10AS032H2F34I1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel
MPN: 10AS032H2F34I1HG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3600.09 | $3,600.09 |
| 10 | $3240.08 | $32,400.80 |
| 25 | $3060.07 | $76,501.75 |
| 50 | $2880.06 | $144,003.00 |
| 100 | $2700.05 | $270,005.00 |
Drop-in alternatives for 10AS032H2F34I1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032H2F34I1SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS032H2F34E2SG
✅ Drop-In✓ In Stock
$1410 / Unit
View Datasheet →10AS032H2F34E1HG
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View Datasheet →10AS032H2F34E2LG
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$1380 / Unit
View Datasheet →10AS032H1F34I1HG
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View Datasheet →10AS032H1F35I1HG
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View Datasheet →10AS032H2F34I1HG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Logic Elements | 320K |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Hard Processor Frequency | 1.5 GHz |
| Process Technology | TSMC 20 nm |
| Package | 1152-BBGA, FCBGA (35x35 mm) |
| Device Family Member | 10AS032 |
| Memory Controller | Hard DDR3/DDR4 controller (HPS) |
| Operating Temperature | Industrial -40C to +100C |
| Speed Grade | 2 (mid-speed) |
| Mounting Type | Surface Mount (BGA) |
10AS032H2F34I1HG 1152-bbga, fcbga (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS032H2F34I1HG (1152-bbga, fcbga (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H2F34I1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H2F34I1HG is suitable for 6 applications: Industrial Machine Vision Systems, Software Defined Radio Baseband, Motor Control and Industrial Drives, Broadcast Video Processing, Automotive ADAS Prototyping, 5G Baseband Pre-Processing.
Industrial Machine Vision Systems
The 10AS032H2F34I1HG fits machine vision by combining 320K logic elements for parallel pixel pipelines with the dual-core ARM Cortex-A9 HPS running Linux for camera control, object detection, and protocol bridging. Its variable-precision DSP blocks accelerate convolutional operations in real time, and the hard DDR3/DDR4 controller feeds multi-megapixel image streams without fabric overhead. Placed between the image sensor array and the EtherCAT or GigE Vision uplink, the SoC delivers deterministic latency unachievable with separate MCU+FPGA solutions.
Recommended
Software Defined Radio Baseband
In SDR baseband processing, the 10AS032H2F34I1HG pairs multi-gigabit transceivers with DSP fabric for channelization, FFT, and modulation/demodulation. The 1.5 GHz ARM Cortex-A9 HPS runs Linux with GNU Radio or custom DSP frameworks while offloading MAC-layer processing to the FPGA. Coherent HPS-fabric AXI accesses reduce buffer copies across the data plane, lowering end-to-end latency. Power consumption stays manageable in rack-mounted base station form factors.
Recommended
Motor Control and Industrial Drives
The 10AS032H2F34I1HG powers advanced motor control by integrating Field-Oriented Control (FOC) loops, encoder interfaces, and safety logic on the FPGA fabric while the Cortex-A9 HPS handles PLC communications, EtherCAT master stacks, and HMI. Sub-microsecond deterministic interrupt response from the HPS enables high-RPM precision control. The 1152-FBGA package supports the wide I/O count needed for multi-axis drive systems with parallel feedback channels.
Recommended
Broadcast Video Processing
For 4K video processing and broadcast infrastructure, the 10AS032H2F34I1HG provides the DSP throughput for real-time video scaling, color space conversion, and overlay composition. The HPS runs Linux for network control and codec management, while FPGA fabric accelerates pixel-rate pipelines. Hard transceivers support SDI, SMPTE 2022, and 12G-SDI links. Industrial temperature grade ensures reliable operation in broadcast rack environments.
Recommended
Automotive ADAS Prototyping
The 10AS032H2F34I1HG is used in ADAS prototype and pre-production platforms where its 320K logic elements support sensor fusion of camera, radar, and lidar data streams. The Cortex-A9 HPS runs AUTOSAR or RTOS-based perception software while FPGA fabric implements deterministic sensor preprocessing. Industrial temperature grade supports the extended automotive thermal envelope. Production deployment typically transitions to dedicated ASICs or Stratix 10 devices.
Recommended
5G Baseband Pre-Processing
In 5G fronthaul and baseband units, the 10AS032H2F34I1HG implements PHY-layer functions including channel coding, beamforming weight calculation, and FFT/iFFT transforms. Hard multi-gigabit transceivers interface with radio units via CPRI or eCPRI links, while the HPS runs MAC scheduling and OAM software. The combination delivers throughput required for sub-6 GHz small cell sites within a compact, power-efficient footprint.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H2F34I1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H2F34I1SG | 10AS032H2F34E2SG | 10AS032H2F34E1HG | 10AS032H2F34E2LG | 10AS032H1F34I1HG |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1152-FBGA, FCBGA (35x35 mm) | 1152-FBGA, FCBGA (35x35 mm) - same | 1152-FBGA, FCBGA (35x35 mm) - same | 1152-FBGA, FCBGA (35x35 mm) - same | 1152-FBGA, FCBGA (35x35 mm) - same | 1152-FBGA, FCBGA (35x35 mm) - same |
| Speed Grade | H2 (mid-speed) | H2 | E2 | E1 | E2 | H1 |
| Temperature Grade | Industrial (-40C to +100C) | Extended industrial | Extended industrial | Industrial | LG (commercial-like) | Industrial |
| Logic Elements | 320K | 320K | 320K | 320K | 320K | 320K |
| HPS Core | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz |
| Process Technology | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm |
| Unit Price (1 qty) | $3600.09 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Quartus Toolchain Support | Yes (Quartus Prime) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Highest mid-range speed grade H2 in industrial temperature (vs 10AS032H1F34I1HG)
- Industrial temperature qualification for harsh environments (vs 10AS032H2F34E2LG)
- Dual-core ARM Cortex-A9 HPS at 1.5 GHz (vs FPGA-only 10CL025 (Cyclone V FPGA without HPS))
- Single-die SoC reduces PCB area versus separate MCU+FPGA (vs Discrete MCU (e.g. STM32) + Cyclone V FPGA solution)
Design Notes
The 1152-FBGA package requires a high-density PCB stack-up with microvias, fine-pitch escape routing, and a continuous ground/plane stitching beneath the BGA. Recommended: 8-12 layer stack-up with 1oz copper on outer layers and 0.5oz on inner layers. The 1.0 mm ball pitch allows standard via-in-pad plating but mandates laser-drilled microvias or sequential lamination. Inadequate thermal vias under the central BGA balls will cause junction temperature rise and logic errors under sustained compute loads.
Arria 10 SX requires sequenced multi-rail power: 0.95 V core VCCH, 1.1 V HPS VCCP, 1.5 V-2.5 V transceiver VCCR/VCCPT, and 2.5 V-3.3 V I/O VCCIO. Power-on and power-down must follow the manufacturer's sequencing specification to avoid latch-up. Use a dedicated PMIC such as the LM3880 or Intel's recommended controllers. Decoupling requires 0402/0201 ceramic capacitors within 2 mm of each power pin, with bulk capacitors distributed around the PCB periphery. Estimated total board power is 8-15 W typical for SoC workloads.
Estimated: at 10 W total board power with 35x35 mm FCBGA (theta_JA approximately 15 C/W on a 4-layer JEDEC test board), junction temperature rises approximately 150 C above ambient without forced cooling. A heatsink with thermal interface material or 200 LFM forced airflow is recommended for industrial environments up to +85 C ambient. For sealed enclosures, derate by 30-40% or specify extended temperature screening.
Transceiver channels must be routed with controlled-impedance differential pairs (typically 100 ohm differential) on the top microvia layer, with reference planes uninterrupted. Keep transceiver routes away from noisy HPS power islands. Use Quartus Prime pin planner to optimize I/O placement before PCB layout to minimize signal integrity issues and avoid post-layout re-spins.
Do not confuse the F34 package (this part) with the F29, F27, or F35 packages - they have different ball maps and are NOT PCB-compatible despite the same Arria 10 SX family. Verify the device datasheet pin connection guidelines against your PCB footprint before ordering. Also note that speed grades H1, H2, E1, E2 differ in timing margin; E grades are lower power and slower, H grades are higher performance. Mixing them in production can cause frequency-dependent failures.
Compliance Information
RoHS and REACH compliance per Intel/Altera product documentation. AEC-Q100 not applicable for FPGAs (automotive uses different screening). Industrial temperature grade per I1 ordering code.
