10AS032H2F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel
MPN: 10AS032H2F34E1HG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2046.5 | $2,046.50 |
| 10 | $1841.85 | $18,418.50 |
| 25 | $1637.2 | $40,930.00 |
| 50 | $1432.55 | $71,627.50 |
| 100 | $1227.9 | $122,790.00 |
Drop-in alternatives for 10AS032H2F34E1HG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10AS032H1F34E1HG
β Drop-Inβ In Stock
$1755 / Unit
View Datasheet β10AS032H3F34E1HG
β Drop-Inπ Reference alternative (not in catalog)
10AS027H1F34E1HG
β Drop-Inπ Reference alternative (not in catalog)
10AS032H2F34E2HG
β Drop-Inπ Reference alternative (not in catalog)
10AS032H2F34I1HG
β Drop-Inβ In Stock
$2700.05 / Unit
View Datasheet β10AS032H2F34E1HG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Core Type | Dual ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 320,000 |
| HPS Core Frequency | 1.5 GHz |
| User I/O | 384 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Package | 1152-FBGA, FC (35x35 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (industrial, per Arria 10 SX F34 ordering code) |
| Transceivers | Up to 12.5 Gbps (per family datasheet) |
| Hard Memory Controller | DDR3/DDR4 (per Arria 10 SX family) |
| RoHS Status | Compliant (per Intel product page) |
| Lead Free | Yes |
| Configuration | SRAM-based, configuration via HPS or external |
10AS032H2F34E1HG 1152-fbga, fc (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS032H2F34E1HG (1152-fbga, fc (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H2F34E1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H2F34E1HG is suitable for 6 applications: High-Speed Industrial Imaging, Military Radar Signal Processing, Medical Imaging Backplanes, Test and Measurement Instrumentation, High-Bandwidth Protocol Bridging, Aerospace Flight Control Systems.
High-Speed Industrial Imaging
The 10AS032H2F34E1HG's 320K logic elements and dual-core ARM Cortex-A9 at 1.5 GHz make it ideal for industrial machine vision systems where FPGA-side hardware pipelines process high-resolution sensor data while the HPS runs Linux-based vision analytics. The 384 user I/Os interface directly with MIPI CSI-2, LVDS, and CoaXPress image sensors. Hardware-accelerated image processing achieves deterministic latency that software-only systems cannot match. Transceivers up to 12.5 Gbps enable direct interface to high-bandwidth sensors without external bridge chips, reducing BOM cost and PCB area in factory-floor vision deployments.
Recommended
Military Radar Signal Processing
The Arria 10 SX architecture combines hard IEEE 754 floating-point DSP blocks with a programmable HPS for radar front-end processing. The 10AS032H2F34E1HG's 12.5 Gbps transceivers stream digitized RF data into the FPGA fabric where DSP blocks perform pulse compression, MTI filtering, and FFT. The HPS subsystem handles tracker algorithms and display rendering under Linux. This partitioning achieves deterministic radar processing latency essential for phased-array beamforming and adaptive target tracking. The industrial temperature grade supports deployment in harsh environmental conditions.
Recommended
Medical Imaging Backplanes
Medical imaging systems such as CT, MRI, and ultrasound require the deterministic processing and high data throughput that the 10AS032H2F34E1HG provides. FPGA-side fabric performs real-time beamforming, image reconstruction, and noise reduction on raw sensor data, while the dual-core ARM Cortex-A9 manages patient interfaces and DICOM stack. PCIe Gen3 hard IP enables direct connection to host processors for image archival. The 20 nm process node provides the reliability required for medical IEC 62304 and ISO 13485 compliant designs. Hardware-accelerated processing reduces scan time and improves patient comfort.
Recommended
Test and Measurement Instrumentation
The 10AS032H2F34E1HG enables next-generation test equipment by combining high-speed analog front-end interfacing on the FPGA side with protocol-aware control software on the HPS. The 12.5 Gbps transceivers handle PCIe Gen3, 10GbE, and proprietary high-speed serial test interfaces. Programmable logic provides sub-nanosecond timing accuracy for stimulus generation and response capture, while the ARM cores manage display UI, USB host, and Ethernet interfaces. The 1152-FBGA package supports high pin-count mixed-signal designs required for oscilloscope and logic analyzer front ends.
Recommended
High-Bandwidth Protocol Bridging
The 10AS032H2F34E1HG serves as a multi-protocol bridge in telecom and networking equipment, converting between PCIe, 10GbE, CPRI, and custom serial interfaces. Hardened PCIe Gen3 and 10GbE MAC blocks minimize logic consumption, leaving FPGA fabric free for protocol adaptation logic. The ARM HPS runs the network stack and management interfaces. The industrial temperature grade supports deployment in central office and outdoor cabinet environments. Hardware offload reduces latency and CPU load compared to pure-software bridging solutions.
Recommended
Aerospace Flight Control Systems
Avionics systems benefit from the 10AS032H2F34E1HG's deterministic real-time processing combined with the flexibility of a programmable SoC. The FPGA fabric handles sensor fusion, actuator control loops, and ARINC 429/MIL-STD-1553 interfaces, while the HPS runs flight management software. Built-in ECC on memory and configuration logic supports fault-tolerant operation required for DO-254 design assurance. The industrial temperature grade and 20 nm process provide reliability for airborne and UAV applications. Redundant configuration via dual QSPI images enables fault recovery.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H2F34E1HG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H1F34E1HG | 10AS032H3F34E1HG | 10AS027H1F34E1HG | 10AS032H2F34E2HG | 10AS032H2F34I1HG |
|---|---|---|---|---|---|---|
| Package | 1152-FBGA F34 (35x35 mm) | 1152-FBGA F34 (35x35 mm) - same | 1152-FBGA F34 (35x35 mm) - same | 1152-FBGA F34 (35x35 mm) - same | 1152-FBGA F34 (35x35 mm) - same | 1152-FBGA F34 (35x35 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 320K | 320K | 320K | 270K (-15.6%) | 320K | 320K |
| Speed Grade | H2 | H1 (slower -1 grade) | H3 (faster +1 grade) | H1 | H2 | H2 |
| Temperature Grade | E1 (industrial) | E1 | E1 | E1 | E2 (extended) | I1 (industrial wider) |
| User I/O | 384 | 384 | 384 | 384 | 384 | 384 |
| HPS Core Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Unit Price (USD, qty 1) | $2,046.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- H2 speed grade vs H1 - 15% faster timing closure (vs 10AS032H1F34E1HG)
- 320K logic elements - same fabric, F34 pin-compatible (vs 10AS027H1F34E1HG)
- Dual ARM Cortex-A9 MPCore integrated HPS eliminates external processor (vs 10AS066K2F35I1HG)
Design Notes
Estimated: The 1152-FBGA F34 package has a typical theta_JA of approximately 12 C/W with appropriate thermal management (heat sink plus thermal interface material). At full utilization of the 320K logic elements and 1.5 GHz HPS, total power dissipation can reach 25-35 W. Design PCB stack-up with at least 2 oz copper on outer layers and dedicated thermal vias under the BGA to spread heat. For industrial-grade deployments, derate ambient temperature by 10 C above 70 C to maintain junction temperature within spec.
The 1152-FBGA package requires a high-density interconnect (HDI) PCB with micro-via stack-ups. Use at least 8 PCB layers with 1 oz copper for signal layers and 2 oz for power/ground planes. Maintain 50 ohm controlled impedance on high-speed serial traces and 100 ohm differential for LVDS pairs. Decouple all power rails with 0.1 uF, 1 uF, and 10 uF ceramic capacitors placed as close to the BGA as possible. Add bulk decoupling (47-100 uF) at the regulator output stages.
Critical sequencing: Power-on sequence must follow Intel's recommended order - core 0.9 V must ramp before HPS rails, and HPS rails must be stable before I/O banks. Failure to sequence properly can cause inrush currents and latch-up. Also, configure MSEL pins correctly for the desired configuration mode (AS, PS, JTAG). Boot from QSPI requires the flash to be programmed with a valid .pof bitstream and bootloader image for HPS-only boot mode.
12.5 Gbps transceiver channels require strict PCB routing rules: maximum 1 connector discontinuity per channel, 100 ohm differential impedance with 85 ohm common-mode for ACX coupling, length matching within 0.127 mm (5 mils) for TX and RX pairs within a channel. Use 4-PCB layer stack-up with buried stripline for long-haul channels. Reference Intel Transceiver Layout Guidelines for full routing requirements.
Compliance Information
RoHS and REACH compliance per Intel product page. Lead-free reflow compatible. Industrial-grade temperature (E1 suffix), not AEC-Q100 qualified - choose automotive variants for automotive applications. Conflict minerals compliance per Intel supplier program.
