10AS032H2F34I1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel
部品番号: 10AS032H2F34I1HG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3600.09 | $3,600.09 |
| 10 | $3240.08 | $32,400.80 |
| 25 | $3060.07 | $76,501.75 |
| 50 | $2880.06 | $144,003.00 |
| 100 | $2700.05 | $270,005.00 |
10AS032H2F34I1HG 概要
An SoC FPGA combines a traditional programmable logic fabric with a hard processor system on a single die, allowing hardware accelerators to communicate with the processor over a coherent interconnect. Arria 10 SX sits in Intel's mid-range SoC portfolio, above Cyclone V but below Stratix 10, balancing logic density, transceiver performance, power efficiency, and processor capability for cost-effective embedded compute.
Key features include 1.5 GHz dual-core ARM Cortex-A9 with CoreSight debug, integrated DDR3/DDR4 memory controllers, PCIe Gen3 x8 hard IP blocks, up to 24 transceiver channels at multi-gigabit data rates, and variable-precision DSP blocks supporting IEEE 754 single-precision floating point. The 1152-FBGA package provides the I/O density required for memory-rich and transceiver-rich designs.
The hard processor subsystem offloads complex control-plane tasks from the FPGA fabric, enabling deterministic interrupt latency and software reuse. Coherent accesses between the HPS and FPGA fabric eliminate the need for explicit data copying across AXI bridges in many workloads, simplifying architecture for vision, motor control, and protocol bridging designs.
Typical applications include industrial machine vision, motor control and drives, software-defined radio front ends, automotive ADAS prototypes, broadcast video processing, and 5G baseband pre-processing. The device's combination of ARM Cortex-A9 software ecosystem and Arria 10 DSP fabric is particularly well suited to mixed-control/signal-processing workloads.
When designing with this device, pay close attention to PCB BGA escape routing, multi-rail power sequencing (0.95 V core, 1.1 V HPS, 1.5 V transceiver, 2.5 V/3.3 V I/O), and thermal management for sustained compute loads. The Quartus Prime design suite provides reference designs and IP cores tailored to Arria 10 SX variants.
This page synthesizes distributor pricing, drop-in alternatives drawn from the Arria 10 family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a faster path from selection to bring-up.
ドロップイン代替品: 10AS032H2F34I1HG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AS032H2F34I1HG （同一形状・フットプリント） — 相違点: Package, Speed Grade, Operating Temperature, Logic Elements, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
10AS032H2F34I1SG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10AS032H2F34E2SG
✅ ドロップイン✓ 在庫あり
$1410 / 個
データシートを見る →10AS032H2F34E1HG
✅ ドロップイン✓ 在庫あり
$1227.9 / 個
データシートを見る →10AS032H2F34E2LG
✅ ドロップイン✓ 在庫あり
$1380 / 個
データシートを見る →10AS032H1F34I1HG
✅ ドロップイン✓ 在庫あり
$2077.26 / 個
データシートを見る →10AS032H1F35I1HG
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2265 / 個
データシートを見る →10AS032H2F34I1HG 最大定格＆電気的特性
| Family | Arria 10 SX |
| Logic Elements | 320K |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Hard Processor Frequency | 1.5 GHz |
| Process Technology | TSMC 20 nm |
| パッケージ | 1152-BBGA, FCBGA (35x35 mm) |
| Device Family Member | 10AS032 |
| Memory Controller | Hard DDR3/DDR4 controller (HPS) |
| 動作温度 | Industrial -40C to +100C |
| Speed Grade | 2 (mid-speed) |
| 実装タイプ | Surface Mount (BGA) |
10AS032H2F34I1HG 1152-bbga, fcbga (35x35 mm) ピン配置ガイド
10AS032H2F34I1HG (1152-bbga, fcbga (35x35 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AS032H2F34I1HG.
詳細は データシート をご参照ください。
主な用途
10AS032H2F34I1HG の用途: 6 件s: Industrial Machine Vision Systems, Software Defined Radio Baseband, Motor Control and Industrial Drives, Broadcast Video Processing, Automotive ADAS Prototyping, 5G Baseband Pre-Processing.
Industrial Machine Vision Systems
The 10AS032H2F34I1HG fits machine vision by combining 320K logic elements for parallel pixel pipelines with the dual-core ARM Cortex-A9 HPS running Linux for camera control, object detection, and protocol bridging. Its variable-precision DSP blocks accelerate convolutional operations in real time, and the hard DDR3/DDR4 controller feeds multi-megapixel image streams without fabric overhead. Placed between the image sensor array and the EtherCAT or GigE Vision uplink, the SoC delivers deterministic latency unachievable with separate MCU+FPGA solutions.
おすすめ
Software Defined Radio Baseband
In SDR baseband processing, the 10AS032H2F34I1HG pairs multi-gigabit transceivers with DSP fabric for channelization, FFT, and modulation/demodulation. The 1.5 GHz ARM Cortex-A9 HPS runs Linux with GNU Radio or custom DSP frameworks while offloading MAC-layer processing to the FPGA. Coherent HPS-fabric AXI accesses reduce buffer copies across the data plane, lowering end-to-end latency. Power consumption stays manageable in rack-mounted base station form factors.
おすすめ
Motor Control and Industrial Drives
The 10AS032H2F34I1HG powers advanced motor control by integrating Field-Oriented Control (FOC) loops, encoder interfaces, and safety logic on the FPGA fabric while the Cortex-A9 HPS handles PLC communications, EtherCAT master stacks, and HMI. Sub-microsecond deterministic interrupt response from the HPS enables high-RPM precision control. The 1152-FBGA package supports the wide I/O count needed for multi-axis drive systems with parallel feedback channels.
おすすめ
Broadcast Video Processing
For 4K video processing and broadcast infrastructure, the 10AS032H2F34I1HG provides the DSP throughput for real-time video scaling, color space conversion, and overlay composition. The HPS runs Linux for network control and codec management, while FPGA fabric accelerates pixel-rate pipelines. Hard transceivers support SDI, SMPTE 2022, and 12G-SDI links. Industrial temperature grade ensures reliable operation in broadcast rack environments.
おすすめ
Automotive ADAS Prototyping
The 10AS032H2F34I1HG is used in ADAS prototype and pre-production platforms where its 320K logic elements support sensor fusion of camera, radar, and lidar data streams. The Cortex-A9 HPS runs AUTOSAR or RTOS-based perception software while FPGA fabric implements deterministic sensor preprocessing. Industrial temperature grade supports the extended automotive thermal envelope. Production deployment typically transitions to dedicated ASICs or Stratix 10 devices.
おすすめ
5G Baseband Pre-Processing
In 5G fronthaul and baseband units, the 10AS032H2F34I1HG implements PHY-layer functions including channel coding, beamforming weight calculation, and FFT/iFFT transforms. Hard multi-gigabit transceivers interface with radio units via CPRI or eCPRI links, while the HPS runs MAC scheduling and OAM software. The combination delivers throughput required for sub-6 GHz small cell sites within a compact, power-efficient footprint.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AS032H2F34I1HG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AS032H2F34I1SG | 10AS032H2F34E2SG | 10AS032H2F34E1HG | 10AS032H2F34E2LG | 10AS032H1F34I1HG |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1152-FBGA, FCBGA (35x35 mm) | 1152-FBGA, FCBGA (35x35 mm) - same | 1152-FBGA, FCBGA (35x35 mm) - same | 1152-FBGA, FCBGA (35x35 mm) - same | 1152-FBGA, FCBGA (35x35 mm) - same | 1152-FBGA, FCBGA (35x35 mm) - same |
| Speed Grade | H2 (mid-speed) | H2 | E2 | E1 | E2 | H1 |
| Temperature Grade | Industrial (-40C to +100C) | Extended industrial | Extended industrial | Industrial | LG (commercial-like) | Industrial |
| Logic Elements | 320K | 320K | 320K | 320K | 320K | 320K |
| HPS Core | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz |
| Process Technology | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm |
| Quartus Toolchain Support | Yes (Quartus Prime) | Yes | Yes | Yes | Yes | Yes |
主な差別化要因
- Highest mid-range speed grade H2 in industrial temperature （vs 10AS032H1F34I1HG)
- Industrial temperature qualification for harsh environments （vs 10AS032H2F34E2LG)
- Dual-core ARM Cortex-A9 HPS at 1.5 GHz （vs FPGA-only 10CL025 (Cyclone V FPGA without HPS))
- Single-die SoC reduces PCB area versus separate MCU+FPGA （vs Discrete MCU (e.g. STM32) + Cyclone V FPGA solution)
設計ノート
The 1152-FBGA package requires a high-density PCB stack-up with microvias, fine-pitch escape routing, and a continuous ground/plane stitching beneath the BGA. Recommended: 8-12 layer stack-up with 1oz copper on outer layers and 0.5oz on inner layers. The 1.0 mm ball pitch allows standard via-in-pad plating but mandates laser-drilled microvias or sequential lamination. Inadequate thermal vias under the central BGA balls will cause junction temperature rise and logic errors under sustained compute loads.
Arria 10 SX requires sequenced multi-rail power: 0.95 V core VCCH, 1.1 V HPS VCCP, 1.5 V-2.5 V transceiver VCCR/VCCPT, and 2.5 V-3.3 V I/O VCCIO. Power-on and power-down must follow the manufacturer's sequencing specification to avoid latch-up. Use a dedicated PMIC such as the LM3880 or Intel's recommended controllers. Decoupling requires 0402/0201 ceramic capacitors within 2 mm of each power pin, with bulk capacitors distributed around the PCB periphery. Estimated total board power is 8-15 W typical for SoC workloads.
Estimated: at 10 W total board power with 35x35 mm FCBGA (theta_JA approximately 15 C/W on a 4-layer JEDEC test board), junction temperature rises approximately 150 C above ambient without forced cooling. A heatsink with thermal interface material or 200 LFM forced airflow is recommended for industrial environments up to +85 C ambient. For sealed enclosures, derate by 30-40% or specify extended temperature screening.
Transceiver channels must be routed with controlled-impedance differential pairs (typically 100 ohm differential) on the top microvia layer, with reference planes uninterrupted. Keep transceiver routes away from noisy HPS power islands. Use Quartus Prime pin planner to optimize I/O placement before PCB layout to minimize signal integrity issues and avoid post-layout re-spins.
Do not confuse the F34 package (this part) with the F29, F27, or F35 packages - they have different ball maps and are NOT PCB-compatible despite the same Arria 10 SX family. Verify the device datasheet pin connection guidelines against your PCB footprint before ordering. Also note that speed grades H1, H2, E1, E2 differ in timing margin; E grades are lower power and slower, H grades are higher performance. Mixing them in production can cause frequency-dependent failures.
コンプライアンス情報
RoHS and REACH compliance per Intel/Altera product documentation. AEC-Q100 not applicable for FPGAs (automotive uses different screening). Industrial temperature grade per I1 ordering code.
