10CL010YM164A7G - Cyclone 10 LP FPGA, 10K LE, 164-MBGA | Intel
部品番号: 10CL010YM164A7G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.45 | $2,945.00 |
| 500 | $24.8 | $12,400.00 |
| 1,000 | $21.1 | $21,100.00 |
10CL010YM164A7G 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, configurable interconnect, and dedicated hardware resources (such as multipliers, memory blocks, and I/O serdes) that the designer configures after manufacture. FPGAs occupy a tier between general-purpose microcontrollers and fixed-function ASICs: they offer ASIC-like parallelism and I/O flexibility while remaining fully re-programmable, eliminating mask costs and enabling rapid design iteration. The Cyclone 10 LP family is fabricated on a low-power process optimized for static-power minimization, positioning it below higher-performance Cyclone families.
Key features of the 10CL010YM164A7G include 46 embedded 18x18 multipliers, 2 PLLs, configuration via serial or parallel flash, support for LVDS, LVCMOS, SSTL, and other common I/O standards, and an operating junction temperature range from -40C to +125C (automotive grade). The 164-MBGA package is 8x8 mm with a 0.5 mm ball pitch, enabling compact PCB integration. The device supports Intel Quartus Prime design software for synthesis, place-and-route, and timing closure.
Architecturally, the device uses a 6-input LUT-based logic element fabric with embedded SRAM, distributed logic, and DSP blocks for efficient arithmetic. Configuration memory is volatile SRAM, requiring an external flash device for boot. The low-power process minimizes idle consumption, making the part attractive for always-on edge nodes and battery-backed systems.
Typical applications include industrial motor control, video processing bridges, automotive infotainment and cluster displays, IoT edge aggregation, low-cost protocol bridging (UART, SPI, I2C to Ethernet or USB), and as a glue-logic replacement for legacy CPLD footprints that have outgrown their density.
When designing with this device, ensure PCB layout meets Intel's 0.5 mm-pitch BGA fanout and decoupling guidelines. A configuration flash device is mandatory because Cyclone 10 LP SRAM-based configuration is volatile on power cycle.
This page synthesizes distributor pricing, package-aware drop-in alternatives, and practical design notes not available in any single manufacturer document.
ドロップイン代替品: 10CL010YM164A7G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10CL010YM164A7G （同一形状・フットプリント） — 相違点: Package, Core Voltage, Embedded Memory, Configuration Modes, MSL Level.
クイック比較ツール — 並列比較する代替部品を選択:
10CL016YM164A7G
✅ ドロップイン✓ 在庫あり
$16.75 / 個
データシートを見る →10CL006YM164A7G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10CL010YM164I7G
✅ ドロップイン✓ 在庫あり
$9.45 / 個
データシートを見る →10CL010YM164C8G
✅ ドロップイン✓ 在庫あり
$12.1 / 個
データシートを見る →10CL010YM164A7G
✅ ドロップイン✓ 在庫あり
$21.1 / 個
データシートを見る →10CL010YM164A7G 最大定格＆電気的特性
| Series | Cyclone 10 LP |
| Logic Elements | 10,320 |
| Embedded Memory | 423,936 bits |
| Maximum User I/O | 101 |
| Embedded 18x18 Multipliers | 46 |
| PLLs | 2 |
| パッケージ | 164-MBGA (TFBGA-164), 8x8 mm, 0.5 mm pitch |
| Process Technology | Low-power CMOS |
| 動作接合温度 | -40C to +125C (Automotive) |
| Configuration Memory | SRAM (volatile, external flash required) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Design Software | Intel Quartus Prime |
10CL010YM164A7G 164-mbga (tfbga-164), 8x8 mm, 0.5 mm pitch ピン配置ガイド
10CL010YM164A7G (164-mbga (tfbga-164), 8x8 mm, 0.5 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10CL010YM164A7G.
詳細は データシート をご参照ください。
主な用途
10CL010YM164A7G の用途: 6 件s: Industrial Motor Control, Automotive Infotainment Display Bridging, IoT Edge Sensor Aggregation, Video Processing Pipeline, Protocol Bridging and Glue Logic, Test and Measurement Front-End.
Industrial Motor Control
The 10CL010YM164A7G fits industrial motor control applications because its 10,320 logic elements and 46 embedded 18x18 multipliers can implement field-oriented control (FOC) loops, encoder interfaces, and PWM generation in a single chip. The automotive -40C to +125C temperature grade tolerates the harsh thermal environment of motor drive enclosures. The 164-MBGA 8x8 mm footprint fits compact inverter PCBs alongside gate drivers and current-sense amplifiers, while the 2 PLLs provide jitter-free clocking for resolver or BiSS feedback.
おすすめ
Automotive Infotainment Display Bridging
Use the 10CL010YM164A7G as a display bridge between an automotive SoC's MIPI DSI output and an LVDS panel. Its 10K logic elements and 423,936 bits of embedded memory comfortably handle pixel-rate conversion, color space translation, and partial-frame buffer storage. The AEC-Q100 qualification and -40C to +125C range satisfy automotive cluster and head-unit thermal requirements. The 164-MBGA footprint is small enough to mount on the flex PCB behind the display, and 101 user I/Os provide ample headroom for backlight, touch, and GPIO multiplexing.
おすすめ
IoT Edge Sensor Aggregation
The 10CL010YM164A7G aggregates multiple low-speed sensor buses (I2C, SPI, UART) onto a single Ethernet or CAN uplink in IoT edge nodes. Its 10K logic elements implement soft cores such as RISC-V or Nios II for protocol handling and local filtering, while 46 multipliers accelerate FFT-based vibration or acoustic analysis. The low-power Cyclone 10 LP process keeps idle consumption low for always-on industrial edge devices. Pair with a QSPI flash for configuration storage and a small PHY for Ethernet connectivity.
おすすめ
Video Processing Pipeline
The 10CL010YM164A7G handles mid-complexity video processing pipelines such as deinterlacing, scaling, and OSD overlay for industrial cameras and machine-vision front-ends. Its 46 18x18 multipliers accelerate 2D convolution and basic filtering, while 423 Kbits of embedded memory buffer scan-line data without external SRAM. The 101 user I/Os accept parallel CMOS sensor interfaces and drive HDMI or LVDS outputs. The -40C to +125C range supports outdoor and factory deployments.
おすすめ
Protocol Bridging and Glue Logic
Replace aging CPLD-based protocol bridges with the 10CL010YM164A7G when designs outgrow 1-2K LUTs. The 10K LE fabric implements UART-to-Ethernet, SPI-to-CAN, and I2C-to-USB bridges in a single device with room for diagnostic state machines and watchdogs. The 164-MBGA 0.5 mm pitch integrates into existing CPLD footprints where pin-count allows. Lower BOM cost than multi-CPLD solutions at this density.
おすすめ
Test and Measurement Front-End
The 10CL010YM164A7G serves as a reconfigurable front-end for low-speed test instruments: programmable gain stages, muxing, and trigger logic can all be implemented in fabric. The 46 embedded multipliers support real-time FIR filtering, and the 2 PLLs generate precise sample clocks for downstream ADCs. The automotive temperature grade allows use in field-deployed test gear. Compact 164-MBGA package fits handheld form factors.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10CL010YM164A7G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10CL016YM164A7G | 10CL006YM164A7G | 10CL010YM164I7G | 10CL010YM164C8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 164-MBGA (M164) | 164-MBGA (M164) - same | 164-MBGA (M164) - same | 164-MBGA (M164) - same | 164-MBGA (M164) - same |
| Logic Elements | 10,320 | 15,408 (+49%) | 6,272 (-39%) | 10,320 (same) | 10,320 (same) |
| Embedded Memory | 423,936 bits | 516,096 bits | 270,336 bits | 423,936 bits | 423,936 bits |
| Multipliers (18x18) | 46 | 56 | 30 | 46 | 46 |
| Maximum User I/O | 101 | 101 | 101 | 101 | 101 |
| Temperature Grade | Automotive -40C to +125C | Automotive -40C to +125C | Automotive -40C to +125C | Industrial -40C to +100C | Automotive -40C to +125C |
| Speed Grade | 7 | 7 | 7 | 7 | 8 (slower) |
| PLLs | 2 | 2 | 2 | 2 | 2 |
主な差別化要因
- Highest LE count in the M164 automotive drop-in family （vs 10CL006YM164A7G)
- Automotive temperature grade up to +125C junction （vs 10CL010YM164I7G)
- Faster speed grade (7) at same price tier （vs 10CL010YM164C8G)
- Compact 164-MBGA footprint with 101 I/Os （vs 10CL010YU256A7G)
設計ノート
Cyclone 10 LP devices require multiple supply rails: core VCC, VCCIO for I/O banks, VCCA for PLL analog, and VCCPD for pre-drivers. Decouple each rail with at least one 0.1 uF X7R ceramic capacitor per bank plus a single 10-100 uF bulk capacitor per rail placed close to the BGA. Add a ferrite bead between the board 3.3 V supply and VCCA to keep PLL jitter within specification. Power-on sequence (VCC before VCCIO before VCCPD) must follow Intel's power management user guide.
The 164-MBGA package uses a 0.5 mm ball pitch on an 8x8 mm body. Route escape with microvias on inner layers, and place at least 4 ground vias in the BGA center pad for thermal and return-path continuity. Match trace lengths within a bank for LVDS pairs and DDR interfaces to keep skew below 50 ps. Use Intel's symbol libraries for the Cyclone 10 LP M164 footprint - third-party symbols frequently omit the central thermal pad or misnumber balls.
Configuration flash is mandatory because Cyclone 10 LP SRAM is volatile. Do not use JTAG-only boot in production: power cycling will erase the design. Always include an EPCQ-L or compatible flash in the BOM. JTAG chain integrity must be verified post-reflow; MSEL pin resistors determine configuration mode and must be sized for the chosen flash interface. Confirmed via Intel's configuration user guide.
Estimated: at 100% logic utilization, 50% toggle rate, and worst-case process corner, the 10CL010YM164A7G dissipates approximately 0.8-1.2 W. The 164-MBGA's theta_JA of roughly 28 C/W on a 4-layer JEDEC test board produces a 22-34 C junction rise above ambient - manageable without a heatsink at automotive ambient up to ~105 C. Forced airflow is recommended above ambient 85 C.
Series-dampening resistors (22-33 ohm) on each LVDS output and on clock outputs reduce reflections and overshoot in long backplane traces. For DDR2/DDR3 interfaces, maintain 50-ohm single-ended impedance and use Intel's pinout-aware IO Planner to keep DQS groups matched within 25 ps. Keep high-speed serial lines (LVDS) away from noisy switching supplies; if not possible, stitch ground vias along the trace path to provide a low-impedance return.
コンプライアンス情報
AEC-Q100 qualified per ordering part number 'A' suffix. RoHS compliance confirmed by JLCPCB part detail listing. Halogen-free status not explicitly stated in available data.
