes using external flash. Typical applications for the EP3C80F484C8N span industrial control and machine vision, video processing and display pipelines, telecommunications line cards, motor and motion control, test and measurement instrumentation, and entry-level DSP cards. The combination of embedded multipliers and distributed RAM allows designers to implement FIR filters, FFT engines, and image-processing kernels without external DSP chips. When designing with this part, pay attention to the 484-FBGA ball pitch (typically 1.0 mm) and follow Intel's PCB layout and decoupling guidelines to maintain signal integrity on LVDS pairs. The device is lead-free / RoHS compliant and supports commercial (0 C to 85 C) operating temperature range as denoted by the 'C8' speed-grade suffix.

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EP3C80F484I7 - Cyclone III FPGA, 81K LE, 484-FBGA | Intel
EP3C80F484I7

EP3C80F484I7 - Cyclone III FPGA, 81K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP3C80F484I7 is a Cyclone III field-programmable gate array (FPGA) featuring 81,264 logic elements, 2,810,880 bits of embedded memory, and 295 user I/Os in a 484-ball FineLine BGA package. Built on a 65 nm low-power CMOS process, this device operates from a 1.2 V core supply and supports up to 472 MHz internal operation, targeting cost-sensitive high-volume applications. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit alongside ASICs in the digital IC hierarchy: PLD -> FPGA -> CPLD (simpler) and FPGA -> SoC FPGA (more complex). Unlike fixed-function ASICs, FPGAs can be reconfigured in the field to implement arbitrary digital logic, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. The Cyclone III family delivers up to 200K logic elements, up to 8 Mbits of RAM, and integrated multipliers, while consuming a fraction of the power of previous-generation FPGAs. The EP3C80F484I7 specifically offers 5,079 LABs, 244 M9K memory blocks, four PLLs, and supports external memory interfaces including DDR, DDR2, and QDRII SRAM. Its 484-ball FBGA package with 1.0 mm ball pitch simplifies PCB layout and supports standard reflow processes. This part is well suited for applications such as industrial motor control, video processing pipelines, software-defined radio (SDR) baseband, automotive infotainment pre-development, and high-volume consumer electronics. The Cyclone III architecture supports the Nios II soft-core processor, enabling complete microcontroller/SoC functionality within a single FPGA. Designers benefit from the Quartus II design software with extensive IP libraries. When designing with this device, pay close attention to power sequencing - the 1.2 V core, 2.5 V analog, and I/O voltages must ramp in a defined order to prevent latch-up. The device supports hot-socketing and has dedicated JTAG pins for boundary-scan testing. For high-speed memory interfaces, use the dedicated DQS pins and follow Intel's pinout guidelines to achieve the rated 472 MHz performance.

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EP3C80F484I7N - Cyclone III FPGA 81K LE 484-FBGA | Intel
EP3C80F484I7N

EP3C80F484I7N - Cyclone III FPGA 81K LE 484-FBGA | Intel

The Intel (Altera) EP3C80F484I7N is a low-power Cyclone III field-programmable gate array (FPGA) with 81,264 logic elements, 2,810,880 bits of embedded memory, and 295 user I/O pins, packaged in a 484-ball FineLine BGA (FBGA-484, 23x23 mm, 1.0 mm pitch). It belongs to the industrial-temperature grade (I7: -40C to +100C junction) and targets cost-sensitive, high-volume applications. A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as memory blocks, multipliers, PLLs, and transceivers, all of which can be re-programmed in the field to implement arbitrary digital logic. FPGAs sit hierarchically between standard microcontrollers (fixed instruction set, software-defined behavior) and application-specific integrated circuits (ASICs, fixed hardware). Within the broader taxonomy, the EP3C80F484I7N belongs to the Cyclone III family, which is itself a low-power, high-volume sub-family of Intel's FPGA portfolio aimed at industrial, automotive driver-assist, video, and communications designs. Key features of the EP3C80F484I7N include 81,264 logic elements, 2,810,880 RAM bits distributed across M9K memory blocks, 244 dedicated 18x18 multipliers (sufficient for DSP-class workloads such as video processing or software-defined radio baseband), four general-purpose PLLs, and 295 user I/O. The device is built on a 60 nm low-power process and operates from a 1.2 V core supply (VCCINT 1.15 V to 1.25 V), with separate VCCIO banks that support 1.5 V, 1.8 V, 2.5 V, 3.0 V, and 3.3 V interfacing. Architecturally, the device pairs an SRAM-based LUT fabric with embedded hard IP - including M9K memory blocks, 18x18 multipliers, and PLLs - to deliver a balanced logic/memory/DSP ratio at lower static and dynamic power than prior Cyclone generations. The 60 nm process and optimized clock network allow typical commercial applications to operate without active thermal management even at full utilization. Typical applications include industrial motor control and machine vision, video surveillance and image processing pipelines, software-defined radio (SDR) baseband, automotive driver-assistance subsystems, and low-cost ASIC prototyping. The wide VCCIO support enables direct bridging between 3.3 V legacy peripherals and 1.8 V modern serializer/deserializer links without external level shifters. When designing with the EP3C80F484I7N, ensure that the Quartus II toolchain (version 13.0sp1 or later with device support, or Quartus Prime 17.0 legacy mode) is used; that all VCCINT and VCCIO rails are decoupled per the AN 529 design guidelines; and that JTAG and configuration pin pull-ups are correctly placed for the selected configuration mode (AS, PS, JTAG, or Fast Passive Parallel). This page synthesizes distributor pricing, verified drop-in equivalents within the Cyclone III family, and practical Quartus design notes that are not duplicated in any single manufacturer document - giving procurement and design engineers a single landing page for the EP3C80F484I7N.

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EP3C80F780C6 - Cyclone III FPGA 81K LE 780-FBGA | Altera
EP3C80F780C6

EP3C80F780C6 - Cyclone III FPGA 81K LE 780-FBGA | Altera

The Altera EP3C80F780C6 is a Cyclone III family Field Programmable Gate Array (FPGA) with 81,264 logic elements, 429 user I/O, and 2,810,880 bits of embedded memory, fabricated on a 65 nm low-power process and housed in a 780-pin FineLine BGA (FBGA) package. The 'C6' speed grade supports up to 500 MHz internal operation with a core voltage of 1.2 V, targeting high-volume, low-power applications such as industrial control, video processing, and communications infrastructure. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware such as multipliers, memory blocks, and phase-locked loops. In the wider taxonomy, FPGAs sit between general-purpose microcontrollers and fully custom ASICs, offering hardware-level parallelism with software-reconfigurable logic. The Cyclone III series specifically targets cost-sensitive, power-conscious designs that previously required ASICs, with static power consumption reduced by up to 75% compared to earlier 90 nm Cyclone II devices. Key features include 81264 logic elements (LE), 2810880 embedded RAM bits distributed across M9K memory blocks, 244 18x18 embedded multipliers for DSP functions, four general-purpose PLLs per device, and 429 user I/O pins supporting multiple I/O standards including LVDS, LVCMOS, SSTL, and LVTTL. The 780-FBGA package uses a 1.0 mm ball pitch for board compatibility with mainstream PCB manufacturing, and supports hot-socketing for live insertion into backplanes. The device is built on TSMC's 65 nm low-power CMOS process, delivering an optimal balance of performance-per-watt. Designers configure the FPGA using Quartus II design software with hardware description languages such as Verilog HDL or VHDL. Configuration data is loaded from external flash, an embedded EPCS device, or via JTAG, and can be reloaded in milliseconds for remote field updates. Typical applications include industrial machine vision, video surveillance and broadcast equipment, automotive infotainment, wireline communications, and portable medical devices where low static power and high DSP throughput are required. The Cyclone III architecture enables custom parallel processing pipelines that would be impractical in a sequential processor. When designing with this device, plan power distribution carefully: core current can exceed 2 A at full logic utilization, requiring multiple low-impedance decoupling capacitors near the 1.2 V supply pins. Thermal management is also important - the 780-FBGA has a junction-to-ambient thermal resistance of approximately 14 C/W with proper PCB thermal vias, but high-utilization designs may require airflow. This page synthesizes distributor pricing, pin-compatible Cyclone III alternatives, and practical design notes not found in the Altera datasheet, helping engineers select, source, and integrate the EP3C80F780C6 with confidence.

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EP3C80F780C6N - Cyclone III FPGA 81K LE 780-FBGA | Intel
EP3C80F780C6N

EP3C80F780C6N - Cyclone III FPGA 81K LE 780-FBGA | Intel

The Intel (formerly Altera) EP3C80F780C6N is a high-density, low-power Cyclone III Field Programmable Gate Array (FPGA) delivering 81,264 logic elements, 2,810,880 bits of embedded memory, and 429 maximum user I/O pins in a 780-ball FineLine BGA package. It is fabricated on a 65 nm low-power process and operates with a core voltage of 1.2 V, offering a balance of functional density, performance, and power efficiency for cost-sensitive embedded and signal-processing designs. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that combines the integration density of an ASIC with the flexibility of in-system reprogrammability. FPGAs sit above CPLDs in the programmable logic hierarchy and below fixed-function ASICs in NRE cost; they are used to implement custom datapaths, parallel DSP blocks, memory interfaces, and high-speed serial protocols without the cost and lead time of a custom IC. Cyclone III FPGAs specifically target the low-power segment of the FPGA market, where designers need tens of thousands of logic elements and embedded multipliers without the power budget of high-end transceivers. Key features of the EP3C80F780C6N include four PLLs, 281 embedded 18x18 multipliers, 4 Mbits of embedded SRAM (2,810,880 bits), Cyclone III architecture support for DDR/DDR2/QDRII external memory interfaces, and 429 user I/O pins distributed across 8 I/O banks. The device supports LVDS, SSTL, and LVTTL I/O standards, and is supported by the Quartus II / Quartus Prime design toolchain. The device is offered in the commercial temperature grade (0 C to +85 C). Architecturally, the EP3C80F780C6N uses look-up-table (LUT)-based logic elements, dedicated 18x18 multiplier blocks for DSP workloads, and embedded SRAM columns distributed across the fabric. The 65 nm TSMC process gives a typical static power figure well below 100 mW, making the Cyclone III family popular for industrial, automotive infotainment, video processing, and motor control applications. Typical applications include industrial motor control, video surveillance and image processing pipelines, automotive driver-assistance preprocessing, software-defined radio front-ends, and embedded DSP cards. The high logic density and embedded multipliers make it particularly attractive for parallel processing tasks where a microcontroller or DSP alone would be too slow. When designing with this device, plan for at least 12 PCB layers to escape the 780-ball BGA cleanly, and use the Quartus II pin planner to assign I/O banks to compatible voltage rails. Leave 20% logic and 30% memory headroom for late-stage ECOs to avoid running out of fabric on design closure. This page synthesizes distributor pricing, FPGA-class drop-in alternatives, and practical PCB-layout guidance that are not aggregated on a single manufacturer or distributor page, giving you a one-stop reference for sourcing and substitution decisions.

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EP3C80F780C7 - Cyclone III 81K LE FPGA, 780-FBGA | Intel
EP3C80F780C7

EP3C80F780C7 - Cyclone III 81K LE FPGA, 780-FBGA | Intel

The Intel (formerly Altera) EP3C80F780C7 is a Cyclone III Field Programmable Gate Array (FPGA) with 81,264 logic elements, 2,810,880 bits of embedded memory, and 429 user I/O pins, housed in a 780-ball FineLine BGA (FBGA) package. It is fabricated on a low-power 65 nm CMOS process and is targeted at cost-sensitive, high-volume applications where the combination of high logic density, embedded multipliers, and low static power is required. Cyclone III FPGAs belong to the broader family of SRAM-based programmable logic devices, which sit within the semiconductor hierarchy as follows: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike CPLDs (Complex Programmable Logic Devices) which use non-volatile flash or EEPROM configuration memory, SRAM-based FPGAs must be configured at every power-up from an external flash memory, but in exchange offer far higher logic density, embedded memory blocks, hardware multipliers, and DSP blocks. Cyclone III occupies the low-power, low-cost end of the SRAM-FPGA segment, making it a popular choice for industrial control, video processing, and communications infrastructure where power and cost are critical constraints. Key differentiating specifications include up to 81,264 logic elements, 2,810,880 embedded RAM bits organized in M9K blocks, 244 embedded 18x18 hardware multipliers, and four phase-locked loops (PLLs). The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards across 8 I/O banks, and operates from a 1.2 V core supply with separate VCCIO banks for flexible I/O voltage interfacing. Static power consumption is dramatically reduced compared to Cyclone II thanks to the 65 nm process. The EP3C80F780C7 architecture consists of LABs (Logic Array Blocks) containing 16 Logic Elements each, interconnected by a multi-tier routing fabric. Embedded multiplier blocks and M9K memory blocks are distributed in columns alongside the LABs, providing efficient implementation of DSP pipelines and FIFO buffers. The configuration scheme uses a serial or parallel flash loader, with bitstream decryption available via the AES-128 option on higher-tier Cyclone III LS devices. Typical applications include industrial machine vision, motor control and servo drive, broadcast video processing, software-defined radio baseband, telecom line cards, and portable medical instrumentation. The combination of high logic density and embedded DSP blocks makes the EP3C80F780C7 well suited to parallel signal-processing tasks where microcontrollers or DSP processors cannot meet throughput. When designing with this device, plan for an external configuration flash (EPCS or compatible) because the FPGA is SRAM-based. Maintain solid power-plane decoupling on the 1.2 V core rail and observe simultaneous switching output (SSO) guidelines for the 780-ball FBGA to maintain signal integrity. This page synthesizes distributor pricing across 19 channels, verified drop-in alternatives sharing the same 780-FBGA footprint, and practical design notes covering configuration, power sequencing, and signal integrity that go beyond the manufacturer datasheet itself.

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EP3C80F780C7N - 81264 LE Cyclone III FPGA 780-FBGA | Intel / Altera
EP3C80F780C7N

EP3C80F780C7N - 81264 LE Cyclone III FPGA 780-FBGA | Intel / Altera

The Intel / Altera EP3C80F780C7N is a low-power Cyclone III Field Programmable Gate Array (FPGA) integrating 81,264 logic elements (LEs) into a 780-ball FineLine BGA package at 29 x 29 mm. Built on a low-k dielectric TSMC 65 nm CMOS process, it targets cost-sensitive, high-volume applications where power efficiency, density, and price-per-logic-element are critical decision factors. The device is rated for a maximum internal clock frequency of 472.5 MHz. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, interconnect, and I/O cells are configured by the user via a hardware description language such as Verilog or VHDL. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the design hierarchy, offering ASIC-class parallelism without NRE cost. The Cyclone III family is Intel's mid-density, low-power line positioned for industrial control, video processing, and consumer electronics. Key features include 81,264 LEs, 2,810,880 bits of embedded memory (RAM), 429 maximum user I/O pins, 4 PLLs, and 288 embedded 18 x 18 multipliers for DSP workloads. The device supports multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL) at up to 16 global clock networks, while on-chip configuration memory retains bitstream contents without external boot ROM when configured in serial or parallel modes. Typical applications span industrial motor control, video surveillance and image processing pipelines, automotive infotainment and driver-assistance subsystems, communication protocol bridging, and portable test-and-measurement equipment. The 65 nm process yields static power in the tens of mW, allowing fanless operation even at elevated ambient temperatures. When designing with the EP3C80F780C7N, observe the JTAG configuration pin assignments and provide adequate decoupling (typically 0.1 uF plus 10 uF bulk per power rail) near the FBGA balls. The 780-BGA requires a multi-layer PCB with microvia or via-in-pad technology for reliable assembly.

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EP3C80F780C8 - Cyclone III FPGA 81K LE 780-FBGA | Intel | Altera
EP3C80F780C8

EP3C80F780C8 - Cyclone III FPGA 81K LE 780-FBGA | Intel | Altera

The Intel (formerly Altera) EP3C80F780C8 is a Cyclone III Field Programmable Gate Array (FPGA) built on a 65 nm low-power process, providing 81,264 logic elements, 2,810,880 bits of embedded memory, and 429 maximum user I/O pins in a 780-ball FineLine BGA (FBGA) package. As a member of the Cyclone III family, it targets cost-sensitive, power-conscious high-volume applications that require high logic density and rich memory resources. What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) belonging to the semiconductor integrated circuit hierarchy. It contains an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory blocks, multipliers, and I/O cells. After manufacturing, the FPGA's function is defined by a user-supplied configuration bitstream loaded into SRAM-based configuration cells. In the broader system hierarchy, an FPGA sits between standard programmable logic (CPLD) and full Application-Specific Integrated Circuits (ASIC) - offering ASIC-like performance and parallelism with the flexibility of in-system reprogrammability. Key features include 81,264 logic elements arranged in a fabric of M9K memory blocks totaling 2,810,880 RAM bits, 244 embedded 18x18 multipliers, four general-purpose PLLs per device, and 429 maximum user I/O supporting multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL). The device operates from a 1.2 V core supply and supports commercial temperature grades (0C to +85C), with industrial grade variants also available. Configuration is handled via active serial (AS), passive serial (PS), JTAG, or Fast Passive Parallel (FPP) modes using external or in-package configuration devices. The Cyclone III architecture uses 65 nm TSMC process technology with low-k dielectric, achieving up to 50% lower dynamic power than the prior Cyclone II family at equivalent performance. The M9K memory blocks support true dual-port, simple dual-port, and single-port RAM configurations up to 36 kbits per block, while dedicated 18x18 hardware multipliers enable DSP functions without burning logic resources. The Quartus II / Quartus Prime design suite supports the entire Cyclone III family with synthesis, place-and-route, timing closure, and on-chip debug via SignalTap II. Typical applications include industrial motor control and machine vision, video processing and display controllers, telecommunications line cards and protocol bridging, automotive infotainment prototyping, test and measurement instrumentation, software-defined radio (SDR), and low-cost ASIC prototyping. The combination of high logic density and embedded multipliers makes the EP3C80 particularly suited for mid-range DSP pipelines and parallel data acquisition. When designing with this device, pay close attention to power supply sequencing - the 1.2 V core, 2.5 V PLL analog, and 3.3 V I/O rails must power up in the order specified by the datasheet to avoid latch-up. Use multiple decoupling capacitors (0.1 uF and 10 uF) near each power pin and keep configuration traces short to avoid bitstream loading errors. This page consolidates distributor pricing snapshots, drop-in same-package alternatives, application examples, and practical design guidance that go beyond the raw datasheet, helping engineers select and integrate the EP3C80F780C8 with confidence.

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EP3C80F780C8N - 81K LE Cyclone III FPGA, 780-FBGA | Intel / Altera
EP3C80F780C8N

EP3C80F780C8N - 81K LE Cyclone III FPGA, 780-FBGA | Intel / Altera

The Intel / Altera EP3C80F780C8N is a low-power, high-volume Cyclone III Field Programmable Gate Array (FPGA) delivering 81,264 logic elements (LE), 2,810,880 bits of embedded memory (RAM), and 429 user I/O pins in a 780-ball FineLine BGA package. Fabricated on a 60 nm TSMC low-k process, it supports up to 472 MHz internal operation and consumes roughly a quarter of the power of the prior Cyclone II generation. A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit that combines programmable Look-Up Tables (LUTs), programmable interconnect, embedded block RAM, DSP blocks, and high-speed transceiver/PLL resources on a single die. FPGAs belong to the broader hierarchy: programmable logic -> logic IC -> integrated circuit. Compared with ASICs, FPGAs offer lower NRE cost, faster time-to-market, and field re-programmability, which is why engineers choose them for prototyping, low-volume production, and designs that need late-stage I/O or protocol updates. Key features of the EP3C80F780C8N include four phase-locked loops (PLLs), 244 embedded 18x18 multipliers (DSP blocks) suitable for moderate DSP workloads, and support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X). It offers Nios II embedded processor support and is supported by the Quartus II design toolchain (Cyclone III device family). The 780-FBGA package has a 29x29 mm body, 1.0 mm ball pitch, and 2.60 mm height, easing PCB escape routing relative to finer-pitch BGA options. Typical applications span industrial motor control, video surveillance and image processing, automotive infotainment, telecom line cards, and handheld test equipment. Designers favor the Cyclone III family for its low static and dynamic power versus older families, which simplifies thermal budgets in fanless enclosures. When designing with this part, validate that the 1.0 mm pitch FBGA can be manufactured with your PCB fab's BGA capability. Use Quartus II 13.0sp1 or later for synthesis, and plan the decoupling network around the PLL analog supply pins (VCCA_PLL) with a 0.1 uF + 10 uF combination for jitter performance. This page synthesizes distributor pricing, drop-in same-package alternatives within the Cyclone III family, and practical board-level guidance not found in the manufacturer datasheet alone.

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EP3C80F780C8NAF - Cyclone III FPGA 81K LE 780-BGA | Altera
EP3C80F780C8NAF

EP3C80F780C8NAF - Cyclone III FPGA 81K LE 780-BGA | Altera

The Altera EP3C80F780C8NAF is a Cyclone III family field-programmable gate array (FPGA) integrating 81,264 logic elements, 2,810,880 bits of embedded memory, and 4 PLLs into a 780-ball FineLine BGA package. Speed grade C8 and commercial temperature grade make it suited to cost-sensitive, high-volume digital logic designs where the proven Cyclone III architecture is preferred over newer families. A Field Programmable Gate Array (FPGA) is a semiconductor IC whose logic function is defined by a customer-supplied configuration bitstream rather than fixed at the fab. FPGAs occupy a distinct position in the digital design hierarchy: they sit above discrete logic ICs and below application-specific integrated circuits (ASICs), bridging the gap between software-like design flows and hardware-implemented performance. Cyclone III devices are low-power, low-cost SRAM-based FPGAs, with this variant falling into the higher-density tier of the family. Key features include 81,264 logic elements (LEs), 2,810,880 total RAM bits, 244 embedded 18x18 multipliers, 4 phase-locked loops (PLLs), and up to 429 user I/O pins. The 780-pin FineLine BGA exposes a wide I/O count, supporting multiple high-speed external memory interfaces and LVDS channels on a single die. Configuration is via the standard Altera active serial (AS), passive serial (PS), or JTAG paths. Typical applications include industrial motor and motion control, video processing pipelines, telecom baseband pre-processing, prototyping for ASICs, and embedded DSP for instrumentation. The C8 speed grade corresponds to an internal performance tier appropriate for parallel datapaths and moderate-clock peripherals rather than highest-frequency serial transceivers. When designing with this part, account for the SRAM-based configuration that requires a non-volatile boot device on every board. The 780-FBGA package also demands careful PCB layout, controlled-impedance routing, and power-rail sequencing; an accompanying Intel/Altera pinout should always be used. Plan JTAG access early to keep debug accessible on production boards. This page synthesizes distributor stock data, drop-in same-package alternatives within the Cyclone III family, and practical design considerations not aggregated on a single manufacturer page, so engineers and procurement teams can make faster source-of-truth decisions.

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