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MPC8555EPXAQF

MPC8555EPXAQF - PowerQUICC III 1GHz e500 MPU | NXP | Networking

The NXP Semiconductors (formerly Freescale) MPC8555EPXAQF is a PowerQUICC III integrated communications microprocessor built on Power Architecture technology, integrating a PowerPC e500 core with system logic for networking and telecommunications. Operating at up to 1.0 GHz core clock, it features a 32-bit data path architecture and is housed in a 783-ball FCPBGA (29 x 29 mm, 1 mm pitch) package. The device supplies 1.2 V core voltage with on-chip voltage regulation support for downstream logic. A microprocessor (MPU) is a single-chip CPU that integrates arithmetic logic, control unit, register file, cache, and memory management hardware. The MPC85xx PowerQUICC III family belongs to the broader category of embedded communications processors, sitting within networking SoCs / MPU hierarchy and targeting wireline/wireless infrastructure equipment where deterministic packet processing and rich peripheral integration are required. Key features include a hardware-accelerated peripheral set, integrated security engine, DDR memory controller, multiple GigaBit Ethernet MACs (typically four), PCI/PCI-X controller, and programmable serial interfaces (TDM, UTOPIA, SPI, I2C). The part is marketed under the part-status designation "PQ 37 LITE 8555E" per Mouser listing, indicating it is the lower-power / specific-configuration variant of the MPC8555E family. Typical applications include multi-service routers, DSLAM line cards, industrial control gateways, secure VPN appliances, 3G/4G base station control-plane processing, and Power-over-Ethernet switches. The combination of e500 core performance and integrated communications peripherals reduces system BOM by eliminating companion ASICs or FPGAs. When designing with this device, route all four DDR data byte lanes with matched-length, 100 ohm differential impedance, and provide extensive decoupling (>= 22 uF bulk + 0.1 uF per power pin). The thermal design must account for typical 6-9 W dissipation at 1 GHz; a multi-layer PCB with internal ground planes is mandatory for junction temperature compliance. This page synthesizes distributor availability, parametric cross-references to other PowerQUICC III variants, and practical design notes not found in the manufacturer datasheet, providing engineers with actionable selection guidance for new designs and field-replacement scenarios.

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MPC8555EVTAJD

MPC8555EVTAJD - PowerQUICC III e500 MPU 533MHz | NXP

The NXP MPC8555EVTAJD is a PowerQUICC III integrated communications processor built on Power Architecture technology, featuring an e500 processor core running up to 533 MHz in a 783-pin FCBGA (29x29 mm) package. The device integrates the e500 core with system logic optimized for networking, telecommunications, and embedded control applications, combining high-performance processing with integrated communications peripherals in a single SoC. A microprocessor (MPU) is a single-chip CPU that integrates the central processing unit, cache, memory controller, and peripheral interfaces into one package. The PowerQUICC family sits in the broader taxonomy as an integrated communications processor - bridging general-purpose MPU cores with hardware acceleration for networking protocols. The MPC8555E extends this lineage by combining the e500 core with the system-on-chip PowerQUICC III platform architecture, enabling high-throughput packet processing alongside general-purpose compute. Key features of the MPC8555EVTAJD include a 32-bit e500 core at 533 MHz, dual DDR memory controllers (32-bit DDR and 16-bit DDR2), integrated security engine, four Gigabit Ethernet controllers, and a 783-ball FCBGA package with 1.0 mm pitch. The device also integrates PCI Express and Serial RapidIO interfaces, making it suitable for high-bandwidth backplane and line-card designs. The e500 core includes dual-issue superscalar execution, hardware MMU, and dual 32 KB L1 caches. The architecture pairs the e500 execution pipeline with the communications peripheral logic block, allowing deterministic packet handling without CPU intervention. The integrated security engine supports DES, 3DES, AES, and SHA-1/2, offloading cryptographic workloads from the host core. The dual DDR memory controllers can operate independently, supporting high-throughput parallel memory transactions critical for packet buffer management. Typical applications include wireless base station line cards, routing and switching line cards, DSLAM equipment, edge routers, network attached storage controllers, and industrial embedded control. The integrated communications peripherals make the MPC8555E particularly well-suited for designs where board space, BOM cost, and time-to-market are critical constraints. When designing with the MPC8555EVTAJD, ensure proper thermal management through the exposed-die BGA substrate and adequate PCB layer stack-up for high-speed DDR routing. JTAG boundary scan is supported for board-level test, and the device requires a compatible boot ROM and system PLL configuration at power-up. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing engineering decision support beyond raw specification listing.

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MPC8555EVTAPF

MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP

The NXP (formerly Freescale) MPC8555EVTAPF is a PowerQUICC III host processor integrating a PowerPC e500 core running at 833 MHz with a 32-bit data path, packaged in a 783-ball FCBGA (FCPBGA) measuring 29 x 29 mm. A microprocessor (MPU) is the central processing unit of an embedded system that fetches, decodes, and executes instructions while coordinating memory and peripherals. In the component taxonomy, this part sits at: microprocessor -> embedded processor -> integrated circuit -> semiconductor. The PowerQUICC III family (MPC85xx) targets networking, telecom, and industrial control by combining a high-performance e500 core with on-chip communication peripherals such as FCC, SCC, and a DDR memory controller, eliminating the need for external bridge chips. Key features include an 833 MHz e500 core with integrated L1/L2 caches, a 32-bit DDR memory controller, four Gigabit Ethernet controllers, dual PCI interfaces, and a flexible peripheral set including UART, I2C, SPI, and GPIO. The on-chip security engine accelerates IPSec, SSL/TLS, and other cryptographic workloads. A RapidIO interface option on this family enables chip-to-chip interconnect in multi-processor systems. Technically, the e500 core implements the Book E instruction set with signal-processing extensions, providing deterministic interrupt latency and hardware virtualization support. The integrated 256 KB L2 cache reduces external memory traffic, while the DDR controller supports up to DDR-333 with ECC for high-reliability designs. Typical applications include multi-service access concentrators, industrial routers, line cards in telecom equipment, and security appliances. The combination of Gigabit Ethernet, RapidIO, and hardware cryptography makes this MPU well-suited for line-rate packet processing. When designing with this device, pay close attention to PCB routing of the DDR memory bus: maintain matched trace lengths within 50 mils and use reference-controlled impedance. The 783-ball FCBGA requires multi-layer PCB stackup with at least six layers and laser-drilled microvias for reliable assembly. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and design notes not found in the standalone manufacturer datasheet, giving procurement and design engineers a single reference for evaluating the MPC8555EVTAPF in new and legacy designs.

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MPC8555EVTAQF

MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA

The NXP MPC8555EVTAQF is a PowerQUICC III integrated communications processor featuring a PowerPC e500 core running up to 1.0 GHz, packaged in a 783-ball FC-PBGA (29x29 mm, 1 mm pitch). Built on Power Architecture technology, the MPC8555E integrates a powerful e500 core with a flexible communications peripheral subsystem for networking and embedded systems requiring high I/O throughput. An integrated communications processor (ICP) is a class of system-on-chip that combines a general-purpose processor core with one or more dedicated communications engines, such as a QUICC Engine block. The PowerQUICC III family sits at the top of NXP's PowerQUICC hierarchy (PowerQUICC I -> PowerQUICC II -> PowerQUICC III), historically targeting routers, switches, and wireless baseband controllers. The MPC8555E belongs to the MPC85xx SoC family, positioned for mid-to-high performance networking equipment where deterministic I/O and proven PowerPC software ecosystems matter more than raw core frequency. Key features include a 32-bit e500 core with 32 KB L1 instruction cache and 32 KB L1 data cache, dual DDR memory controllers, three 10/100/1000 Mbps Enhanced Three-Speed Ethernet controllers (eTSECs), a PCI Express interface, four DMA channels, and a QUICC Engine technology block for multi-protocol serial communications. The device operates from a 1.2 V core supply with I/O voltages that interface to standard 2.5 V / 3.3 V logic, and provides 783 solder balls in a flip-chip plastic BGA. Typical applications include enterprise and SMB routers and switches, wireless base station baseband processing, industrial control with deterministic serial I/O, network-attached storage (NAS) controllers, and telecom line cards. Designers select the MPC8555E for PowerPC legacy code reuse, mature VxWorks SDK fabrics, and time-proven NXP/NXP/Freescale silicon process quality. Design consideration: the 783-ball FC-PBGA requires a multi-layer PCB (typically 8+ layers) with controlled-impedance routing for DDR signals, matched-length SERDES lanes, and a thermal management solution sized for the SoC's TDP. Ensure boot configuration pins are correctly pulled at reset and that the JTAG chain is accessible for boundary-scan and code debug.

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MPC8555PXALF

MPC8555PXALF - PowerQUICC III 667MHz MPU, 783-FCPBGA | NXP

The NXP MPC8555PXALF is a PowerQUICC III integrated communications microprocessor built on Power Architecture technology, featuring a PowerPC e500 core running at 667 MHz in a 783-ball FCBGA (29x29 mm) package. As a member of the MPC85xx family, it integrates a high-performance e500 core with the system-on-chip platform used widely in networking and telecom infrastructure. What is a PowerQUICC III processor? A PowerQUICC (pronounced "power-quick") is a family of integrated communications processors originally developed by Motorola (later Freescale, now NXP) that combines a PowerPC processor core with specialized communications peripherals. The III generation extends the architecture with the e500 core, enhanced system logic, and integrated security engines, making it a single-chip solution for routing, switching, and embedded control. Within the broader taxonomy, it sits at: MPU -> microprocessor -> integrated circuit -> semiconductor. Key features of the MPC8555PXALF include a 32-bit PowerPC e500 core at 667 MHz, dual 32-bit DDR memory controllers, dual Gigabit Ethernet MACs, a 32-bit PCI/PCI-X interface, and an integrated security engine. It supports supply voltages of 1.2V (core) and 2.5V/3.3V (I/O), with a 783-pin flip-chip BGA package measuring 29x29 mm at 1 mm pitch. Architecturally, the MPC8555E uses a system-on-chip platform with separate internal buses for the e500 core, DDR controllers, and peripheral blocks. The integrated communications engine (CE) handles protocol processing independently of the core, freeing CPU cycles for control-plane tasks. Hardware encryption and pattern-matching accelerators support IPSec, SSL/TLS, and 3GPP wireless protocols at line rate. Typical applications include enterprise routers, multiservice switches, DSLAM line cards, wireless base station controllers, and industrial control platforms requiring deterministic processing and high I/O bandwidth. The integrated DDR and Ethernet controllers reduce external component count. Designers should note the 783-ball FCBGA requires a 1 mm-pitch PCB land pattern with matched-impedance routing for DDR traces. Thermal management is critical given the 7-12W typical dissipation; a multi-layer PCB with thermal vias under the die is recommended. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that supplement the manufacturer hardware specifications.

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MPC8555PXAPF

MPC8555PXAPF - PowerQUICC III e500 MPU 833MHz | NXP FCPBGA-783

The NXP (formerly Freescale) MPC8555PXAPF is a PowerQUICC III integrated communications processor built on Power Architecture technology, integrating a PowerPC e500 core running at 833 MHz with system logic required for networking and telecommunications infrastructure, housed in a 783-ball flip-chip plastic BGA package measuring 29x29 mm with 1 mm pitch. A microprocessor (MPU) is an integrated circuit that contains the arithmetic, logic, and control circuitry required to execute software instructions and act as the central processing unit of an embedded system. Within the broader taxonomy of semiconductors, the MPC8555PXAPF sits in the integrated communications processor (ICP) category, a hypernym combining microprocessor (MPU), digital signal processor (DSP), and network-on-chip peripherals. PowerQUICC III is NXP's flagship ICP family, specifically engineered to offload packet processing, ATM, Ethernet, and TDM voice/datacom traffic from the host CPU. Key features include a 32-bit PowerPC e500 core with dual-issue superscalar pipeline, dedicated security engine, integrated DDR memory controller, four Gigabit Ethernet MACs, dual PCI/PCI-X interfaces, and a RapidIO interconnect. The device is built on a 1.2 V core supply with 1.5 V/1.8 V/2.5 V/3.3 V I/O tolerance for legacy peripheral interfacing. The 783-FCPBGA package provides flip-chip interconnect for high signal integrity at the elevated 833 MHz core frequency. The architecture combines a high-performance e500 core, separate RISC-based peripheral engines, and an integrated security coprocessor. This heterogeneous multiprocessing approach allows wire-speed packet classification, encryption/decryption (IPSec, SSL/TLS), and QoS queue management without burdening the host core. The device delivers deterministic latency for backplane and line-card deployments. Typical applications include enterprise routers, multiservice access concentrators, DSLAM line cards, wireless base station controllers, industrial protocol gateways, and network-attached storage controllers. The combination of gigabit Ethernet, PCI-X, and RapidIO makes it ideal for high-bandwidth line cards. When designing with this device, allocate adequate PCB layers (typically 8-10) for the 1 mm-pitch BGA breakout, provide a low-noise power supply tree (separating 1.2 V core from 1.5 V/3.3 V I/O rails), and account for the thermal envelope (junction-to-ambient thermal resistance depends on PCB stack-up and airflow). Reference the NXP application note for DDR termination and impedance-controlled routing. This page synthesizes distributor pricing, same-package alternatives within the PowerQUICC III family, and practical design notes not consolidated in the manufacturer datasheet.

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MPC8555VTAPF

MPC8555VTAPF - 833MHz PowerQUICC III MPU | NXP | 783-FCPBGA

The NXP (formerly Freescale) MPC8555VTAPF is a PowerQUICC III integrated communications microprocessor based on the PowerPC e500 core, delivering 833 MHz of 32-bit processing performance in a 783-ball FCBGA (29x29 mm) package. It targets networking, telecommunications, and embedded communications infrastructure where deterministic performance and rich peripheral integration are required. An integrated communications processor (also known as a comms MPU or PowerQUICC) is a specialised microprocessor that combines a general-purpose CPU core with a Communications Processor Module (CPM) and rich serial peripherals. It sits within the broader power management and embedded processing taxonomy as: PowerQUICC -> communications processor -> embedded MPU -> microprocessor -> IC. This architecture has historically been used in routers, base stations, and industrial control equipment where deterministic serial throughput is critical. Key features include the PowerPC e500 core with 32 KB L1 instruction and data caches, a CPM co-processor supporting multiple fast communications controllers (FCCs), multi-channel HDLC, ATM, and PCI interfaces. The device integrates DDR and SDRAM memory controllers, a local bus controller, and dual 10/100/1000 Ethernet MACs with TCP/IP acceleration offload, reducing host CPU overhead in network packet processing. The 833 MHz e500 core delivers approximately 1640 MIPS, while the CPM provides hardware acceleration for protocol handling. The integrated memory controller supports DDR1/SDRAM with ECC, and the device includes dual PCI/PCI-X interfaces for expansion. A dedicated security engine handles IPSec, SSL/TLS, and 3DES/AES acceleration, making the part suitable for VPN gateway and secure router applications. Typical applications include enterprise routers and switches, DSLAM line cards, wireless base station controllers, industrial embedded controllers, and secure VPN gateways. The wide operating temperature range and long product lifecycle (historically) made the MPC8555VTAPF popular in carrier-grade networking equipment. When designing with this device, ensure the 783-ball FCBGA PCB layout follows NXP's reference design guidelines for controlled-impedance differential routing on the SerDes and Ethernet interfaces. Thermal management is critical: at full 833 MHz operation with all peripherals active, a heatsink and thermal interface material are required. This page synthesizes NXP datasheet specifications, distributor pricing, cross-reference alternatives from the same PowerQUICC III family, and practical design guidance not consolidated in any single manufacturer document.

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MPC855TCVR50D4

MPC855TCVR50D4 - 50MHz PowerQUICC MPU 357-BGA | NXP

The NXP MPC855TCVR50D4 is a member of the MPC860 PowerQUICC family, integrating a 32-bit MPC8xx core processor with a separate RISC Communication Processor Module (CPM) on a single die, designed for cost-sensitive access equipment requiring Fast Ethernet support up to 100 Mbps. Operating at 50 MHz core frequency, the device combines the PowerPC instruction set architecture with dedicated serial communication controllers in a 357-ball Plastic BGA (PBGA) package measuring 25x25 mm. A PowerQUICC processor is a highly integrated system-on-chip that combines a general-purpose microprocessor with specialized communication hardware, typically used in networking equipment where multiple serial protocols must be handled without burdening the main CPU. The MPC855T extends the MPC8xx family by integrating Ethernet support directly into the CPM, eliminating the need for an external Ethernet MAC in many designs while preserving the multi-protocol serial capabilities of the original MPC860 architecture. Key features include a 32-bit PowerPC core running at 50 MHz, dual Fast Ethernet controllers via the CPM, multiple serial communication controllers (SCCs), serial management controllers (SMCs), a system integration unit with memory controller, and on-chip peripherals including timers, DMA, and interrupt controllers. The 357-PBGA package provides ample I/O for the external memory bus and peripheral interfaces while maintaining compatibility with existing MPC860 PowerQUICC PCB layouts. Typical applications include low-cost remote access equipment, DSLAM line cards, integrated access devices, router and switch control planes, and industrial networking controllers. The combination of integrated Ethernet and PowerPC processing makes the MPC855T well suited for embedded networking designs where deterministic communication handling is required. When designing with this device, ensure proper thermal management through adequate PCB copper area and consider using the same MMU2 board layout patterns as MPC860 for design reuse. The MPC855T is also available at 66 and 80 MHz speed grades for higher throughput requirements within the same BGA footprint. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Detailed specifications, lifecycle information, and application examples are provided to support component selection and qualification decisions for both new designs and legacy system maintenance.

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MPC855TCZQ50D4

MPC855TCZQ50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP

The NXP (formerly Freescale / Motorola) MPC855TCZQ50D4 is a 32-bit PowerQUICC MPC8xx microprocessor integrating a PowerPC core with a Communications Processor Module (CPM), 357-pin BGA package, and 50 MHz core speed. It is designed as a one-chip integrated microprocessor and peripheral combination for cost-sensitive access equipment that requires 100 Mbps Fast Ethernet support, alongside ATM, HDLC, and PCMCIA interfaces. The device runs from a 3.3 V supply and operates across the industrial -40C to +95C temperature range, packaged in a 357-ball PBGA at 25x25 mm. A PowerQUICC device belongs to the Power Architecture (PowerPC) family of integrated microprocessors. It combines a CPU core, system memory controller, and a dedicated communications processor (CPM) for offloading networking and serial protocol work. The hierarchy is: microprocessor (MPU) -> PowerPC -> PowerQUICC -> communications SoC. PowerQUICC parts are typically deployed where deterministic networking performance is required without burdening the main CPU with protocol handling. Key features of the MPC855TCZQ50D4 include the 50 MHz PowerPC core, an integrated CPM supporting Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, UART, and PCMCIA controllers, on-chip system memory controller, and a 357-ball PBGA footprint that is pin-compatible with the broader MPC860 family. The chip was originally branded Motorola, then transitioned to Freescale, and is now sold by NXP as the part matures through its end-of-life cycle. According to the manufacturer product page, the part is footprint-compatible with existing MPC860 PowerQUICC designs. The architecture segregates general-purpose CPU work from real-time data-plane protocol processing. By offloading Ethernet, ATM, and HDLC packet handling to the CPM through dedicated RISC engines and DMA channels, the main PowerPC core stays free for control-plane tasks and application code. This dual-engine design is the defining architectural trait of the PowerQUICC family and the reason it became a long-standing platform for SOHO routers, DSLAM line cards, and industrial control routers. Typical applications include SOHO / SMB routers and switches with Fast Ethernet WAN/LAN, DSL modem and ADSL/CPE gateway designs, industrial Ethernet and SCADA gateways, ATM edge devices, and legacy telecom equipment. The 100 Mbps Fast Ethernet support, combined with HDLC and ATM on the CPM, lets a single MPC855T replace several discrete protocol converters. The 3.3 V I/O and 50 MHz speed make it a fit for designs that prioritize protocol-rich I/O over raw CPU throughput. When designing with this device, validate supply chain availability before committing to a new layout. Per the NXP product page, this part is reaching End of Life and replacements are listed in the official discontinuance notice - design teams should check the NXP PCN before board bring-up. The 357-BGA requires standard PBGA reflow profiles and X-ray inspection; signal integrity work is concentrated on the 60x bus and Ethernet MII traces. This page synthesizes distributor pricing, BGA-compatible drop-in alternatives in the MPC8xx family, and design considerations beyond what is found in the bare manufacturer datasheet.

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MPC855TCZQ50D4557

MPC855TCZQ50D4557 - MPC8xx PowerQUICC MPU, 50 MHz, 357-BGA | NXP

The NXP (formerly Freescale) MPC855TCZQ50D4557 is a PowerQUICC-integrated communications microprocessor from the MPC8xx family, operating at 50 MHz core frequency in a 357-ball Plastic BGA package. It combines a PowerPC MPC8xx core with the communication processor module (CPM) that supports multiple serial protocols including Ethernet, HDLC/SDLC, UART, and SCC/SMC channels. The ZQ speed-grade designation places it in the 50 MHz commercial temperature class. An MPU (Microprocessor Unit) in the MPC8xx family integrates a PowerPC integer unit with dedicated on-chip peripherals that historically target telecommunications, networking, and embedded control applications. Unlike a generic microcontroller, the MPC8xx is built around the PowerPC architecture with a memory management unit and dual-bus Harvard architecture, while the on-chip CPM offloads serial communication from the core. This taxonomy places MPC8xx above single-core MCUs and below multi-core application processors in the embedded-computing hierarchy. Key features include 4 KB instruction cache, 4 KB data cache, integrated floating-point unit, dual 10/100 Ethernet MACs via the CPM, and memory controller for SDRAM, SRAM, EPROM, and Flash. The device is qualified for commercial temperature range (0°C to +70°C) and supports JTAG boundary-scan test. Power management features include low-power doze and sleep modes with wake-up on external interrupt. The 357-BGA package measures 25 mm × 25 mm with 1.27 mm pitch and is supplied in tray packaging. The -50 speed grade yields approximately 89 MIPS (Dhrystone 2.1) at 50 MHz. The integrated CPM and dual Ethernet MACs make this part especially efficient for legacy routing and telecom equipment where power dissipation and BOM count matter more than raw clock speed. The MPC8xx CPM runs independently of the core, allowing sustained serial throughput with minimal CPU load. Typical applications include legacy enterprise routers, ISDN terminal adapters, WAN access multiplexers, industrial serial-control gateways, and legacy printer controllers. The dual Ethernet and multi-protocol serial support reduce external glue logic, while the BGA package supports high-density multilayer PCB designs used in networking line cards. The MPC8xx architecture remains in service across installed-base equipment that has been certified to specific firmware revisions, where re-validation cost makes platform migration uneconomical. When designing with this device, verify thermal management for the BGA package - although the MPC855T at 50 MHz consumes roughly 1 W typical, a multi-layer PCB with thermal vias under the die-attached balls is recommended. The 357-BGA footprint has been used by multiple MPC8xx variants, enabling straightforward migration across speed grades within the same board layout.

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MPC855TVR50D4

MPC855TVR50D4 - PowerQUICC I 50MHz SoC | NXP | 357-PBGA

The NXP MPC855TVR50D4 is a PowerQUICC I integrated communications microprocessor SoC with a Power Architecture 32-bit core running at 50MHz, housed in a 357-ball PBGA package (25x25 mm). It integrates an MPC8xx core, 8KB instruction/data cache, CPM (Communications Processor Module), Ethernet, ATM, HDLC and PCMCIA controllers, making it a one-chip solution for cost-sensitive networking and access equipment. A PowerQUICC (Power Architecture with QUICC engine) is a category of integrated communications processors that combines a Power Architecture CPU with dedicated serial-communication peripherals on a single die. It sits at the border between traditional microprocessors and systems-on-chip - earlier PowerQUICC devices typically pair a host CPU with a RISC-based CPM offload engine for TDM/HDLC/Ethernet traffic, allowing wire-speed processing without burdening the main core. The MPC8xx/PowerQUICC I family originated at Motorola (later Freescale, now NXP) and was widely deployed in access equipment, ISDN routers, and industrial control boards. Key features include a 32-bit Power Architecture core at 50MHz, 8KB unified cache, a CPM with RISC controller supporting HDLC/ATM/Ethernet, dual 10/100 Mbps Fast Ethernet MACs (FCC/FEC), PCMCIA interface, and integrated memory controller for SDRAM, ROM and Flash. The device operates at 2.0V to 3.6V core I/O supply and is qualified over the 0C to +95C ambient temperature range (commercial). Architecturally, the MPC855T couples a PowerPC-style integer core with a separate RISC-based CPM, letting the host CPU handle control-plane tasks while the CPM engine handles time-critical DMA and serial protocols. This split-engine approach reduces interrupt latency and offloads bit-banging from the main core, which is the defining engineering benefit of the PowerQUICC family. Typical applications include DSLAM line cards, ISDN routers, low-end ATM switches, industrial gateways, and embedded control with Ethernet connectivity. The integrated PCMCIA interface also supports legacy laptop-style peripherals and CompactFlash storage in industrial designs. When designing with the MPC855TVR50D4, careful BGA escape routing and a multi-layer (typically 6+ layer) PCB stackup are required to maintain SI on the 50MHz parallel memory bus. Thermal dissipation is modest at 50MHz but the PBGA still requires thermal vias under the die for production reliability. This page synthesizes distributor inventory across DigiKey, Rochester Electronics, LCSC and Heisener, alongside parametric drop-in alternatives not consolidated on a single manufacturer page, plus practical design notes covering BGA fan-out, memory-controller tuning and CPM programming considerations.

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MPC855TVR66D4

MPC855TVR66D4 - 66MHz PowerQUICC MPC8xx MPU 357-BGA | NXP

The NXP Semiconductors MPC855TVR66D4 is a 32-bit PowerQUICC integrated microprocessor (MPU) from the MPC8xx family, featuring a single MPC8xx core running at 66 MHz, housed in a 357-pin PBGA package measuring 25x25 mm. The device integrates an MPC8xx core with NXP's Communication Processor Module (CPM), a separate RISC engine that offloads communications tasks from the main CPU, enabling efficient handling of Fast Ethernet, ATM, HDLC, and PCMCIA interfaces. A microprocessor (MPU) is an integrated circuit that contains the central processing unit of a computer system. Within the broader semiconductor taxonomy, the MPC855TVR66D4 sits at: microprocessor -> MPU -> embedded processor -> communications SoC -> semiconductor. It is part of the PowerQUICC family, a long-running line of integrated communications processors widely deployed in networking equipment during the late 1990s and 2000s. Key features include a 32-bit data bus, 66 MHz core clock, integrated CPM with Ethernet, ATM, HDLC, and PCMCIA support, 0.32 µm process technology, and an operating temperature range of 0 to 95 °C. The 357-BGA package provides the high pin count required for parallel external memory bus plus rich peripheral I/O. The part is suitable for lower-cost access equipment that requires Fast Ethernet (100 Mbps) connectivity. Architecturally, the MPC855T combines an embedded PowerPC core with a dedicated CPM RISC engine for protocol processing, which was a defining feature of the PowerQUICC line. This dual-engine approach allows wire-speed handling of communications protocols without burdening the host CPU, which remains free for control-plane and application tasks. Typical applications include edge computing nodes, industrial HMI, embedded Linux systems, communication gateways, and high-performance control platforms where deterministic communications handling is required. The 100 Mbps Fast Ethernet capability makes it particularly relevant for legacy industrial networking, serial-to-Ethernet bridges, and protocol-conversion gateways. When designing with this device, verify PBGA PCB land pattern and thermal management: the 25x25 mm BGA has substantial thermal mass but should be paired with appropriate via arrays under the package for heat dissipation in enclosed industrial enclosures. This page synthesizes distributor pricing, drop-in alternatives from the same MPC860 PowerQUICC family, and practical design notes not found in the manufacturer datasheet, with data verified as of 2026-10-16.

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MPC855TVR80D4

MPC855TVR80D4 - PowerQUICC 80MHz 32-Bit MPU, 357-PBGA | NXP

The NXP MPC855TVR80D4 is a PowerQUICC integrated communications processor combining an 80 MHz, 32-bit MPC8xx core with a separate RISC Communication Processor Module (CPM), 357-pin PBGA (25x25 mm) package, and 3.0 V to 3.6 V supply operation. Designed for cost-sensitive access equipment, it integrates Fast Ethernet MAC, ATM, HDLC, and PCMCIA controllers directly on-chip, eliminating the need for an external networking ASIC in many designs. A PowerQUICC (PowerPC Unified Communication Architecture) processor is a system-on-chip (SoC) optimized for wired communications, combining a general-purpose PowerPC core with a hardware-oriented communications engine. It belongs to the broader MPU (microprocessor unit) family within embedded processors, sitting between microcontrollers (single-core compact control) and high-end application processors (multi-core GHz-class compute). The CPM offloads packet handling from the core, freeing the PowerPC engine for protocol stacks, routing tables, and management software - the architectural foundation behind the family’s success in routers, DSLAMs, and PBX systems in the early 2000s. Key features include MPC8xx core running at 80 MHz, integrated CPM with Fast Ethernet (10/100 Mbps), ATM SAR, HDLC/SDLC, UART, SCC, and PCMCIA support. The PBGA-357 package provides high I/O density for parallel memory and serial peripheral buses, and the industrial 0 °C to 95 °C operating range allows deployment in access-aggregation equipment without thermal management overhead. The architecture pairs a 32-bit PowerPC integer unit with a dedicated RISC CPM, both sharing the system bus to internal SRAM and external memory controllers. Typical SDRAM, DRAM, SRAM, and burst-ROM support is provided via the external memory controller with chip-select logic. Hardware queue management in the CPM reduces interrupt load by autonomously moving packets between peripheral ports and memory. Typical applications include low- to mid-end routers, DSL/Cable modem gateways, PBX and access-concentration equipment, industrial control with serial networking, and legacy telecom backplanes. Fast Ethernet MAC and HDLC channels suit serial TDM systems where the CPM reduces bill-of-materials cost compared with discrete PHY/MAC pairs. Design considerations include proper decoupling of the 3.3 V supply near the PBGA, signal-integrity work on the memory bus due to the large 357-ball package, and confirming software/firmware compatibility across PowerQUICC revisions when porting older designs. The `D4` suffix indicates 0-95 °C commercial temperature; engineers targeting industrial extended ranges should evaluate the MPC855TVR133D variant and verify thermal performance in the end chassis. This page synthesizes distributor stock, drop-in PowerQUICC alternatives, lifecycle status, and practical design notes not found in the datasheet alone - useful for engineers maintaining installed bases or sourcing legacy telecom silicon.

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MPC855TZQ50D4

MPC855TZQ50D4 - 50MHz PowerQUICC SoC | NXP 357-PBGA

The NXP Semiconductors MPC855TZQ50D4 is a PowerQUICC integrated communications microprocessor SoC combining a 32-bit Power Architecture core with a dedicated Communications Processor Module (CPM), operating at 50 MHz and housed in a 357-ball PBGA package measuring 25 x 25 mm. The part supports fast Ethernet up to 100 Mbps and integrates ATM, HDLC, and PCMCIA controllers on-chip for telecom and networking equipment. A PowerQUICC SoC (System-on-Chip) is a category of integrated communications processors that merge a general-purpose CPU with a dedicated RISC-based communications engine on a single die. Within the broader semiconductor hierarchy, it sits under Microprocessor ICs > MPU > SoC > Communications Processor > Power Architecture SoC. The CPM offloads serial-channel processing (Ethernet, ATM, HDLC) from the main core, enabling deterministic throughput for wireline access equipment without consuming CPU cycles. The MPC855T is part of the MPC8xx family that introduced PowerQUICC to cost-sensitive access applications. Key features include a 50 MHz Power Architecture 32-bit core, on-chip CPM with 10/100 Mbps Ethernet MAC, ATM segmentation and reassembly (SAR), HDLC/SDLC controllers, PCMCIA interface, 4 KB instruction cache and 4 KB data cache, MMU, and dual UARTs. The device operates from 0C to 95C commercial temperature range and runs on a 3.3V I/O and 2.5V/3.3V core supply architecture typical of the MPC8xx generation. The architecture separates control-plane processing (Power Architecture core) from data-plane processing (CPM RISC engine). The CPM handles DMA, serial protocols, and time-division multiplexing, leaving the CPU free for protocol stacks, routing tables, and management functions. The 357-ball PBGA package uses a 25 x 25 mm body with a 1.27 mm ball pitch and exposed die for thermal dissipation. Typical applications include DSLAM line cards, low-end routers, ISDN terminal adapters, set-top box controllers, industrial control with Ethernet, and PCMCIA-based wireless access points. The on-chip Ethernet MAC enables direct PHY connection without external glue logic for 10/100 Mbps designs. Design considerations include a multi-voltage power architecture requiring both 3.3V and 2.5V supplies, plus careful PBGA PCB layout with via-in-pad recommended for thermal performance. The 357-ball package requires controlled-impedance routing and matched-length clocks for the CPM-driven serial interfaces. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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MPC855TZQ66D4

MPC855TZQ66D4 - 66MHz PowerQUICC MPU, 357-PBGA | NXP

The NXP MPC855TZQ66D4 is a PowerQUICC-integrated microprocessor from the MPC8xx family, combining an MPC8xx core with a separate Communication Processor Module (CPM) RISC engine and a 10/100 Ethernet MAC on a single die. It integrates one 32-bit CPU core running at 66 MHz, hardware communications controllers for SCC/SMC/UART, ATM, HDLC, and PCMCIA, and a 357-ball Plastic BGA (PBGA) package measuring 25 mm x 25 mm. The part targets cost-sensitive networking access equipment that requires 100 Mbps Ethernet support without an external protocol engine. A PowerQUICC processor is a System-on-Chip (SoC) that integrates a general-purpose embedded CPU with a dedicated communications processor. The MPC855T belongs to the broader MPC860 PowerQUICC family, which historically served as the workhorse of SOHO routers, ISDN/DSL access multiplexers, Voice-over-IP gateways, and industrial control planes. Architecturally, PowerQUICC sits within the Power Architecture embedded SoC hierarchy, and the MPC8xx core itself is a single-issue, hardware-multiplied PowerPC core distinct from later PowerQUICC II/III (MPC82xx/MPC83xx/MPC85xx) devices. Key features include a 66 MHz core clock, 32-bit data path, integrated 10/100 Mbit/s Fast Ethernet controller, dedicated CPM for protocol offload, on-chip memory management, programmable interrupt controller, and a parallel bus interface. Industrial temperature grade (0C to +95C) and a long-lifecycle product status make this device suitable for legacy telecom and industrial control platforms where re-qualification cost dominates. Typical applications include SOHO routers, xDSL modems, Ethernet bridges, industrial serial-to-Ethernet gateways, and access multiplexer line cards. When designing with this device, verify the supply voltage (3.3 V core, 3.3 V I/O), the JTAG chain layout, and the PBGA thermal management using a four-layer minimum PCB with continuous ground/power planes.

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MPC855TZQ80D4

MPC855TZQ80D4 - PowerQUICC 32-Bit MPU, 80MHz | NXP 357-PBGA

The NXP (formerly Freescale) MPC855TZQ80D4 is a 32-bit PowerQUICC microprocessor from the MPC8xx family, integrating an MPC8xx core operating at 80 MHz within a 357-pin PBGA (25x25 mm) package. It combines a Power Architecture core with a separate RISC Communication Processor Module (CPM), supporting fast Ethernet (100 Mbps), ATM, HDLC, and PCMCIA interfaces — making it a single-chip integrated microprocessor and peripheral combination purpose-built for cost-sensitive access equipment. An MPU (Microprocessor Unit) is the central processing component of an embedded system, distinct from an MCU by typically lacking on-chip flash and relying on external memory. The MPC8xx PowerQUICC family sits in the hierarchy as: MPU -> embedded processor -> integrated communications processor -> telecom/networking SoC. The MPC855T specifically targets telecom access gear (DSLAMs, routers, switches) where wire-speed Fast Ethernet and serial-protocol termination are required without a separate MAC ASIC. Key features include a 32-bit Power Architecture core, on-chip CPM with dedicated RISC engine, Fast Ethernet MAC (10/100 Mbps), ATM AAL support, HDLC/SS#7 channels, PCMCIA interface, memory controller for SDRAM/ROM/Flash, and a commercial 0 to +95 °C operating temperature grade ('Z' = no floor). The 'TQ80' suffix decodes to a 80 MHz core frequency at the Z (0 to 95 °C) commercial grade, and the 'D4' indicates revision 4.x silicon in the ZQ/ZU 357-BGA package family. Typical applications include SOHO and SMB routers, xDSL gateway/CPE platforms, ISDN terminal adapters, Fast Ethernet bridges, industrial serial-protocol converters, and embedded telecom control boards. The integrated CPM offloads protocol processing from the core, allowing wire-rate handling of multiple WAN interfaces simultaneously. When designing with this part, allocate at least four PCB layers for the PBGA fan-out, and follow NXP's PowerQUICC Hardware Specifications for memory-controller timing, decoupling, and thermal management. Stock is constrained because NXP has issued a Discontinuance and Replacement Product Change Notice for this EOL family.

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MPC8560PX667LC

MPC8560PX667LC - PowerPC e500 MPU 667MHz 783-FCPBGA | NXP

The NXP MPC8560PX667LC is a PowerPC e500-based microprocessor from the PowerQUICC III MPC85xx family, delivering 667 MHz core clock speed in a 783-pin FCPBGA (29x29 mm) package. This 32-bit integrated MPU combines a high-performance e500 core with peripheral interfaces commonly used in networking and embedded infrastructure designs, supported by 2.5V/3.3V I/O supply rails. A microprocessor (MPU) is a single-chip CPU that integrates fetch, decode, execution, and memory management, forming the computational heart of an embedded system. An MPU sits above microcontrollers in capability, offering higher clock rates, MMU support, and external memory interfaces for systems running full operating systems such as Linux or VxWorks. The MPC85xx family extends this with integrated communications peripherals tailored to wired networking, making it a member of the broader embedded computing hierarchy: MPU -> microprocessor -> SoC -> semiconductor. Key features include a PowerPC e500 core with Book-E instruction set, integrated L1/L2 caches, a 667 MHz system bus, dual 10/100/1000 Ethernet MACs via the TSEC block, PCI Express interface, and security acceleration via the integrated crypto engine. The 783-FCPBGA package provides the dense I/O count required for multi-protocol networking while remaining surface-mount compatible with standard PCB assembly processes. Architecturally, the MPC8560PX667LC leverages the e500's dual-issue superscalar pipeline with hardware MMU support, enabling full virtualization and memory protection required in network infrastructure. The TSEC (Triple Speed Ethernet Controller) blocks offload packet processing from the core, while the QUICC Engine HDI handles serial protocol termination—allowing wire-speed throughput without CPU intervention. This heterogeneous integration makes it well suited to deterministic networking workloads. Typical applications include enterprise switches and routers, network security appliances (firewall/VPN), DSLAM/edge aggregation, industrial control and factory automation gateways, and storage area network (SAN) controllers. The combination of CPU horsepower and integrated communications peripherals replaces what would otherwise require multi-chip solutions. When designing with this device, allocate generous PCB area for the 29x29 mm FCPBGA and follow NXP's reference design for DDR2 memory routing, power sequencing, and decoupling. Latch-up and signal-integrity issues in production layouts are commonly traced to incomplete power-rail decoupling rather than the silicon itself. This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the standalone manufacturer datasheet.

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MPC8560PXAQFC

MPC8560PXAQFC - PowerQUICC III MPU 1GHz PowerPC e500 783-BGA | NXP

The NXP MPC8560PXAQFC is a PowerQUICC III communications microprocessor integrating a PowerPC e500 core running up to 1.0 GHz with 32-bit RISC architecture, housed in a 783-pin FCBGA (29x29 mm) package. It combines a high-performance e500 processor core, dual integrated DDR memory controllers, and the QUICC Engine technology that offloads communications workloads from the core. According to the verified distributor listing, the device is classified as PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 1.0GHz 783-FCPBGA (29x29). A PowerQUICC III MPU is a specialized microprocessor family designed for networking and communications equipment. Within the broader taxonomy it is classified as an embedded microprocessor -> communications processor -> network processor -> integrated communications controller. The device targets telecom, datacom, and embedded routing/switching applications where deterministic I/O throughput, multi-protocol serial interfaces, and hardware offload engines are required. Key features include the PowerPC e500 core with double-precision floating point, integrated security engine (SEC 2.0), DDR memory controller, dual gigabit Ethernet controllers, four triple-speed Ethernet controllers (TsECs), integrated PCI/PCI-X bridge, and the QUICC Engine subsystem supporting multichannel HDLC, POS (Packet over SONET), ATM, and UTOPIA interfaces. The 783-FCPBGA package with 29x29 mm body provides high-density interconnect for multi-rail power, multiple SerDes lanes, and large address/data buses. Operating voltage is 2.5V/3.3V. The architecture pairs the e500 core with a 64-bit DDR memory controller that supports DDR1/DDR2 with ECC, enabling high-bandwidth memory access for packet processing. The QUICC Engine offload block implements microcode-driven protocol handling that previously required external ASICs, reducing BOM and PCB complexity while increasing deterministic latency on data-plane tasks. Security is accelerated by the integrated SEC 2.0 block handling IPSec, SSL/TLS, Kasumi, and bulk cryptographic primitives. Typical applications include multiservice routers, DSLAM line cards, wireless base station controllers, IP-PBX systems, industrial embedded control, and enterprise edge routers. The integrated serial interfaces and protocol offload make it especially suitable for T1/E1/T3/E3 channelized aggregation and SONET/SDH framer interfacing. When designing with this device, ensure the FCBGA substrate has matched impedance for SerDes lanes and that thermal vias are placed beneath the exposed die area. Power sequencing of the 2.5V core and 3.3V I/O rails must follow the manufacturer sequencing specification to avoid latch-up during power-up.

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MPC8560VT667LB

MPC8560VT667LB - PowerPC e500 MPU, 667MHz, 783-FCBGA | NXP

The NXP MPC8560VT667LB is a PowerPC e500-core microprocessor unit (MPU) from NXP's MPC85xx family, operating at 667 MHz with a 32-bit architecture and integrated communications features. Housed in a 783-pin FC-BGA (29x29 mm) package with 2.5V/3.3V I/O, it is part of NXP's PowerQUICC III communications processor lineup for embedded networking infrastructure. A microprocessor (MPU) is the central processing unit of an embedded system, integrating one or more CPU cores, caches, memory controllers, and peripheral interfaces on a single die. The MPC85xx family sits in the broader PowerPC/e500 hierarchy: MPU -> embedded processor -> networking SoC -> communications platform. These parts are designed for high-throughput packet processing in routers, switches, and base stations, where deterministic performance and rich I/O matter more than minimum power consumption. Key features include the e500 single core with Book E enhanced architecture, integrated L1/L2 caches, a 667 MHz core clock, support for DDR memory, multiple Gigabit Ethernet interfaces, PCI Express, RapidIO, and dedicated hardware accelerators for communications workloads. The 783-FCBGA package exposes the full set of high-speed serial interfaces required by telecom and networking line cards. The architecture combines an out-of-order e500 core with on-chip SRAM, a DDR SDRAM controller, four Gbits of Ethernet MACs, a CPM (Communications Processor Module), and a high-speed system interface for glueless connection to additional Freescale/NXP processors. This integration eliminates external bridge chips for typical line-card designs. Typical operating supply voltages are 1.0V core and 2.5V/3.3V I/O. Typical applications include enterprise routers and switches, wireless base stations, network attached storage controllers, and telecom line cards. The integrated communications engine and SERDES interfaces make it suitable for protocol bridging and security offload where deterministic throughput is required. The 667 MHz speed grade balances performance against thermal output for sealed enclosures. When designing with this device, allocate the largest possible copper area on the PCB top side to dissipate the heat generated by the 783-FCBGA package. Use controlled-impedance routing on all high-speed serial links, and follow NCPW's hardware design checklist for DDR memory layout to meet timing margins. For systems that do not need the full peripheral set, consider lower-cost MPC8536 variants; for higher throughput, look at MPC8572 derivatives. This page synthesizes distributor inventory, parametric alternatives, and design guidance that go beyond the datasheet alone. Specifications below reflect publicly available distributor data and the manufacturer datasheet as of 2026-10-16.

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MPC8560VT833LB

MPC8560VT833LB - 833MHz PowerQUICC III MPU | Freescale/NXP | BGA-783

The Freescale (NXP) MPC8560VT833LB is a PowerQUICC III MPC85xx 32-bit microprocessor in the 783-pin FCPBGA (29x29 mm) package, operating at 833 MHz with a PowerPC e500 core. It is a single-core, 32-bit RISC microprocessor designed for high-performance embedded networking and communications workloads, integrating a 32-bit processor core with dedicated communication engine peripherals on a single die. A microprocessor (MPU) is an integrated circuit containing a complete central processing unit (CPU) and core peripherals fabricated on a single die, typically paired with external memory and I/O devices. Within the broader semiconductor taxonomy, MPUs sit under microcontrollers and microprocessors (Embedded - Microprocessors), then logic ICs, and finally integrated circuits. The PowerQUICC III MPC85xx family is positioned for high-end industrial, telecom, and networking systems where deterministic CPU performance, integrated peripheral control, and an extended temperature range are required. The MPC8560VT833LB operates from 2.5V/3.3V rails and is supplied in a Tray packaging format suited for volume production. Key features include the PowerPC e500 core running at 833 MHz, 32-bit instruction set support, a 783-ball FCBGA (flip-chip plastic BGA) thermal package compatible with high-density surface-mount assembly, and integration of the QUICC Engine for protocol acceleration in networking environments. The 29x29 mm body footprint delivers the I/O density needed for the address, data, and peripheral buses required for routing and switching equipment. The combination of high CPU frequency and integrated packet-handling peripherals is the primary reason this MPU is widely deployed in long-life industrial platforms. The architecture follows PowerPC e500 RISC principles with deep pipeline stages and hardware multiply-accumulate support, paired with the unified peripheral bus structure characteristic of the MPC85xx family. The 783-pin FCPBGA exposes the full memory controller I/O, local bus, PCI/PCI-X, Ethernet, and QUICC Engine multiplexed interfaces required by networking equipment, while the 2.5V/3.3V power supply supports typical industrial board designs. The device is rated over commercial operating temperatures suitable for controlled-environment enclosures. Typical applications include enterprise routers and switches, DSLAM and access multiplexers, industrial control and factory automation controllers, and long-life military and aerospace communication platforms. The MPC8560VT833LB is also used in legacy telecom base stations where the PowerQUICC III architecture offers protocol-offload efficiency alongside CPU horsepower for control-plane workloads. When designing with this part, plan thermal dissipation through the FCPBGA package, provide generous via-stitched ground returns for high-speed interfaces, and verify that the BIOS / firmware / RTOS toolchain supports the e500 core. Memory timing must be matched to datasheet-supported DIMM and SDRAM configurations to prevent intermittent faults. This page synthesizes distributor availability, same-family replacements, and practical hardware notes for the MPC8560VT833LB that complement the Freescale / NXP datasheet.

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MPC8560VTAQFC

MPC8560VTAQFC - 1GHz PowerQUICC III MPU | NXP 783-FCPBGA

The NXP MPC8560VTAQFC is a PowerQUICC III integrated communications microprocessor built on Power Architecture technology, featuring a PowerPC e500 core running at up to 1.0 GHz with a 32-bit core architecture, packaged in a 783-ball FCBGA (29x29 mm, 1.0 mm pitch). The part integrates a high-performance e500 core with system logic and a Communications Processor Module (CPM) tuned for networking, telecommunications, and wireless infrastructure designs. A microprocessor (MPU) is a single-chip or chip-set implementation of a CPU combined with peripheral subsystems and memory interfaces; the PowerQUICC III family sits within the broader taxonomy of microprocessor IC -> embedded processor -> communications processor -> SoC. The MPC8560 is part of the MPC85xx PowerQUICC III series, sharing architectural lineage with the MPC8540, MPC8555, and MPC8533 families while targeting higher-bandwidth networking applications that demand dedicated serial controllers and fast DDR memory access. Key features include a 1.0 GHz core frequency, integrated 32-bit PowerPC e500 core, DDR/SDRAM memory controllers, hardware-accelerated communications peripherals, 64-bit data bus, and a flip-chip plastic BGA package optimized for high-speed signal integrity. The part is specified for industrial networking and embedded communications workloads where deterministic serial performance and deterministic latency matter more than raw single-thread throughput. Architecturally, the e500 core is a superscalar PowerPC implementation with Book E instruction set support, dual-issue pipelines, and dedicated L1 caches. The on-chip CPM offloads DMA, serial, and protocol handling from the core, leaving the e500 free to run control-plane and routing software. The 1.2 V core supply and separate I/O rails are managed through an external power sequencer, while the flip-chip package keeps the die-to-ball inductance path short for GHz-class clocks. Typical applications include multi-gigabit Ethernet routers, DSLAM line cards, wireless base station control, secure VPN appliances, and industrial protocol bridges. The CPM's multichannel serial controllers make the MPC8560 particularly well suited to T1/E1 aggregation, ATM, HDLC, and PPP termination alongside packet processing. When designing with the MPC8560VTAQFC, plan for a multi-rail power tree (1.2 V core, 1.8 V/2.5 V DDR, 3.3 V I/O) with controlled sequencing, and provide matched-length DDR routing to the integrated memory controller. PCB designers should also budget thermal dissipation - the FCBGA exposes only the topside for cooling, and airflow or a heatsink is typically required for sustained 1 GHz operation. This page synthesizes distributor inventory snapshots, drop-in PowerQUICC III family alternatives, and PCB-level design notes not collated in the standalone manufacturer datasheet.

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MPC8568EVTAUJJ

MPC8568EVTAUJJ - PowerPC e500v2 MPU 1.333GHz | NXP

The NXP MPC8568EVTAUJJ is a PowerPC e500v2 based microprocessor IC from the MPC85xx (PowerQUICC III) family, delivering 1.333 GHz of single-core 32-bit performance in a 1023-ball FCBGA package measuring 33 mm x 33 mm with 1 mm ball pitch. It integrates a high-performance e500v2 core with double-precision floating-point support, dual I/O controllers, and a flexible peripheral set for embedded networking and communications infrastructure. A microprocessor (MPU) is the central processing unit of an embedded system, executing operating systems and application code while coordinating memory, I/O, and on-chip peripherals. The PowerQUICC III family is the second tier of NXP's Power Architecture roadmap below QorIQ, and the MPC8568E specifically sits between the MPC8567E and MPC8569E, sharing the e500v2 instruction set but adding hardware acceleration for security and packet processing. MPU variants differ from microcontrollers (MCU) by typically requiring external DRAM and boot ROM and by exposing richer memory management, ECC, and high-bandwidth I/O. Key features include 32 KB L1 instruction cache, 32 KB L1 data cache, a 512 KB unified L2 cache with ECC, integrated DDR1/DDR2 memory controller, dual 10/100/1000 Ethernet MACs with hardware TCP/IP acceleration, PCI Express and Serial RapidIO interfaces, and four on-chip DMA channels. The device also integrates a security engine supporting IPSec, SSL/TLS, and bulk crypto offload, plus a programmable QUICC Engine block for HDLC, TDM, and ATM serial protocols used in legacy telecom infrastructure. The MPC8568E is fabricated in a 90 nm CMOS process and operates from split 1.0 V core / 1.8 V / 2.5 V / 3.3 V supply rails. Thermal resistance and maximum junction temperature follow JEDEC JESD51 series for BGAs. Due to its high pin count and 1.333 GHz clock rate, the package demands careful PCB design with controlled-impedance routing, multiple decoupling capacitors, and thermal vias to maintain a junction temperature inside the safe operating envelope. Typical applications include enterprise routers, multi-service switches, wireless base stations, IP-PBX systems, factory automation controllers, networked storage controllers, and industrial gateways. The part is widely deployed in long-life telecom and defense programs where its combination of Ethernet acceleration, security offload, and deterministic QUICC Engine protocols continues to deliver value. Designers frequently choose it when migrating from older PowerQUICC II designs to gain PCIe or SRIO fabric interfaces without porting firmware to a new ISA. When designing with the MPC8568EVTAUJJ, ensure the boot configuration pins are pulled correctly at reset to select the correct POR (Power-on Reset) source and bus width. Allocate generous ground and 1.0 V core-plane copper with stitched thermal vias under the BGA, and follow NXP AN3534 layout and decoupling guidance to maintain signal integrity on DDR2 memory and SerDes lanes. Power sequencing between 1.0 V core and 1.8 V/3.3 V I/O must meet the datasheet-specified overlap and rise-time constraints to avoid latch-up. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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MPC8568VTAQGG

MPC8568VTAQGG - PowerPC e500v2 MPU 1GHz 1023-FCPBGA | NXP

The NXP Semiconductors MPC8568VTAQGG is a PowerPC e500v2 based microprocessor IC from the MPC85xx family, integrating a single 32-bit core at up to 1.0 GHz in a 1023-ball FCBGA (33x33 mm) package. It is part of NXP's communications processor line that combines a high-performance e500v2 core with integrated networking and acceleration peripherals for embedded infrastructure equipment. A microprocessor (MPU) is a single-chip CPU that integrates the arithmetic logic unit, control unit, register file, and cache onto one die; the MPC8568 family adds an on-chip platform block with high-speed serial I/O, DDR2 memory controller, PCI Express, and Security/SRIO engines, which elevates it from a generic MPU to a system-on-chip (SoC) communications processor. Architecturally this places the MPC8568 at the top of the embedded processor hierarchy: MPU -> SoC -> Communications Processor -> Network Infrastructure SoC. Key features of the MPC8568VTAQGG include the PowerPC e500v2 32-bit core with dual-issue superscalar pipeline, integrated 32 KB / 32 KB L1 instruction/data caches, 512 KB of L2 cache, a 64-bit DDR2 memory controller with ECC, four Gigabit Ethernet controllers (SGMII/RGMII), two PCI Express interfaces, two Serial RapidIO (SRIO) interfaces, and an integrated security engine. Core voltage is 1.1 V with I/O at 1.8 V / 2.5 V / 3.3 V, allowing flexible mixed-voltage system design. The 33x33 mm FCBGA package provides the necessary signal and power-pin density for the high-speed serial interfaces. The part is built on a 90 nm CMOS process and is targeted at deeply embedded networking applications including multi-service routers, line cards for IP/MPLS/ATM switches, wireless base-station control plane processing, and storage area network controllers. Compared to discrete CPU-plus-ASIC solutions, the integrated peripherals reduce BOM and board area while sustaining 1 GHz deterministic throughput for packet-processing workloads. When designing with this device, follow NXP's reference PCB stack-up for the FCBGA - matched impedance for SERDES lanes and a solid ground/VDD core plane underneath the BGA are mandatory. The high pin count (1023 balls) requires blind/buried vias or microvia stack-up with a 0.8 mm or finer pitch; PCB fabrication capability must be confirmed before committing to this package. This page synthesizes distributor pricing, pin-compatible MPC8568 family alternatives, and practical board-design notes that complement the NXP datasheet, giving procurement and hardware engineers a single decision-ready reference.

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MPC8568VTAUJJ

MPC8568VTAUJJ - PowerQUICC 32-bit 1.333GHz MPU, 1023-FCPBGA | NXP

The NXP MPC8568VTAUJJ is a high-performance PowerQUICC III microprocessor built on the 32-bit Power Architecture e500v2 core, running at up to 1.333 GHz, and housed in a 1023-ball FCPBGA (33x33 mm). It integrates a QUICC Engine subsystem for offloading communications tasks, dual 10/100/1 Gb Ethernet controllers with TCP/IP acceleration, Serial RapidIO, PCI Express, and DDR2 memory controller, targeting networking, telecom, and embedded control applications. A microprocessor (MPU) is a single-chip CPU that integrates the central processing unit, cache hierarchy, memory controller, and a configurable mix of peripherals and accelerators. Within embedded systems, MPUs occupy the layer above microcontrollers (MCUs), where higher computational throughput, deterministic networking throughput, and rich high-speed I/O are required. The PowerQUICC family from NXP sits in the broader hierarchy of Power Architecture devices -> embedded processors -> integrated circuits (ICs) -> semiconductors. Key features of the MPC8568VTAUJJ include 36-bit physical addressing, 512 Kbytes of L2 cache, hardware-accelerated encryption (security engine present on the MPC8568E variant; this MPC8568V part is the non-encrypt version per the Mouser listing), an integrated DDR2 memory controller, and operating temperature range of 0C to 105C (TJ). The device supports both SRIO and PCIe for high-speed interconnects in chassis-to-chassis and backplane designs, while the TSEC (Triple Speed Ethernet Controllers) provide line-rate gigabit throughput. Architecturally, the e500v2 core is a superscalar out-of-order design with Book-E-compliant MMU, paired with a 32-Kbyte L1 instruction cache and 32-Kbyte L1 data cache. The QUICC Engine handles protocol termination, RTP, and AAL2 segmentation, reducing host CPU load in multi-service access concentrators and DSLAM line cards. Combined with hardware queue management, the MPC8568 line has been widely deployed in IMS, gateway, and edge-router designs. Typical applications include enterprise and carrier-grade routers, multiservice access platforms, xDSL line cards, industrial control with deterministic networking, secure gateways with IPsec offload (E variant), and PCI Express-based embedded compute nodes. The MPC8568V (non-encrypt) is typically preferred where secure boot and runtime crypto are handled externally. When designing with this part, pay careful attention to the 1023-ball FCPBGA escape routing, DDR2 trace-length matching, and the multi-rail power sequence (Vdd, Gvdd, LVDDR, etc.). The non-encrypt suffix means designers must not rely on integrated SEC; route cryptographic operations to an external accelerator or to a software fallback. This page synthesizes distributor pricing, NXP product change notices, and practical design notes not found in the standalone manufacturer datasheet to assist engineers sourcing this EOL PowerQUICC part.

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製品 (39,000+)

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MPC855TCZQ50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP

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MPC855TVR66D4 - 66MHz PowerQUICC MPC8xx MPU 357-BGA | NXP

MPC855TVR80D4 - PowerQUICC 80MHz 32-Bit MPU, 357-PBGA | NXP

MPC855TZQ50D4 - 50MHz PowerQUICC SoC | NXP 357-PBGA

MPC855TZQ66D4 - 66MHz PowerQUICC MPU, 357-PBGA | NXP

MPC855TZQ80D4 - PowerQUICC 32-Bit MPU, 80MHz | NXP 357-PBGA

MPC8560PX667LC - PowerPC e500 MPU 667MHz 783-FCPBGA | NXP

MPC8560PXAQFC - PowerQUICC III MPU 1GHz PowerPC e500 783-BGA | NXP

MPC8560VT667LB - PowerPC e500 MPU, 667MHz, 783-FCBGA | NXP

MPC8560VT833LB - 833MHz PowerQUICC III MPU | Freescale/NXP | BGA-783

MPC8560VTAQFC - 1GHz PowerQUICC III MPU | NXP 783-FCPBGA

MPC8568EVTAUJJ - PowerPC e500v2 MPU 1.333GHz | NXP

MPC8568VTAQGG - PowerPC e500v2 MPU 1GHz 1023-FCPBGA | NXP

MPC8568VTAUJJ - PowerQUICC 32-bit 1.333GHz MPU, 1023-FCPBGA | NXP