10CL010YM164A7G - Cyclone 10 LP FPGA, 10K LE, 164-MBGA | Intel
Référence : 10CL010YM164A7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.45 | $2 945,00 |
| 500 | $24.8 | $12 400,00 |
| 1 000 | $21.1 | $21 100,00 |
10CL010YM164A7G Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, configurable interconnect, and dedicated hardware resources (such as multipliers, memory blocks, and I/O serdes) that the designer configures after manufacture. FPGAs occupy a tier between general-purpose microcontrollers and fixed-function ASICs: they offer ASIC-like parallelism and I/O flexibility while remaining fully re-programmable, eliminating mask costs and enabling rapid design iteration. The Cyclone 10 LP family is fabricated on a low-power process optimized for static-power minimization, positioning it below higher-performance Cyclone families.
Key features of the 10CL010YM164A7G include 46 embedded 18x18 multipliers, 2 PLLs, configuration via serial or parallel flash, support for LVDS, LVCMOS, SSTL, and other common I/O standards, and an operating junction temperature range from -40C to +125C (automotive grade). The 164-MBGA package is 8x8 mm with a 0.5 mm ball pitch, enabling compact PCB integration. The device supports Intel Quartus Prime design software for synthesis, place-and-route, and timing closure.
Architecturally, the device uses a 6-input LUT-based logic element fabric with embedded SRAM, distributed logic, and DSP blocks for efficient arithmetic. Configuration memory is volatile SRAM, requiring an external flash device for boot. The low-power process minimizes idle consumption, making the part attractive for always-on edge nodes and battery-backed systems.
Typical applications include industrial motor control, video processing bridges, automotive infotainment and cluster displays, IoT edge aggregation, low-cost protocol bridging (UART, SPI, I2C to Ethernet or USB), and as a glue-logic replacement for legacy CPLD footprints that have outgrown their density.
When designing with this device, ensure PCB layout meets Intel's 0.5 mm-pitch BGA fanout and decoupling guidelines. A configuration flash device is mandatory because Cyclone 10 LP SRAM-based configuration is volatile on power cycle.
This page synthesizes distributor pricing, package-aware drop-in alternatives, and practical design notes not available in any single manufacturer document.
Alternatives de remplacement direct pour 10CL010YM164A7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10CL010YM164A7G (même facteur de forme et même empreinte) — différant par Package, Core Voltage, Embedded Memory, Configuration Modes, MSL Level.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10CL016YM164A7G
✅ Remplacement direct✓ En stock
$16.75 / unité
Voir la fiche technique →10CL006YM164A7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10CL010YM164I7G
✅ Remplacement direct✓ En stock
$9.45 / unité
Voir la fiche technique →10CL010YM164C8G
✅ Remplacement direct✓ En stock
$12.1 / unité
Voir la fiche technique →10CL010YM164A7G
✅ Remplacement direct✓ En stock
$21.1 / unité
Voir la fiche technique →10CL010YM164A7G Valeurs maximales et caractéristiques électriques
| Series | Cyclone 10 LP |
| Logic Elements | 10,320 |
| Embedded Memory | 423,936 bits |
| Maximum User I/O | 101 |
| Embedded 18x18 Multipliers | 46 |
| PLLs | 2 |
| Boîtier | 164-MBGA (TFBGA-164), 8x8 mm, 0.5 mm pitch |
| Process Technology | Low-power CMOS |
| Température de jonction en fonctionnement | -40C to +125C (Automotive) |
| Configuration Memory | SRAM (volatile, external flash required) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Design Software | Intel Quartus Prime |
Guide de configuration des broches du 10CL010YM164A7G 164-mbga (tfbga-164), 8x8 mm, 0.5 mm pitch
Configuration des broches du 10CL010YM164A7G (boîtier 164-mbga (tfbga-164), 8x8 mm, 0.5 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10CL010YM164A7G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10CL010YM164A7G convient pour 6 applications: Industrial Motor Control, Automotive Infotainment Display Bridging, IoT Edge Sensor Aggregation, Video Processing Pipeline, Protocol Bridging and Glue Logic, Test and Measurement Front-End.
Industrial Motor Control
The 10CL010YM164A7G fits industrial motor control applications because its 10,320 logic elements and 46 embedded 18x18 multipliers can implement field-oriented control (FOC) loops, encoder interfaces, and PWM generation in a single chip. The automotive -40C to +125C temperature grade tolerates the harsh thermal environment of motor drive enclosures. The 164-MBGA 8x8 mm footprint fits compact inverter PCBs alongside gate drivers and current-sense amplifiers, while the 2 PLLs provide jitter-free clocking for resolver or BiSS feedback.
Recommandé
Automotive Infotainment Display Bridging
Use the 10CL010YM164A7G as a display bridge between an automotive SoC's MIPI DSI output and an LVDS panel. Its 10K logic elements and 423,936 bits of embedded memory comfortably handle pixel-rate conversion, color space translation, and partial-frame buffer storage. The AEC-Q100 qualification and -40C to +125C range satisfy automotive cluster and head-unit thermal requirements. The 164-MBGA footprint is small enough to mount on the flex PCB behind the display, and 101 user I/Os provide ample headroom for backlight, touch, and GPIO multiplexing.
Recommandé
IoT Edge Sensor Aggregation
The 10CL010YM164A7G aggregates multiple low-speed sensor buses (I2C, SPI, UART) onto a single Ethernet or CAN uplink in IoT edge nodes. Its 10K logic elements implement soft cores such as RISC-V or Nios II for protocol handling and local filtering, while 46 multipliers accelerate FFT-based vibration or acoustic analysis. The low-power Cyclone 10 LP process keeps idle consumption low for always-on industrial edge devices. Pair with a QSPI flash for configuration storage and a small PHY for Ethernet connectivity.
Recommandé
Video Processing Pipeline
The 10CL010YM164A7G handles mid-complexity video processing pipelines such as deinterlacing, scaling, and OSD overlay for industrial cameras and machine-vision front-ends. Its 46 18x18 multipliers accelerate 2D convolution and basic filtering, while 423 Kbits of embedded memory buffer scan-line data without external SRAM. The 101 user I/Os accept parallel CMOS sensor interfaces and drive HDMI or LVDS outputs. The -40C to +125C range supports outdoor and factory deployments.
Recommandé
Protocol Bridging and Glue Logic
Replace aging CPLD-based protocol bridges with the 10CL010YM164A7G when designs outgrow 1-2K LUTs. The 10K LE fabric implements UART-to-Ethernet, SPI-to-CAN, and I2C-to-USB bridges in a single device with room for diagnostic state machines and watchdogs. The 164-MBGA 0.5 mm pitch integrates into existing CPLD footprints where pin-count allows. Lower BOM cost than multi-CPLD solutions at this density.
Recommandé
Test and Measurement Front-End
The 10CL010YM164A7G serves as a reconfigurable front-end for low-speed test instruments: programmable gain stages, muxing, and trigger logic can all be implemented in fabric. The 46 embedded multipliers support real-time FIR filtering, and the 2 PLLs generate precise sample clocks for downstream ADCs. The automotive temperature grade allows use in field-deployed test gear. Compact 164-MBGA package fits handheld form factors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10CL010YM164A7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10CL016YM164A7G | 10CL006YM164A7G | 10CL010YM164I7G | 10CL010YM164C8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 164-MBGA (M164) | 164-MBGA (M164) - same | 164-MBGA (M164) - same | 164-MBGA (M164) - same | 164-MBGA (M164) - same |
| Logic Elements | 10,320 | 15,408 (+49%) | 6,272 (-39%) | 10,320 (same) | 10,320 (same) |
| Embedded Memory | 423,936 bits | 516,096 bits | 270,336 bits | 423,936 bits | 423,936 bits |
| Multipliers (18x18) | 46 | 56 | 30 | 46 | 46 |
| Maximum User I/O | 101 | 101 | 101 | 101 | 101 |
| Temperature Grade | Automotive -40C to +125C | Automotive -40C to +125C | Automotive -40C to +125C | Industrial -40C to +100C | Automotive -40C to +125C |
| Speed Grade | 7 | 7 | 7 | 7 | 8 (slower) |
| PLLs | 2 | 2 | 2 | 2 | 2 |
Principaux différenciateurs
- Highest LE count in the M164 automotive drop-in family (vs 10CL006YM164A7G)
- Automotive temperature grade up to +125C junction (vs 10CL010YM164I7G)
- Faster speed grade (7) at same price tier (vs 10CL010YM164C8G)
- Compact 164-MBGA footprint with 101 I/Os (vs 10CL010YU256A7G)
Notes de conception
Cyclone 10 LP devices require multiple supply rails: core VCC, VCCIO for I/O banks, VCCA for PLL analog, and VCCPD for pre-drivers. Decouple each rail with at least one 0.1 uF X7R ceramic capacitor per bank plus a single 10-100 uF bulk capacitor per rail placed close to the BGA. Add a ferrite bead between the board 3.3 V supply and VCCA to keep PLL jitter within specification. Power-on sequence (VCC before VCCIO before VCCPD) must follow Intel's power management user guide.
The 164-MBGA package uses a 0.5 mm ball pitch on an 8x8 mm body. Route escape with microvias on inner layers, and place at least 4 ground vias in the BGA center pad for thermal and return-path continuity. Match trace lengths within a bank for LVDS pairs and DDR interfaces to keep skew below 50 ps. Use Intel's symbol libraries for the Cyclone 10 LP M164 footprint - third-party symbols frequently omit the central thermal pad or misnumber balls.
Configuration flash is mandatory because Cyclone 10 LP SRAM is volatile. Do not use JTAG-only boot in production: power cycling will erase the design. Always include an EPCQ-L or compatible flash in the BOM. JTAG chain integrity must be verified post-reflow; MSEL pin resistors determine configuration mode and must be sized for the chosen flash interface. Confirmed via Intel's configuration user guide.
Estimated: at 100% logic utilization, 50% toggle rate, and worst-case process corner, the 10CL010YM164A7G dissipates approximately 0.8-1.2 W. The 164-MBGA's theta_JA of roughly 28 C/W on a 4-layer JEDEC test board produces a 22-34 C junction rise above ambient - manageable without a heatsink at automotive ambient up to ~105 C. Forced airflow is recommended above ambient 85 C.
Series-dampening resistors (22-33 ohm) on each LVDS output and on clock outputs reduce reflections and overshoot in long backplane traces. For DDR2/DDR3 interfaces, maintain 50-ohm single-ended impedance and use Intel's pinout-aware IO Planner to keep DQS groups matched within 25 ps. Keep high-speed serial lines (LVDS) away from noisy switching supplies; if not possible, stitch ground vias along the trace path to provide a low-impedance return.
Informations de conformité
AEC-Q100 qualified per ordering part number 'A' suffix. RoHS compliance confirmed by JLCPCB part detail listing. Halogen-free status not explicitly stated in available data.
