K9DVGB8U5M vs K9MDG08U5M 比較

詳細な並列比較: K9DVGB8U5M メーカー: Samsung Electronics および K9MDG08U5M メーカー: Samsung Electronics。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。

Samsung Electronics
K9DVGB8U5M K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M ✓ 生産中
Samsung Electronics
K9MDG08U5M K9MDG08U5M - 16Gb x8 MLC NAND Flash TSOP1-48 | Samsung

K9MDG08U5M - 16Gb x8 MLC NAND Flash TSOP1-48 | Samsung

K9MDG08U5M ✓ 生産中

仕様比較

パラメータ K9DVGB8U5M K9MDG08U5M
ブランド Samsung Electronics Samsung Electronics
カテゴリ Memory ICs Memory ICs
ライフサイクル状態 有効 有効
在庫状況 In Stock In Stock
単価(USD) $3.05 $35.50
メモリタイプ NAND Flash MLC Large Block NAND Flash
メモリ構成 [DATA_NEEDED: capacity organization] 16G x 8 bit
インターフェース Asynchronous x8-bit I/O Asynchronous x8 multiplexed address/data
電源電圧 [DATA_NEEDED: VCC range] —
パッケージ [DATA_NEEDED: package type and dimensions] 48-pin TSOP1 dual stacked, 12 mm x 20 mm
実装タイプ Surface Mount Surface Mount
Page Size [DATA_NEEDED: main page size] [DATA_NEEDED: page size]
Block Size [DATA_NEEDED: erase block size] [DATA_NEEDED: block size]
Read Time (tR) [DATA_NEEDED: page read cycle time] —
Program Time (tPROG) [DATA_NEEDED: page program time] [DATA_NEEDED: tPROG]
Erase Time (tBERS) [DATA_NEEDED: block erase time] —
Endurance [DATA_NEEDED: program/erase cycles] —
Data Retention [DATA_NEEDED: retention specification] —
動作温度 [DATA_NEEDED: temperature range] [DATA_NEEDED: operating temperature range]
Access Interface Signals CLE, ALE, WE, RE, CE, R/B, WP —
Bad Block Management Host-managed (controller ECC and bad-block table required) —
RoHS ステータス [DATA_NEEDED: RoHS compliance] unknown
Density — 16 Gbit (2 GB)
Cell Type — MLC (2 bits per cell)
Supply Voltage Min — 2.7 V
Supply Voltage Max — 3.6 V
Terminals — 48
Circuits — 1
Die Configuration — Dual stacked
Page Read Time (tR) — [DATA_NEEDED: tR]

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