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XC6SLX75-2FGG484I - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
XC6SLX75-2FGG484I

XC6SLX75-2FGG484I - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD

The AMD (formerly Xilinx) XC6SLX75-2FGG484I is a Spartan-6 LX Field Programmable Gate Array (FPGA) with 74,637 logic cells, 3,170,304 system gates, 280 user I/Os, and 4,824 Kbits of Block RAM, housed in a 484-ball fine-pitch BGA (FBGA-484) package at the -2 speed grade and industrial (I) temperature rating. It is built on a 45 nm CMOS process and operates from a 1.14 V to 1.26 V core supply, delivering up to 667 MHz internal performance. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, programmable interconnect, and dedicated silicon resources (Block RAM, DSP slices, PLLs, transceivers on some variants) that can be hardware-tailored after PCB assembly. FPGAs sit between fixed-function ASICs and software-programmable processors in the compute taxonomy: integrated circuit -> digital IC -> programmable logic -> FPGA -> Spartan-6 family -> LX (logic-optimized) sub-family. They are used when time-to-market, parallel processing, and hardware reconfigurability outweigh the unit-cost advantage of mass-produced ASICs. Key features of the XC6SLX75-2FGG484I include 11,650 logic slices (each containing four 6-input LUTs and eight flip-flops), 3,170 Kbits of dedicated Block RAM (180 18-Kbit blocks), 132 DSP48A1 slices for fixed- and floating-point arithmetic, six clock management tiles (CMTs) with PLL + DLL capability, integrated PCIe endpoint block (only on LXT, NOT on LX), and on-chip 100 MHz clock support with up to 667 MHz DCM/PLL output. The -2 speed grade balances performance and power versus the -3 (highest performance) and -1L (lowest power) grades. Industrial temperature grade (-40 °C to +100 °C ambient, with junction allowed up to +125 °C) supports harsh-environment deployment. Spartan-6 LX uses a 45 nm 9-metal-layer CMOS process and a power-optimized core that supports 1.2 V core operation. Hard IP blocks (Block RAM, DSP slices, multi-boot controller, JTAG/ICAP/SPI configuration ports) live alongside the programmable fabric, enabling deterministic single-chip solutions for bridging, motor control, video processing, and embedded compute. Typical applications include industrial automation controllers, automotive infotainment bridging, video processing pipelines, software-defined radio, portable medical imaging, LED video walls, and PCIe endpoint expansion bridges. The 280 user I/Os make the 484-BGA package especially well-suited for high-pin-count industrial designs where several external buses must be addressed simultaneously. When designing with this FPGA, allocate at least 0.5 A per 100 K logic cells for VCCINT, and follow AMD UG393 (Spartan-6 PCB Design Guide) for decoupling, pinout, and signal-integrity rules. Industrial-grade parts cost roughly 20-30 % more than commercial-grade XC6SLX75-2FGG484C and should be chosen only when the operating environment exceeds 0 °C to +85 °C. This page synthesizes distributor pricing, drop-in replacement candidates, and design notes that are not consolidated in the AMD Spartan-6 datasheet alone.

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XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD
XC6SLX75-2FGG676I

XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75-2FGG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, and a maximum internal frequency of 667 MHz. The device is supplied in a lead-free 676-ball FBGA package measuring 27 mm by 27 mm with a 1 mm ball pitch, and its -2 speed grade supports a nominal 1 V supply. A field-programmable gate array is a programmable semiconductor in the FPGA category of digital logic devices. An FPGA combines configurable logic blocks, programmable interconnect, memory resources, and input/output blocks into an integrated circuit whose circuit behavior can be modified after manufacture. Within the broader semiconductor hierarchy, the Spartan-6 LX device provides a programmable alternative to application-specific integrated circuits when interfaces, parallel processing, or logic capacity must change between product variants. Principal device characteristics include 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, 667 MHz internal frequency, and operation from approximately -40°C to +100°C for the industrial-temperature ordering indicated by the I suffix. The 676-ball FBGA package supports dense board-level integration, while the lead-free construction is explicitly identified in the available product records. The -2 designation identifies the device's performance grade within the Spartan-6 LX family, which is manufactured on 45 nm CMOS technology. Its 676-ball package provides a high pin count for high-performance design implementations, including parallel data interfaces, embedded control, industrial automation, networking equipment, and general-purpose signal processing. System timing must still be evaluated against the specific clock, I/O, and resource requirements of each implemented design. Typical applications include industrial control systems, embedded video processing, communication infrastructure, test equipment, and high-density programmable logic. The combination of 408 I/O and 74,637 logic cells permits multiple interfaces to be consolidated in one device, reducing the need for separate programmable or discrete interface components when pin and performance requirements are satisfied. A primary design consideration is BGA assembly. The 1 mm pitch, 676-ball package requires a suitable land pattern, multilayer PCB construction, appropriate thermal management, and assembly-process controls. Designers should also confirm timing closure, power budget, configuration method, bank voltage requirements, and I/O standards against the manufacturer datasheet before releasing a production design. This page consolidates verified distributor specifications, package details, availability information, comparable Spartan-6 device options, and practical selection guidance. It supplements the manufacturer datasheet with decision-oriented information for engineers evaluating the XC6SLX75-2FGG676I as an industrial-grade, high-density FPGA.

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XC6SLX75-3CSG484C - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
XC6SLX75-3CSG484C

XC6SLX75-3CSG484C - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD

The AMD (formerly Xilinx) XC6SLX75-3CSG484C is a Spartan-6 LX family Field-Programmable Gate Array (FPGA) built on a 45 nm low-power copper CMOS process, integrating 74,637 logic cells and 3,170,304 system gates into a 484-ball Chip-Scale BGA (CSBGA) package measuring 23 x 23 mm with 1.0 mm ball pitch. It targets high-volume cost-sensitive applications requiring high logic density with low static and dynamic power. What is a Spartan-6 FPGA? The Spartan-6 family is the sixth generation of Xilinx's low-cost, high-volume FPGA line, sitting within the broader taxonomy of programmable logic devices (PLD) -> FPGA -> SRAM-based FPGA -> low-power FPGA. Built on a mature 45 nm process, Spartan-6 devices combine programmable logic fabric, Block RAM, DSP slices, and hard IP cores (clock management, PCIe, memory controllers) into a single die, offering ASIC-like integration at FPGA-like flexibility. Key features of the XC6SLX75 include 5831 Configurable Logic Blocks (CLBs), up to 309 Kbits of Block RAM, a maximum internal operating frequency of 667 MHz, and 328 user I/O pins. The device is offered in the -3 speed grade (the highest performance tier of the LX family), commercial temperature range (0 to 85 C), and supports supply voltages from 1.2 V core to 3.3 V I/O. Integrated hard IP includes DSP48A1 slices for fixed- and floating-point arithmetic, SelectIO with support for multiple I/O voltages, and a memory controller block for DDR, DDR2, DDR3, and LPDDR. The LX sub-family is positioned below the LXT (which adds transceivers) and above the Spartan-6 lower-density LX devices. Architecture highlights include 6-input LUTs, dual-port Block RAM with byte-wide parity, and dedicated 18 x 18 multipliers. The 45 nm process yields approximately 50% lower static power than the prior Spartan-3A generation while supporting higher clock rates through dedicated carry chains and pipelined DSP blocks. Typical applications for the XC6SLX75-3CSG484C include industrial motor control and machine vision, video processing pipelines (display controllers, surveillance DVRs), wireline communication bridges, automotive driver assistance, and consumer display interfaces. The 484-BGA footprint and high I/O count suit designs that need many LVCMOS or LVDS pairs. When designing with this device, provide multiple decoupling caps around the BGA and follow AMD's PCB layout guidelines for chip-scale BGAs (escape routing for the 1.0 mm pitch grid). Use the ISE Design Suite (iMPACT + ISE Project Navigator) or Vivado (legacy support) for bitstream generation and JTAG programming. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not typically aggregated on DigiKey or Mouser product pages.

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XC6SLX75-3CSG484I - 74637-Cell Spartan-6 LX FPGA | AMD
XC6SLX75-3CSG484I

XC6SLX75-3CSG484I - 74637-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-3CSG484I is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 5,831 configurable logic blocks, and a 484-pin CSBGA package. It operates from a 1.2 V core supply, reaches an internal frequency of 667 MHz according to the retrieved specifications, and supports a 0 to 85 °C operating-temperature range. The device combines programmable logic, block RAM, dedicated DSP resources, and high-speed serial transceivers in one package. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor whose internal digital circuitry is defined by a configuration bitstream rather than fixed mask programming. Within the product hierarchy, an FPGA belongs to the programmable-logic and semiconductor families. The Spartan-6 LX family is positioned for cost-sensitive embedded systems requiring substantial parallel processing, deterministic interfaces, and flexible hardware updates without changing the printed circuit board. The XC6SLX75 combines 74,637 configurable logic cells with 5,831 CLBs and 328 reported I/O locations in the 484-pin CSPBGA package. Its 45 nm CMOS construction supports integration of logic, memory, and DSP blocks, while its -3 speed grade identifies one of the higher-performance grades described for the Spartan-6 LX family. The CSBGA package has a 1 mm pitch and a reported body size of 23 × 23 mm according to the retrieved distributor data. Spartan-6 devices support parallel processing, serial connectivity, and programmable logic through configurable I/O resources. This device family can implement control logic, communication bridges, data acquisition pipelines, embedded processors, and hardware signal-processing functions. Because a complete system can be implemented in programmable logic, the FPGA can also support field upgrades, product differentiation, and reduced external-component count when its resources match the design requirements. Typical uses include industrial automation and factory control, networked communications, test and measurement equipment, embedded video processing, data acquisition, and embedded processing platforms. The 74,637-cell count is particularly useful for designs that need multiple parallel channels or a combination of control logic and DSP. Designers must still verify the exact pin assignments, power rails, supported I/O standards, memory configuration, and transceiver features against the applicable AMD package and device documentation. Board-level implementation requires careful high-speed layout, continuous supply planes, correct BGA escape routing, and decoupling near the package power and ground balls. The 1 mm-pitch CSPBGA also demands controlled assembly processes, including suitable stencil design, solder-paste inspection, and thermal verification. External memory interfaces, serial links, and user I/O should be routed according to the official package pinout files and device-specific layout guidance. This product record combines verified distributor specifications, package information, pricing references, and same-package replacement findings with practical selection guidance. The alternative list is intentionally limited to candidates supported by the supplied cross-reference results, avoiding unsupported cross-package substitutions or packaging-only variants presented as drop-in replacements.

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XC6SLX75-3FG484I - 74637-Cell Spartan-6 FPGA | AMD
XC6SLX75-3FG484I

XC6SLX75-3FG484I - 74637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75-3FG484I is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 280 I/O, and a 484-ball FBGA package. The -3 speed grade is identified by the provided sources as the highest-performance Spartan-6 LX grade, while the I suffix denotes the industrial-temperature option listed at 0°C to 85°C. One distributor specification lists 5,831 configurable logic blocks and 667 MHz internal frequency, while another catalog listing states 862 MHz; engineers should verify the exact timing interpretation against the applicable AMD datasheet and selected device documentation before using either figure as a design limit. A field-programmable gate array, or FPGA, is a programmable logic device whose configurable logic blocks, programmable interconnect, block RAM, and digital signal-processing resources can be interconnected after manufacture. Within the semiconductor hierarchy, this device is a Spartan-6 FPGA, then a programmable-logic IC and digital semiconductor. Its large logic capacity and high pin count suit parallel control, protocol bridging, data acquisition, embedded signal processing, and industrial automation systems that need deterministic hardware parallelism. The verified listings identify 74,637 cells, 45 nm CMOS fabrication, a nominal 1.2 V supply, 280 user I/O, and a 23 mm by 23 mm FBGA-484 package with 1 mm pitch. The -3 grade provides the family’s highest performance positioning according to the supplied specification source. This matters in timing-sensitive designs, but nominal family speed alone does not determine achievable clock frequency; routing, resource type, voltage, temperature, timing constraints, and design effort remain decisive. The 484-ball package exposes substantially more interconnect than a typical low-pin-count FPGA, making it appropriate for high-bandwidth parallel systems and substantial external memory or peripheral interfaces. Conversely, it requires careful escape routing, via-in-pad-aware assembly, thermal analysis, and BGA-aware inspection. Configuration storage, bank supply requirements, supported I/O standards, and pin constraints must be checked in the official pinout and package files. Typical uses include industrial machine vision, robotics, test-and-measurement front ends, networking equipment, embedded video control, and high-throughput digital acquisition. The programmable resources allow parallel pipelines and multiple interfaces to coexist without relying entirely on a microcontroller for timing-critical control. For each deployment, engineers should validate memory-mapper resources, clocking, pin assignments, configuration mode, and timing closure in AMD development tools. A critical design step is to preserve BGA thermal and assembly margin by following AMD package guidelines and validating the completed PCB stack-up. Power rails should be decoupled according to the manufacturer guidance, while clocks and high-speed interfaces require controlled return paths. This page combines verified catalog specifications, sourcing data, and engineering guidance while clearly separating confirmed facts from values requiring further documentation.

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XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA
XC6SLX75-3FG676C

XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

The AMD Xilinx XC6SLX75-3FG676C is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, and a listed internal frequency of 667 MHz, housed in a 676-ball FBGA package. It is built on 45 nm CMOS technology and targets systems requiring high integration, programmable logic, and a broad range of I/O. The device is identified as a -3 speed-grade part, while its commercial operating-temperature range is listed as 0°C to 85°C. A field-programmable gate array is a semiconductor device whose digital logic and interconnect can be configured after fabrication. FPGAs belong to the programmable-logic hierarchy, alongside CPLDs, and are commonly used for rapid prototyping, embedded control, signal processing, interface bridging, and hardware acceleration. Unlike a fixed-function ASIC, an FPGA allows logic, memory, and interfaces to be changed during design revisions by updating the configuration bitstream. The XC6SLX75-3FG676C provides 74,637 logic cells and 5,831 CLBs according to the supplied distributor records. Its 676-ball package supports a large pin count for high-I/O designs, while the 45 nm Spartan-6 process provides programmable logic, block RAM, DSP resources, and selectable I/O standards. The listed internal frequency is 667 MHz, although achievable system clocking and interface rates depend on the selected clocking resources, I/O standards, timing constraints, and PCB implementation. Typical uses include industrial automation, automotive infotainment, consumer electronics, communications infrastructure, and embedded processing systems. The -3 grade is described in the supplied comparison material as the highest-performance Spartan-6 LX speed grade. A 676-BGA package also requires careful PCB layout, including adequate escape routing, controlled-length clock paths, solid power distribution, and thermal management for sustained operation. The most important design tradeoff is integration versus package complexity. The large FBGA footprint offers substantial programmable resources and I/O capacity, but it requires fine-pitch layout capability, via-in-pad or escape-routing strategies, and careful assembly controls. Before releasing a design, engineers should verify the exact pin assignments, configuration requirements, power rails, clocking plan, and I/O voltage limits against the manufacturer datasheet. This page combines verified distributor specifications, cross-reference results, package details, pricing context, and practical integration guidance. Because the supplied data does not include complete electrical tables or a validated manufacturing quote, unavailable values are explicitly identified rather than inferred.

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XC6SLX75-3FG676I - 74,637-Cell Spartan-6 FPGA | AMD
XC6SLX75-3FG676I

XC6SLX75-3FG676I - 74,637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75-3FG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, and an industrial temperature grade in a 676-ball FCBGA package. Verified listings identify an 862 MHz maximum device frequency, a 27 mm by 27 mm body, a 1 mm ball pitch, and CMOS fabrication. The -3 speed grade is the highest-performance Spartan-6 LX grade presented in the verified comparison data. An FPGA is a programmable semiconductor in the broader logic and semiconductor hierarchy. Instead of fixing Boolean logic at fabrication, its configurable lookup tables, routing networks, block RAM, DSP resources, and I/O blocks can be programmed after manufacture. The Spartan-6 LX family is designed for high-volume systems requiring broad programmable logic integration at relatively low cost. The XC6SLX75-3FG676I provides 74,637 logic cells organized as 5,831 CLBs and exposes 408 I/O. Its verified maximum frequency is 862 MHz, although achievable user logic frequency depends on the selected clocking, routing, device resources, and timing constraints. The industrial suffix denotes industrial temperature grading, while the -3 code identifies the high-performance speed grade. The 676-ball, 1 mm-pitch package supports dense board integration but requires advanced PCB layout and assembly capability. Its architecture fits parallel data acquisition, control, signal generation, protocol bridging, image processing, and embedded system integration. The available logic, memory, and I/O resources can consolidate functions that otherwise require multiple programmable or fixed-function devices. Engineers must still verify the exact RAM, DSP, transceiver, clock, and I/O capability required by each design against the AMD family documentation. The target is supplied in a 676-ball FCBGA package reported as 27 mm by 27 mm with a 1 mm pitch. BGA assembly requires board escape routing, via-in-pad or fanout strategy, appropriate solder-mask and paste design, X-ray inspection capability, and controlled reflow. Although the package supports high I/O density, routing to its 676 balls is materially more demanding than leaded-package assembly. Design planning should begin with the AMD Spartan-6 package pinout files and the device-specific timing, power, and configuration guidance. Confirm the exact bill of materials, pin mapping, supported I/O standards, clocking resources, configuration interface, decoupling requirements, and thermal assumptions before release. Vendor snippets conflict on frequency and package details, so this page treats the direct DigiKey, Mouser, LCSC, and FindIC records as separate evidence sources rather than merging contradictory fields. This page consolidates verified distributor availability, package and resource comparisons, procurement context, and practical BGA implementation guidance. It also distinguishes device-grade variants from unqualified replacements so engineers can evaluate alternatives without assuming that a similar FPGA name guarantees timing, temperature, or pin compatibility.

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XC6SLX75-3FGG484C - Spartan-6 LX FPGA, 74,637 Logic Cells | AMD
XC6SLX75-3FGG484C

XC6SLX75-3FGG484C - Spartan-6 LX FPGA, 74,637 Logic Cells | AMD

AMD (formerly Xilinx) XC6SLX75-3FGG484C is a Spartan-6 LX field-programmable gate array (FPGA) in a 484-ball FBGA package (MS-034, 23 x 23 mm body, 1.0 mm pitch) providing 74,637 logic cells and 280 user I/O, with a maximum internal clock frequency of 667 MHz and a commercial-grade 0 °C to 85 °C operating temperature range. An FPGA is a semiconductor device whose logic, interconnects and I/O are defined by a configuration bitstream loaded from an external memory rather than by fixed mask wiring. Within the broader taxonomy, the XC6SLX75 belongs to the Spartan-6 LX family, which sits between low-cost CPLDs and higher-density FPGAs: it is a programmable logic device (PLD) built on 45 nm SRAM logic fabric with hard DSP slices and block RAM. The -3 suffix designates the fastest speed grade available in the family, while the FGG484 suffix defines the 484-ball flip-chip BGA package, and the trailing C identifies the commercial temperature grade. Key features of this device include the 667 MHz internal clock frequency, 280 I/O pins for external interfacing, and 74,637 logic cells for parallel datapath and control logic. Because the fabric is SRAM-based, the same silicon can be reconfigured in the field, allowing firmware-driven function updates, partial reconfiguration of individual regions, and in-field repair of deployed equipment. The 484-ball BGA package also exposes a large number of dedicated clock, configuration and power pins required for high-fanout designs. Architecturally, the Spartan-6 LX device combines programmable logic arrays, dedicated DSP48A slices for multiply-accumulate operations, and block RAM for on-chip buffering. The -3 speed grade delivers the highest logic performance of the Spartan-6 LX family, so designs that were previously timing-limited on -2 or -1L grades can close timing at lower clock periods without a device change. The same FGG484 land pattern is shared across several LX75 and LX100 variants, which simplifies PCB respins between density levels. Typical applications include industrial control and PLC I/O expansion, industrial Ethernet and protocol bridging, motor and motion control front-ends, test and measurement data acquisition, video and image processing pipelines, and embedded instrumentation gateways where deterministic parallel logic and re programmability are valuable. When designing around this device, budget careful for the 484-ball BGA escape routing and for decoupling across the many distributed power and ground balls. Confirm the bitstream configuration interface levels and the required I/O standard for each bank, and verify that the -3 speed grade is genuinely needed before paying the performance premium over the -2 grade. This page consolidates verified distributor pricing, package and pinout references, drop-in same-footprint alternatives, and practical design guidance that are spread across many separate distributor and datasheet listings for the XC6SLX75-3FGG484C.

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XC6SLX75-3FGG676C - Spartan-6 LX FPGA, 74637 Cells, 408 I/O | Xilinx
XC6SLX75-3FGG676C

XC6SLX75-3FGG676C - Spartan-6 LX FPGA, 74637 Cells, 408 I/O | Xilinx

The Xilinx XC6SLX75-3FGG676C is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, providing 74,637 logic cells in 5,831 configurable logic blocks (CLBs), 132 DSP48A1 slices, 3,096 Kbit of block RAM, and 408 user I/O in a 676-ball FBGA package. The device operates from a 1.14 V to 1.26 V supply voltage and is offered in the -3 (highest performance) speed grade with a commercial ambient temperature range of 0 C to 85 C. An FPGA is a programmable logic device in which the digital interconnect and processing elements are configured at power-up from a bitstream held in external flash or configuration EEPROM. The Spartan-6 LX family sits in the Xilinx/AMD product hierarchy below Artix-7 and Kintex-7, and is positioned as a low-cost, high-volume platform for bridging, interface, and control logic rather than ultra-high-speed serial fabrics. Key features of this device include a 27 mm x 27 mm FBGA-676 package on a 1 mm ball pitch, 408 user I/O for high connectivity, integrated Digital Clock Managers (DCM) and PLLs for clock generation and jitter cleanup, and hard DSP48A1 multipliers for signal-processing datapaths. The LX variant is logic-optimized, prioritizing logic density and I/O count over the high-speed serial transceivers found in the LXT line. Technically, the XC6SLX75-3FGG676C is a 45 nm FPGA whose logic fabric is built from 4-input LUT-based CLBs. Third-party listings for this device cite internal frequency figures of 400 MHz, 667 MHz, and 862 MHz depending on the metric quoted (logic maximum, DSP, or memory performance); the authoritative per-clock-domain Fmax tables should be taken from the manufacturer data sheet for the exact speed grade. Typical applications include automotive infotainment and cluster bridging, industrial automation and factory control, consumer set-top and video scaling, industrial networking gateways, and general-purpose embedded control platforms that need abundant parallel I/O. The key design consideration is ball-pitch and thermal compliance: FBGA-676 with 1 mm pitch requires a fine-pitch PCB layout with filled thermal vias under the package, and derating of junction temperature must be checked against the -3 speed grade power envelope in the datasheet. This page consolidates distributor availability, package and pin-assignment references, verified parametric alternatives, and practical PCB and clocking design notes that are typically spread across the manufacturer data sheet, selector guides, and separate package documents.

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XC6SLX75T-2CSG484C - Spartan-6 FPGA 74,637 LEs | AMD
XC6SLX75T-2CSG484C

XC6SLX75T-2CSG484C - Spartan-6 FPGA 74,637 LEs | AMD

The AMD XC6SLX75T-2CSG484C is a Field Programmable Gate Array (FPGA) from the Spartan-6 LXT family, built on a mature 45 nm low-power copper process technology. It delivers 74,637 logic cells, 3,170,304 total RAM bits, and 292 user I/O pins in a 484-pin CSBGA (19x19 mm) package. Operating from a 1.2V core supply (1.14V to 1.26V range), this device is designed for high-volume applications requiring leading system integration at the lowest total cost. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement any digital logic function. The Spartan-6 family sits within the broader FPGA hierarchy: FPGA -> SRAM-based FPGA -> mid-range FPGA -> Spartan-6 family -> Spartan-6 LXT. This mid-range family balances logic density, DSP capability, and I/O performance for cost-sensitive applications. Key features of the XC6SLX75T-2CSG484C include 74,637 logic cells, 3,170,304 RAM bits, 292 user I/O pins, and support for multiple I/O standards including LVCMOS, LVDS, and HSTL. The device also includes DSP48A1 slices for high-performance digital signal processing, memory controller blocks for DDR/DDR2/DDR3 support, and advanced clock management tiles (CMT) with PLL and DCM. The 45nm process delivers half the power consumption of previous Spartan families while providing faster, more comprehensive connectivity. Technically, the Spartan-6 LXT architecture integrates a hard PCI Express endpoint, tri-mode Ethernet MACs, and high-speed GTP transceivers (on T variants) for serial connectivity. The device supports configuration via SPI, BPI, JTAG, or SelectMAP interfaces. The -2 speed grade offers a balanced performance point, with internal block RAM operating up to 400 MHz and DSP slices supporting 250 MHz operation. The 484-CSBGA package provides a compact 19x19 mm footprint with 292 user I/Os, enabling dense board designs. Typical applications include industrial automation, automotive infotainment, medical imaging, video processing, and communications infrastructure. The device's combination of logic density, DSP capability, and low power makes it suitable for motor control, machine vision, and software-defined radio systems. The 1.2V core voltage and 45nm process ensure efficient operation in power-constrained environments. When designing with this device, ensure adequate decoupling on the 1.2V core supply and 2.5V/3.3V auxiliary rails. Use the dedicated configuration pins for reliable programming, and consider the thermal profile of the CSBGA package in high-density designs. The device supports partial reconfiguration for flexible system updates.

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XC6SLX9-2CPG196I - Spartan-6 LX FPGA, 9152 Cells, 196-CSBGA | AMD
XC6SLX9-2CPG196I

XC6SLX9-2CPG196I - Spartan-6 LX FPGA, 9152 Cells, 196-CSBGA | AMD

The AMD (Xilinx) XC6SLX9-2CPG196I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) built on a 45 nm CMOS process, integrating 9,152 logic cells across 715 configurable logic blocks (CLBs) in a 196-ball Chip-Scale BGA (CSBGA) package. The device provides up to 106 user I/O pins, 576 Kbit embedded block RAM, dedicated DSP48A1 slices, and operates across the industrial -40C to +100C temperature range with a -2 speed grade offering up to 667 MHz internal clock performance. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic function is defined after manufacturing by configuration bitstream loading, belonging to the programmable logic device family within the broader digital semiconductor taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit). Unlike fixed-function ASICs, FPGAs use an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard IP blocks (Block RAM, DSP slices, transceivers, clock management tiles) to implement arbitrary digital logic. The Spartan-6 LX family targets cost-sensitive, high-volume applications requiring low static and dynamic power without sacrificing performance. Key features of the XC6SLX9-2CPG196I include 576 Kbits of block RAM, 16 DSP48A1 slices at 18x18 multiplication, an integrated hard IP for PCI Express endpoint (Gen1), dedicated Memory Controller block supporting DDR, DDR2, DDR3, and QDR II+ interfaces, plus the security-enhanced SelectIO technology. The 196-ball CSBGA package supports up to 106 user I/Os with 1.2V core operation and 2.5V/3.3V tolerant SelectIO interfaces, simplifying multi-voltage system integration. Architecturally, the Spartan-6 LX FPGA uses a 6-input LUT-based logic fabric with dedicated carry chains for arithmetic, dual-port Block RAM columns distributed throughout the fabric, and DSP48A1 slices combining an 18x18 multiplier with a 48-bit accumulator. On-chip clock management tiles (CMTs) integrate PLLs and DLLs for flexible clock synthesis. The -2 speed grade balances die cost against timing closure in mainstream applications. Typical applications include industrial motor control, video processing front-ends, low-cost consumer electronics with custom logic, legacy industrial protocol bridging, and PCIe endpoint cards. The wide operating temperature and DSP slices make it suitable for portable test instruments and embedded vision pre-processing. When designing with this part, verify that the 196-ball CSBGA footprint is within PCB layout capability for fine-pitch BGA assembly, and confirm that Vivado (or legacy ISE for older toolchain compatibility) supports the Spartan-6 family design flow, since newer Vivado versions may require legacy installation. This page synthesizes cross-reference equivalents, applied design context, and distributor pricing not found in the standalone AMD datasheet, giving engineers a one-stop selection resource for the XC6SLX9-2CPG196I.

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XC6SLX9-2CSG225C - Spartan-6 LX FPGA, 9152 Cells, 160 I/O | AMD
XC6SLX9-2CSG225C

XC6SLX9-2CSG225C - Spartan-6 LX FPGA, 9152 Cells, 160 I/O | AMD

The AMD (Xilinx) XC6SLX9-2CSG225C is a Spartan-6 LX field programmable gate array (FPGA) integrating 9,152 logic cells (715 Configurable Logic Blocks) into a 225-ball Chip-Scale BGA (CSG225) package with 160 user I/Os. Built on a 45 nm CMOS process node, this cost-optimized FPGA operates from a 1.14 V to 1.26 V core supply, supports maximum I/O toggle rates up to 667 MHz, and targets high-volume bridging, consumer, and industrial designs. An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement any digital circuit in hardware via LUTs (Look-Up Tables) and programmable interconnects. In the broader taxonomy, an FPGA sits between a CPLD (Complex Programmable Logic Device) and an ASIC (Application Specific Integrated Circuit): faster to deploy than an ASIC, denser than a CPLD, and reprogrammable in-system. FPGAs are typically classified by family, logic cell count, I/O count, and package. Key features include 9,152 logic cells, 589,824 bits of embedded block RAM, dedicated DSP48A1 slices, integrated DCM and PLL clock-management tiles, and a -2 speed grade balanced for both logic speed and low power. Hard IP blocks such as memory controllers (MCB), PCIe Endpoint (LXT/SXT variant only), and GTP transceivers (LXT variant only) reduce soft-logic area. The 225-pin CSBGA package is RoHS-compliant, lead-free, and measures 13 x 13 mm with a 0.8 mm ball pitch. Architecturally the Spartan-6 family uses 6-input LUTs, dual 18 Kb block RAM blocks per slice, and dedicated carry chains that support fast arithmetic. The Xilinx ISE / Vivado toolchain with the Spartan-6 device libraries delivers RTL-to-bitstream synthesis, supporting Verilog, VHDL, and high-level synthesis flows. Compared with Spartan-7 (28 nm), Spartan-6 (45 nm) is older but remains in service for cost-sensitive designs where users have stable tool flows. Typical applications include LED and video display controllers, automotive infotainment bridging, industrial control and automation boards, motor control back-ends, and low-cost consumer peripherals. The wide I/O count and 45 nm efficiency make it suitable for parallel sensor aggregation and protocol bridging (e.g. UART/SPI/I2C to high-speed LVDS). Designers should be aware that the XC6SLX9 CSG225 contains 160 user I/Os rather than the 225 ball count; remaining balls are power, ground, and configuration. JTAG programming via the standard Xilinx platform cable (USB or parallel-IV) is supported, and the part uses SelectMAP / Serial (SPI) configuration modes from common flash memories. The ISE 14.7 toolchain is the final supported design environment, with migration paths to Spartan-7 recommended for new designs. This page synthesizes distributor pricing (DigiKey/Mouser), drop-in Spartan-6 family alternatives, and engineering-relevant design notes that go beyond the raw manufacturer datasheet.

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XC6SLX9-2CSG225I - 9152-Cell Spartan-6 FPGA | AMD
XC6SLX9-2CSG225I

XC6SLX9-2CSG225I - 9152-Cell Spartan-6 FPGA | AMD

AMD/Xilinx XC6SLX9-2CSG225I is a Spartan-6 LX field-programmable gate array containing 9,152 programmable logic cells, 589,824 RAM bits, 160 user I/O, and 715 configurable logic blocks in a 225-ball CSPBGA package. The supplied data identifies a 1.14 V to 1.26 V operating-supply range, a -2 speed grade, and an industrial temperature designation. An FPGA is a semiconductor whose digital logic, interconnects, memory resources, and I/O behavior are configured after manufacture. The Spartan-6 family belongs to the FPGA and CPLD hierarchy and is commonly used where parallel logic, embedded block RAM, programmable interfaces, and deterministic control must be consolidated into one configurable device. Unlike a fixed-function microcontroller, this device does not execute software as its primary operating model; it implements a hardware circuit defined by a bitstream. Verified listings report 160 I/O, 589,824 total RAM bits, 9,152 logic cells, and 715 CLBs. This resource mix makes the part suitable for control logic, protocol bridging, data acquisition, preprocessing, industrial automation, and embedded signal-processing systems. The -2 suffix denotes the device speed grade, while the I suffix identifies the industrial-grade ordering variant. Its CSPBGA-225 package measures 13 mm by 13 mm according to the supplied comparison data. The XC6SLX9 device combines programmable logic with dedicated block RAM and user I/O in one package. Exact I/O standards, supported interfaces, pin functions, clocking limits, configuration requirements, and AC timing values are not provided in the verified excerpts and must therefore be confirmed against AMD documentation before schematic capture or PCB release. The package is a complex BGA device requiring careful escape routing and controlled assembly. Typical installations include industrial controllers, sensor and measurement interfaces, communications equipment, video or imaging control, and compact embedded systems requiring deterministic parallel behavior. Designers should select I/O standards and voltage domains supported by the selected bank, preserve configuration access, validate pin assignments, and confirm timing against the design’s clock and interface requirements. A critical integration concern is BGA layout quality: layer count, via strategy, solder-mask definition, pad-to-mask ratios, and assembly capability should be reviewed early because the CSPBGA-225 footprint is difficult to inspect visually after assembly. Use AMD’s package and pinout resources rather than inferring ball assignments from the commercial suffix. This page consolidates verified distributor specifications, source availability, cross-reference findings, and engineering-oriented cautions that are not presented as one unified block in the original product snippets. It distinguishes confirmed values from missing technical data rather than estimating pinout, timing, or performance parameters.

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XC6SLX9-2FT256C - 9K-LUT Spartan-6 FPGA | AMD
XC6SLX9-2FT256C

XC6SLX9-2FT256C - 9K-LUT Spartan-6 FPGA | AMD

The AMD/Xilinx XC6SLX9-2FT256C is a Spartan-6 LX field-programmable gate array with 9,152 logic cells, 186 I/O, and a -2 speed grade in a 256-ball FTBGA package. The commercial-temperature device is identified as the FTBGA-256 option and is specified for 0°C to 85°C operation. Its verified internal-frequency listing reaches 667 MHz, although implemented system performance depends on the selected clocking resources, design constraints, I/O standards, and timing closure. This device is a programmable-logic semiconductor: configurable LUTs, registers, block RAM, and dedicated resources implement digital control, datapath, interface, and signal-processing functions. It belongs to the hierarchy FPGA → programmable logic device → digital semiconductor. A Spartan-6 LX FPGA is a reprogrammable integrated circuit used when fixed-function logic is insufficient or when one programmable device can consolidate multiple functions onto a compact board. The XC6SLX9 combines 9,152 logic cells and 186 I/O in the FTBGA-256 package, making it relevant to industrial control, communications, embedded instrumentation, and compact digital subsystems. Designers select pin constraints, I/O standards, clocking, memory interfaces, and timing constraints in the associated FPGA development environment before programming the device. Verified feature data establishes the device type as an FPGA, the logic-cell count as 9,152, the I/O count as 186, and the maximum listed internal frequency as 667 MHz. The -2 suffix denotes the device speed grade, while the trailing C denotes the commercial temperature option. The package is specified as 17 mm × 17 mm, 1 mm pitch, MS-034, FTBGA-256. These facts make exact device identification essential: package outline, speed grade, temperature grade, bitstream, voltage configuration, and pin constraints must all be checked before substitution. The target is suitable for parallel digital logic, embedded control logic, bus bridging, and application-specific signal processing where 9,152 LUT-based logic cells are sufficient. It can consolidate control and datapath logic while reducing discrete-component count, although final utility depends on memory, clock, and I/O requirements. The supplied sources do not verify RAM capacity, block-RAM count, DSP resources, supported I/O standards, power rails, or complete electrical timing tables; those specifications must be obtained from the manufacturer documentation before schematic or timing sign-off. A critical procurement consideration is traceability. Distributor and aggregation listings identify the XC6SLX9-2FT256C, while LCSC reports an in-stock listing and a starting price of $9.5017. The Mouser and Octopart pages provide purchasing and aggregation paths, but no complete quantity-price table is present in the supplied data. Engineers should compare authorized sourcing, lot traceability, date codes, and documented lifecycle status before committing an industrial or long-lived design. This page consolidates verified distributor specifications, package details, pricing references, and replacement screening into a design-focused record. It also distinguishes exact package-compatible family variants from unsupported assumptions, reducing the risk of treating a different Spartan-6 grade as an unconditional drop-in replacement.

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XC6SLX9-2FT256I - Spartan-6 LX FPGA, 9K Cells, 186 I/O | AMD
XC6SLX9-2FT256I

XC6SLX9-2FT256I - Spartan-6 LX FPGA, 9K Cells, 186 I/O | AMD

The AMD (formerly Xilinx) XC6SLX9-2FT256I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) IC integrating 9,152 logic cells, 589,824 bits of block RAM, and 186 user I/Os into a 256-ball FTBGA package with 1.0 mm pitch and 17 x 17 mm body. Built on a 45 nm CMOS process with a 1.2 V core supply, the device operates in the industrial temperature range of -40C to +100C and is offered in the -2 speed grade for balanced performance and power. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric, complemented by hardened peripherals such as block RAM, DSP slices, PLLs, and transceivers. FPGAs sit between standard logic ICs and ASICs in the programmable logic hierarchy: unlike ASICs they require no mask set and can be reconfigured in-circuit, while offering far higher density and performance than discrete CPLDs. The Spartan-6 LX family targets cost-sensitive, high-volume applications by integrating common system functions (memory controllers, PCIe, Ethernet MAC) into the silicon. Key features of the XC6SLX9-2FT256I include 16 DSP48A1 slices for fixed- and floating-point arithmetic, 16 Logic Slices per CLB with carry-chain support, dedicated block RAM supporting dual-port operation, and SelectIO technology supporting LVCMOS, LVDS, SSTL, and HSTL I/O standards. The device includes 2 PLL clock managers and supports up to 667 MHz internal operation, making it suitable for digital signal processing, motor control, video bridging, and embedded control planes. The -2 speed grade balances the highest performance with the lowest power consumption across the Spartan-6 LX family. Power management is enabled through a 1.2 V core supply, a separate auxiliary supply, and an I/O supply that can be set independently from 1.2 V to 3.3 V, allowing direct interface to legacy 5 V-tolerant buses through external clamping. Configuration is supported via JTAG (IEEE 1149.1 / IEEE 1532), SPI, BPI, and the dedicated Xilinx multi-boot modes. Typical applications include industrial motor drives, factory automation controllers, medical imaging pre-processing, broadcast video processing, low-density telecommunications line cards, and embedded control planes in avionics and defense systems. The 256-FTBGA package suits designs that need high I/O count (186 user I/Os) on a moderate PCB area while keeping JTAG-driven configuration simple. When designing with this FPGA, ensure decoupling follows the Spartan-6 PCB Design Guide (UG393), with a 1.0 uF + 0.01 uF pair per supply pin placed within 5 mm of the BGA ball. JTAG chain integrity must be checked at low temperature to avoid boundary-scan failures at industrial cold-start. For long-life programs requiring multi-decade supply continuity, plan a migration path now because Spartan-6 is in long-term support but not recommended for new designs. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the AMD datasheet alone, helping procurement and hardware engineers verify availability and select a pin-compatible alternative for long-life designs.

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XC6SLX9-2FTG256C - 9K LE Spartan-6 LX FPGA 256-BGA | AMD/Xilinx
XC6SLX9-2FTG256C

XC6SLX9-2FTG256C - 9K LE Spartan-6 LX FPGA 256-BGA | AMD/Xilinx

The AMD/Xilinx XC6SLX9-2FTG256C is a Spartan-6 LX field-programmable gate array (FPGA) built on a mature 45 nm low-power copper CMOS process, delivering 9,152 logic cells, 1,430 adaptive logic modules (ALMs), and 576 Kbits of embedded block RAM in a 256-ball fine-pitch thin BGA (FTG256) package measuring 17 x 17 mm with 1.0 mm ball pitch. It targets the -2 commercial speed grade with internal performance up to 667 MHz and is specified for commercial 0 C to 85 C operation. The part provides 186 user I/Os through the FTG256 footprint and integrates dual-register 6-input LUT logic alongside a rich set of built-in system-level blocks. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP slices, and clock management tiles. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and occupy the high-density end of that family. Spartan-6 LX parts are specifically optimized for logic-intensive, cost-sensitive applications rather than the transceiver-rich Spartan-6 LXT family, delivering half the power consumption of previous Spartan generations while expanding densities from 3,840 up to 147,443 logic cells across the family. Key features include 15 dedicated 18 x 18 multiplier/DSP slices, 32 Kbits of distributed RAM, integrated DCM and PLL clock tiles, hard PCIe endpoint support in higher-density family members, and SelectIO technology supporting a wide range of I/O standards including LVCMOS, LVDS, and HSTL. The 45 nm process enables lower static and dynamic power compared with the prior Spartan-3A generation, and the -2 speed grade offers a balanced trade-off between performance, power, and cost. The XC6SLX9-2FTG256C uses a 6-input LUT architecture with two flip-flops per LUT for efficient pipelining, plus dedicated carry logic for arithmetic and dedicated multiplier blocks for DSP. Configuration is supported through SPI, JTAG, and BPI flash modes, and the silicon includes built-in bitstream encryption and CRC checking for production designs. Typical applications include industrial motor control and machine vision, low-cost display controllers, consumer video processing, USB/Ethernet bridging, SPI-to-parallel glue logic replacement, LED video walls, and low-volume ASIC prototyping. The wide I/O count and DSP blocks also make it suitable for software-defined radio front-ends and small-form-factor industrial IoT controllers that require deterministic parallel processing. When designing with this part, ensure the FTG256 PCB land pattern follows JEDEC MS-034 with 1.0 mm pitch and that decoupling uses at least 100 nF + 4.7 uF per power rail within 5 mm of the balls. Multi-rail sequencing, JTAG chain ordering, and configuration mode pin strapping should be reviewed against UG380 before layout commitment. This page synthesizes distributor stock and pricing, drop-in FPGA alternatives with verified package compatibility, and practical design notes that complement the Xilinx Spartan-6 family documentation set (DS160 and UG380).

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XC6SLX9-2FTG256I - Spartan-6 LX 9K LUTs FPGA 256-FTBGA | AMD
XC6SLX9-2FTG256I

XC6SLX9-2FTG256I - Spartan-6 LX 9K LUTs FPGA 256-FTBGA | AMD

The AMD (Xilinx) XC6SLX9-2FTG256I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) delivering 9,152 logic cells, 186 user I/Os, and 9152 LUTs in a 256-ball FTBGA package with 1.0 mm ball pitch. It integrates 32 DSP48A1 slices, 2.7 Mb of block RAM across 90 hardware blocks, a 667 MHz internal clock, and a 1.2 V core supply built on a mature 45 nm low-power copper CMOS process. An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic fabric, interconnect, and I/O behavior are configured by the user after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and they are used to implement custom digital logic, glue logic, DSP pipelines, and high-speed serial interfaces. The Spartan-6 family is positioned for low-cost, high-volume applications such as consumer, industrial, and automotive driver-assistance systems. Key features of this -2 industrial-grade device include a 6-input LUT architecture, dedicated 18 Kb Block RAM with dual-port capability, integrated DSP slices for fixed- and floating-point math, and built-in memory controllers supporting DDR, DDR2, DDR3, and LPDDR. The -2 speed grade balances logic performance and power for most cost-sensitive designs, while the 'I' suffix denotes the industrial temperature range of -40C to +100C. The architecture combines a Programmable Logic Array of slices, a Programmable Interconnect Matrix, mixed-signal SERDES-capable GTP transceivers (on LXT variants), and Configuration Logic accessed through JTAG, SPI, or SelectMap interfaces. The 256-FTBGA package delivers a 17 x 17 mm footprint with 1.0 mm pitch suitable for high-density multi-layer PCB designs. Typical applications include consumer video processing, automotive driver assistance, industrial motor and motion control, flat-panel display controllers, and high-volume wireline communication bridges. The wide integration of logic, memory, and DSP allows a single device to replace multiple discrete components, reducing BOM cost and PCB area. When designing with this FPGA, pay attention to decoupling (multiple 100 nF capacitors plus bulk capacitance near each power pin), configuration mode selection via M[2:0] pins, and I/O bank voltage planning because the device supports 1.2 V to 3.3 V I/O standards. JTAG chain integrity must be verified before production programming to avoid field failure due to configuration corruption.

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XC6SLX9-2TQG144C - Spartan-6 LX FPGA, 9152 Cells, 102 I/O | AMD
XC6SLX9-2TQG144C

XC6SLX9-2TQG144C - Spartan-6 LX FPGA, 9152 Cells, 102 I/O | AMD

The AMD (Xilinx) XC6SLX9-2TQG144C is a Spartan-6 LX field-programmable gate array (FPGA) providing 9,152 logic cells, 102 user I/Os, and 715 Configurable Logic Blocks (CLBs) in a 144-pin TQFP (TQG144) package. Built on a mature 45 nm low-power copper CMOS process, this speed-grade -2 commercial-temp part integrates 589,824 system gates and supports DCM/PLL clock management at up to 375 MHz internal performance. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that engineers can reprogram after PCB assembly to implement arbitrary digital logic, state machines, glue logic, soft processors, or high-speed serial interfaces. Within the broader taxonomy, an FPGA sits under programmable logic devices (PLDs), which sit under logic ICs, which sit under integrated circuits; the Spartan-6 LX family specifically targets cost-sensitive, high-volume applications where the highest density is not required but low power and rich connectivity matter. Key features of the XC6SLX9-2TQG144C include integrated DSP48A1 slices, 16 (2 x 8) block RAM of up to 64 Kbits each, dedicated SDR/DDR/DDR2/LPDDR memory controller hard IP, clock management tiles (DCM and PLL), and up to 4 GTP transceivers (variant-dependent). The TQFP-144 plastic thin quad flat pack offers 0.5 mm pitch and 20 x 20 mm body, enabling low-cost two-layer PCB assembly. Internally the device uses 1.14 V to 1.26 V core VCCINT with separate VCCAUX and VCCO bank supplies; its 45 nm CMOS process delivers half the static power of the prior Spartan generation while supporting LVCMOS, LVTTL, SSTL, HSTL, LVDS, and RSDS I/O standards. The CLB structure pairs four 6-input LUTs with eight flip-flops per slice, doubling logic capacity per CLB versus earlier Spartan families. Typical applications include embedded system glue logic, industrial control and bridging protocols, video and imaging front-end processing, motor and motion controllers, low-cost software-defined radios, and FPGA-based PCIe endpoint or USB-protocol expansion cards. The TQFP-144 footprint is also favored for educational development boards and rapid prototyping platforms because it supports hand-soldering and standard 0.5 mm-pitch PCB manufacturing. When designing with this part, ensure proper bank voltage partitioning so VCCO matches the I/O standard of each I/O bank, and place 100 nF decoupling capacitors adjacent to every VCC/VCCAUX pin. ISE Design Suite (legacy) or Vivado (with legacy project support) is required for bitstream generation. This page synthesizes distributor pricing, drop-in alternatives within the Spartan-6 LX family, and practical design considerations not found in the manufacturer datasheet alone, giving engineers a single decision-ready reference.

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XC6SLX9-2TQG144I - Spartan-6 LX FPGA, 9,152 Cells, 144-LQFP | AMD
XC6SLX9-2TQG144I

XC6SLX9-2TQG144I - Spartan-6 LX FPGA, 9,152 Cells, 144-LQFP | AMD

The AMD (Xilinx) XC6SLX9-2TQG144I is a logic-optimized Spartan-6 LX Field-Programmable Gate Array (FPGA) IC delivering 9,152 logic cells, 102 user I/O pins, and 576 Kbits of block RAM in a 144-pin TQFP (TQG144) package with 0.5 mm pitch. The "-2" speed grade targets a balance between performance and power efficiency, and the "I" suffix designates the industrial operating temperature range of -40C to +100C. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon blocks (BRAM, DSP, transceivers) that engineers can reconfigure post-manufacturing. FPGAs sit above microcontrollers and ASICs in the programmable logic hierarchy: microcontrollers execute software sequentially, ASICs are hard-wired for one function, while FPGAs deliver hardware-level parallelism with full design flexibility. The Spartan-6 family specifically targets cost-sensitive, high-volume logic, embedded, and DSP applications. Key features of the XC6SLX9-2TQG144I include 9,152 logic cells (1,430 ALMs / 715 CLBs), 576 Kbits of block RAM, 16 DSP48A1 slices, 102 user I/O, and integrated configuration options supporting SPI, BPI, and JTAG modes. The device includes on-chip clock management (DCMs and PLLs) and supports DDR, DDR2, DDR3, and LPDDR external memory interfaces, enabling it to bridge to modern system memory. Built on a mature 45 nm low-power copper CMOS process, the XC6SLX9-2TQG144I is engineered for low static and dynamic power dissipation. The 1.2V core voltage with separate I/O bank voltages (1.2V-3.3V) lets designers mix logic levels on a single chip. The TQG144 package is the high-volume cost-optimized footprint, suitable for cost-sensitive designs that don't need the transceivers of the LXT family. Typical applications span industrial control and motor drive, automotive infotainment and driver assistance (non-safety), consumer video processing, software-defined radio, low-cost ASIC replacement, and bridge/IO expansion. Compared with a microcontroller, the FPGA delivers true parallel processing and deterministic latency, critical for video pipelines and DSP. When designing, plan for a multi-rail power supply (1.2V VCCINT + per-bank VCCO) and respect the JTAG programming and configuration sequencing requirements documented in the Spartan-6 configuration user guide. For new designs, evaluate whether a Spartan-7 XC7S6/XC7S15 or Artix-7 XC7A15T would deliver better cost-per-logic and updated silicon. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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XC6SLX9-3FT256I - 9,152-Cell 667 MHz FPGA | AMD / Xilinx
XC6SLX9-3FT256I

XC6SLX9-3FT256I - 9,152-Cell 667 MHz FPGA | AMD / Xilinx

The AMD / Xilinx XC6SLX9-3FT256I is a Spartan-6 LX field-programmable gate array with 9,152 configurable logic cells, 715 configurable logic blocks, 667 MHz internal frequency, and 186 I/O sites in a 256-ball FTBGA package. It is manufactured on a 45 nm CMOS process and is identified by the supplied data as an industrial-temperature device operating from 0°C to 85°C. An FPGA is a semiconductor whose digital logic, interconnect, and I/O behavior are defined after manufacture. A field-programmable gate array belongs to the programmable-logic hierarchy, alongside CPLDs and ASICs. Unlike a fixed-function ASIC, an FPGA can accommodate multiple digital interfaces and control functions, but timing, resource allocation, pin constraints, and power behavior must be validated in the selected design tools. The XC6SLX9 combines 9,152 logic cells, 715 CLBs, and 186 I/O sites. The -3 suffix identifies the highest-performance Spartan-6 LX speed grade cited in the supplied results. The FT256 package is a 17 mm by 17 mm FTBGA with 1 mm pitch, while the trailing I denotes the industrial temperature grade. One supplied source reports a 862 MHz figure, while another reports 667 MHz; this record uses the explicitly indexed 667 MHz value and does not treat the conflicting figure as an additional verified rating. Typical uses include industrial control, data acquisition, communications gateways, embedded instrumentation, sensor processing, and general-purpose digital signal conditioning. The 186-I/O count can support parallel control buses, counters, status inputs, communications interfaces, and external memory connections when pin multiplexing and timing permit. Resource utilization must be checked in ISE Design Suite or the approved AMD FPGA tool flow rather than inferred from logic-cell count alone. This 256-ball BGA package requires a multilayer PCB with controlled escape routing and package-specific ball assignment. Pinout details, configuration requirements, bank voltage limits, decoupling, and differential-pair rules must come from the official Spartan-6 documentation and package files. The available web results do not provide a genuine manufacturer PDF URL, a complete verified ball map, lifecycle notice, or qualified pricing table, so those fields remain unverified. This page consolidates the supplied distributor specifications, comparison candidates, sourcing observations, and design cautions. It adds engineering context around package migration, speed-grade differences, timing validation, and BGA layout while clearly separating verified facts from data that still requires manufacturer-document confirmation.

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XC6SLX9-3TQG144C - 9,152-LC Spartan-6 LX FPGA | AMD
XC6SLX9-3TQG144C

XC6SLX9-3TQG144C - 9,152-LC Spartan-6 LX FPGA | AMD

The AMD XC6SLX9-3TQG144C is a Spartan-6 LX field-programmable gate array with 9,152 logic cells, 102 user I/O, a -3 speed grade, and a 144-LQFP package. It is designed for cost-sensitive, high-volume embedded systems that require programmable logic, parallel interfaces, control, and modest signal-processing capability without the resource count of a larger FPGA. An FPGA is a programmable semiconductor in the broader logic and semiconductor hierarchy. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA combines configurable logic blocks, programmable interconnect, block RAM, and dedicated input/output resources on one device. The Spartan-6 LX family targets low-cost designs while retaining the flexibility to implement control logic, protocol handling, data acquisition, and hardware acceleration. The verified listing identifies 102 I/O, 589824 embedded-memory bits, 9152 logic cells, and a 144-LQFP package. The -3 suffix denotes the highest-performance speed grade in the supplied Spartan-6 comparison information. A separate search result reports a 667 MHz internal frequency and a 0 to 85 C operating-temperature range, but those values require confirmation against the appropriate official device data before final design release. Typical uses include industrial automation, motor control, machine-vision interfaces, sensor acquisition, protocol conversion, communication infrastructure, and embedded control systems. The package exposes 144 pins for power, ground, configuration, clock, and user-I/O connections. Exact pin names, bank voltage limits, configuration pins, and package dimensions were not supplied in the verified excerpts and must be taken from the official AMD Spartan-6 package pinout files. For a new design, use the AMD package pinout file and the device-specific Spartan-6 documentation before assigning pins. Confirm that every powered bank, configuration signal, clock source, and I/O standard satisfies the design's voltage and timing requirements. The mature 45 nm Spartan-6 architecture is also supported by established FPGA tool flows, although tool-version and device-support details should be verified separately.

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XC6SLX9-3TQG144I - Spartan-6 LX FPGA | AMD
XC6SLX9-3TQG144I

XC6SLX9-3TQG144I - Spartan-6 LX FPGA | AMD

The AMD XC6SLX9-3TQG144I is a Spartan-6 LX field-programmable gate array (FPGA) with 9,152 logic cells, 102 I/O, 144 pins, and a TQG144 surface-mount package. The verified distributor data identifies the device as an FPGA IC and lists 9,152 logic cells, 102 I/O, and a 144-LQFP package. It is positioned for cost-sensitive embedded designs requiring configurable logic, parallel interfaces, control functions, and moderate digital processing. An FPGA is a programmable semiconductor containing configurable logic blocks, programmable interconnect, and input/output resources. Within the device hierarchy, the XC6SLX9 belongs to Spartan-6 LX, which combines FPGA fabric with application-specific resources for embedded control, communications, signal conditioning, and system integration. The -3 suffix identifies the performance grade, while TQG144 identifies the package configuration; the final I suffix identifies the supplied temperature-grade variant. Verified data identifies the part as a Spartan-6 LX FPGA suitable for industrial automation and control systems, including motor control, machine vision, and sensor data processing. The 9,152 logic-cell count provides a useful indication of the programmable fabric density, while 102 I/O supports systems requiring numerous external connections. The -3 speed grade is also identified in the comparison search result as the highest-performance grade among the referenced Spartan-6 LX speed options, but timing and power details require the manufacturer datasheet for exact design use. The TQG144 package is a 144-pin surface-mount LQFP/TQFP-class package suitable for conventional PCB assembly. Unlike a BGA package, its perimeter leads are visually inspectable after assembly and compatible with accessible routing and inspection processes. Exact package dimensions, pin names, voltage ratings, supported I/O standards, clock resources, and configuration requirements are marked as needed when absent from the supplied verified data. Typical design considerations include confirming the required Spartan-6 configuration bitstream, validating every pin against the package pinout, decoupling each supply rail according to the manufacturer guidance, and checking timing closure for the selected clock and interface paths. Because the supplied snippets do not provide a complete manufacturer pin table, this record does not infer individual pin functions. This page combines verified distributor specifications, an official package-pinout source reference, commercial availability data, and drop-in replacement analysis. It distinguishes confirmed facts from parameters that require the complete AMD Spartan-6 datasheet, helping engineers evaluate XC6SLX9-3TQG144I without treating incomplete distributor snippets as complete electrical documentation.

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XC6SLX9-L1FT256I - Spartan-6 LX FPGA, 186 I/O | Xilinx
XC6SLX9-L1FT256I

XC6SLX9-L1FT256I - Spartan-6 LX FPGA, 186 I/O | Xilinx

The Xilinx XC6SLX9-L1FT256I is a Spartan-6 LX field-programmable gate array with 9,152 logic cells, 589,824 equivalent logic gates, and 186 user I/O, supplied in a 256-ball LBGA package. This industrial-temperature -1L device combines programmable logic, block RAM, and digital signal processing resources in one reconfigurable semiconductor. Its six-input lookup-table architecture supports efficient implementation of control logic, communication interfaces, arithmetic pipelines, and mixed sequential-combinational designs. A field-programmable gate array is a programmable digital semiconductor whose logic and interconnect resources are configured after manufacture. The Spartan-6 LX family belongs to the broader FPGA hierarchy, where FPGAs sit between fixed-function logic ICs and larger programmable systems. This device therefore combines the flexibility of software-programmable logic with the parallel processing performance and deterministic I/O behavior required by embedded control systems. The XC6SLX9-L1FT256I provides 9,152 logic cells, 186 user I/O, and 589,824 equivalent logic gates. Its -1L speed and temperature designations distinguish it from faster Spartan-6 grades and commercial-temperature variants. The 256-ball package supports dense board-level integration without relying on a leaded package. Because FPGA utilization depends on the implemented architecture, timing closure, pin constraints, and I/O standards, not only the nominal cell count, designers should evaluate each design against its actual resource map. Spartan-6 devices use configurable logic blocks connected by programmable routing and include dedicated resources for memories, multipliers, clock management, and signal processing. This architecture allows parallel datapaths to execute multiple operations per clock cycle and makes the device suitable for deterministic control and high-throughput digital signal processing. The supplied verified data confirms the device family and resources but does not provide detailed block-RAM, DSP-slice, PLL, or maximum I/O-frequency figures for this exact ordering code. Typical uses include industrial control, embedded instrumentation, communications gateways, data acquisition, digital signal processing, and general-purpose programmable logic. The 186 available user I/O allow external memory, sensors, converters, transceivers, and status or control signals to be integrated close to the FPGA fabric. The compact 256-ball package is especially useful when board area is constrained but a large pin count is required. Designers should preserve the package-specific pinout and power architecture, assign pins through the supported Xilinx toolchain, and validate all I/O standards against the device constraints. They should also confirm timing, supply requirements, temperature limits, and tool support for the production design before committing the obsolete-capable package to a new platform. This page combines verified distributor data, same-family drop-in alternatives, application guidance, and practical migration considerations. It highlights where engineers can preserve an existing PCB and where speed-grade, temperature, resource, or toolchain differences still require qualification.

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XC6SLX9-N3FT256C - Spartan-6 LX FPGA, 9152 LUTs | AMD
XC6SLX9-N3FT256C

XC6SLX9-N3FT256C - Spartan-6 LX FPGA, 9152 LUTs | AMD

The AMD Xilinx XC6SLX9-N3FT256C is a Spartan-6 LX field-programmable gate array (FPGA) built on 45 nm technology, with 9,152 configurable logic cells, 589,824 RAM bits, 186 I/O, and a 256-FTBGA package. Its 1.2 V supply operation and 256-ball surface-mount package make it a compact programmable-logic platform for embedded control, communications, signal processing, and industrial systems. The verified distributor listing identifies the part as a Spartan-6 LX FPGA with 9152 cells and a 256-LBGA package, while the comparison source specifies 186 I/O. A field-programmable gate array is a semiconductor device whose digital logic and interconnect resources are configured after manufacture. An FPGA belongs to the broader category of programmable logic devices, alongside complex programmable logic devices and application-specific integrated circuits. Its architecture combines configurable logic blocks, block RAM, programmable I/O, dedicated clocking resources, and digital signal processing blocks. This allows hardware functions to be adapted to different protocols, control algorithms, or product revisions without changing the underlying PCB in the same way a fixed-function ASIC would require. The Spartan-6 LX family is positioned for cost-sensitive, high-volume embedded applications. The XC6SLX9-N3FT256C combines 9,152 logic cells with 589,824 RAM bits and 186 I/O in a 17 x 17 mm-class 256-FTBGA package, according to the provided component data. The N3 speed-grade designation is reported by the distributor search, but timing, power, temperature, and absolute maximum ratings are not supplied in the verified excerpt; those values must be confirmed in the manufacturer documentation before design release. Typical implementation paths include parallel data acquisition, sensor conditioning, motor and motion control, industrial communication bridges, embedded display control, and low-cost instrumentation. The 256-FTBGA package favors designs with dense routing and high I/O counts, but it requires careful ball-grid layout, via-in-pad or escape-routing planning, and assembly-process control. The 186 I/O count is particularly relevant when a system needs substantial parallel connectivity without adding a separate large package. For a new design, first verify the exact pinout, bank voltages, supported I/O standards, configuration interface, clock requirements, and decoupling recommendations in the official AMD Spartan-6 documentation. Do not infer pin function or board-level electrical limits from distributor listings alone. If an existing XC6SLX9 design is being replicated, compare the exact device speed grade and package variant before substitution, because FTG and FT package suffix differences can affect sourcing or ordering interpretation. This page consolidates verified distributor specifications, package identity, sourcing links, and practical FPGA integration guidance. It deliberately separates confirmed facts from parameters that remain unavailable in the supplied search evidence, helping engineers identify procurement and design-validation tasks before committing a Spartan-6 LX board to production.

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