10AS032H1F34I1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FCBGA | Intel
MPN: 10AS032H1F34I1HG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2596.57 | $2,596.57 |
| 10 | $2466.74 | $24,667.40 |
| 100 | $2336.91 | $233,691.00 |
| 500 | $2207.08 | $1,103,540.00 |
| 1,000 | $2077.26 | $2,077,260.00 |
Drop-in alternatives for 10AS032H1F34I1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032E4F29E3SG
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$1920 / Unit
View Datasheet →10AS032H1F34I2HG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS032H1F34I1SG
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10AS032H1F34E1HG
✅ Drop-In✓ In Stock
$1755 / Unit
View Datasheet →10AS032H1F34I1HG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Series | 10AS |
| Logic Elements | 320,000 |
| Hard Processor Subsystem | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| DSP Blocks | 156 (18 × 19 multipliers) |
| On-chip Memory | 256 KB |
| User I/O Pins | 384 |
| Package | 1152-BGA, FCBGA (35 mm × 35 mm) |
| Process Technology | 20 nm |
| Transceivers | Up to 17.4 Gbps (multi-gigabit) |
| Memory Interfaces | DDR4 / DDR3 / LPDDR3 / LPDDR2 |
| Speed Grade | -1 |
| Operating Temperature | -40 °C to +100 °C (industrial) |
| RoHS | Compliant |
| Mounting Type | Surface Mount (BGA) |
| Lifecycle Status | Active |
10AS032H1F34I1HG 1152-bga, fcbga (35 mm × 35 mm) Pin Configuration Guide
Complete pinout information for 10AS032H1F34I1HG (1152-bga, fcbga (35 mm × 35 mm) package) with 384 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H1F34I1HG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 384 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H1F34I1HG is suitable for 6 applications: Motor Control and Industrial Drives, Medical Imaging and Ultrasound, 4K/8K Video Broadcast Infrastructure, Software-Defined Radio (SDR), High-Performance Embedded Computing Modules, Test and Measurement Instrumentation.
Motor Control and Industrial Drives
The 10AS032H1F34I1HG fits multi-axis motor-drive and industrial-automation platforms because the Arria 10 SX combines a dual-core ARM Cortex-A9 HPS running deterministic control loops with 320K LE of programmable logic and 156 hardware DSP blocks. Field-oriented control for a 4-axis servo drive at 32 kHz switching frequency easily fits in the FPGA fabric with hardware floating-point math, while the HPS runs Linux/QNX for networking and HMI. The 17.4 Gbps transceivers support EtherCAT, PROFINET IRT, or SERCOS III on the same board without an external ASSP. Industrial temperature range and 1.5 GHz headroom let the SoC replace a discrete CPU+FPGA combo in higher-end line-card designs.
Recommended
Medical Imaging and Ultrasound
The 10AS032H1F34I1HG is widely used in ultrasound beamformers, endoscopy image processors, and CT reconstruction front-ends thanks to its 320K logic elements and 156 hardware DSP blocks, which can sustain channel-data rates well above 5 Gbps per imaging channel. The hard ARM Cortex-A9 subsystem handles patient-interface stack and DICOM transmission, while the FPGA fabric performs beamforming, FIR filtering, and harmonic imaging in real time. DDR4 memory bandwidth supports 4D volumetric rendering at 30 fps without external memory. The industrial temperature grade suits portable bedside units and operating-room carts.
Recommended
4K/8K Video Broadcast Infrastructure
Broadcast video routers, contribution encoders, and studio glue logic rely on the 10AS032H1F34I1HG because the Arria 10 SX family includes multi-gigabit transceivers up to 17.4 Gbps (12G-SDI capable) and enough logic to handle 4:4:4 12G-SDI at 60 fps on a single chip. The HPS runs a control-plane stack (NMOS IS-04/05, PTP) while the FPGA fabric implements color-space conversion, HDR mapping, and audio embedding. The FCBGA-1152 package supports 384 user I/Os for matrix-router backplanes. Engineers designing for SMPTE ST 2110 IP-based workflows commonly choose this part as the I/O bridge between SDI and 25G Ethernet.
Recommended
Software-Defined Radio (SDR)
The 10AS032H1F34I1HG is a strong fit for wideband SDR platforms and tactical radio front-ends, where its 17.4 Gbps transceivers support multiple independent RF channels and its DSP density handles DDC/DUC, channelization, and waveform-specific transforms on the same die. The dual-core ARM Cortex-A9 runs waveform code (LTE, TETRA, proprietary) under a real-time OS, while the FPGA fabric offloads PHY-layer primitives at line rate. The industrial temperature range and high logic count support multi-band, multi-mode radios previously requiring a separate FPGA and DSP. Reference designs from Intel/Altera show 4×4 MIMO LTE at 20 MHz bandwidth fully closed in one Arria 10 SX device.
Recommended
High-Performance Embedded Computing Modules
VPX, VITA 57.4 (FMC+), and OpenVPX-based single-board computers (SBCs) for defense and aerospace use the 10AS032H1F34I1HG because the SoC FPGA consolidates CPU, FPGA, and high-speed serial on one die. The Arria 10 SX device runs a real-time OS on the ARM Cortex-A9 for housekeeping, runs Linux for network services, and accelerates sensor-fusion algorithms in the FPGA fabric. 100 GbE and PCIe Gen3 interfaces are achievable using the integrated transceivers, eliminating the external PHY+ASIC pair found in legacy designs. The -40 °C to +100 °C industrial temperature grade and RoHS compliance meet the typical defense/aerospace environmental envelope.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers use the 10AS032H1F34I1HG for the acquisition and processing pipeline because of its combination of high transceivers (40+ Gbps aggregate), abundant logic, and dual-core ARM Cortex-A9. The FPGA fabric performs real-time triggering, pattern matching, and protocol decoding at line rate, while the HPS runs the GUI stack, scripting engine, and remote-control interfaces (LXI, SCPI). The 1152-ball FCBGA-1152 package supports the dense connector interface required for multi-channel acquisition cards. Industrial temperature operation suits bench, ATE, and field-test deployment scenarios.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H1F34I1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032E4F29E3SG | 10AS032H1F34I2HG | 10AS032H1F34I1SG | 10AS032H1F34E1HG |
|---|---|---|---|---|---|
| Package | FCBGA-1152 (F34, 35x35 mm) | FCBGA-780 (F29, 29x29 mm) | FCBGA-1152 (F34, 35x35 mm) - same | FCBGA-1152 (F34, 35x35 mm) - same | FCBGA-1152 (F34, 35x35 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Family | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| HPS Maximum Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Speed Grade | -1 | -3 | -2 | -1 | -1 |
| Operating Temperature | -40 to +100 °C (industrial) | -40 to +100 °C (industrial) | -40 to +100 °C (industrial) | -40 to +100 °C (industrial) | 0 to +85 °C (commercial) |
| DSP Blocks | 156 | 156 | 156 | 156 | 156 |
| User I/O | 384 | 240 | 384 | 384 | 384 |
| Transceiver Rate | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps |
Key Differentiators
- Highest logic capacity within the Arria 10 SX portfolio (vs 10AS032E4F29E3SG)
- Industrial temperature grade with full hard processor subsystem (vs 10AS032H1F34E1HG)
- Speed-grade -1 offers the highest performance bin (vs 10AS032H1F34I2HG)
Design Notes
Estimated: A 35 mm × 35 mm FCBGA with typical Arria 10 SX utilization (~60% logic, 60% DSP, HPS active at 1.5 GHz) dissipates approximately 15 to 25 W at 25 °C ambient, which translates to a junction temperature rise of 25-40 °C above ambient with a properly designed 4-layer thermal pad. A heatsink with 3 to 5 C/W thermal resistance is recommended when operating near the industrial upper limit of 100 °C; without forced airflow the junction will exceed 100 °C under sustained high utilization. Use Intel PowerPlay early-power estimator and a junction-to-ambient thermal model of the PCB stack-up before layout freeze.
For the 1152-ball FCBGA with 1.0 mm pitch, use a 0.8 mm pad diameter with NSMD (non-solder mask defined) pads and a microvia-in-pad stack-up. Maintain a 4-layer minimum PCB stack-up with continuous reference planes under the BGA fanout region to control impedance of HPS DDR4 traces (typically 85 ohm differential for SSTL). Reference Intel's Arria 10 SX Hardware Reference Manual for HPS PCB layout, and verify with the Quartus Prime Pin Planner that all HPS DDR4 fly-by lengths fall within the published deskew tolerance.
Common pitfalls with the Arria 10 SX include: (1) forgetting the HPS reset sequencing requirements - the FPGA fabric must be configured before HPS is released from reset in most boot flows; (2) leaving GPIO banks without proper VCCIO power sequencing, which can cause I/O contention; (3) using incorrect PLL reference clock topology for transceivers - reference clocks must meet the strict jitter spec defined in the datasheet; (4) underestimating configuration time and boot-bypass time for secure boot designs. Validate all of these with the Arria 10 SX Development Kit before final schematic review.
Place HPS DDR4 memory immediately adjacent to the FCBGA-1152 with matched trace lengths to avoid skew issues. Use ground stitching vias every 200 mil along the high-speed transceiver edges to maintain return path continuity. Separate analog supply pins (PLL_VCC, HPS_VCC, XCVR_VCC) with local ferrite beads and decoupling caps - do not share analog supply planes with noisy digital rails. The Intel Arria 10 SX layout checklist provides a complete DFM rule set for this package.
Compliance Information
RoHS compliance per Intel/Altera product specification. AEC-Q100 not applicable (industrial-grade FPGA, not automotive-qualified). Halogen-free status not confirmed from provided web data - set to unknown.
