MPC755CPX400LE vs MPC755CRX400LE 比較
詳細な並列比較: MPC755CPX400LE メーカー: NXP Semiconductors および MPC755CRX400LE メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | MPC755CPX400LE | MPC755CRX400LE |
|---|---|---|
| ブランド | NXP Semiconductors | NXP Semiconductors |
| カテゴリ | Microcontrollers | Microcontrollers |
| ライフサイクル状態 | Obsolete | Obsolete |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $82.50 | $171.00 |
| Manufacturer | NXP Semiconductors (formerly Motorola/Freescale) | — |
| Part Family | MPC7xx PowerPC G3 | — |
| Core Architecture | PowerPC 32-bit RISC, 64-bit external bus | — |
| Core Clock Speed | 400 MHz | — |
| データバス幅 | 64-bit | 64-Bit |
| Address Bus Width | 32-bit | — |
| On-chip L2 Cache | 256 KB unified with ECC | — |
| Floating Point Unit | Double-precision IEEE-754 FPU | — |
| Supply Voltage - Core | 2.5 V | — |
| Supply Voltage - I/O | 3.3 V | — |
| Process Technology | 0.22 um CMOS, 5 metal layers | 0.22 µm |
| パッケージ | 360-FCBGA (25 mm x 25 mm) | — |
| 実装タイプ | Surface Mount (Flip-Chip BGA) | Surface Mount |
| 動作接合温度 | 0 C to +105 C | — |
| Weight / Tray Qty | [DATA_NEEDED: tray quantity] | — |
| Lead Free / RoHS | SnPb solder balls - NOT RoHS compliant | — |
| ピン数 | 360 | — |
| Addressable Memory | Up to 2 GB via 32-bit address bus | — |
| ライフサイクル状態 | Obsolete - last time-buy programs are closed | — |
| Architecture | — | RISC (PowerPC) |
| Family | — | MPC7xx PowerPC |
| Core Count | — | 1 |
| Operating Frequency | — | 400 MHz |
| External Bus Frequency | — | 100 MHz |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 3.3 V |
| Package Type | — | CBGA-360 (Ceramic Ball Grid Array) |
| Package Dimensions | — | 25 mm x 25 mm |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 3.20 mm |
| Pin/Ball Count | — | 360 |
| RoHS ステータス | — | [DATA_NEEDED: RoHS status] |
| 動作温度 | — | [DATA_NEEDED: operating temperature range] |